MOS FET Relays G3VM-61H1 New MOS FET Relays Designed for Switching Minute Signals and Analog Signals Have a 6-pin SOP Package and 60-V Load Voltage. • Continuous load current of 400 mA. • Dielectric strength of 1,500 Vrms between I/O. RoHS compliant ! Note: The actual product is marked differently from the image shown here. ■ Application Examples • Broadband systems • Measurement devices • Data loggers • Amusement machines ■ List of Models Contact form SPST-NO Terminals Surface-mounting terminals Load voltage (peak value) 60 VAC Model Number per stick 75 --- G3VM-61H1(TR) --- 2,500 ■ Dimensions Note: All units are in millimeters unless otherwise indicated. G3VM-61H1 4.4±0.25 2.1 max. 6.3±0.25 0.15 Note: The actual product is marked differently from the image shown here. 2.54±0.25 0.6±0.3 0.1±0.1 0.4±0.1 7.0±0.4 Weight: 0.13 g ■ Terminal Arrangement/Internal Connections (Top View) G3VM-61H1 6 5 4 1 2 3 ■ Actual Mounting Pad Dimensions (Recommended Value, Top View) G3VM-61H1 6 to 6.3 1.2 0.8 2.54 66 2.54 Number per tape G3VM-61H1 G3VM-61H1 G3VM-61H1 ■ Absolute Maximum Ratings (Ta = 25°C) Item Input Output Symbol Rating Unit Measurement Conditions Note: LED forward current IF 50 mA Repetitive peak LED forward current IFP 1 A 100 µs pulses, 100 pps LED forward current reduction rate ∆ IF/°C −0.5 mA/°C Ta ≥ 25°C LED reverse voltage VR 5 V Connection temperature Tj 125 °C Output dielectric strength VOFF 60 V Continuous load current IO 400 mA Connection A Connection B Connection A 800 ∆ ION/°C −4.0 Ta ≥ 25°C mA/°C Connection B −4.0 Connection B 1 6 2 5 3 4 1 6 2 5 3 4 1 6 2 5 3 4 Load AC or DC Load DC −8.0 Connection C Tj 125 °C Dielectric strength between input and output (See note 1.) VI-O 1,500 Vrms Operating temperature Ta Storage temperature Soldering temperature (10 s) Connection temperature Connection A 400 Connection C ON current reduction rate 1. The dielectric strength between the input and output was checked by applying voltage between all pins as a group on the LED side and all pins as a group on the light-receiving side. Connection Diagram AC for 1 min −40 to +85 °C With no icing or condensation Tstg −55 to +125 °C With no icing or condensation --- 260 °C 10 s Connection C Load DC ■ Electrical Characteristics (Ta = 25°C) Item Input Symbol Minimum Typical Maximum Unit Measurement conditions Note: LED forward voltage VF 1.0 1.15 1.3 V IF = 10 mA Reverse current IR --- --- 10 µA VR = 5 V Capacity between terminals CT --- 30 --- pF V = 0, f = 1 MHz Trigger LED forward current IFT --- 1.6 3 mA IO = 400 mA Maximum resistance with output ON RON --- 1 2 Ω IF = 5 mA, IO = 400 mA Connection B --- 0.5 1 Ω IF = 5 mA, IO = 400 mA Connection C --- 0.25 --- Ω IF = 5 mA, IO = 800 mA ILEAK --- --- 1.0 µA VOFF = 60 V Capacity between I/O terminals CI-O --- 0.8 --- pF f = 1 MHz, Vs = 0 V Insulation resistance RI-O 1,000 --- --- MΩ VI-O = 500 VDC, RoH ≤ 60% IF = 5 mA, RL = 200 Ω, VDD = 20 V (See note 2.) Output Connection A Current leakage when the relay is open Turn-ON time tON --- 0.8 2.0 ms Turn-OFF time tOFF --- 0.1 0.5 ms 2. Turn-ON and Turn-OFF Times IF 1 6 2 4 RL VDD VOUT IF VOUT 10% t ON 90% t OFF ■ Recommended Operating Conditions Use the G3VM under the following conditions so that the Relay will operate properly. Item Symbol Minimum Typical Output dielectric strength VDD --- --- Operating LED forward current IF 5 Continuous load current IO --- Operating temperature Ta − 20 --- Maximum Unit 48 V 7.5 25 mA --- 400 mA 65 °C ■ Engineering Data ■ Safety Precautions Load Current vs. Ambient Temperature Refer to “Common Precautions” for all G3VM models. Load current (mA) G3VM-61H1 1,000 Connection C 800 600 Connection A or connection B 400 200 0 −20 0 20 40 60 80 100 Ambient temperature (°C) 67 G3VM Series G3VM Series Common Precautions !WARNING Be sure to turn OFF the power when wiring the Relay, otherwise an electric shock may be received. !WARNING Do not touch the charged terminals of the SSR, otherwise an electric shock may be received. Protection from Surge Voltage on the Input Terminals If any reversed surge voltage is imposed on the input terminals, insert a diode in parallel to the input terminals as shown in the following circuit diagram and do not impose a reversed