Omron G3VM-21LR1(TR05) datasheet: pdf

MOS FET Relays
G3VM-21LR1
World’s Smallest SSOP Package MOS
FET Relays with Low Output
Capacitance and ON Resistance (C×R =
5pF•Ω) in a 20-V Load Voltage Model.
• ON resistance of 1 Ω (typical) suppresses output signal
attenuation.
• Information correct as of October 2002, according to data obtained by OMRON.
RoHS compliant
Note:
!
The actual product is marked differently from the image
shown here.
■ Application Examples
• Semiconductor inspection tools
• Measurement devices
• Broadband systems
• Data loggers
■ List of Models
Contact form
SPST-NO
Terminals
Surface-mounting
terminals
Load voltage (peak value)
Model
20 VAC
Number per tape
G3VM-21LR1
---
G3VM-21LR1(TR) 1,500
■ Dimensions
Note:
All units are in millimeters unless otherwise indicated.
G3VM-21LR1
4.2
211
228
1.7
1.4 dia.
3.5
0.15
Note: The actual product is marked differently
from the image shown here.
0.3
1.27
0.2
1.8
Note: A tolerance of ±0.1 mm applies to
all dimensions unless otherwise
specified.
3.8
2.04
0.46±0.2
Weight: 0.03 g
■ Terminal Arrangement/Internal Connections (Top View)
G3VM-21LR1
4
3
1
2
■ Actual Mounting Pad Dimensions (Recommended Value, Top View)
G3VM-21LR1
0.95 3.73
0.8
1.27
106
G3VM-21LR1
G3VM-21LR1
■ Absolute Maximum Ratings (Ta = 25°C)
Item
Input
Symbol
Rating
Unit
Measurement Conditions
Note:
LED forward current
IF
50
mA
Repetitive peak LED forward
current
IFP
1
A
100 µs pulses, 100 pps
LED forward current reduction
rate
∆ IF/°C
−0.5
mA/°C
Ta ≥ 25°C
LED reverse voltage
VR
5
V
Connection temperature
Tj
125
°C
Output dielectric strength
VOFF
20
V
Continuous load current
IO
450
mA
ON current reduction rate
∆ ION/°C
−4.5
mA/°C
Connection temperature
Tj
125
°C
VI-O
1,500
Vrms
AC for 1 min
Operating temperature
Ta
−20 to +85
°C
With no icing or condensation
Storage temperature
Tstg
−40 to +125
°C
With no icing or condensation
Soldering temperature (10 s)
---
260
°C
10 s
Output
Dielectric strength between input and
output (See note 1.)
1. The dielectric strength between the input and
output was checked by applying voltage between all pins as a group on the LED side and
all pins as a group on the light-receiving side.
Ta ≥ 25°C
■ Electrical Characteristics (Ta = 25°C)
Item
Input
Output
Symbol
Minimum
Typical
Maximum
Unit
Measurement
conditions
Note:
LED forward voltage
VF
1.0
1.15
1.3
V
IF = 10 mA
Reverse current
IR
---
---
10
µA
VR = 5 V
Capacity between terminals
CT
---
15
---
pF
V = 0, f = 1 MHz
Trigger LED forward current
IFT
---
---
4
mA
IO = 100 mA
Maximum resistance with output ON
RON
---
0.8
1.2
Ω
IF = 5 mA,
IO = 450 mA, t = 10 ms
Current leakage when the relay is
open
ILEAK
---
---
1.0
nA
VOFF = 20 V, Ta = 50°C
Capacity between terminals
COFF
---
5.0
12.0
pF
V = 0, f = 100 MHz,
t<1s
CI-O
---
0.8
---
pF
f = 1 MHz, Vs = 0 V
Capacity between I/O terminals
Insulation resistance
RI-O
1,000
---
---
MΩ
VI-O = 500 VDC,
RoH ≤ 60%
IF = 10 mA, RL = 200 Ω,
VDD = 20 V (See note 2.)
Turn-ON time
tON
---
---
0.5
ms
Turn-OFF time
tOFF
---
---
0.5
ms
2. Turn-ON and Turn-OFF
Times
IF
1
4
2
3
RL
VDD
VOUT
IF
VOUT
10%
t ON
90%
t OFF
■ Recommended Operating Conditions
Use the G3VM under the following conditions so that the Relay will operate properly.
Item
Symbol
Minimum
Typical
Output dielectric strength
VDD
---
---
Operating LED forward current
IF
10
Continuous load current
IO
---
Operating temperature
Ta
25
---
Maximum
Unit
20
V
---
30
mA
---
450
mA
60
°C
■ Engineering Data
■ Safety Precautions
Load Current vs. Ambient Temperature
Refer to “Common Precautions” for all G3VM models.
