RENESAS PS9505

Preliminary Data Sheet
PS9505,PS9505L1,PS9505L2,PS9505L3
R08DS0015EJ0100
Rev.1.00
Jan 06, 2012
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER
DESCRIPTION
The PS9505, PS9505L1, PS9505L2 and PS9505L3 are optically coupled isolators containing a GaAlAs LED on the
input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9505 Series is designed specifically for high common mode transient immunity (CMR), high output current and
high switching speed.
The PS9505 Series is suitable for driving IGBTs and MOS FETs.
The PS9505 Series is in a plastic DIP (Dual In-line Package).
The PS9505L1 is lead bending type for long creepage distance.
The PS9505L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
The PS9505L3 is lead bending type (Gull-wing) for surface mounting.
FEATURES
• Long creepage distance (8 mm MIN.: PS9505L1, PS9505L2)
PIN CONNECTION
(Top View)
• Large peak output current (2.5 A MAX., 2.0 A MIN.)
• High speed switching (tPLH, tPHL = 0.25 μs MAX.)
8
7
6
5
1
2
3
4
• UVLO (Under Voltage Lock Out) protection with hysteresis
• High common mode transient immunity (CMH, CML = ±25 kV/μs MIN.)
SHIELD
• Embossed tape product: PS9505L2-E3: 1 000 pcs/reel
: PS9505L3-E3: 1 000 pcs/reel
<R>
<R>
• Pb-Free product
1. NC
2. Anode
3. Cathode
4. NC
5. VEE
6. VO
7. VO
8. VCC
• Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved: No. 1115598
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
APPLICATIONS
• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• IH (Induction Heating)
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 1 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS9505
9.25
+0.5
–0.25
7.62
+0.4
1.01–0.2
+0.5
3.5±0.2
2.8 MIN. 4.15±0.3
6.5–0.1
0.5±0.15
0.25 M
0 to 15°
2.54
0.84±0.15
Lead Bending Type (Gull-wing) For Surface Mount
PS9505L3
+0.5
9.25–0.25
8
5
1
4
3.5±0.2
1.01
0.5±0.15
0.25 M
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
0.635±0.15
9.65±0.4
+0.4
–0.2
+0.5
6.5–0.1
2.54
0.74±0.25
Page 2 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
Lead Bending Type For Long Creepage Distance
PS9505L1
+0.5
9.25–0.25
10.16
+0.4
+0.5
6.5–0.1
3.5±0.2
2.8 MIN. 3.87±0.4
1.01–0.2
0.5±0.15
0.25 M
0 to 15°
2.54
0.84±0.15
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9505L2
+0.5
9.25–0.25
8
5
1
4
3.5±0.2
0.5±0.15
0.25 M
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
+0.5
6.5–0.1
0.25±0.2
1.01
11.8±0.4
+0.4
–0.2
2.54
0.9±0.25
Page 3 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
PHOTOCOUPLER CONSTRUCTION
Parameter
PS9505, PS9505L3
PS9505L1, PS9505L2
Air Distance (MIN.)
7 mm
8 mm
Outer Creepage Distance (MIN.)
7 mm
8 mm
0.4 mm
0.4 mm
Isolation Distance (MIN.)
FUNCTIONAL DIAGRAM
8
(Tr. 1)
2
7
6
(Tr. 2)
3
5
SHIELD
<R>
Input
LED
Tr. 1
Tr. 2
Output
H
ON
ON
OFF
H
L
OFF
OFF
ON
L
MARKING EXAMPLE
No. 1 pin
Mark
R
9505
NT131
Company Initial
Type Number
Assembly Lot
N T 1 31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
Rank Code
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 4 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
<R>
Chapter Title
ORDERING INFORMATION
Part Number
Order Number
Packing Style
Solder Plating
Specification
PS9505
PS9505-AX
Pb-Free
PS9505L1
PS9505L1-AX
(Ni/Pd/Au)
PS9505L2
PS9505L3
PS9505L2-E3
PS9505L2-E3-AX
50 Magazine Cases
Safety Standard
Approval
Application Part
*1
Number
Standard
PS9505
products
PS9505L1
PS9505L2-AX
(UL, CSA, SEMKO
PS9505L2
PS9505L3-AX
approved)
Embossed Tape
PS9505L3
PS9505L2
PS9505L3-E3
PS9505L3-E3-AX
1 000 pcs/reel
PS9505-V
PS9505-V-AX
50 Magazine Cases
PS9505L3
PS9505L1-V
PS9505L1-V-AX
(VDE0884 Part2)
PS9505L1
PS9505L2-V
PS9505L2-V-AX
approved
PS9505L2
PS9505L3-V
PS9505L3-V-AX
(Option)
PS9505L3
PS9505L2-V-E3
PS9505L2-V-E3-AX
Embossed Tape
PS9505L2
PS9505L3-V-E3
PS9505L3-V-E3-AX
1 000 pcs/reel
PS9505L3
DIN EN60747-5-2
PS9505
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Forward Current
IF
25
mA
IF (TRAN)
1.0
A
VR
5
V
IOH (PEAK)
2.5
A
IOL (PEAK)
2.5
A
(VCC - VEE)
0 to 35
V
VO
0 to VCC
V
PC
250
mW
BV
5 000
Vr.m.s.
