Technical Notes Contents I. Bin Codes a. Intensity Bin Codes b. Wavelength Bin Codes c. CIE 1931 Chromaticity Diagram II. Reliability Tests a. SMD LEDs b. LED Lamps c. LED Displays III. Application Notes a. b. c. d. e. f. g. h. Storage, MSL, and Humidity Conditions Cleaning Lead Forming Mounting Methods Soldering ESD Precautions Design Notes Additional Remarks SunLED | Technical Notes Ver. 1.0a 1031 1 I. Bin Codes SunLED products are bin sorted for intensity and wavelength to ensure consistency in optical output. Refer to below tables for the binning methodology and reference below section (III. Application Notes [Additional Remarks]) for identification of bin codes on parts. Intensity Bin Codes (back to top) Intensity Bin Codes for High Intensity LEDs (IF=20mA, Ta=25°C, Tolerance=± 15%) Bin Code Intensity in mcd Min. Max. A 2 3 B 3 C Bin Code Intensity in mcd Min. Max. T 700 1000 5 U 1000 5 8 V D 8 12 E 12 F Bin Code Intensity in mcd Min. Max. ZH 9000 11000 1300 ZM 11000 14000 1300 1600 ZN 14000 18000 W 1600 1900 ZP 18000 22000 20 X 1900 2300 ZQ 22000 27000 20 40 Y 2300 2700 ZR 27000 35000 G 40 55 Z 2700 3100 ZS 35000 43000 H 55 80 ZA 3100 3600 ZT 43000 55000 M 80 120 ZB 3600 4200 ZU 55000 75000 N 120 200 ZC 4200 5000 ZV 75000 130000 P 200 300 ZD 5000 6000 ZW 130000 200000 Q 300 400 ZE 6000 7000 ZX 200000 320000 R 400 500 ZF 7000 8000 ZY 320000 490000 S 500 700 ZG 8000 9000 ZZ 490000 800000 Intensity Bin Codes for Standard LEDs (IF=10mA, Ta=25°C, Tolerance=± 15%) Intensity in mcd Intensity in mcd Bin Bin Code Bin Code Code Min. Max. Min. Max Intensity in mcd Min. Max. F 0.1 0.2 R 15 20 ZB 550 700 G 0.2 0.35 S 20 30 ZC 700 1000 H 0.35 0.5 T 30 50 ZD 1000 1600 I 0.5 0.8 U 50 80 ZE 1600 2200 K 0.8 1.2 V 80 120 ZF 2200 2800 L 1.2 2 W 120 180 ZG 2800 3400 M 2 4 X 180 250 ZH 3400 4300 N 4 6 Y 250 320 ZM 4300 5200 P 6 10 Z 320 450 ZN 5200 6300 Q 10 15 ZA 450 550 ZP 6300 7400 SunLED | Technical Notes Ver. 1.0a 1031 2 Intensity Bin Codes cont’d (back to top) Intensity Bin Codes for High Powered LEDs (Ta=25°C, Tolerance=± 15%) Luminous Flux in Luminous Flux in lm Bin lm Bin Code Bin Code Code Min. Max. Min. Max. Luminous Flux in lm Min. Max. A1 0.5 0.6 B1 10 12 C4 160 180 A2 0.6 0.7 B2 12 14 C5 180 210 A3 0.7 0.8 B3 14 17 C6 210 240 A4 0.8 1 B4 17 20 C7 240 280 A5 1 1.2 B5 20 24 C8 280 320 A6 1.2 1.4 B6 24 29 C9 320 370 A7 1.4 1.7 B7 29 35 C10 370 430 A8 1.7 2 B8 35 42 C11 430 490 A9 2 2.4 B9 42 50 C12 490 560 A10 2.4 2.9 B10 50 60 C13 560 640 A11 2.9 3.5 B11 60 70 C14 640 740 A12 3.5 4.2 B12 70 80 C15 740 850 A13 4.2 5 B13 80 90 C16 850 1000 A14 5 6 B14 90 100 D1 1000 1200 A15 6 7.2 C1 100 120 D2 1200 1400 A16 7.2 8.6 C2 120 140 D3 1400 1600 A17 8.6 10 C3 140 160 D4 1600 1800 Intensity Bin Codes for LED Displays (IF=10mA, Ta=25°C, Tolerance=± 15%) Intensity in ucd Bin Code Min. Max. C 70 140 D 140 E Intensity in ucd Intensity in ucd Min. Max. Bin Code L 3600 5600 T 88000 150000 240 M 5600 9000 U 150000 255000 240 360 N 9000 14000 V 255000 433000 F 360 560 P 14000 21000 W 433000 736000 G 560 900 Q 21000 31000 X 736000 1251000 H 900 1400 R 31000 52000 Y 1251000 2126000 I 1400 2200 S 52000 88000 Z 2126000 3614000 K 2200 3600 SunLED | Technical Notes Ver. 1.0a 1031 Bin Code Min. Max. 3 Intensity Bin Codes cont’d (back to top) Intensity Bin Codes for Infrared Emitting Diodes (IF=20mA, Ta=25°C, Tolerance=± 15%) Bin Code Intensity in mW/sr Min. Max. AK 0.8 