Technical Notes

Technical Notes
Contents
I. Bin Codes
a. Intensity Bin Codes
b.
Wavelength Bin Codes
c. CIE 1931 Chromaticity Diagram
II. Reliability Tests
a. SMD LEDs
b.
LED Lamps
c.
LED Displays
III. Application Notes
a.
b.
c.
d.
e.
f.
g.
h.
Storage, MSL, and Humidity Conditions
Cleaning
Lead Forming
Mounting Methods
Soldering
ESD Precautions
Design Notes
Additional Remarks
SunLED | Technical Notes
Ver. 1.0a 1031
1
I. Bin Codes
SunLED products are bin sorted for intensity and wavelength to ensure consistency in optical
output. Refer to below tables for the binning methodology and reference below section (III.
Application Notes [Additional Remarks]) for identification of bin codes on parts.
Intensity Bin Codes (back to top)
Intensity Bin Codes for High Intensity LEDs (IF=20mA, Ta=25°C, Tolerance=± 15%)
Bin
Code
Intensity in mcd
Min.
Max.
A
2
3
B
3
C
Bin Code
Intensity in mcd
Min.
Max.
T
700
1000
5
U
1000
5
8
V
D
8
12
E
12
F
Bin Code
Intensity in mcd
Min.
Max.
ZH
9000
11000
1300
ZM
11000
14000
1300
1600
ZN
14000
18000
W
1600
1900
ZP
18000
22000
20
X
1900
2300
ZQ
22000
27000
20
40
Y
2300
2700
ZR
27000
35000
G
40
55
Z
2700
3100
ZS
35000
43000
H
55
80
ZA
3100
3600
ZT
43000
55000
M
80
120
ZB
3600
4200
ZU
55000
75000
N
120
200
ZC
4200
5000
ZV
75000
130000
P
200
300
ZD
5000
6000
ZW
130000
200000
Q
300
400
ZE
6000
7000
ZX
200000
320000
R
400
500
ZF
7000
8000
ZY
320000
490000
S
500
700
ZG
8000
9000
ZZ
490000
800000
Intensity Bin Codes for Standard LEDs (IF=10mA, Ta=25°C, Tolerance=± 15%)
Intensity in mcd
Intensity in mcd
Bin
Bin Code
Bin Code
Code
Min.
Max.
Min.
Max
Intensity in mcd
Min.
Max.
F
0.1
0.2
R
15
20
ZB
550
700
G
0.2
0.35
S
20
30
ZC
700
1000
H
0.35
0.5
T
30
50
ZD
1000
1600
I
0.5
0.8
U
50
80
ZE
1600
2200
K
0.8
1.2
V
80
120
ZF
2200
2800
L
1.2
2
W
120
180
ZG
2800
3400
M
2
4
X
180
250
ZH
3400
4300
N
4
6
Y
250
320
ZM
4300
5200
P
6
10
Z
320
450
ZN
5200
6300
Q
10
15
ZA
450
550
ZP
6300
7400
SunLED | Technical Notes
Ver. 1.0a 1031
2
Intensity Bin Codes cont’d (back to top)
Intensity Bin Codes for High Powered LEDs (Ta=25°C, Tolerance=± 15%)
Luminous Flux in
Luminous Flux in lm
Bin
lm
Bin Code
Bin Code
Code
Min.
Max.
Min.
Max.
Luminous Flux in lm
Min.
Max.
A1
0.5
0.6
B1
10
12
C4
160
180
A2
0.6
0.7
B2
12
14
C5
180
210
A3
0.7
0.8
B3
14
17
C6
210
240
A4
0.8
1
B4
17
20
C7
240
280
A5
1
1.2
B5
20
24
C8
280
320
A6
1.2
1.4
B6
24
29
C9
320
370
A7
1.4
1.7
B7
29
35
C10
370
430
A8
1.7
2
B8
35
42
C11
430
490
A9
2
2.4
B9
42
50
C12
490
560
A10
2.4
2.9
B10
50
60
C13
560
640
A11
2.9
3.5
B11
60
70
C14
640
740
A12
3.5
4.2
B12
70
80
C15
740
850
A13
4.2
5
B13
80
90
C16
850
1000
A14
5
6
B14
90
100
D1
1000
1200
A15
6
7.2
C1
100
120
D2
1200
1400
A16
7.2
8.6
C2
120
140
D3
1400
1600
A17
8.6
10
C3
140
160
D4
1600
1800
Intensity Bin Codes for LED Displays (IF=10mA, Ta=25°C, Tolerance=± 15%)
Intensity in ucd
Bin
Code
Min.