PT
300
mW
f
50
kHz
Operating Ambient Temperature
TA
−40 to +110
°C
Storage Temperature
Tstg
−55 to +125
°C
Diode
Peak Transient Forward
Current (Pulse Width < 1 μs)
Reverse Voltage
Detector
High Level Peak Output
Current
*1
Low Level Peak Output
Current
*1
Supply Voltage
Output Voltage
Power Dissipation
Isolation Voltage
*2
*3
Total Power Dissipation
Operating Frequency
*4
*5
*1 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*2 Reduced to 4.8 mW/°C at TA = 70°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
*4 Reduced to 5.4 mW/°C at TA = 70°C or more.
*5 IOH (PEAK) ≤ 2.0 A (≤ 0.3 μs), IOL (PEAK) ≤ 2.0 A (≤ 0.3 μs)
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 5 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
(VCC - VEE)
15
Forward Current (ON)
IF (ON)
7
Forward Voltage (OFF)
VF (OFF)
TA
Supply Voltage
Operating Ambient Temperature
<R>
TYP.
MAX.
Unit
30
V
16
mA
−2
0.8
V
−40
110
°C
10
ELECTRICAL CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter
Diode
Symbol
Conditions
Forward Voltage
VF
IF = 10 mA, TA = 25°C
Reverse Current
IR
VR = 3 V, TA = 25°C
Input Capacitance
Detector High Level Output Current
CIN
IOH
IOL
1.2
f = 1 MHz, VF = 0 V, TA = 25°C
VO = (VCC − 4 V)
*2
VO = (VCC − 15 V)
Low Level Output Current
MIN.
VO = (VEE + 2.5 V)
VO = (VEE + 15 V)
0.5
*3
*2
*3
*4
TYP.
*1
1.56
MAX.
Unit
1.8
V
10
μA
30
pF
2.0
A
2.0
A
2.0
0.5
2.0
High Level Output Voltage
VOH
IO = −100 mA
Low Level Output Voltage
VOL
IO = 100 mA
0.1
0.5
V
High Level Supply Current
ICCH
VO = open, IF = 10 mA
1.4
3.0
mA
Low Level Supply Current
ICCL
VO = open, VF = 0 to +0.8 V
1.3
3.0
mA
10.8
12.3
13.4
V
9.5
11.0
12.5
0.4
1.3
UVLO Threshold
VUVLO+
VO > 5 V, IF = 10 mA
VUVLO−
UVLO Hysteresis
Coupled Threshold Input Current
UVLOHYS VO > 5 V, IF = 10 mA
IFLH
IO = 0 mA, VO > 5 V
VFHL
IO = 0 mA, VO < 5 V
VCC − 3.0 VCC − 1.5
2.0
V
V
5.0
mA
(L → H)
Threshold Input Voltage
0.8
V
(H → L)
*1 Typical values at TA = 25°C.
*2 Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%.
*3 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*4 VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle =
20%).
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 6 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
<R>
Chapter Title
SWITCHING CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter
Propagation Delay Time (L → H)
Propagation Delay Time (H → L)
Symbol
tPLH
tPHL
Pulse Width Distortion (PWD)
|tPHL−tPLH|
Propagation Delay Time (Difference
tPHL−tPLH
Conditions
MIN.
Rg = 10 Ω, Cg = 10 nF, f = 10 kHz,
*2
Duty Cycle = 50% , IF = 10 mA
TYP.
*1
MAX.
Unit
0.07
0.25
μs
0.10
0.25
μs
0.03
0.1
μs
0.1
μs
−0.1
Between Any Two Products)
Rise Time
tr
50
ns
Fall Time
tf
50
ns
UVLO (Turn On Delay)
tUVLO ON
VO > 5 V, IF = 10 mA
0.8
μs
UVLO (Turn Off Delay)
tUVLO OFF VO < 5 V, IF = 10 mA
0.6
μs
Common Mode Transient Immunity at
|CMH|
Common Mode Transient Immunity at
Low Level Output
TA = 25°C, IF = 10 to 16 mA, VCC = 30 V,
25
kV/μs
25
kV/μs
VO (MIN.) = 26 V, VCM = 1.5 kV
High Level Output
|CML|
TA = 25°C, IF = 0 mA, VCC = 30 V,
VO (MAX.) = 1 V, VCM = 1.5 kV
*1 Typical values at TA = 25°C.