1.2 AL 1.2 A B Bin Code Intensity in mW/sr Min. Max. C 5 8 2 D 8 2 3 E 12 3 5 Bin Code Intensity in mW/sr Min. Max. F 20 40 12 G 40 55 20 H 55 80 Bin Codes for NPN Phototransistors (Ta=25°C, Tolerance=± 15%) Photocurrent in Photocurrent in mA Bin mA Bin Code Code Min. Max. Min. Max. Bin Code Photocurrent in mA Min. Max. F 0.1 0.2 I 0.5 0.8 M 2 4 G 0.2 0.35 K 0.8 1.2 N 4 6 H 0.35 0.5 L 1.2 2 P 6 10 Wavelength Bin Codes (back to top) Wavelength (λD) Bin Codes for Yellow LEDs (Ta=25°C, Tolerance=± 1nm) Bin Code Wavelength in nm Min. Max. 1 581 584 2 584 3 586 Bin Code Wavelength in nm Min. Max. 4 588 590 586 5 590 592 588 6 592 594 Bin Code Wavelength in nm Min. Max. 7 594 597 8 597 600 Wavelength (λD) Bin Codes for Green LEDs (Ta=25°C, Tolerance=± 1nm) Bin Code Wavelength in nm Min. Max. 0 556 559 1 559 2 561 Bin Code Wavelength in nm Min. Max. 3 563 565 561 4 565 563 5 567 Bin Code Wavelength in nm Min. Max. 6 569 571 567 7 571 573 569 8 573 575 Wavelength (λD) Bin Codes for True Green LEDs (Ta=25°C, Tolerance=± 1nm) Bin Code Wavelength in nm Min. Max. 0 510 515 1 515 520 SunLED | Technical Notes Ver. 1.0a 1031 Bin Code Wavelength in nm Min. Max. 2 520 525 3 525 530 Bin Code Wavelength in nm Min. Max. 4 530 535 5 535 540 4 Wavelength Bin Codes cont’d (back to top) Wavelength (λD) Bin Codes for Aqua Green LEDs (Ta=25°C, Tolerance=± 1nm) Bin Code Wavelength in nm Min. Max. 1 497 501 2 501 504 3 504 506 Wavelength in nm Min. Max. Bin Code 4 506 508 5 508 510 Bin Code Wavelength in nm Min. Max. 6 510 512 7 512 515 Wavelength (λD) Bin Codes for Blue LEDs (Ta=25°C, Tolerance=± 1nm) Bin Code Wavelength in nm Wavelength in nm Min. Max. Bin Code 2A 466 469 455 2B 469 455 460 3A 1A 460 463 1B 463 466 Min. Max. 1 445 450 2 450 3 SunLED | Technical Notes Ver. 1.0a 1031 Bin Code Wavelength in nm Min. Max. 4B 477 479 471 5A 479 481 471 473 5B 481 483 3B 473 475 5C 483 486 4A 475 477 5 CIE 1931 Chromaticity Diagram (back to top) SunLED white LEDs are color sorted based on either CIE (coordinates) or CCT (Kelvin). Refer to below diagram (Fig. 1). Fig. 1 SunLED | Technical Notes Ver. 1.0a 1031 6 CIE 1931 Chromaticity Diagram cont’d (back to top) Refer to below tables for color coordinates and temperatures based on the bin codes indicated on the above CIE 1931 diagram. Note that these are the general binning methodology used by SunLED. Always refer to the latest datasheets for each specific part for most accurate binning data. CIE Bin Codes Coordinates Bin Code X Y a2 a0 b2 b1 c0 CCT Bin Codes CCT Bin Code CCT Coordinates X Y 0.4373 0.3893 0.4593 0.3944 0.4813 0.4319 0.263 0.213 0.282 0.245 0.265 0.265 0.242 0.226 0.4562 0.4260 0.282 0.245 0.4147 0.3814 0.298 0.271 0.4373 0.3893 0.286 0.299 0.4562 0.4260 0.265 0.265 0.4299 0.4165 0.298 0.271 0.3889 0.3690 0.313 0.296 0.4147 0.3814 0.306 0.332 0.4299 0.4165 0.286 0.299 0.3996 0.4015 0.313 0.296 0.3670 0.3578 0.329 0.325 0.3898 0.3716 0.329 0.371 0.4006 0.4044 0.306 0.332 0.3736 0.3874 0.329 0.325 0.3361 0.3328 0.358 0.372 0.3670 0.3578 0.363 0.400 0.3736 0.3874 0.329 0.371 0.3376 0.3616 0.3081 0.3049 0.3364 0.3328 0.3376 0.3616 0.3028 0.3304 15000K 9000 – 15000K 6800 – 9000K 5600 – 6800K 4600 – 5600K W1 W2 W3 N1 N2 C1 SunLED | Technical Notes Ver. 1.0a 1031 2580 – 2870K 2870 – 3220K 3220 – 3710K 3710 – 4260K 4260 – 5310K 5310 - 7040K 7 II. Reliability Tests SunLED products undergo a full range of stringent