Max.
C
70
140
D
140
E
Intensity in ucd
Intensity in ucd
Min.
Max.
Bin
Code
L
3600
5600
T
88000
150000
240
M
5600
9000
U
150000
255000
240
360
N
9000
14000
V
255000
433000
F
360
560
P
14000
21000
W
433000
736000
G
560
900
Q
21000
31000
X
736000
1251000
H
900
1400
R
31000
52000
Y
1251000
2126000
I
1400
2200
S
52000
88000
Z
2126000
3614000
K
2200
3600
SunLED | Technical Notes
Ver. 1.0a 1031
Bin Code
Min.
Max.
3
Intensity Bin Codes cont’d (back to top)
Intensity Bin Codes for Infrared Emitting Diodes (IF=20mA, Ta=25°C, Tolerance=± 15%)
Bin
Code
Intensity in mW/sr
Min.
Max.
AK
0.8
1.2
AL
1.2
A
B
Bin Code
Intensity in mW/sr
Min.
Max.
C
5
8
2
D
8
2
3
E
12
3
5
Bin Code
Intensity in mW/sr
Min.
Max.
F
20
40
12
G
40
55
20
H
55
80
Bin Codes for NPN Phototransistors (Ta=25°C, Tolerance=± 15%)
Photocurrent in
Photocurrent in mA
Bin
mA
Bin Code
Code
Min.
Max.
Min.
Max.
Bin Code
Photocurrent in mA
Min.
Max.
F
0.1
0.2
I
0.5
0.8
M
2
4
G
0.2
0.35
K
0.8
1.2
N
4
6
H
0.35
0.5
L
1.2
2
P
6
10
Wavelength Bin Codes (back to top)
Wavelength (λD) Bin Codes for Yellow LEDs (Ta=25°C, Tolerance=± 1nm)
Bin
Code
Wavelength in nm
Min.
Max.
1
581
584
2
584
3
586
Bin Code
Wavelength in nm
Min.
Max.
4
588
590
586
5
590
592
588
6
592
594
Bin Code
Wavelength in nm
Min.
Max.
7
594
597
8
597
600
Wavelength (λD) Bin Codes for Green LEDs (Ta=25°C, Tolerance=± 1nm)
Bin
Code
Wavelength in nm
Min.
Max.
0
556
559
1
559
2
561
Bin Code
Wavelength in nm
Min.
Max.
3
563
565
561
4
565
563
5
567
Bin Code
Wavelength in nm
Min.
Max.
6
569
571
567
7
571
573
569
8
573
575
Wavelength (λD) Bin Codes for True Green LEDs (Ta=25°C, Tolerance=± 1nm)
Bin
Code
Wavelength in nm
Min.
Max.
0
510
515
1
515
520
SunLED | Technical Notes
Ver. 1.0a 1031
Bin Code
Wavelength in nm
Min.
Max.
2
520
525
3
525
530
Bin Code
Wavelength in nm
Min.
Max.
4
530
535
5
535
540
4
Wavelength Bin Codes cont’d (back to top)
Wavelength (λD) Bin Codes for Aqua Green LEDs (Ta=25°C, Tolerance=± 1nm)
Bin
Code
Wavelength in nm
Min.
Max.
1
497
501
2
501
504
3
504
506
Wavelength in nm
Min.
Max.
Bin
Code
4
506
508
5
508
510
Bin Code
Wavelength in nm
Min.
Max.
6
510
512
7
512
515
Wavelength (λD) Bin Codes for Blue LEDs (Ta=25°C, Tolerance=± 1nm)
Bin
Code
Wavelength in nm
Wavelength in nm
Min.
