UM10385 GreenChip 65 W TEA1733(L)T demo board

UM10385
GreenChip 65 W TEA1733(L)T demo board
Rev. 02 — 2 June 2010
User manual
Document information
Info
Content
Keywords
Notebook adapter, TEA1733(L)T, Low standby power, High efficiency,
fixed frequency flyback, jitter
Abstract
This manual provides the specification, schematics, and Printed-Circuit
Board (PCB) layout of the 65 W TEA1733(L)T demo board. For details on
the TEA1733(L)T IC please refer to the application note.
UM10385
NXP Semiconductors
GreenChip 65 W TEA1733(L)T demo board
Revision history
Rev
Date
Description
02
20100602
Modifications
01
20100413
•
•
Table 2 “Output specification” tstartup value modified.
•
Section 8.1 “Changing the output voltage” variation range removed
Figure 13 “Schematic 65 W TEA1733(L)T demo board” and Table 10 “Bill of materials”,
C15 value modified.
First issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
UM10385
User manual
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GreenChip 65 W TEA1733(L)T demo board
1. Introduction
014aab146
Fig 1.
65 W TEA1733(L)T demo board
This 65 W TEA1733(L)T demo board demonstrates the capabilities of the TEA1733(L)T
Switched Mode Power Supply (SMPS) controller. This manual provides the specifications,
schematics, and PCB layout of the 65 W TEA1733(L)T demo board. For details on the
TEA1733(L)T SMPS controller please refer to the application note and data sheet for the
TEA1733(L)T.
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel that is qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
1.1 Features
•
•
•
•
•
•
•
•
UM10385
User manual
Universal mains supply operation
OverCurrent Protection (OCP)
OverPower Protection (OPP)
Low ripple and noise
Low-cost implementation
Low no-load standby power (< 100 mW at 230 V; 50 Hz)
ENERGY STAR compliant
EMI CISPR 22 compliant
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2. Power supply specification
Table 1.
UM10385
User manual
Input specification
Symbol
Description
Conditions
Specification
Unit
Vi
input voltage
-
90 to 264
V
fi
input frequency
-
47 to 60
Hz
Pi(no load)
no load input power
at 230 V; 50 Hz
< 100
mW
Table 2.
Output specification
Symbol
Description
Conditions
Specification
Unit
Vo
output voltage
-
19.5
V
Vo(ripple)(p-p)
peak-to-peak output
ripple voltage
20 MHz bandwidth
 100
mV
Io
output current
continuous
0 to 3.34
A
Io(p)
peak output current
for 50 ms
-
A
Rcable
output cable resistance
-
-

Po
output power
0 to 40 C
-
W
tholdup
hold-up time
at 115 V; 60 Hz; full load
5
ms
-
line regulation
-
1
%
-
load regulation
-
2
%
tstartup
start-up time
at 115 V; 60 Hz
3
s

efficiency
according to ENERGY
STAR (EPS 2)
 87
%
-
EMI
CISPR22 compliant
pass
-
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3. Performance data
Performance figures based on the following PCB design:
• Schematic version: Tuesday 2 February 2010 rev. A
• PCB marking: APBADC051 ver. A
3.1 Efficiency
Efficiency measurements were taken using an automated test program containing a
temperature stability detection algorithm. The output voltage and current were measured
using a 4-wire current sense configuration directly at the PCB connector. Measurements
were performed for 115 V; 60 Hz and 230 V; 50 Hz.
Table 3.
Efficiency results[1][2]
Condition
ENERGY STAR 2.0
efficiency
requirement (%)
Efficiency (%)
Average
25 % load
50 % load
75 % load
100 % load
115 V, 60 Hz
> 87
89.6
89.6
90.1
89.7
89.3
230 V, 50 Hz
> 87
90.0
87.5
90.2
90.2
90.3
[1]
Warm-up time: 10 minutes
[2]
There is an approximate 1 % loss of efficiency, when measured at the end of a 1 m output cable.
A
DC current
source
V
Cable
014aab147
Fig 2.
DC resistance output cable
3.2 No load power consumption
Power consumption performance of the total application board with no load connected
was measured using an automated test program containing a temperature stability
detection algorithm. The output voltage and current were measured using a 4-wire current
sense configuration directly at the PCB connector. Measurements were performed for
90 V; 60 Hz, 115 V; 60 Hz, 230 V; 50 Hz, and 264 V; 50 Hz.
Table 4.