tests to ensure reliability standards are met. SMD LEDs, LED Lamps, and Displays are subject to tests which conform to engineering standards. Refer to below tables for details. SMD LEDs (back to top) Test Criteria Continuous operating Test Conditions Description Ta=25 -5°C T=1000hrs To determine the resistance of the device when operating under electrical stress JIS C 7035 T=1000hrs To evaluate the product durability after long-term storage in high temperature JIS C 7021:B-10 To evaluate the product durability after long-term storage in low temperature JIS C 7021:B-12 To evaluate the product durability under long-term high temperature and high humidity storage JIS C 7021:B-10 To determine the resistance of the device under electrical and thermal stress JIS C 7021:B-11 +10 IF=20mA RH<75%RH Engineering Standard High temperature storage Ta=100± 10°C Low temperature storage Ta=-40 High temperature & humidity storage Ta=85 -3°C +5 RH=85 -10%RH T=1000hrs High temperature & humidity operating IF=5mA 10%RH +5 Ta=85 -3°C RH=85 Solderability Ta=245± 5°C T=5± 1sec To evaluate solderability on leads of the device JIS C 7021:A-2 T=10sec(max) To determine the thermal resistance characteristics of the device to sudden exposures at extreme changes in temperature during Tindipping JIS C 7021:B-10 To determine the resistance of the device for storage under extreme temperature for hours JIS C 7021:B-10 To determine the resistance of the device under extreme temperature for hours JIS C 7021:A-4 To determine the resistance of the device to sudden extreme changes in high and low temperature JIS C 7021:A-3 +3 -5°C T=1000hrs +5 +5 - T=1000hrs Soldering resistance Ta=260± 5°C Temperature cycling Ta=-40 -5~25 -5~100 -3~25 5°C T=(30~5~30~5min) x 10 cycles Temperature cycling operating Ta=-40 -5~25 -5~100 -3~25 5°C T=(30~5~30~5min) x 10 cycles IF=20mA Thermal shock Ta=-40 -5~100 -3°C T=(5~5min) x 100 cycles +3 +3 +3 SunLED | Technical Notes Ver. 1.0a 1031 +10 +10 +5 +5 +5 +10 - +10 - 8 LED Lamps (back to top) Test Criteria Continuous operating High temperature storage Test Conditions Description Ta=25 -5°C T=1000hrs To determine the resistance of the device when operating under electrical stress JIS C 7035 T=1000hrs To evaluate the product durability after long-term storage in high temperature JIS C 7021:B-10 To evaluate the product durability after long-term storage in low temperature JIS C 7021:B-12 To evaluate the product durability after long-term high temperature and high humidity storage JIS C 7021:B-10 To determine the resistance of the device under electrical and thermal stress JIS C 7021:B-11 To evaluate the product durability against mechanical stress applied to the leads JIS C 7021:A-8 To evaluate the product durability against mechanical stress JIS C 7021:A-8 +10 IF=20mA RH<75%RH Ta=100± 10°C Low temperature storage Ta=-40 High temperature & humidity storage Ta=85 -3°C +5 RH=85 -10%RH T=1000hrs High temperature & humidity operating IF=5mA 10%RH +5 Ta=85 -3°C RH=85 Lead frame bending Ta=25 -5°C T=3 Cycles Lead frame pulling Solderability +3 -5°C T=1000hrs +5 +5 - T=1000hrs +10 T=Bend 90° Ta=25 -5°C T=30± 5sec +10 W=1kg Ta=245± 5°C T=5± 1sec To evaluate solderability on leads of device JIS C 7021:A-2 T=5± 1sec To determine the thermal resistance characteristics of the device to sudden exposures at extreme changes in temperature during Tindipping JIS C 7021:B-10 