Max.
Bin
Code
2A
466
469
455
2B
469
455
460
3A
1A
460
463
1B
463
466
Min.
Max.
1
445
450
2
450
3
SunLED | Technical Notes
Ver. 1.0a 1031
Bin Code
Wavelength in nm
Min.
Max.
4B
477
479
471
5A
479
481
471
473
5B
481
483
3B
473
475
5C
483
486
4A
475
477
5
CIE 1931 Chromaticity Diagram (back to top)
SunLED white LEDs are color sorted based on either CIE (coordinates) or CCT (Kelvin). Refer to
below diagram (Fig. 1).
Fig. 1
SunLED | Technical Notes
Ver. 1.0a 1031
6
CIE 1931 Chromaticity Diagram cont’d (back to top)
Refer to below tables for color coordinates and temperatures based on the bin codes indicated
on the above CIE 1931 diagram. Note that these are the general binning methodology used by
SunLED. Always refer to the latest datasheets for each specific part for most accurate binning
data.
CIE Bin Codes
Coordinates
Bin
Code
X
Y
a2
a0
b2
b1
c0
CCT Bin Codes
CCT
Bin Code
CCT
Coordinates
X
Y
0.4373
0.3893
0.4593
0.3944
0.4813
0.4319
0.263
0.213
0.282
0.245
0.265
0.265
0.242
0.226
0.4562
0.4260
0.282
0.245
0.4147
0.3814
0.298
0.271
0.4373
0.3893
0.286
0.299
0.4562
0.4260
0.265
0.265
0.4299
0.4165
0.298
0.271
0.3889
0.3690
0.313
0.296
0.4147
0.3814
0.306
0.332
0.4299
0.4165
0.286
0.299
0.3996
0.4015
0.313
0.296
0.3670
0.3578
0.329
0.325
0.3898
0.3716
0.329
0.371
0.4006
0.4044
0.306
0.332
0.3736
0.3874
0.329
0.325
0.3361
0.3328
0.358
0.372
0.3670
0.3578
0.363
0.400
0.3736
0.3874
0.329
0.371
0.3376
0.3616
0.3081
0.3049
0.3364
0.3328
0.3376
0.3616
0.3028
0.3304
15000K
9000 – 15000K
6800 – 9000K
5600 – 6800K
4600 – 5600K
W1
W2
W3
N1
N2
C1
SunLED | Technical Notes
Ver. 1.0a 1031
2580 – 2870K
2870 – 3220K
3220 – 3710K
3710 – 4260K
4260 – 5310K
5310 - 7040K
7
II. Reliability Tests
SunLED products undergo a full range of stringent tests to ensure reliability standards are met.
SMD LEDs, LED Lamps, and Displays are subject to tests which conform to engineering standards.
Refer to below tables for details.
SMD LEDs (back to top)
Test Criteria
Continuous
operating
Test Conditions
Description
Ta=25 -5°C
T=1000hrs
To determine the resistance of the
device when operating under
electrical stress
JIS C 7035
T=1000hrs
To evaluate the product durability
after long-term storage in high
temperature
JIS C 7021:B-10
To evaluate the product durability
after long-term storage in low
temperature
JIS C 7021:B-12
To evaluate the product durability
under long-term high temperature
and high humidity storage
JIS C 7021:B-10
To determine the resistance of the
device under electrical and thermal
stress
JIS C 7021:B-11
+10
IF=20mA
RH<75%RH
Engineering
Standard
High temperature
storage
Ta=100± 10°C
Low temperature
storage
Ta=-40
High temperature
& humidity
storage
Ta=85 -3°C
+5
RH=85 -10%RH
T=1000hrs
High temperature
& humidity
operating
IF=5mA
10%RH
+5
Ta=85 -3°C
RH=85
Solderability
Ta=245± 5°C
T=5± 1sec
To evaluate solderability on leads of
the device
JIS C 7021:A-2
T=10sec(max)
To determine the thermal resistance
characteristics of the device to
sudden exposures at extreme
changes in temperature during Tindipping
JIS C 7021:B-10
To determine the resistance of the
device for storage under extreme
temperature for hours
JIS C 7021:B-10
To determine the resistance of the
device under extreme temperature
for hours
JIS C 7021:A-4
To determine the resistance of the
device to sudden extreme changes
