IC Sockets XR2 OMRON’s IC Connectors Have Excellent Reliability and Can Tolerate Momentary Interruptions in Power. Ideal for Highspeed Data Processing. ■ Round pins and 4-point (4-finger) contact construction ensure long life and excellent shock and vibration durability. ■ Contact entry holes are large for easy insertion. ■ IC lead contacts placed high for solid connections. ■ No flux rise. ■ A wide product range: open-frame, closed-frame, single-row, carrier-type DIP terminals, wrap terminals, solder-sleeve terminals, and low-profile DIP terminals. ■ A new tin-plated product series offers more choice when it comes to selecting the optimum IC Socket for an application. ■ Conform to UL standards (file no. E 103202). RoHS Compliant ■ Construction ■ Contact Dimensions DIP Terminals Inner clip Base Low-profile DIP Terminals Wrap Terminals 1.83 dia. 1.83 dia. 1.83 dia. Outer sleeve Solder-sleeve Terminals 1.83 dia. 1.35 dia. 0.79 dia. Carrier Inner clip 0.51 dia. 0.635 × 0.635 Outer sleeve ■ Terminology z Carrier type Carrier type refers to products where only terminals are mounted by removing the carrier after mounting on the board. z Solder sleeve type Solder sleeve type refers to products with a board mounting height of 0.8 mm that can be used in locations with height restrictions. 1 Ratings and Characteristics Item Gold plated Gold flash plated Applicable Wrap Post Wire Sizes AWG30, AWG28, AWG26, AWG24 (Solid wire: 0.25 to 0.51 mm dia.) Rated current 1A Rated voltage 300 VAC Contact resistance 20 mΩ max. (at 20 mV, 100 mA max.) Insulation resistance 1,000 MΩ min. (at 500 VDC) Dielectric strength 1,000 VAC for 1 min (leakage current: 1 mA max.) Applicable IC Lead Dimensions Insertion force (See note.) 3.92 N max. DIP, Wrap, and Solder-sleeve Terminals Removal force (See note.) 0.64 N min. Insertion durability 100 times (0.75-µm gold plating), 50 times (0.25-µm gold plating) Ambient operating temperature Note: Operating: − 55 to 125°C (with no icing) Materials and Finish Fiber-glass reinforced PBT resin (UL94V-0)/ black Carrier Aluminum Inner clip Beryllium copper/nickel base, gold plated Beryllium copper/nickel base, gold flash plating Outer sleeve Note: 2 Brass/nickel base, gold flash plating For non-standard plating, contact your OMRON representative. IC Sockets XR2 3 wires Depth × width (mm) 20 times (gold flash plating) The contact insertion force and contact removal force are for a test gauge, t = 0.432 mm. Base Wrap Post Length Flat lead 0.29 ±0.09 × 0.46 ±0.08 (See note 1.) Round lead 0.53 dia. max. 0.41 dia. min. Low-profile DIP Terminals Depth × width (mm) Flat lead 0.29 ±0.09 × 0.46 ±0.08 (See note 2.) Round lead 0.50 dia. max. 0.41 dia. min. Note: 1. Do not use wire where the diagonal is more than 0.56 mm. 2. Do not use wire where the diagonal is more than 0.52 mm. 3. IC lead length of 3 mm or more (If the lead terminal is too long, the IC may rise up.) XR2B Closed-frame Sockets ■ Dimensions (unit: mm) XR2B-1611-N XR2B-1601-N Mounting holes (bottom view) 0.8 ±0.05 dia. (DIP terminals) 0.51 dia. 1.33 dia. XR2B-@@11-N XR2B-@@01-N Dimensions No. of contacts Dimensions (mm) A B 16 7.62 17.78 24 15.24 27.94 28 15.24 33.02 32 15.24 38.10 40 15.24 48.26 0.51 dia. 1.33 dia. ■ Ordering Information Appearance No. of contacts Row pitch (A) (mm) Sockets with DIP terminals With 0.25-µm gold plating With 0.75-µm gold plating 16 7.62 XR2B-1611-N XR2B-1601-N 24 15.24 XR2B-2411-N XR2B-2401-N 28 15.24 XR2B-2811-N XR2B-2801-N 32 15.24 XR2B-3211-N XR2B-3201-N 40 15.24 XR2B-4011-N XR2B-4001-N IC Sockets XR2 5