LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE PROCEDURE No. PCP3003 Computer File Name: PCP3003~A4_Capability_Document. doc Page 1 of 11 Title: PCB MANUFACTURING CAPABILITY CONTENTS 1. Introduction 2. Data Interface 3. Drilling 4. Machining (Metal Backed) 5. Routing (Softboard/Multilayer) 6. Feature Imaging 7. Surface Finish 8. Solder Mask/Notation 9. Chip & Wire Assembly Status Authorised by: Mr P. Bagley Signed Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 2 of 11 Title: PCB MANUFACTURING CAPABILITY 1. Introduction Labtech’s capabilities are geared towards the successful manufacture of microwave PTFE Printed Circuit Boards and has significant experience meeting the demands of this sector. The following pages present Labtech’s capabilities by specific process. Labtech produces the following PCB types: Metal Backed PTFE Circuits Aluminium, Brass and Copper carrier Post and pre-bonded processing PTH through PTFE and metal carrier Single Sided & Double Sided Soft PTFE Circuits High tolerance softboard Multilayer Microwave Circuits PTFE Multilayer Mixed dielectric multilayers Metal backed multilayers Metal core multilayers Fusion bonded multilayers Blind & buried vias Conformal multilayers Assembly of embedded resistors, capacitors and connectors Chip and wire assembly For details of laminates used, refer to the file ‘Microwave Materials’ (located under ‘PDF Index’) on our website, www.labtechmicrowave.com Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 3 of 11 Title: PCB MANUFACTURING CAPABILITY 2. Data Interface Data Submittal Methods E-mail: Modem: FTP: Post: [email protected] Contact Technical Sales Contact Technical Sales 3.5” Disc/ CD Rom / Hard Copy Drawings / Photography Masters Data Formats PCB Design Data: Gerber / Extended Gerber (RS-274X) Graphicode Workfile Autocad DWG / DXF Excellon / Sieb & Meyer NC Data 3D Mechanical Design: Autocad DWG / DXF IGES Please note PCB design data submitted in Autcad DWG / DXF format will require approval plots following translation. Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 4 of 11 Title: PCB MANUFACTURING CAPABILITY 3. Drilling Minimum Feature Softboard / Multilayer Holes Brass / Copper Backed Holes Aluminium Backed Holes Standard 0.30mm 0.80mm 1.00mm 0.15mm Laser Drilled Vias 0.012” 0.032” 0.040” 0.006” Technical 0.20mm 0.40mm 0.60mm 0.10mm R&D 0.008" 0.016” 0.024” 0.004" 0.05mm 0.002” Maximum Aspect Ratio (Board Thickness : Hole Diameter) Standard Technical Aluminium Backed Blind Holes 5:1 up to 1.6mm thickness 6:1 above 1.6mm thickness 8:1 4:1 1:1 On metal backed circuits aspect ratios may be reduced by machining a recess into the metal backing, by agreement. Minimum Hole to Hole Spacing Standard R&D 0.20mm 0.10 mm 0.008" 0.004” +/- 0.075mm +/- 0.050mm +/- 0.003" +/- 0.002" +/- 0.050mm +/- 0.020mm +/- 0.002" +/- 0.0008" Plated Through Hole Diameter Tolerance (Finished) Standard Technical Non-Plated Through Hole Diameter Tolerance Standard Technical Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 5 of 11 Title: PCB MANUFACTURING CAPABILITY Positional Tolerance Hole – Hole +/- 0.020mm +/- 0.0008" +/- 0.100mm +/- 0.050mm +/- 0.025mm +/- 0.004" +/- 0.002" +/- 0.001 “Z” Axis Depth Control (Softboard / Multilayers) Standard Technical R&D 4. Machining (Metal Backed) Profile Feature Tolerance Standard Technical R&D +/- 0.100mm +/-0.050mm +/- 0.025mm +/- 0.004" +/- 0.002" +/- 0.001 Minimum Internal Radii Standard Technical R&D NB: 1.00mm 0.50mm 0.20mm 0.040" 0.020" 0.008 Smaller effective internal radii of corners can be achieved by permitting ‘overshooting’. Laser machining can be used to ablate material to expose heavy metal backing. Alignment to Circuit Image Standard Technical +/- 0.100mm +/-0.050mm +/- 0.004" +/- 0.002" 2 “Z” - Axis Depth Control Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 6 of 11 Title: PCB MANUFACTURING CAPABILITY Standard (Mechanical) Technical (Mechanical) Status +/- 0.100mm +/-0.050mm Authorised by: Mr P. Bagley +/- 0.004" +/- 0.002" Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 7 of 11 Title: PCB MANUFACTURING CAPABILITY 5. Routing (Softboard/Multilayer) Profile Feature Tolerance Standard (Mechanical) Technical (Mechanical) Laser +/- 0.100mm +/-0.050mm +/-0.025mm +/- 0.004" +/- 0.002" +/- 0.001" 0.500mm 0.200mm 0.010mm 0.020" 0.008" 0.0004" +/- 0.100mm +/-0.050mm +/-0.020mm +/- 0.004" +/- 0.002" +/- 0.0008" +/- 0.100mm +/-0.050mm +/- 0.004" +/- 0.002" Minimum Internal Radii Standard (Mechanical) Technical (Mechanical) Laser Alignment to Circuit Image Standard (Mechanical) Technical (Mechanical) Laser “Z” Axis Depth Control Standard (Mechanical) Technical (Mechanical) Laser machining can be controlled to ablate material and thus expose buried tracks and pads. Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 8 of 11 Title: PCB MANUFACTURING CAPABILITY 6. Feature Imaging Minimum Circuit Feature (Track) Standard Technical R&D 0.100mm 0.050mm 0.025mm 0.004" 0.002" 0.001” Standard Technical 0.100mm 0.050mm 0.004" 0.002" Standard Technical +/- 0.020mm +/- 0.010mm +/- 0.0008" +/- 0.0004" Minimum Circuit Feature – Feature Spacing (Gap) Track & Gap Tolerances NB. Final tolerances will be dependant on etched copper weight and customer design. Pad – Drilled Hole Registration Standard Technical R&D +/- 0.100mm +/- 0.050mm +/- 0.030mm +/- 0.004" +/- 0.002" +/- 0.0012 +/- 0.100mm +/- 0.040mm +/- 0.020mm +/- 0.004" +/- 0.0016" +/- 0.0008" Image Registration Side – Side Standard Technical R&D Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 9 of 11 Title: PCB MANUFACTURING CAPABILITY 7. Surface Finish Standard Technical Tin / Lead (90 / 10 Ratio) or Tin (dull) (As Plated or Brushed) 5.00 – 15.00m Bright Acid Tin 5.00 – 15.00m Electroless Tin Immersion Tin 0.10 – 1.00m 0.10m maximum Electroless Nickel / Immersion Gold Ni Au 3.50 – 8.00m 0.05 – 0.08m Electroless Nickel / Immersion Gold (Higher Build Gold for wire Bonding) Ni Au 3.50 – 8.00m 0.08 – 0.10m Electroless Nickel / Palladium / Gold (Universal Plating for wire bonding) Ni Pd Au 3.50 – 8.00m 0.20 – 0.50m 0.01 – 0.06m Electrolytic Pure Soft Gold Plating (Suitable for wire bonding) Optional Nickel Under-layer Au 1.00 – 5.00m Ni 1.00 – 10.00m Electrolytic Nickel / Hard Gold Ni Au 1.00 – 10.00m 1.00 – 5.00m Hot Air Solder Levelled (Vertical) (Note: Thickness will reduce in holes and on track/pad corners) Deposit thickness will vary across the circuit, due to variations in design 0.75 – 5.00m Other processes may be offered under R & D services by agreement Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 10 of 11 Title: PCB MANUFACTURING CAPABILITY 8. Solder Mask Solder Mask Type: Thickness: Colour: Pencil Hardness: Photoimageable Lea Ronal SPSR 5600 Series 20-30m / 0.0008"-0.0012" Green (Red or Blue also Available) 6-7 H Circuit Feature – Mask Clearance on Design Standard Technical 0.100mm 0.075mm 0.004" 0.003" 0.150mm 0.100mm 0.006" 0.004" 0.150mm 0.100mm 0.008" 0.004" Minimum Soldermask Web (Isolation) Standard Technical Solder Resist Dams (Line Thickness) Standard Technical Notation Type: Colour: Pencil Hardness: Tamura USI-210 series White, Yellow & Black (Others also Available) 4H Minimum Character Size Standard Technical 1.500mm 1.000mm 0.060" 0.040" Standard Technical 0.254mm 0.150mm 0.010" 0.006" Minimum Line Thickness Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 11 of 11 Title: PCB MANUFACTURING CAPABILITY Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 12 of 12 Title: PCB MANUFACTURING CAPABILITY Peelable (Temporary) Solder Masks Peters SD 2962P (Green) Peters SD 2954 (Blue) Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4 PROCEDURE No. PCP3003 LABTECH LIMITED ISO9001 QMS LEVEL THREE PROCEDURE Computer File Name: PCP3003~A4_Capability_Document. doc Page 13 of 13 Title: PCB MANUFACTURING CAPABILITY 9. Chip & Wire Assembly Silver Epoxy transfer print and dispense Bond Wires: Standard – Gold 25m diameter Options: Gold – 12.7 – 76m diameter Aluminium – 20 to 76m diameter Gold Ribbon – up to 25 x 250m (standard 25 x 50m) Maximum working assembly area 100mm x 100mm Typical placement accuracy 20m depending upon positioning indications Surface finished for bonding: Strengths with 25m gold wire Finish Electrolytic pure gold Universal finish High build electroless gold Typical Bond - 8.00grms - 9.00grms - 7.50grms Component sizes down to 0202 (smaller by arrangement) Components picked from waffle or gel pack Change Record A2->A3 Minimum Track & Gap (technical) amended from 100 to 50 microns. Image registration side to side (technical) from 50 to 40 microns A3 ->A4 Changes throughout to table values. R&D category added. List of laminates added. Status Authorised by: Mr P. Bagley Date: 9th January 2007 Issue: A4