TECHNICAL

TECHNICAL
59
60
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INTENSITY CODES
WAVELENGTH CODES
RELIABILITY TESTS
SOLDERING INSTRUCTIONS
APPLICATION NOTES
INTENSITY CODES
Bin
Code
www.SunLED.com
Intensity Code for Standard LEDs
Intensity Code for Displays
(Ta=25°C; Tolerance +/-15%)
(Ta=25°C; Tolerance +/-15%)
Light intensity in
mcd(10mA)
min.
max.
F
0.1
0.2
G
0.2
H
I
Bin
Code
Light intensity in
mcd(10mA)
min.
max.
R
15
20
0.35
S
20
0.35
0.5
T
0.5
0.8
U
Bin
Code
Light intensity in
mcd(10mA)
min .
max.
ZB
550
700
30
ZC
700
1000
30
50
ZD
1000
1600
50
80
ZE
1600
2200
Bin
Code
Light intensity in
ucd(10mA)
min.
max.
C
70
140
D
140
E
Light intensity in
ucd(10mA)
Bin
Code
min.
max.
P
14000
21000
240
Q
21000
31000
240
360
R
31000
52000
F
360
560
S
52000
88000
G
560
900
T
88000
150000
H
900
1400
U
150000
255000
I
1400
2200
V
255000
433000
K
2200
3600
W
433000
736000
L
3600
5600
X
736000
1251000
K
0.8
1.2
V
80
120
ZF
2200
2800
L
1.2
2
W
120
180
ZG
2800
3400
M
2
4
X
180
250
ZH
3400
4300
N
4
6
Y
250
320
ZM
4300
5200
P
6
10
Z
320
450
ZN
5200
6300
M
5600
9000
Y
1251000
2126000
Q
10
15
ZA
450
550
ZP
6300
7400
N
9000
14000
Z
2126000
3614000
Intensity Code for High Intensity LEDs
Intensity Codes for High Powered LEDs
(Ta=25°C; Tolerance +/-15%)
(Ta=25°C; Tolerance: +/-15%)
Light intensity
in mcd(20mA)
Bin Code
Min.
Light intensity
in mcd(20mA)
Bin Code
Max.
Min.
Bin Code
Max.
A
2
3
ZA
3100
3600
B
3
5
ZB
3600
4200
C
5
8
ZC
4200
5000
D
8
12
ZD
5000
6000
E
12
20
ZE
6000
7000
Luminous Flux
in lm
Bin Code
Luminous Flux
in lm
Min.
Max.
Min.
Max.
A1
0.5
0.6
B10
50
60
A2
0.6
0.7
B11
60
70
A3
0.7
0.8
B12
70
80
A4
0.8
1
B13
80
90
A5
1
1.2
B14
90
100
A6
1.2
1.4
C1
100
120
A7
1.4
1.7
C2
120
140
A8
1.7
2
C3
140
160
A9
2
2.4
C4
160
180
F
20
40
ZF
7000
8000
G
40
55
ZG
8000
9000
H
55
80
ZH
9000
11000
A10
2.4
2.9
C5
180
210
M
80
120
ZM
11000
14000
A11
2.9
3.5
C6
210
240
N
120
200
ZN
14000
18000
A12
3.5
4.2
C7
240
280
P
200
300
ZP
18000
22000
A13
4.2
5
C8
280
320
A14
5
6
C9
320
370
400
ZQ
22000
27000
A15
6
7.2
C10
370
430
R
400
500
ZR
27000
35000
A16
7.2
8.6
C11
430
490
A17
8.6
10
C12
490
560
B1
10
12
C13
560
640
B2
12
14
C14
640
740
B3
14
17
C15
740
850
S
500
700
ZS
35000
43000
T
700
1000
ZT
43000
55000
U
1000
1300
ZU
55000
75000
V
1300
1600
ZV
75000
130000
B4
17
20
C16
850
1000
W
1600
1900
ZW
130000
200000
B5
20
24
D1
1000
1200
B6
24
29
D2
1200
1400
B7
29
35
D3
1400
1600
B8
35
42
D4
1600
1800
B9
42
50
D5
1800
2100
X
1900
2300
ZX
200000
320000
Y
2300
2700
ZY
320000
490000
Z
2700
3100
ZZ
490000
800000
TECHNICAL
300
INTENSITY CODES
Q
59
INTENSITY CODES
www.SunLED.com
Code for NPN Phototransistors
Code for Infrared Emitting Diodes
(Ta=25°C; Tolerance +/-15%)
(Ta=25°C; Tolerance +/-15%) Photocurrent(mA)
min.