voltage value of 3 V or more. Surge Voltage Protection Circuit Example !Caution Do not apply overvoltage or overcurrent to the I/O circuits of the SSR, otherwise the SSR may malfunction or burn. !Caution Be sure to wire and solder the Relay under the proper soldering conditions, otherwise the Relay in operation may generate excessive heat and the Relay may burn. Typical Relay Driving Circuit Examples Protection from Spike Voltage on the Output Terminals If a spike voltage exceeding the absolute maximum rated value is generated between the output terminals, insert a C-R snubber or clamping diode in parallel to the load as shown in the following circuit diagram to limit the spike voltage. Spike Voltage Protection Circuit Example C-MOS Load Unused Terminals (6-pin models only) Transistor Terminal 3 is connected to the internal circuit. Do not connect anything to terminal 3 externally. Load 10 to 100 kΩ Pin Strength for Automatic Mounting In order to maintain the characteristics of the relay, the force imposed on any pin of the relay for automatic mounting must not exceed the following. Use the following formula to obtain the LED current limiting resistance value to assure that the relay operates accurately. R1 = VCC − VOL − VF (ON) 5 to 20 mA Use the following formula to obtain the LED forward voltage value to assure that the relay releases accurately. VF (OFF) = VCC − VOH < 0.8 V 4 In direction A: 1.96 N In direction B: 1.96 N G3VM Series G3VM Series Load Connection Solder Mounting Do not short-circuit the input and output terminals while the relay is operating or the relay may malfunction. Perform solder mounting under the following recommended conditions to prevent the temperature of the Relays from rising. AC Connection <Flow Soldering> Through-hole Mounting (Once Only) Load Solder type DC Single Connection Load Preheating Soldering Lead solder SnPb 150°C 60 to 120 s 230 to 260°C 10 s max. Lead-free solder SnAgCu 150°C 60 to 120 s 245 to 260°C 10 s max. Note: We recommend that the suitability of solder mounting be verified under actual conditions. <Reflow Soldering> Surface Mounting DIP or SOP Packages (Twice Max.) Load DC Parallel Connection Load Solder type Preheating Soldering Lead solder SnPb 140→160°C 60 to 120 s 210°C 30 s max. Peak 240°C max. Lead-free solder SnAgCu 180→190°C 60 to 120 s 230°C 30 to 50 s Peak 260°C max. Surface Mounting SSOP Packages (Twice Max.) Solder type Preheating Soldering Lead solder SnPb 140→160°C 60 to 120 s 210°C 30 s max. Peak 240°C max. Lead-free solder SnAgCu 150→180°C 120 s max. 230°C 30 s max. Peak 250°C max. Note: 1. We recommend that the suitability of solder mounting be verified under actual conditions. 2. Tape cut SSOPs are packaged without humidity resistance. Use manual soldering to mount them. Manual Soldering (Once Only) Manually solder at 350°C for 3 s or less or at 260°C for 10 s or less. SSOP Handling Precautions <Humidity-resistant Packaging> Component packages can crack if surface-mounted components that have absorbed moisture are subjected to thermal stress when mounting. To prevent this, observe the following precautions. 1. Unopened components can be stored in the packaging at 5 to 30°C and a humidity of 90% max., but they should be used within 12 months. 2. After the packaging has been opened, components can be stored at 5 to 30°C and a humidity of 60% max., but they should be mounted within 168 hours. 3. If, after opening the packaging, the humidity indicator turns pink to the 30% mark or the expiration data is exceeded, bake the components while they are still on the taping reel, and use them within 72 hours. Do not bake the same components more than once. Baking conditions: 60±5°C, 64 to 72 h Expiration date: 12 months from the seal date (given on the label) 4. If the same components are baked repeatedly, the tape detachment strength will change, causing problems when mounting. When mounting using dehumidifying measures, always take countermeasures against component damage from static electricity. 5. Do not throw or drop components. If the laminated packaging material is damaged, airtightness will be lost. 6. Tape cut SSOPs are packaged without humidity resistance. Use manual soldering to mount them. 5