UM10385
User manual
Output voltage and power consumption: no load
Condition
ENERGY STAR 2.0
requirement (mW)
Output voltage (V)
No load power
consumption (mW)
90 V; 60 Hz
 300 mW
19.53
55
115 V; 60 Hz
 300 mW
19.54
59
230 V; 50 Hz
 300 mW
19.54
90
264 V; 50 Hz
 300 mW
19.54
106
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3.3 Output regulation
The output voltage versus load current was measured using a 4-wire current sense
configuration directly at the PCB connector. Measurements were performed without
probes attached to the application for 115 V; 60 Hz and 230 V; 50 Hz.
014aab148
20.0
Output
voltage
(V)
19.8
19.6
19.4
19.2
19.0
0
2
4
Output current (A)
6
(1) Vo = 115 V; 60 Hz
(2) Vo = 230 V; 50 Hz
Fig 3.
Output voltage regulation as function of load
3.4 VCC voltage
The IC VCC pin 1 voltage was measured for both no load and full load (3.34 A) conditions.
Table 5.
VCC voltage
Condition
115 V; 60 Hz
230 V; 50 Hz
No load
14.4
14.6
Full load (3.34 A)
20.8
20.8
3.5 Brownout and start level
Brownout and start level was measured for no load and full load (3.34 A) conditions.
Table 6.
Brownout and start level results
Condition
Brownout V (AC)
Start level V (AC)
No load
63
84
Full load (3.34 A)
77
84
3.6 Overvoltage protection
The maximum output voltage in case of over voltage protection was measured by
shortening the optocoupler at the secondary side. The output voltage was measured
directly at the output connector for both no load and full load (3.34 A) conditions.
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Table 7.
Maximum output voltage in case of OVP
Condition
115 V (AC)
230 V (AC)
No load
24.5
24.5
Full load (3.34 A)
23.9
24.0
3.7 Startup time
Startup time was measured for three mains input voltages and full load (3.34 A) condition.
Vi input measured using a current probe (to avoid adding additional capacitance to the
mains input). Vo was measured using a voltage probe grounded at the secondary side.
Table 8.
Startup time
Condition
Startup time (s)
90 V; 60 Hz
3.7
115 V; 60 Hz
2.4
230 V; 50 Hz
0.9
3.8 Dynamic loading
The output voltage was measured at the end of the cable.
Table 9.
Dynamic loading test conditions and results
Condition
Loading
Vo(ripple)(p-p) (mV)
90 V; 47 Hz
Io: 0 % - 50 %, frequency 50 Hz; duty cycle 50 %
359
264 V; 63 Hz Io: 0 % - 50 %, frequency 50 Hz; duty cycle 50 %
364
014aab149
014aab149
Yellow: Vo (V), Cyan: Io (A)
Fig 4.
Yellow: Vo (V), Cyan: Io (A)
Load transient response 90 V; 47 Hz, ripple
and noise
UM10385
User manual
Fig 5.
Load transient response 264 V; 63 Hz, ripple
and noise
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3.9 Output ripple and noise
Output ripple and noise were measured at the end of the cable using the measurement
setup described in the picture below. An oscilloscope probe connected to the end of the
adapter cable using a probe tip. 100 nF and 1 F capacitors were added between plus
and minus to reduce the high frequency noise. Output ripple and noise were measured for
mains voltages 90 V; 47 Hz and 264 V; 63 Hz, both at full load (3.34 A) output current.
1 μF
Adapter cable
100 nF
1:10 Probe
Probe tip
014aab151
Fig 6.
Output ripple and noise measurement setup
014aab153
014aab152
Fig 7.
Output 90 V; 47 Hz, Ripple and noise
Fig 8.
Output 264 V; 63 Hz, Ripple and noise
3.10 EMI performance
Conditions:
•
•
•
•
•
•
•
UM10385
User manual
Type: conducted EMC measurement
Frequency range: 150 kHz to 30 MHz
Output power: full load condition
Supply voltage: 115 V and 230 V
Margin: 6 dB below limit
Measuring time: 50 ms
Secondary ground connected to mains earth ground
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GreenChip 65 W TEA1733(L)T demo board
014aab155
014aab154
Fig 9.