To determine the resistance of the device for storage under extreme temperature for hours JIS C 7021:B-10 To determine the resistance of the device under extreme temperature for hours JIS C 7021:A-4 To determine the resistance of the device to sudden extreme changes in high and low temperature JIS C 7021:A-3 Soldering resistance Ta=260± 5°C Temperature cycling Ta=-40 -5~25 -5~100 -3~25 5°C T=(30~5~30~5min) x 10 cycles Temperature cycling operating Ta=-40 -5~25 -5~100 -3~25 5°C T=(30~5~30~5min) x 10 cycles IF=20mA Thermal shock Ta=-40 -5~100 -3°C T=(5~5min) x 100 cycles +3 +3 +3 SunLED | Technical Notes Ver. 1.0a 1031 Engineering Standard +10 +10 +5 +5 +5 +10 - +10 - 9 LED Displays (back to top) Test Criteria Continuous operating High temperature storage Test Conditions IF=20mA 5°C RH<75%RH Ta=25 Description +10 - To determine the resistance of the device when operating under electrical stress JIS C 7035 T=1000hrs To evaluate the product durability after long-term storage in high temperature JIS C 7021:B-10 T=1000hrs To evaluate the product durability after long-term storage in low temperature JIS C 7021:B-12 To evaluate the product durability after long-term high temperature and high humidity storage JIS C 7021:B-10 T=1000hrs Ta=100± 10°C Engineering Standard Low temperature storage Ta=-40 High temperature & humidity storage Ta=60± 3°C RH=90-95%RH T=1000hrs Solderability Ta=245± 5°C T=5± 1sec To evaluate solderability on leads of device JIS C 7021:A-2 T=5± 1sec To determine the thermal resistance characteristics of the device to sudden exposures at extreme changes in temperature during Tindipping JIS C 7021:B-10 To determine the resistance of the device for storage under extreme temperature for hours JIS C 7021:B-10 To determine the resistance of the device to sudden extreme changes in high and low temperature JIS C 7021:A-3 +3 -5°C Soldering resistance Ta=260± 5°C Temperature cycling Ta=-40 -5~25 -5~100 -3~25 5°C T=(30~5~30~5min) x 10 cycles Thermal shock Ta=-40 -5~100 -3°C T=(15~15min) x 100 cycles +3 +3 SunLED | Technical Notes Ver. 1.0a 1031 +10 +5 +5 +10 - 10 III. Application Notes Storage, MSL, and Humidity Conditions (back to top) SMD LEDs are considered moisture sensitive and storage/usage precautions must be taken to prevent damage to the internal materials. Excess moisture trapped within the component may cause internal vapor pressure during solder reflow leading to possible delamination of the die or wire bond. 1. Do not store LEDs in an environment where high levels of moisture or corrosive gases are present and keep away from rapid transitions in ambient temperature. Recommended storage conditions for each type of LED product as per below: Product Type Temperature Humidity SMD LED < 40°C < 90%RH Through-hole LED ≤ 30°C < 60%RH 5°C to 30°C < 60%RH LED Displays Note: Above conditions are based on products in original sealed packaging 2. All SMD LEDs are packaged in moisture barrier bags (MBB) with a label indicating the moisture sensitivity level (MSL). 