max.
F
0.1
0.2
G
0.2
H
Radiant intensity
in mW/sr(20mA)
Photocurrent(mA)
Bin Code
Bin Code
Bin Code
min.
max.
L
1.2
2
0.35
M
2
0.35
0.5
N
I
0.5
0.8
P
K
0.8
1.2
min.
max.
AK
0.8
1.2
4
AL
1.2
4
6
A
6
10
Bin Code
Radiant intensity
in mW/sr(20mA)
min.
max.
D
8
12
2
E
12
20
2
3
F
20
40
B
3
5
G
40
55
C
5
8
H
55
80
WAVELENGTH CODES
Color Code for LEDs and Displays (Ta=25°C; Tolerance: +/-1nm)
Dom. Wavelength (nm)
Green
Bin Code
Aqua Green
min.
max.
min.
0
556
559
1
559
561
497
2
561
563
3
563
4
True Green
max.
Yellow
min.
max.
min.
max.
510
515
501
515
520
581
584
501
504
520
525
584
586
565
504
506
525
530
586
588
565
567
506
508
530
535
588
590
5
567
569
508
510
535
540
590
592
6
569
571
510
512
592
594
7
571
573
512
515
594
597
8
573
575
597
600
Color Code for LEDs and Displays (Ta=25°C; Tolerance: +/-1nm)
Dom. Wavelength (nm)
Blue
INTENSITY WAVELENGTH CODES
TECHNICAL
Bin Code
60
Dom. Wavelength (nm)
Bin Code
min.
max.
1
445
450
2
450
3
Blue
min.
max.
3A
471
473
455
3B
473
475
455
460
4A
475
477
1A
460
463
4B
477
479
1B
463
466
5A
479
481
2A
466
469
5B
481
483
2B
469
471
5C
483
486
RELIABILITY TESTS
www.SunLED.com
SMD LED Products
Test Item
Continuous operating
Test Conditions
Ta=25°C T=1000hrs
RH=75%RH, IF(Max)
Description
Reference
Standard
The purpose of this test is to determine the resistance of the
device when operating under electrical stress
EIAJ ED-4701 100 101
High temperature storage
Ta=100°C T=1000hrs
The purpose of this test is to evaluate the product durability
after long-term storage in high temperature
EIAJ ED-4701 200 201
Low temperature storage
Ta=-40°C T=1000hrs
The purpose of this test is to evaluate the product durability
after long-term storage in low temperature
EIAJ ED-4701 200 202
The purpose of this test is to evaluate product durability
under long-term high temperature and high humidity storage
EIAJ ED-4701 100 103
The purpose of this test is to determine the resistance of the
device under electrical and thermal stress
EIAJ ED-4701 100 102
High temperature and
humidity storage
High temperature and
humidity operating
Ta=60°C T=1000hrs
RH=90%RH
Ta=60°C T=1000hrs
RH=90%RH, IF(Max)
Solderability
Ta=245°C T=5sec
The purpose of this test is to evaluate solderability on leads
of device
EIAJ ED-4701 300 303
Soldering resistance
Ta=260°C T=10sec
The purpose of this test is to determine the thermal resistance
characteristics of the device to sudden exposures at extreme
changes in temperature during Tin-dipping
EIAJ ED-4701 300 302
The purpose of this test is to determine the resistance of the
device to storage under extreme temperature for hours
EIAJ ED-4701 100 105
Temperature cycling
Temperature cycling
operating
Thermal shock
Ta=-40°C~25°C~100°C~25°C
T=(30min~5min~30min~5min)×10cycles
Ta=-40°C~25°C~100°C~25°C IF(Max)
T=(30min~5min~30min~5min)×10cycles
Ta=0°C~100°C
T=5min~5min×100cycles
The purpose of this test is to determine the resistance of the
device under extreme temperature for hours
The purpose of this test is to determine the resistance of the device to
sudden extreme changes in high and low temperature
N/A
EIAJ ED-4701 300 307
LED Displays
Test Item
Continuous operating
Test Conditions
Ta=25°C T=1000hrs
