2SC4617

TAK CHEONG
®
SEM IC O N DU C TO R
150mW SOT-523 SURFACE MOUNT
2SC4617
Green Product
Plastic Package
NPN Silicon General Purpose Transistor
3
Absolute Maximum Ratings
Symbol
TA = 25°C unless otherwise noted
Parameter
2
Value
Units
PC
Collector Power Dissipation
150
mW
TSTG
Storage Temperature Range
-55 to +150
°C
+150
°C
TJ
Operating Junction Temperature
VCBO
Collector-Base Voltage
50
V
VCEO
Collector-Emitter Voltage
50
V
VEBO
Emitter-Base Voltage
5
V
100
mA
IC
Collector Current - Continuous
1
SOT-523
These ratings are limiting values above which the serviceability of the diode may be impaired.
pecification Features:
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
Electrical Symbol:
Low Cob = 2.0pF (Typical)
Low Vce(sat) < 0.4V
RoHS Compliant
Green EMC
Matte Tin(Sn) Lead Finish
Weight: approx. 0.002g
TA = 25°C unless otherwise noted
Electrical Characteristics
Parameter
Symbol
Test Condition
Limits
Min
Typ
Max
Unit
V(BR)CBO
Collector-Base Breakdown Voltage
IC=50uA, IE=0A
50
Volts
V(BR)CEO
Collector-Emitter Breakdown Voltage
IC=1mA, IB=0A
50
Volts
V(BR)EBO
Emitter-Base Breakdown Voltage
IE=50uA, IC=0A
5
Volts
ICBO
Collector Cut-off Current
VCB=50V, IE=0A
0.1
µA
IEBO
Emitter Cut-off Current
VEB=5V, IC=0A
0.1
µA
hFE
DC Current Gain
VCE=6V, IC=1mA
560
---
Collector-Emitter Saturation Voltage
IC=50mA, IB=5mA
0.4
Volts
Transition Frequency
VCE =5V, IC=10mA
f=30MHz
280
MHz
Collector Output Capacitance
VCB =12V, IE =0A,
f=1MHz
2.0
pF
VCE(sat)
fT
COB
120
DB Number: DB-245
April 2015, Revision A
Page 1
TAK CHEONG
®
SEM IC O N DU C TO R
Classification of hFE
Rank
Range
Marking
Q
R
S
120 - 270
180 - 390
270 - 560
BQ
BR
BS
SOT-523 Package Outline
DIM
Typical Soldering Pattern:
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
0.70
0.90
0.028
0.035
A1
0.00
0.10
0.000
0.004
A2
0.70
0.80
0.028
0.031
b1
0.15
0.25
0.006
0.010
b2
0.25
0.35
0.010
0.014
c
0.10
0.20
0.004
0.008
D
1.50
1.70
0.059
0.067
E
0.70
0.90
0.028
0.035
E1
1.45
1.75
0.057
0.069
e
e1
0.50 TYP.
0.90
L
L1
θ
0.020 TYP.
1.10
0.035
0.40 REF.
0.10
0
O
0.043
0.016 REF.
0.30
8
O
0.004
0
O
0.012
8
O
NOTES:
1. Above package outline conforms to JEITA EAIJ ED-7500A SC-75A.
2. Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions.
DB Number: DB-245
April 2015, Revision A
Page 2
TAK CHEONG
®
DISC LA I MER NOTIC E
NOTICE
The information presented in this document is for reference only. Tak Cheong reserves the right to make
changes without notice for the specification of the products displayed herein.
The product listed herein is designed to be used with ordinary electronic equipment or devices, and not
designed to be used with equipment or devices which require high level of reliability and the malfunction of with
would directly endanger human life (such as medical instruments, transportation equipment, aerospace
machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor
Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such
improper use of sale.
This publication supersedes & replaces all information reviously supplied. For additional information, please visit
our website http://www.takcheong.com, or consult your nearest Tak Cheong’s sales office for further assistance.
Number: DB-100
April 14, 2008 / A