2. Storage conditions for unopened MBB: Temperature < 40°C, Humidity < 90%RH 3. Floor life for opened MBB follows the corresponding MSL as per below: IPC/JEDEC J-STD-020 Floor Life MSL Time Conditions 1 Unlimited ≤30°C / 85%RH 2 1 Year ≤30°C / 60%RH 2a 4 Weeks ≤30°C / 60%RH 3 168 Hours ≤30°C / 60%RH 4 72 Hours ≤30°C / 60%RH 5 48 Hours ≤30°C / 60%RH 5a 24 Hours ≤30°C / 60%RH 6 Time indicated on label ≤30°C / 60%RH 4. All SMD LEDs are packaged with desiccants and a humidity indicator card (HIC). If the LEDs are not used within the specific floor life or if the HIC has indicated presence of moisture, the following baking procedure must be taken: Condition LEDs inside carrier tape LEDs outside carrier tape SunLED | Technical Notes Ver. 1.0a 1031 Temperature Humidity Bake Duration 60°C ± 3°C <5% RH 100 hours 110°C - 10 hours 11 Cleaning (back to top) 1. Do not use harsh organic solvents such as acetone, trichloroethylene, Chlorsan, and/or diflon solvent for cleaning as they may cause damage or hazing to the LED lens. 2. Recommended solvents for cleaning: deionized water or isopropyl alcohol. 3. Special attention should be taken if other chemicals are used for cleaning as they may damage the epoxy lens or housing. 4. Any cleaning should take place at room temperature and the wash duration should not exceed one minute. 5. Use forced-air drying immediately following water wash to remove excess moisture. Lead Forming (back to top) 1. Any lead forming or bending must be done prior to soldering. 2. Avoid bending leads at the same point more than once as it may compromise the integrity of the leads. 3. Minimum clearance of 3mm is required between the base of the LED lens and the bend location. Refer to below diagram (Fig. 2). Fig. 2 4. Lead forming should only be done with proper tools such as a jig and/or radio pliers. The upper section of the leads should be secured firmly such that the bending force is not exerted on the LED body. Refer to below diagram (Fig. 3) for recommended lead bending method. Fig. 3 SunLED | Technical Notes Ver. 1.0a 1031 12 Mounting Methods (back to top) 1. The LED mounting process should avoid stress applied to the lead terminals. 2. When mounting components for assembly, ensure the terminal pitch matches the hole pitch of the PCB to prevent pressure applied to the LED body due to spreading or pinching of the lead terminals. Refer to below diagram (Fig. 4) for recommended LED mounting method. Fig. 4 3. To ensure proper mounting, lead forming may be required based upon PCB design layout. All lead forming procedures should follow the lead forming notes as described above. Refer to below diagram (Fig. 5) for examples of proper lead forming. Fig. 5 SunLED | Technical Notes Ver. 1.0a 1031 13 Mounting Methods cont’d (back to top) 4. Avoid additional lead forming after LEDs have been mounted on the PCB. 5. Stand-offs or spacers should be used if the LED is required to be mounted at a certain height above the PCB. Soldering (back to top) 1. Manual soldering operations should only be for repairs and reworks unless otherwise noted on product specifications. 2. Maximum soldering iron temperatures for manual soldering: a. Pb-Sn solder: 300°C b. Pb-Free solder: 350°C c. All LEDs using InGaN material (Blue, Green, White): 280°C 3. The soldering iron should never touch the epoxy lens. Contact duration with the component should not exceed 3 seconds. 4. Do not apply stress or pressure to the leads when the component is heated above 80°C as possible damage to the internal wire bonds may occur. 