in high and low temperature
JIS C 7021:A-3
+3
-5°C
T=1000hrs
+5
+5
-
T=1000hrs
Soldering
resistance
Ta=260± 5°C
Temperature
cycling
Ta=-40 -5~25 -5~100 -3~25
5°C
T=(30~5~30~5min) x 10 cycles
Temperature
cycling operating
Ta=-40 -5~25 -5~100 -3~25
5°C
T=(30~5~30~5min) x 10 cycles
IF=20mA
Thermal shock
Ta=-40 -5~100 -3°C
T=(5~5min) x 100 cycles
+3
+3
+3
SunLED | Technical Notes
Ver. 1.0a 1031
+10
+10
+5
+5
+5
+10
-
+10
-
8
LED Lamps (back to top)
Test Criteria
Continuous
operating
High temperature
storage
Test Conditions
Description
Ta=25 -5°C
T=1000hrs
To determine the resistance of the
device when operating under
electrical stress
JIS C 7035
T=1000hrs
To evaluate the product durability
after long-term storage in high
temperature
JIS C 7021:B-10
To evaluate the product durability
after long-term storage in low
temperature
JIS C 7021:B-12
To evaluate the product durability
after long-term high temperature
and high humidity storage
JIS C 7021:B-10
To determine the resistance of the
device under electrical and thermal
stress
JIS C 7021:B-11
To evaluate the product durability
against mechanical stress applied to
the leads
JIS C 7021:A-8
To evaluate the product durability
against mechanical stress
JIS C 7021:A-8
+10
IF=20mA
RH<75%RH
Ta=100± 10°C
Low temperature
storage
Ta=-40
High temperature
& humidity
storage
Ta=85 -3°C
+5
RH=85 -10%RH
T=1000hrs
High temperature
& humidity
operating
IF=5mA
10%RH
+5
Ta=85 -3°C
RH=85
Lead frame
bending
Ta=25 -5°C
T=3 Cycles
Lead frame
pulling
Solderability
+3
-5°C
T=1000hrs
+5
+5
-
T=1000hrs
+10
T=Bend 90°
Ta=25 -5°C
T=30± 5sec
+10
W=1kg
Ta=245± 5°C
T=5± 1sec
To evaluate solderability on leads of
device
JIS C 7021:A-2
T=5± 1sec
To determine the thermal resistance
characteristics of the device to
sudden exposures at extreme
changes in temperature during Tindipping
JIS C 7021:B-10
To determine the resistance of the
device for storage under extreme
temperature for hours
JIS C 7021:B-10
To determine the resistance of the
device under extreme temperature
for hours
JIS C 7021:A-4
To determine the resistance of the
device to sudden extreme changes in
high and low temperature
JIS C 7021:A-3
Soldering
resistance
Ta=260± 5°C
Temperature
cycling
Ta=-40 -5~25 -5~100 -3~25
5°C
T=(30~5~30~5min) x 10 cycles
Temperature
cycling operating
Ta=-40 -5~25 -5~100 -3~25
5°C
T=(30~5~30~5min) x 10 cycles
IF=20mA
Thermal shock
Ta=-40 -5~100 -3°C
T=(5~5min) x 100 cycles
+3
+3
+3
SunLED | Technical Notes
Ver. 1.0a 1031
Engineering
Standard
+10
+10
+5
+5
+5
+10
-
+10
-
9
LED Displays (back to top)
Test Criteria
Continuous
operating
High temperature
storage
Test Conditions
IF=20mA
5°C
RH<75%RH
Ta=25
Description
+10
-
To determine the resistance of the
device when operating under
electrical stress
JIS C 7035
T=1000hrs
To evaluate the product durability
after long-term storage in high
temperature
JIS C 7021:B-10
T=1000hrs
To evaluate the product durability
after long-term storage in low
temperature
JIS C 7021:B-12
To evaluate the product durability
after long-term high temperature
and high humidity storage
JIS C 7021:B-10
T=1000hrs
Ta=100± 10°C
Engineering
Standard
Low temperature
storage
Ta=-40
High temperature
& humidity
storage
Ta=60± 3°C
RH=90-95%RH
T=1000hrs
Solderability
Ta=245± 5°C
T=5± 1sec
To evaluate solderability on leads of
