Part Number: XZTNI45S-9 3.2x2.8 mm INFRARED EMITTING DIODE Features Package Schematics ● Long life and robust package ● Variety of lens types available ● Standard Package: 2000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) TNI (GaAs) Unit Reverse Voltage VR 5 V Forward Current IF 50 mA Operating Characteristics (TA=25°C) TNI (GaAs) Unit Forward Voltage (Typ.) (IF=20mA) VF 1.2 V Forward Voltage (Max.) (IF=20mA) VF 1.6 V Forward Current (Peak) 1/100 Duty Cycle 10us Pulse Width iFS 1200 mA Reverse Current (Max.) (VR=5V) IR 10 uA Power Dissipation PD 80 mW Operating Temperature TA -40 ~ +85 Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) λP 940* nm Tstg -40 ~ +85 Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 50 nm C 90 pF Storage Temperature °C Capacitance (Typ.) (VF=0V, f=1MHz) Part Number XZTNI45S-9 Emitting Material GaAs Lens-color Water Clear Radiant Intensity CIE127-2007* (Po=mW/sr) @20mA min. typ. 1.6 1.2* 3.8 2.5* Wavelength CIE127-2007* λP nm Viewing Angle 2θ 1/2 940* 120° *Radiant intensity value and Wavelength are in accordance with CIE127-2007 standards. Oct 31,2012 XDSB5218 V3-X Layout: Maggie L. P. 1/5 Part Number: XZTNI45S-9 3.2x2.8 mm INFRARED EMITTING DIODE Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Oct 31,2012 XDSB5218 V3-X Layout: Maggie L. P. 2/5 Part Number: XZTNI45S-9 3.2x2.8 mm INFRARED EMITTING DIODE TNI LED is recommended for reflow soldering and soldering profile is shown below. Oct 31,2012 XDSB5218 V3-X Layout: Maggie L. P. 3/5 Part Number: XZTNI45S-9 3.2x2.8 mm INFRARED EMITTING DIODE The device has a single mounting surface. The device must be mounted according to the specifications. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage or radiant intensity / luminous flux), the typical accuracy of the sorting process is as follows: 1. Radiant Intensity / Luminous Flux: +/-15% 2. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters Oct 31,2012 XDSB5218 V3-X Layout: Maggie L. P. 4/5 Part Number: XZTNI45S-9 3.2x2.8 mm INFRARED EMITTING DIODE PACKING & LABEL SPECIFICATIONS Oct 31,2012 XDSB5218 V3-X Layout: Maggie L. P. 5/5