RH=75%RH, IF(Max)
Description
Reference Standard
The purpose of this test is to determine the resistance of the
device when operating under electrical stress
EIAJ ED-4701 100 101
The purpose of this test is to evaluate the product durability
after long-term storage in high temperature
EIAJ ED-4701 200 201
Low temperature storage
Ta=-40°C T=1000hrs
The purpose of this test is to evaluate the product durability
after long-term storage in low temperature
EIAJ ED-4701 200 202
The purpose of this test is to evaluate product durability
under long-term high temperature and high humidity storage
EIAJ ED-4701 100 103
High temperature and
humidity storage
Ta=60°C T=1000hrs
RH=90%RH
Solderability
Ta=245°C T=5sec
The purpose of this test is to evaluate solderability on leads
of device
EIAJ ED-4701 300 303
Soldering resistance
Ta=260°C T=10sec
The purpose of this test is to determine the thermal resistance
characteristics of the device to sudden exposures at extreme
changes in temperature during Tin-dipping
EIAJ ED-4701 300 302
The purpose of this test is to determine the resistance of the
device to storage under extreme temperature for hours
EIAJ ED-4701 100 105
The purpose of this test is to determine the resistance of the device to
sudden extreme changes in high and low temperature
EIAJ ED-4701 300 307
Temperature cycling
Thermal shock
Ta=-40°C~25°C~100°C~25°C
T=(30min~5min~30min~5min)×10cycles
Ta=0°C~100°C
T=5min~5min×100cycles
TECHNICAL
Ta=100°C T=1000hrs
RELIABILITY TESTS
High temperature storage
61
RELIABILITY TESTS
www.SunLED.com
LED Lamps
Test Item
Test Conditions
Ta=25°C T=1000hrs
Continuous operating
RH=75%RH, IF(Max)
EIAJ ED-4701 100 101
The purpose of this test is to evaluate the product durability
after long-term storage in high temperature
EIAJ ED-4701 200 201
Low temperature storage
Ta=-40°C T=1000hrs
The purpose of this test is to evaluate the product durability
after long-term storage in low temperature
EIAJ ED-4701 200 202
The purpose of this test is to evaluate product durability
under long-term high temperature and high humidity storage
EIAJ ED-4701 100 103
The purpose of this test is to determine the resistance of the
device under electrical and thermal stress
EIAJ ED-4701 100 102
Ta=60°C T=1000hrs
RH=90%RH
Ta=60°C T=1000hrs
RH=90%RH, IF(Max)
Lead frame bending
Bend 90°C T=3 cycles
The purpose of this test is to evaluate products durability
against mechanical stress applied to leads
N/A
Lead frame pulling
W=1kg T=30sec
The purpose of this test is to evaluate products durability
against mechanical stress
N/A
Solderability
Ta=245°C T=5sec
The purpose of this test is to evaluate solderability on leads
of device
EIAJ ED-4701 300 303
Soldering resistance
Ta=260°C T=10sec
The purpose of this test is to determine the thermal resistance
characteristics of the device to sudden exposures at extreme
changes in temperature during Tin-dipping
EIAJ ED-4701 300 302
The purpose of this test is to determine the resistance of the
device to storage under extreme temperature for hours
EIAJ ED-4701 100 105
Ta=-40°C~25°C~100°C~25°C
Temperature cycling
T=(30min~5min~30min~5min)×10cycles
Temperature cycling
operating
Ta=-40°C~25°C~100°C~25°C IF(Max)