device
JIS C 7021:A-2
T=5± 1sec
To determine the thermal resistance
characteristics of the device to
sudden exposures at extreme
changes in temperature during Tindipping
JIS C 7021:B-10
To determine the resistance of the
device for storage under extreme
temperature for hours
JIS C 7021:B-10
To determine the resistance of the
device to sudden extreme changes
in high and low temperature
JIS C 7021:A-3
+3
-5°C
Soldering
resistance
Ta=260± 5°C
Temperature
cycling
Ta=-40 -5~25 -5~100 -3~25
5°C
T=(30~5~30~5min) x 10 cycles
Thermal shock
Ta=-40 -5~100 -3°C
T=(15~15min) x 100 cycles
+3
+3
SunLED | Technical Notes
Ver. 1.0a 1031
+10
+5
+5
+10
-
10
III. Application Notes
Storage, MSL, and Humidity Conditions (back to top)
SMD LEDs are considered moisture sensitive and storage/usage precautions must be taken to
prevent damage to the internal materials. Excess moisture trapped within the component may
cause internal vapor pressure during solder reflow leading to possible delamination of the die or
wire bond.
1. Do not store LEDs in an environment where high levels of moisture or corrosive gases
are present and keep away from rapid transitions in ambient temperature.
Recommended storage conditions for each type of LED product as per below:
Product Type
Temperature
Humidity
SMD LED
< 40°C
< 90%RH
Through-hole LED
≤ 30°C
< 60%RH
5°C to 30°C
< 60%RH
LED Displays
Note: Above conditions are based on products in original sealed packaging
2. All SMD LEDs are packaged in moisture barrier bags (MBB) with a label indicating the
moisture sensitivity level (MSL).
2. Storage conditions for unopened MBB: Temperature < 40°C, Humidity < 90%RH
3. Floor life for opened MBB follows the corresponding MSL as per below:
IPC/JEDEC J-STD-020
Floor Life
MSL
Time
Conditions
1
Unlimited
≤30°C / 85%RH
2
1 Year
≤30°C / 60%RH
2a
4 Weeks
≤30°C / 60%RH
3
168 Hours
≤30°C / 60%RH
4
72 Hours
≤30°C / 60%RH
5
48 Hours
≤30°C / 60%RH
5a
24 Hours
≤30°C / 60%RH
6
Time indicated on label
≤30°C / 60%RH
4. All SMD LEDs are packaged with desiccants and a humidity indicator card (HIC). If the
LEDs are not used within the specific floor life or if the HIC has indicated presence of
moisture, the following baking procedure must be taken:
Condition
LEDs inside carrier tape
LEDs outside carrier tape
SunLED | Technical Notes
Ver. 1.0a 1031
Temperature
Humidity
Bake Duration
60°C ± 3°C
<5% RH
100 hours
110°C
-
10 hours
11
Cleaning (back to top)
1. Do not use harsh organic solvents such as acetone, trichloroethylene, Chlorsan, and/or
diflon solvent for cleaning as they may cause damage or hazing to the LED lens.
2. Recommended solvents for cleaning: deionized water or isopropyl alcohol.
3. Special attention should be taken if other chemicals are used for cleaning as they may
damage the epoxy lens or housing.
4. Any cleaning should take place at room temperature and the wash duration should not
exceed one minute.
5. Use forced-air drying immediately following water wash to remove excess moisture.
Lead Forming (back to top)
1. Any lead forming or bending must be done prior to soldering.
2. Avoid bending leads at the same point more than once as it may compromise the
integrity of the leads.
3. Minimum clearance of 3mm is required between the base of the LED lens and the bend
location. Refer to below diagram (Fig. 2).