*2 This load condition is equivalent to the IGBT load at 1 200 V/75 A.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 7 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
TEST CIRCUIT
Fig. 1 IOH Test Circuit
1
8
2
7 0.1 μF
3
6
IF =
7 to 16 mA 4
5
Fig. 2 IOL Test Circuit
4V
IOH
1
8
2
7 0.1 μF
3
6
4
5
VCC = 15 to 30 V
VCC =
15 to 30 V
SHIELD
1
8
2
7 0.1 μF
3
6
4
5
Fig. 4 VOL Test Circuit
VOH
100 mA
VCC =
15 to 30 V
1
8
2
7
0.1 μF
3
6
VOL
4
5
VCC = 15 to 30 V
100 mA
SHIELD
SHIELD
Fig. 5 IFLH Test Circuit
IF
2.5 V
SHIELD
Fig. 3 VOH Test Circuit
IF =
7 to 16 mA
IOL
1
8
2
7
3
6
4
5
SHIELD
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Fig. 6 UVLO Test Circuit
0.1 μF
VO > 5 V
VCC =
15 to 30 V
1
8
IF = 10 mA 2
7
3
6
4
5
0.1 μF
VCC
VO > 5 V
SHIELD
Page 8 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
<R>
Chapter Title
Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms
IF = 10 mA
10 kHz
50% DUTY
CYCLE
1
8
2
7
500 Ω 3
6
4
5
IF
0.1 μF
VO
10 Ω
10 nF
tf
90%
50%
10%
VOUT
tPLH
SHIELD
<R>
tr
VCC = 15 to 30 V
tPHL
Fig. 8 CMR Test Circuit and Wave Forms
IF
A
B
1
8
2
7
3
6
4
5
SHIELD
VCM = 1.5 kV
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
VCM
VCM
δV
=
Δt
δt
0.1 μF
VO
VCC = 30 V
0V
VO
(Switch A: IF = 10 to 16 mA)
VO
(Switch B: IF = 0 mA)
Δt
VOH
26 V
1V
VOL
Page 9 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
350
Total Power Dissipation PT (mW)
Detector Power Dissipation PC (mW)
300
250
200
150
100
50
0
20
40
60
100
80
100
50
20
40
60
80
5.0
TA = +100°C
+85°C
+50°C
+25°C
0°C
−40°C
0.01
1.0
100
120
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
Threshold Input Current IFLH (mA)
Forward Current IF (mA)
150
FORWARD CURRENT vs.
FORWARD VOLTAGE
0.1
1.2
1.4
1.6
1.8
2.0
2.2
VCC = 30 V,
VEE = GND,
VO > 5 V
4.0
3.0
2.0
1.0
0
−40
2.4
−20
0
20
40
60
80
100
Forward Voltage VF (V)
Ambient Temperature TA (°C)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT
0
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
VCC = 30 V,
VEE = GND
25
20
15
10
5
0
200
Ambient Temperature TA (°C)
1.0
30
250
Ambient Temperature TA (°C)
10
35
300
0
120
100
Output Voltage VO (V)
<R>
Chapter Title
1
2
3
4
5
Forward Current IF (mA)
VCC = 30 V,
VEE = GND,
IF = 10 mA
−40°C
−2
−4
TA = +110°C
−6
−8
0
+25°C
0.5
1.0
1.5
2.0
2.5
High Level Output Current IOH (A)
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 10 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
VCC = 30 V,
VEE = GND,
IF = 0 mA
2
−40°C
0.5
1
1.5
2
2.5
VCC = 30 V, VEE = GND,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
6
8
10
12
14
16
18
Forward Current IF (mA)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
250
VEE = GND, IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
15
20
25
30
250
VCC = 30 V, VEE = GND,
IF = 10 mA, Rg = 10 Ω,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
10
30
20
40
50
Supply Voltage VCC (V)
Load Capacitance Cg (nF)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
250
VCC = 30 V, VEE = GND,
IF = 10 mA, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
0
250
Low Level Output Current IOL (A)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
+25°C
4
0
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
TA = +110°C
6
10
20
30
40
50
Load Resistance Rg (Ω)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Low Level Output Voltage VOL (V)
8
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
LOW LEVEL OUTPUT VOLTAGE vs.
LOW LEVEL OUTPUT CURRENT
250
VCC = 30 V, VEE = GND,
IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
−40
−20
0
20
40
60
80
100
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 11 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
SUPPLY CURRENT vs.