T=(30min~5min~30min~5min)×10cycles
Ta=0°C~100°C
Thermal shock
T=5min~5min×100cycles
RELIABILITY TESTS
The purpose of this test is to determine the resistance of the
device when operating under electrical stress
Ta=100°C T=1000hrs
High temperature and
humidity operating
TECHNICAL
Reference
Standard
High temperature storage
High temperature and
humidity storage
62
Description
The purpose of this test is to determine the resistance of the
device under extreme temperature for hours
The purpose of this test is to determine the resistance of
the device to sudden extreme changes in high and low
temperature
N/A
EIAJ ED-4701 300 307
SOLDERING INSTRUCTIONS
www.SunLED.com
1. Manual soldering operations should only be for repairs and reworks unless otherwise noted on product specifications.
2. Maximum soldering iron temperatures for manual soldering:
a. Pb-Sn solder: 300°C
b. Pb-Free solder: 350°C
c. All LEDs using InGaN material (Blue, Green, White): 280°C
3. The soldering iron should never touch the epoxy lens. Contact duration with the component should not exceed 3 seconds.
4. Do not apply stress or pressure to the leads when the component is heated above 80°C as possible damage to the internal wire bonds
may occur.
5. During soldering, component covers and holders should leave enough clearance to avoid any stress applied to the LED. Refer to below
diagram (Fig. 1) for examples of proper method.
6. Refer to below diagrams for recommended soldering profiles.
a. SMD LEDs: Reflow Soldering – Pb-Free Solder (Fig. 2) | Pb-Sn Solder (Fig. 3)
-No more than two soldering passes except SMD CBIs which should not exceed one pass
b. Through-hole LEDs: Wave Soldering – Pb-Free Solder (Fig. 4) | Pb-Sn Solder (Fig. 5)
-No more than one soldering pass
TECHNICAL
SOLDERING INSTRUCTIONS
The technical notes in this catalog are subject to change without notice.
63
SOLDERING INSTRUCTIONS
www.SunLED.com
7. Refer to the appropriate product datasheet for details on specific soldering pay layout. To ensure proper bonding and setting of
the LED, solder paste must be evenly applied to each soldering pad. Refer to below diagram (Fig. 6) for example of improper solder
application.
Fig. 6
8. After soldering, allow at least three minutes for the component to cool to room temperature before further processing.
9. Refer to below table for summary of soldering instructions for dip, wave, and manual solder. Note that these are considered general
instructions and all soldering notes indicated above should take precedence.
Dip soldering / *Wave Soldering
Types
Iron soldering (with 1.5mm iron tip)
Temperature of
the soldering
bath
Maximum
soldering
time
Distance from
solder joint
to package
Temperature of
soldering iron
Maximum
soldering
time
Distance from
solder joint
to package
<=260°C
3s
>=2mm
<=350°C
3s
>2mm
<=260°C
5s
>=5mm
<=350°C
5s
>5mm
SMDs
/
/
/
<=350°C
3s
(one time only)
/
DISPLAYs
*<=260°C
*3s
*>2mm
<=350°C
3s
>2mm
LEDs
APPLICATION NOTES
Cleaning
1. Do not use harsh organic solvents such as acetone, trichloroethylene, Chlorsan, and/or diflon solvent for cleaning as they may cause
damage or hazing to the LED lens.
2. Recommended solvents for cleaning: deionized water or isopropyl alcohol.
3. Special attention should be taken if other chemicals are used for cleaning as they may damage the epoxy lens or housing.