5. During soldering, component covers and holders should leave enough clearance to avoid any stress applied to the LED. Refer to below diagram (Fig. 6) for examples of proper method. Fig. 6 SunLED | Technical Notes Ver. 1.0a 1031 14 Soldering cont’d (back to top) 6. Refer to below diagrams for recommended soldering profiles. a. SMD LEDs: Reflow Soldering – Pb-Free Solder (Fig. 7) | Pb-Sn Solder (Fig. 8) - No more than two soldering passes except SMD CBIs which should not exceed one pass b. Through-hole LEDs: Wave Soldering – Pb-Free Solder (Fig. 9) | Pb-Sn Solder (Fig. 10) - No more than one soldering pass Reflow Soldering Profile (Pb-Free Solder) Notes: 1. 2. 3. Maximum soldering temperature should not exceed 260°C Recommended reflow temperature: 245°C to 260°C Do not apply stress to the epoxy resin during high temperature conditions Fig. 7 Reflow Soldering Profile (Pb-Sn Solder) Fig. 8 SunLED | Technical Notes Ver. 1.0a 1031 15 Soldering cont’d (back to top) Wave Soldering Profile (Pb-Free Solder) Notes: 1. 2. 3. 4. Recommend pre-heat temperature of 105°C or less prior to immersion in solder wave. Maximum solder bath temperature: 260°C Peak wave soldering temperature: 245°C to 255°C for 3s (5s max) Do not apply stress to the epoxy resin while temperature is above 85°C SAC 305 solder alloy recommended and no more than one wave soldering pass Fig. 9 Wave Soldering Profile (Pb-Sn Solder) Fig. 10 SunLED | Technical Notes Ver. 1.0a 1031 16 Soldering cont’d (back to top) 7. Refer to the appropriate product datasheet for details on specific soldering pay layout. To ensure proper bonding and setting of the LED, solder paste must be evenly applied to each soldering pad. Refer to below diagram (Fig. 11) for example of improper solder application. Fig. 11 8. After soldering, allow at least three minutes for the component to cool to room temperature before further processing. 9. Refer to below table for summary of soldering instructions for dip, wave, and manual solder. Note that these are considered general instructions and all soldering notes indicated above should take precedence. Dip Soldering / *Wave Soldering Iron Soldering (with 1.5mm iron tip) Product Type Temp. of solder bath Maximum solder time Distance (jointpackage) Temp. of solder iron Maximum solder time Distance (jointpackage) Throughhole ≤260°C 3s ≥2mm ≤350°C 3s ≥2mm ≤260°C 5s ≥5mm ≤350°C 5s ≥5mm - - - ≤350°C 3s (once) - *≤260°C *3s *≥2mm ≤350°C 3s ≥2mm SMD Displays ESD Precautions (back to top) InGaN/GaN material LEDs are sensitive to electrostatic discharge (ESD) and other transient voltage spikes. ESD and voltage spikes can affect the component’s performance due to increased reverse current and/or decreased forward voltage. This may result in reduced light intensity and/or component failure. Static discharge may occur when static sensitive LEDs come in contact with the user or other conductive devices. ESD sensitive LEDs must incorporate protective circuitry to prevent ESD and to control voltage spikes in order to stay within the maximum voltage specified. SunLED | Technical Notes Ver. 1.0a 1031 17 ESD Precautions cont’d (back to top) SunLED products are stored in anti-static bags for protection during transportation and storage. However, below anti-static measures should always be noted when handling static sensitive components. 1. Operators must wear anti-static wristbands. 2. Operators must wear anti-static suits when entering work areas with conductive machinery and materials. 3. All test instruments and production machinery must be grounded. 4. Avoid static build up by minimizing friction between the LED and its surroundings. 