Fig. 2
4. Lead forming should only be done with proper tools such as a jig and/or radio pliers.
The upper section of the leads should be secured firmly such that the bending force is
not exerted on the LED body. Refer to below diagram (Fig. 3) for recommended lead
bending method.
Fig. 3
SunLED | Technical Notes
Ver. 1.0a 1031
12
Mounting Methods (back to top)
1. The LED mounting process should avoid stress applied to the lead terminals.
2. When mounting components for assembly, ensure the terminal pitch matches the hole
pitch of the PCB to prevent pressure applied to the LED body due to spreading or
pinching of the lead terminals. Refer to below diagram (Fig. 4) for recommended LED
mounting method.
Fig. 4
3. To ensure proper mounting, lead forming may be required based upon PCB design
layout. All lead forming procedures should follow the lead forming notes as described
above. Refer to below diagram (Fig. 5) for examples of proper lead forming.
Fig. 5
SunLED | Technical Notes
Ver. 1.0a 1031
13
Mounting Methods cont’d (back to top)
4. Avoid additional lead forming after LEDs have been mounted on the PCB.
5. Stand-offs or spacers should be used if the LED is required to be mounted at a certain
height above the PCB.
Soldering (back to top)
1. Manual soldering operations should only be for repairs and reworks unless otherwise
noted on product specifications.
2. Maximum soldering iron temperatures for manual soldering:
a. Pb-Sn solder: 300°C
b. Pb-Free solder: 350°C
c. All LEDs using InGaN material (Blue, Green, White): 280°C
3. The soldering iron should never touch the epoxy lens. Contact duration with the
component should not exceed 3 seconds.
4. Do not apply stress or pressure to the leads when the component is heated above 80°C
as possible damage to the internal wire bonds may occur.
5. During soldering, component covers and holders should leave enough clearance to
avoid any stress applied to the LED. Refer to below diagram (Fig. 6) for examples of
proper method.
Fig. 6
SunLED | Technical Notes
Ver. 1.0a 1031
14
Soldering cont’d (back to top)
6.
Refer to below diagrams for recommended soldering profiles.
a. SMD LEDs: Reflow Soldering – Pb-Free Solder (Fig. 7) | Pb-Sn Solder (Fig. 8)
- No more than two soldering passes except SMD CBIs which should not exceed one pass
b. Through-hole LEDs: Wave Soldering – Pb-Free Solder (Fig. 9) | Pb-Sn Solder (Fig. 10)
- No more than one soldering pass
Reflow Soldering Profile (Pb-Free Solder)
Notes:
1.
2.
3.
Maximum soldering temperature should not exceed 260°C
Recommended reflow temperature: 245°C to 260°C
Do not apply stress to the epoxy resin during high temperature conditions
Fig. 7
Reflow Soldering Profile (Pb-Sn Solder)
Fig. 8
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Soldering cont’d (back to top)
Wave Soldering Profile (Pb-Free Solder)
Notes:
1.
2.
3.
4.
Recommend pre-heat temperature of 105°C or less prior to immersion in
solder wave. Maximum solder bath temperature: 260°C
Peak wave soldering temperature: 245°C to 255°C for 3s (5s max)
Do not apply stress to the epoxy resin while temperature is above 85°C
SAC 305 solder alloy recommended and no more than one wave soldering pass
Fig. 9
Wave Soldering Profile (Pb-Sn Solder)
Fig. 10
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Soldering cont’d (back to top)
7. Refer to the appropriate product datasheet for details on specific soldering pay layout.
To ensure proper bonding and setting of the LED, solder paste must be evenly applied to
each soldering pad. Refer to below diagram (Fig. 11) for example of improper solder
application.
Fig. 11
8. After soldering, allow at least three minutes for the component to cool to room
temperature before further processing.
9. Refer to below table for summary of soldering instructions for dip, wave, and manual
solder. Note that these are considered general instructions and all soldering notes
indicated above should take precedence.