4. Any cleaning should take place at room temperature and the wash duration should not exceed one minute.
5. Use forced-air drying immediately following water wash to remove excess moisture.
Lead Forming
SOLDERING APPLICATION NOTES
TECHNICAL
1. Any lead forming or bending must be done prior to soldering.
2. Avoid bending leads at the same point more than once as it may compromise the integrity of the leads.
3. Minimum clearance of 3mm is required between the base of the LED lens and the bend location. Refer to below diagram (Fig. 7).
Fig. 7
The technical notes in this catalog are subject to change without notice.
64
APPLICATION NOTES
www.SunLED.com
4. Lead forming should only be done with proper tools such as a jig and/or radio pliers. The upper section of the leads should be
secured firmly such that the bending force is not exerted on the LED body. Refer to below diagram (Fig. 8) for recommended lead
bending method.
ESD Precautions
InGaN/GaN material LEDs are sensitive to electrostatic discharge (ESD) and other transient voltage spikes. ESD and voltage spikes can
affect the component’s performance due to increased reverse current and/or decreased forward voltage. This may result in reduced
light intensity and/or component failure. Static discharge may occur when static sensitive LEDs come in contact with the user or other
conductive devices. ESD sensitive LEDs must incorporate protective circuitry to prevent ESD and to control voltage spikes in order to
stay within the maximum voltage specified.
SunLED products are stored in anti-static bags for protection during transportation and storage. However, below anti-static measures
should always be noted when handling static sensitive components.
1. Operators must wear anti-static wristbands.
2. Operators must wear anti-static suits when entering work areas with conductive machinery and materials.
3. All test instruments and production machinery must be grounded.
4. Avoid static build up by minimizing friction between the LED and its surroundings.
5. Humidity level should be maintained at 50% or higher in a production environment.
6. All workstations that handle ESD sensitive components must maintain an electrostatic condition of 150V or less.
7. All anti-static measures noted above should be periodically checked and inspected to ensure proper functionality.
Design Notes
1. Protective current-limiting resistors should be used in conjunction with LEDs to ensure parts are operating within specified current
range.
2. The driving circuit should be designed to avoid reverse voltages and transient voltage spikes when the circuit is in both on & off
states.
TECHNICAL
Refer to below diagram (Fig. 9) for an example of a recommended set up.
APPLICATION NOTES
3. When LEDs are mounted in a parallel configuration, there should be individual current-limiting resistors in series with each LED.
The technical notes in this catalog are subject to change without notice.
65
APPLICATION NOTES
www.SunLED.com
4. Mounting direction of SMD components should be placed perpendicular to the direction of PCB travel. This will ensure the solder wets
on each lead simultaneously during reflow and prevent shifting of LEDs. Refer to below diagram (Fig. 10) for examples of recommended
mounting direction.
Fig. 10
5. High-power LED devices require optimization of heat dissipation. Increasing the size of metal mounting surface and proper application
of thermal conductive paste will help improve heat dissipation. Refer to below diagram (Fig. 11) and product datasheets for specific
design recommendations.
Fig. 11
6. High temperatures may reduce component’s performance and reliability. Please refer to individual product datasheets for specific
details on operable temperature range and effects of temperature on the LED.
Additional Notes
1. LED devices may contain Gallium Arsenide (GaAs). GaAs dust and fumes are toxic and harmful if ingested. Do not expose LEDs to
chemical solvents and/or break open LED devices.
2. The light output from UV, blue, and high-power LEDs may cause injury to the human eye when viewed directly.
3. Semiconductor devices can fail or malfunction due to their sensitivity to electrical fluctuation and physical stress. In design
development, please make certain that SunLED products are used within the specified operating conditions as indicated on our most
APPLICATION NOTES
TECHNICAL
current product datasheets. The user is responsible to observe and follow all safety measures to avoid situations where the failure or
malfunction of a SunLED product could cause injury, property damage, or the loss of human life.
4. Reference http://www.SunLED.com/TechnicalNotes for complete technical notes.
The technical notes in this catalog are subject to change without notice.
66