SunLED

Part Number: ZDG25X92S-4
3.5x3.5 mm SMD CHIP LED LAMP
www.SunLED.com
Features
Application Note
z Ideal for indication light on hand held products
Static electricity and surge damage the LEDS.
z Long life and robust package
It is recommended to use a wrist band or anti-electrostatic
z Variety of lens types and color choices available
glove when handling the LEDs.
z ESD protection
All devices, equipment and machinery must be electrically
z Package: 2000pcs / reel
grounded.
z Moisture sensitivity level : level 2a
Applications
z RoHS compliant
z Signal and symbol luminaire for orientation.
z Marker lights (e.g. steps, exit ways, etc).
z Decorative and entertainment lighting.
z Commercial and residential lighting.
z Automotive interior lighting.
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Package Schematics
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Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
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Part Number: ZDG25X92S-4
3.5x3.5 mm SMD CHIP LED LAMP
www.SunLED.com
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
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3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise
pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
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Part Number: ZDG25X92S-4
3.5x3.5 mm SMD CHIP LED LAMP
www.SunLED.com
Part
Number
Emitting
Color
ZDG25X92S-4
Green
Emitting
Material
Luminous Intensity
CIE127-2007*
(IF=150mA)
cd
Lens-color
InGaN
Luminous Flux
CIE127-2007*
(IF=150mA)
lm
min.
typ.
min.
typ.
4.2*
5.99*
14*
19.7*
Water Clear
Viewing
Angle
2 θ 1/2 [1]
120°
Notes:
1. θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. LEDs are binned according to their luminous flux.
* Luminous intensity / luminous flux value is in accordance with CIE127-2007 standards.
Absolute Maximum Ratings at TA=25°C
Parameter
Symbol
Value
Unit
Power Dissipation
PD
600
mW
Junction Temperature [1]
TJ
110
°C
Operating Temperature
Top
-40 To +85
°C
Storage Temperature
Tstg
-40 To +85
°C
IF
150
mA
300
mA
5
V
170
°C/W
50
°C/W
8000
V
DC Forward Current[1]
Peak Forward Current [3]
IFM
Reverse Voltage
VR
Rth j-a
Thermal Resistance [1]
(Junction/solder point)
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Electrostatic Discharge Threshold (HBM)
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Thermal Resistance [1]
(Junction/ambient)
Rth j-S
Notes:
1.Results from mounting on PC board FR4(pad size≥70mm 2 ), mounted on pc board-metal core PCB is recommend
for lowest thermal Resistance.
2.1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA=25°C
Parameter
Wavelength at peak emission
Dominant Wavelength
IF=150mA CIE127-2007*
[Typ.]
IF=150mA CIE127-2007* [Typ.]
Spectral Line Half-width IF=150mA [Typ.]
Symbol
Value
Unit
λ peak
515*
nm
λ dom
525*
nm
Δλ
30
nm
Forward Voltage IF=150mA [Min.]
Forward Voltage IF=150mA [Typ.]
2.9
VF
Forward Voltage IF=150mA [Max.]
3.5
V
4.0
Allowable Reverse Current [Max.]
IR
85
mA
Temperature coefficient of λ peak
IF=150mA, -10°C≤ T≤100°C
[Typ.]
TC λ peak
0.09
nm/°C
Temperature coefficient of λ dom
IF=150mA, -10°C≤ T≤100°C
[Typ.]
TC λ dom
0.03
nm/°C
Temperature coefficient of VF
IF=150mA, -10°C≤ T≤100°C [Typ.]
TCV
-2.7
mV/°C
Notes:
1.The dominant Wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward Voltage: +/-0.1V.
*Wavelength value is in accordance with CIE127-2007 standards.
Dec 16, 2013
SDSA8501
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Part Number: ZDG25X92S-4
www.SunLED.com
3.5x3.5 mm SMD CHIP LED LAMP
ZDG25X92S-4
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Part Number: ZDG25X92S-4
3.5x3.5 mm SMD CHIP LED LAMP
www.SunLED.com
™ LED is recommended for reflow soldering and
soldering profile is shown below.
™ The device has a single mounting surface.
The device must be mounted according to
the specifications.
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™ Reel Dimension
™ Recommended Soldering Pattern
™ Tape Specification (Units : mm)
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Part Number: ZDG25X92S-4
3.5x3.5 mm SMD CHIP LED LAMP
www.SunLED.com
PACKING & LABEL SPECIFICATIONS
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TERMS OF USE
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.
2. Contents within this document are subject to improvement and enhancement changes without notice.
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.
5. The contents within this document may not be altered without prior consent by SunLED.
6. Additional technical notes are available at http://www.SunLED.com/TechnicalNotes
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