Load current (mA)
G3VM-21LR1
600
500
400
300
200
100
0
−20
0
20
40
60
80
100
Ambient temperature (°C)
107
G3VM Series
G3VM Series
Common Precautions
!WARNING
Be sure to turn OFF the power when wiring the Relay, otherwise an electric shock may be received.
!WARNING
Do not touch the charged terminals of the SSR, otherwise an
electric shock may be received.
Protection from Surge Voltage on the Input
Terminals
If any reversed surge voltage is imposed on the input terminals,
insert a diode in parallel to the input terminals as shown in the following circuit diagram and do not impose a reversed voltage value
of 3 V or more.
Surge Voltage Protection Circuit Example
!Caution
Do not apply overvoltage or overcurrent to the I/O circuits of the
SSR, otherwise the SSR may malfunction or burn.
!Caution
Be sure to wire and solder the Relay under the proper soldering
conditions, otherwise the Relay in operation may generate excessive heat and the Relay may burn.
Typical Relay Driving Circuit Examples
Protection from Spike Voltage on the Output
Terminals
If a spike voltage exceeding the absolute maximum rated value is
generated between the output terminals, insert a C-R snubber or
clamping diode in parallel to the load as shown in the following
circuit diagram to limit the spike voltage.
Spike Voltage Protection Circuit Example
C-MOS
Load
Unused Terminals (6-pin models only)
Transistor
Terminal 3 is connected to the internal circuit. Do not connect
anything to terminal 3 externally.
Load
10 to 100 kΩ
Pin Strength for Automatic Mounting
In order to maintain the characteristics of the relay, the force
imposed on any pin of the relay for automatic mounting must not
exceed the following.
Use the following formula to obtain the LED current limiting resistance value to assure that the relay operates accurately.
R1 =
VCC − VOL − VF (ON)
5 to 20 mA
Use the following formula to obtain the LED forward voltage value
to assure that the relay releases accurately.
VF (OFF) = VCC − VOH < 0.8 V
4
In direction A: 1.96 N
In direction B: 1.96 N
G3VM Series
G3VM Series
Load Connection
Solder Mounting
Do not short-circuit the input and output terminals while the relay
is operating or the relay may malfunction.
Perform solder mounting under the following recommended conditions to prevent the temperature of the Relays from rising.
AC Connection
<Flow Soldering>
Through-hole Mounting (Once Only)
Load
Solder type
DC Single Connection
Load
Preheating
Soldering
Lead solder
SnPb
150°C
60 to 120 s
230 to 260°C
10 s max.
Lead-free solder
SnAgCu
150°C
60 to 120 s
245 to 260°C
10 s max.
Note:
We recommend that the suitability of solder mounting be
verified under actual conditions.
<Reflow Soldering>
Surface Mounting DIP or SOP Packages (Twice Max.)
Load
DC Parallel Connection
Load
Solder type
Preheating
Soldering
Lead solder
SnPb
140→160°C
60 to 120 s
210°C
30 s max.
Peak
240°C max.
Lead-free solder
SnAgCu
180→190°C
60 to 120 s
230°C
30 to 50 s
Peak
260°C max.
Surface Mounting SSOP Packages (Twice Max.)
Solder type
Preheating
Soldering
Lead solder
SnPb
140→160°C
60 to 120 s
210°C
30 s max.
Peak
240°C max.
Lead-free solder
SnAgCu
150→180°C
120 s max.
230°C
30 s max.
Peak
250°C max.
Note:
1. We recommend that the suitability of solder mounting
be verified under actual conditions.
2. Tape cut SSOPs are packaged without humidity resistance. Use manual soldering to mount them.
Manual Soldering (Once Only)
Manually solder at 350°C for 3 s or less or at 260°C for 10 s or
less.
SSOP Handling Precautions
<Humidity-resistant Packaging>
Component packages can crack if surface-mounted components
that have absorbed moisture are subjected to thermal stress
when mounting. To prevent this, observe the following precautions.
1. Unopened components can be stored in the packaging at 5
to 30°C and a humidity of 90% max., but they should be
used within 12 months.
2. After the packaging has been opened, components can be
stored at 5 to 30°C and a humidity of 60% max., but they
should be mounted within 168 hours.
3. If, after opening the packaging, the humidity indicator turns
pink to the 30% mark or the expiration data is exceeded,
bake the components while they are still on the taping reel,
and use them within 72 hours. Do not bake the same components more than once.
Baking conditions: 60±5°C, 64 to 72 h
Expiration date:
12 months from the seal date
(given on the label)
4. If the same components are baked repeatedly, the tape
detachment strength will change, causing problems when
mounting. When mounting using dehumidifying measures,
always take countermeasures against component damage
from static electricity.
5. Do not throw or drop components. If the laminated packaging material is damaged, airtightness will be lost.
6. Tape cut SSOPs are packaged without humidity resistance.
Use manual soldering to mount them.
5