uClamp0544P μClampTM 4-Line ESD Protection PROTECTION PRODUCTS - MicroClampTM Description Features The μClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace single line devices such as multilayer varistors (MLVs) in space constrained applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. TVS diodes offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μClampTM0544P is in a 10-pin, RoHS/WEEE compliant, SLP2510P8 package. It measures 2.5 x 1.0 with a nominal height of 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They are designed for easy PCB layout by allowing the traces to run straight through the device. Each device features four TVS diodes with an operating voltage of 5 volts and a maximum loading capacitance of only 10pF. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and notebook computers. TM Transient protection for data lines to Mechanical Characteristics SLP2510P8 package RoHS/WEEE Compliant Nominal Dimensions: 2.5 x 1.0 x 0.58 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Notebooks & Handhelds mp3 Players Cordless Phones Portable Instrumentation Digital Cameras Peripherals Schematic 2.50 1 IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package Protects four data lines Low clamping voltage Working voltage: 5V Low capacitance (10pF) Solid-state silicon-avalanche technology 1 2 2 4 5 1.00 0.50 BSC 0.58 3,8 Nominal Dimensions (mm) (SLP2510P8 Bottom View) Revision 12/6/2008 Note: Pins 6, 7, 9, and 10 are not internally connected. 1 www.semtech.com uClamp0544P PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 25 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 2 Amps VESD +/- 20 +/- 15 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 5 V 7.1 8.5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 0.010 0.10 μA Forward Voltage VF IF = 10mA 1 1.2 V Clamp ing Voltage VC IPP = 2A, tp = 8/20μs 12.5 V Junction Cap acitance Cj VR = 0V, f = 1MHz 10 pF Junction Cap acitance Cj VR = 3.3V, f = 1MHz © 2008 Semtech Corp. 2 6 4.5 pF www.semtech.com uClamp0544P PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 90 % of Rated Power or IPP Peak Pulse Power - PPP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 0 100 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (us) Forward Voltage vs. Forward Current Clamping Voltage vs. Peak Pulse Current 15 8 Forward Voltage - VF (V) Clamping Voltage - VC (V) 7 10 5 Waveform Parameters: tr = 8μs td = 20μs 6 5 4 3 Waveform Parameters: tr = 8μs td = 20μs 2 1 0 0 0 0.5 1 1.5 2 2.5 3 0 Peak Pulse Current - IPP (A) 2 4 6 8 10 12 14 Forward Current - IF (A) Normalized Junction Capacitance vs. Reverse Voltage ESD Clamping (8kV Contact per IEC 61000-4-2) 1.1 f = 1 MHz 1 0.9 CJ(VR) / CJ(VR=0) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 Note: Data is taken with a 10x attenuator © 2008 Semtech Corp. 3 www.semtech.com uClamp0544P PROTECTION PRODUCTS Applications Information Device Connection Circuit Diagram This device is designed to protect four data lines. The device is unidirectional and may be used on lines where the signal polarity is above ground. 1 2 The uClamp0544P is designed such that the traces flow straight through the device. This is accomplished by using PCB traces to connect the pin pairs for each line (pin 1 to pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). For example, line 1 enters at pin 1 and exits at Pin 10 and the PCB trace connects pin 1 and 10 together. This is true for lines connected at pins 2, 4, and 5 also. Ground is connected at pins 3 and 8. One large ground pad should be used in lieu of two separate pads. Multiple ground vias are recommended in order to reduce inductance in the ground path. This will maximize the device’s effectiveness during an ESD event. 5 3,8 Layout Example Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. © 2008 Semtech Corp. 4 Line 1 in Line 2 in 1 Line 1 Out Line 2 Out GND 4 Line 3 in Line 3 Out Line 4 in Line 4 Out www.semtech.com uClamp0544P PROTECTION PRODUCTS Applications Information - Spice Model Spice Model uClamp0544P Spice Parameters © 2008 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 2.05e-15 BV Volt 7.2 VJ Volt 0.79 RS Ohm 0.908 IB V Amp 1.0E-3 CJO Farad 9.7e-12 TT sec 2.541E-9 M -- 0.25 N -- 1.1 EG eV 1.11 5 www.semtech.com uClamp0544P PROTECTION PRODUCTS Outline Drawing - SLP2510P8 A D B DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A2 C A1 b1xN bbb R0.125 A A1 A2 b b1 D E e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 0.50 0.58 0.65 0.00 .001 .002 0.00 0.03 0.05 (.005) (0.13) .006 .008 .010 0.15 0.20 0.25 .014 .016 .018 0.35 0.40 0.45 .094 .098 .102 2.40 2.50 2.60 .035 .039 .043 0.90 1.00 1.10 .020 BSC 0.50 BSC .012 .015 .017 0.30 0.38 0.425 8 8 .003 0.08 .004 0.10 C A B 2 1 E/2 LxN 2X R0.075 7 PLACES N bxN e bbb D/2 C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP2510P8 P1 P DIMENSIONS DIM C G P P1 X X1 Y Y1 Z Y Z (C) (Y1) G X X1 INCHES (.034) .008 .020 .039 .008 .016 .027 (.061) .061 MILLIMETERS (0.875) 0.20 0.50 1.00 0.20 0.40 0.675 (1.55) 1.55 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2008 Semtech Corp. 6 www.semtech.com uClamp0544P PROTECTION PRODUCTS Marking Code Ordering Information UC544 PIN 1 INDICATOR (LASER MARK) Part Number Working Voltage Qty per Reel Reel Size uClamp 0544P.TCT 5V 3,000 7 Inch Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and μClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.23 +/-0.10 mm B0 K0 2.70 +/-0.10 mm 0.70 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2008 Semtech Corp. 7 www.semtech.com