SUPPLY VOLTAGE
1.5
ICCH (IF = 10 mA)
ICCL (IF = 0 mA)
1.0
0.5
−40
20
0
20
60
80
VEE = GND,
VO = OPEN
1.5
ICCH (IF = 10 mA)
ICCL (IF = 0 mA)
1.0
0.5
15
100
25
30
Supply Voltage VCC (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = –100 mA
−0.5
−1.0
−1.5
−2.0
−2.5
−3.0
−40 −20
0
20
40
60
80
0.30
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = 100 mA
0.25
0.20
0.15
0.10
0.05
0.00
−40 −20
100
2.0
1.5
1.0
0.5
0.0
−40 −20
0
20
40
60
80
100
Ambient Temperature TA (°C)
3.0
Low Level Output Current IOL (A)
VCC = 30 V, VEE = GND,
IF = 10 mA, VCC–VO = 4 V
2.5
20
40
60
80
100
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
3.0
0
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
High Level Output Current IOH (A)
20
Ambient Temperature TA (°C)
0.0
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
40
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
2.0
VCC = 30 V,
VEE = GND,
VO = OPEN
Low Level Output Voltage VOL (V)
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
2.0
VCC = 30 V, VEE = GND,
IF = 10 mA, VO = 2.5 V
2.5
2.0
1.5
1.0
0.5
0.0
−40 −20
0
20
40
60
80
100
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 12 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
14
Output Voltage VO (V)
12
10
8
UVLOHYS
6
4
2
0
0
VUVLO+
(12.3 V)
VUVLO−
(11.0 V)
5
10
15
20
Supply Voltage VCC – VEE (V)
Remark The graph indicates nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 13 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
4.5 MAX.
12.8±0.1
11.5±0.1
1.5 +0.1
–0
24.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.1±0.1
10.7±0.1
2.05±0.05
12.0±0.1
0.3±0.05
Tape Direction
PS9505L2-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
25.5±1.0
29.5±1.0
Packing: 1 000 pcs/reel
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
23.9 to 27.4
Outer edge of
flange
Page 14 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
5.3 MAX.
10.4±0.1
7.5±0.1
1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.75±0.1
10.3±0.1
1.55±0.1
12.0±0.1
0.35±0.05
Tape Direction
PS9505L3-E3
Outline and Dimensions (Reel)
2.0±0.5
21.0±0.8
100±1.0
R 1.0
330±2.0
2.0±0.5
13.0±0.2
17.5±1.0
21.5±1.0
Packing: 1 000 pcs/reel
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
15.9 to 19.4
Outer edge of
flange
Page 15 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
C
D
B
<R>
Chapter Title
A
Part Number
Lead Bending
PS9505L2
lead bending type (Gull-wing)
for long creepage distance (surface mount)
PS9505L3
lead bending type (Gull-wing)
for surface mount
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
A
B
C
D
10.2
2.54
1.7
2.2
9.0
2.54
1.7
2.0
Page 16 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content
of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 17 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
<R>
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 18 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
<R>
Chapter Title
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Spec.
Unit
40/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.6 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
UIORM
Upr
1 130
1 808
Vpeak
Vpeak
Upr
2 119
Vpeak
UTR
8 000
Vpeak
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +125
°C
Operating temperature range
TA
–40 to +110
°C
Ris MIN.
Ris MIN.
10
11
10
Package temperature
Tsi
175
°C
Current (input current IF, Psi = 0)
Isi
400
mA
Power (output or total power dissipation)
Psi
700
mW
Ris MIN.
10
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
12
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Isolation resistance
VIO = 500 V dc at TA = Tsi
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
9
Ω
Page 19 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Caution
GaAs Products
Chapter Title
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 20 of 20
Revision History
PS9505,PS9505L1,PS9505L2,PS9505L3 Data Sheet
Rev.
Date
Page
Description
Summary
0.01
1.00
May 12, 2010
Jan 06, 2012
−
Throughout
Throughout
p.1
p.4
p.5
p.6
p.7
p.9
pp.10 to 13
p.16
p.18
p.19
First Edition issued
Preliminary Data Sheet -> Data Sheet
Safety standards approved
Addition of Pb-Free product
Modification of MARKING EXAMPLE
Addition of ORDERING INFORMATION
Modification of ELECTRICAL CHARACTERISTICS
Modification of SWITCHING CHARACTERISTICS
Modification of TEST CIRCUIT
Addition of TYPICAL CHARACTERISTICS
Modification of RECOMMENDED MOUNT PAD DIMENSIONS
Modification of USAGE CAUTIONS 2. (2)
Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
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Colophon 1.1