5. Humidity level should be maintained at 50% or higher in a production environment. 6. All workstations that handle ESD sensitive components must maintain an electrostatic condition of 150V or less. 7. All anti-static measures noted above should be periodically checked and inspected to ensure proper functionality. Design Notes (back to top) 1. Protective current-limiting resistors should be used in conjunction with LEDs to ensure parts are operating within specified current range. 2. The driving circuit should be designed to avoid reverse voltages and transient voltage spikes when the circuit is in both on & off states. 3. When LEDs are mounted in a parallel configuration, there should be individual currentlimiting resistors in series with each LED. Refer to below diagram (Fig. 12) for an example of a recommended set up. Fig. 12 4. Mounting direction of SMD components should be placed perpendicular to the direction of PCB travel. This will ensure the solder wets on each lead simultaneously during reflow and prevent shifting of LEDs. Refer to below diagram (Fig. 13) for examples of recommended mounting direction. SunLED | Technical Notes Ver. 1.0a 1031 18 Design Notes cont’d (back to top) Fig. 13 5. High-power LED devices require optimization of heat dissipation. Increasing the size of metal mounting surface and proper application of thermal conductive paste will help improve heat dissipation. Refer to below diagram (Fig. 14) and product datasheets for specific design recommendations. Conventional Pad Improved Pad Design Fig. 14 6. High temperatures may reduce component’s performance and reliability. Please refer to individual product datasheets for specific details on operable temperature range and effects of temperature on the LED. SunLED | Technical Notes Ver. 1.0a 1031 19 Additional Remarks (back to top) 1. LED devices may contain Gallium Arsenide (GaAs). GaAs dust and fumes are toxic and harmful if ingested. Do not expose LEDs to chemical solvents and/or break open LED components. 2. The light output from UV, blue, and high-power LEDs may cause injury to the human eye when viewed directly. 3. Semiconductor devices can fail or malfunction due to their sensitivity to electrical fluctuation and physical stress. In design development, please make certain that SunLED products are used within the specified operating conditions as indicated on our most current product datasheets. The user is responsible to observe and follow all safety measures to avoid situations where the failure or malfunction of a SunLED product could cause injury, property damage, or the loss of human life. 4. SunLED products are bin sorted for intensity and wavelength. To ensure intensity and color consistency when using multiple LEDs in an array, it is recommended to use parts within the same bin code. Each bag, reel, or tube of LEDs contain a single intensity and wavelength code and is indicated on the part number label. Refer to below diagram (Fig. 15) for bin code identification and reference above section (I. Bin Codes) for specification data. Fig. 15 5. Prolonged reverse bias should be avoided as it could cause metal migration leading to an increase in leakage current or causing a short circuit. 6. Contents within this document are subject to improvement and enhancement changes without notice. SunLED | Technical Notes Ver. 1.0a 1031 20