Dip Soldering / *Wave Soldering
Iron Soldering (with 1.5mm iron tip)
Product
Type
Temp. of
solder
bath
Maximum
solder
time
Distance
(jointpackage)
Temp. of
solder
iron
Maximum
solder
time
Distance
(jointpackage)
Throughhole
≤260°C
3s
≥2mm
≤350°C
3s
≥2mm
≤260°C
5s
≥5mm
≤350°C
5s
≥5mm
-
-
-
≤350°C
3s (once)
-
*≤260°C
*3s
*≥2mm
≤350°C
3s
≥2mm
SMD
Displays
ESD Precautions (back to top)
InGaN/GaN material LEDs are sensitive to electrostatic discharge (ESD) and other transient
voltage spikes. ESD and voltage spikes can affect the component’s performance due to increased
reverse current and/or decreased forward voltage. This may result in reduced light intensity
and/or component failure. Static discharge may occur when static sensitive LEDs come in contact
with the user or other conductive devices. ESD sensitive LEDs must incorporate protective
circuitry to prevent ESD and to control voltage spikes in order to stay within the maximum
voltage specified.
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ESD Precautions cont’d (back to top)
SunLED products are stored in anti-static bags for protection during transportation and storage.
However, below anti-static measures should always be noted when handling static sensitive
components.
1. Operators must wear anti-static wristbands.
2. Operators must wear anti-static suits when entering work areas with conductive
machinery and materials.
3. All test instruments and production machinery must be grounded.
4. Avoid static build up by minimizing friction between the LED and its surroundings.
5. Humidity level should be maintained at 50% or higher in a production environment.
6. All workstations that handle ESD sensitive components must maintain an electrostatic
condition of 150V or less.
7. All anti-static measures noted above should be periodically checked and inspected to
ensure proper functionality.
Design Notes (back to top)
1. Protective current-limiting resistors should be used in conjunction with LEDs to ensure
parts are operating within specified current range.
2. The driving circuit should be designed to avoid reverse voltages and transient voltage
spikes when the circuit is in both on & off states.
3. When LEDs are mounted in a parallel configuration, there should be individual currentlimiting resistors in series with each LED. Refer to below diagram (Fig. 12) for an example
of a recommended set up.
Fig. 12
4. Mounting direction of SMD components should be placed perpendicular to the direction
of PCB travel. This will ensure the solder wets on each lead simultaneously during reflow
and prevent shifting of LEDs. Refer to below diagram (Fig. 13) for examples of
recommended mounting direction.
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Design Notes cont’d (back to top)
Fig. 13
5. High-power LED devices require optimization of heat dissipation. Increasing the size of
metal mounting surface and proper application of thermal conductive paste will help
improve heat dissipation. Refer to below diagram (Fig. 14) and product datasheets for
specific design recommendations.
Conventional Pad
Improved Pad Design
Fig. 14
6. High temperatures may reduce component’s performance and reliability. Please refer to
individual product datasheets for specific details on operable temperature range and
effects of temperature on the LED.
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Additional Remarks (back to top)
1. LED devices may contain Gallium Arsenide (GaAs). GaAs dust and fumes are toxic and
harmful if ingested. Do not expose LEDs to chemical solvents and/or break open LED
components.
2. The light output from UV, blue, and high-power LEDs may cause injury to the human eye
when viewed directly.
3. Semiconductor devices can fail or malfunction due to their sensitivity to electrical
fluctuation and physical stress. In design development, please make certain that SunLED
products are used within the specified operating conditions as indicated on our most
current product datasheets. The user is responsible to observe and follow all safety
measures to avoid situations where the failure or malfunction of a SunLED product could
cause injury, property damage, or the loss of human life.
4. SunLED products are bin sorted for intensity and wavelength. To ensure intensity and
color consistency when using multiple LEDs in an array, it is recommended to use parts
within the same bin code. Each bag, reel, or tube of LEDs contain a single intensity and
wavelength code and is indicated on the part number label. Refer to below diagram (Fig.
15) for bin code identification and reference above section (I. Bin Codes) for specification
data.
Fig. 15
5. Prolonged reverse bias should be avoided as it could cause metal migration leading to
an increase in leakage current or causing a short circuit.
6. Contents within this document are subject to improvement and enhancement changes
without notice.
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