115 V, 65 W TEA1733(L)T demo board phase N
Fig 10. 115 V, 65 W TEA1733(L)T demo board phase L
014aab156
Fig 11. 230 V, 65 W TEA1733(L)T demo board phase N
UM10385
User manual
014aab162
Fig 12. 230 V, 65 W TEA1733(L)T demo board phase L
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R9
43 kΩ
1
A
6
VOUT
C13
680 μF
25 V
F1
C3
3.15 A
250 V
LF1
CX1
0.33 μF
N
5
1
INLET
L
R10
43 kΩ
2
R1
750 kΩ
BD1
KBP206G
LF2
−
C14
680 μF
25 V
19.5V
3.34 A
2200 pF
630 V
+
GND
R1
750 kΩ
C1
120 μF
400 V
3
C2
3300 pF
1 kV
D1
SA2M kΩ
R4
10 MΩ
Rev. 02 — 2 June 2010
R8
750 kΩ
R7
240 kΩ
F
F
C10
0.1 μF
F
Θ
R17
8.06 kΩ
1%
C9
1 nF
U2A
F
F
F
4
6
3
TEA1733T
CTRL
7
OPTIMER
8
R16
2.2 MΩ
C8
0.22 μF
F
F
C19
0.1 μF
D2
1N4148W
5
PROTECT
RT1
TTC05204
R5
10 MΩ
C6
0.22 μF
VISENSE
D4
ZD1
1N4148W BZX84-B24
R6
10 MΩ
2
1
ISENSE
R15
R14
4.7 Ω
10 Ω
R13
C5
1 kΩ
0.22 μF
DRIVER
C7A
68 pF
GND
VCC
C7
0.1 μF
50 V
F
R12
Q1
2SK3569
C4
n.a
R20
330 Ω
R21
n.a
U2B
LTV-356T
R11
0.18 Ω
C11
4.7 μF
50 V
C17
n.a
1 nF
F
L1
10 μH
3
R18
47 Ω
C16
4
R22
10 nF 10 kΩ
C12
220 pF
U3
AP431SR
F
R25
n.a
C15
33 kΩ
D3
BAV21W
F
R23
35.7 kΩ
1%
F
BC1
R24
5.23 kΩ
1%
F
014aab157
Fig 13. Schematic 65 W TEA1733(L)T demo board
UM10385
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CY1
470 pF
GreenChip 65 W TEA1733(L)T demo board
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F
R3
750 kΩ
NXP Semiconductors
D5
STPS20M100ST
RM-10,
Lp = 650 μH
T1
C18
220 pF
4. Schematic 65 W TEA1733(L)T demo board
UM10385
User manual
R26
47 Ω
UM10385
NXP Semiconductors
GreenChip 65 W TEA1733(L)T demo board
5. Bill of materials
5.1 Components list
Table 10.
Bill of materials
Reference
Value
Description
Package
R1
750 k (5 %)
resistor, thin film chip
SMD 1206
R2
750 k (5 %)
resistor, thin film chip
SMD 1206
R3
750 k (5 %)
resistor, thin film chip
SMD 1206
R4
10 M (1 %)
resistor, thin film chip
SMD 1206
R5
10 M (1 %)
resistor, thin film chip
SMD 1206
R6
10 M (1 %)
resistor, thin film chip
SMD 1206
R7
240 k (1 %)
resistor, thin film chip
SMD 0603
R8
750 k (5 %)
resistor, thin film chip
SMD 1206
R9
43 k (5 %)
resistor, thin film chip
SMD 1206
R10
43 k (5 %)
resistor, thin film chip
SMD 1206
R11
0.18  (5 %; 1 W)
resistor, MOF
Axial lead
R12
33 k (1 %)
resistor, thin film chip
SMD 0603
R13
1 k (1 %)
resistor, thin film chip
SMD 0603
R14
10  (5 %)
resistor, thin film chip
SMD 0805
R15
4.7  (5 %)
resistor, thin film chip
SMD 0805
R16
2.2 M (5 %)
resistor, thin film chip
SMD 0603
R17
8.06 k (1 %)
resistor, thin film chip
SMD 0603
R18
47  (5 %)
resistor, thin film chip
SMD 0805
R20
330  (5 %)
resistor, thin film chip
SMD 0603
R21
not mounted
-
-
R22
10 k (5 %)
resistor, thin film chip
SMD 0603
R23
35.7 k (1 %)
resistor, thin film chip
SMD 0603
R24
5.23 k (1 %)
resistor, thin film chip
SMD 0603
R25
not mounted
-
-
RT1
200 k (5 %)
NTC resistor, D = 5, TTC05204/Thinking
Axial lead
CX1
0.33 F; 275 V (AC)
MXP,  2 cap, R46/Arcotronics Nissei
Axial lead
C1
120 F; 400 V, 105 C
E/C, KMG/NCC
Radial lead, 18 mm  30 mm
C2
3300 pF; 1 kV
Ceramic, Z5U
disc, D = 6.5 mm
C3
2200 pF; 630 V
MLCC, Z5U
SMD 1206
C4
not mounted
-
-
C5
0.22 F; 50 V
MLCC, X7R
SMD 0603
C6
0.22 F; 50 V
MLCC, X7R
SMD 0603
C7
0.1 F; 50 V
MLCC, X7R
SMD 0603
C7A
68 pF; 50 V
MLCC, X7R
SMD 0603
C8
0.22 F; 50 V
MLCC, X7R
SMD 0603
C9
1 nF; 50 V
MLCC, X7R
SMD 0603
C10
0.1 F; 50 V
MLCC, X7R
SMD 0603
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Table 10.
Bill of materials …continued
Reference
Value
Description
Package
C11
4.7 F; 50 V, 105 C
E/C, KY/NCC
Radial lead, 5 mm  11.5 mm
C12
220 pF; 100 V
MLCC, NPO
SMD 0805
C13
680F; 25 V, 105 C
E/C, KZH/NCC
Radial lead, 10 mm  12.5 mm
C14
680 F; 25 V, 105 C
E/C, KZH/NCC
Radial lead, 10 mm  12.5 mm
C15
1 nF; 50 V
MLCC, X7R
SMD 0603
C16
10 nF; 50 V
MLCC, X7R
SMD 0603
C17
not mounted
-
-
C18
220 pF; 100 V
MLCC, NPO
SMD 0805
C19
0.1 F; 50 V
MLCC, X7R
SMD 0603
CY1
470 pF; 400 V (AC)
ceramic Y1 Cap CD/TDK
Disc, D = 8.5 mm
BD1
2 A; 600 V
bridge diode, 2KBP206G/LiteON
Flat/mini
D1
1.5 A; 1000 V
general purpose diode, S2M/LiteON
SMB
D2
0.5 A; 75 V
switching diode, 1N4148W/Vishay
SMD SOD-123
D3
0.25 A; 250 V
ultra-fast diode, BAV21W/Vishay
SMD SOD-123
D4
0.5 A; 75 V
switching diode, 1N4148W/Vishay
SMD SOD-123
D5
20 A; 100 V
Schottky diode, STPS20M100ST/ST
SMD TO-23
ZD1
24 V (2 %; 0.25 W)
Zener diode, BZX84-B24/NXP
SMD SOT-123
Q1
10 A; 600 V (0.75 )
MOSFET, 2SK3569/Toshiba, 15p-typical
TO-220F
U1
TEA1733(L)T
GreenChip SMPS control IC, NXP
SO-8
U2
LTV-356T
optocoupler, CTR = 130-260, LiteON
SMD
U3
AP431SR
adjustable precision shunt regulator diodes
SOT-23R
T1
Lp = 650 H
transformer, YiLiAn
RM10-18.6-6P
LF1
9.5 Ts, 380 H
line choke, YiLiAn
T12  6 mm  4 mm,
D = 0.6 mm + 0.6 mm (3L)
LF2
48 Ts, 7.4 mH
line choke, YiLiAn
T16  8-12C, JPH-10,
D = 0.6 mm  2 mm
L1
10 H
inductor, molded W.W ferrite,
WIS252018N-100K/Mingstar
SMD
BC1 for
CY1
S6H; JK
bead core, N6/AMAX
RH 3.5 mm  4.2 mm  1.3 mm
J1
jumper wire
wire, black
26/1007/TC 10 + 14 + 10
J2
jumper wire
jumper wire
D = 0.6 mm  10 mm
J3
jumper wire
jumper wire
D = 0.6 mm  7.5 mm
J4
jumper wire
wire, black
26/1007/TC 10 + 7 + 10
J5
jumper wire
wire, black
26/1007/TC 10 + 22 + 10
For Q1,
BD1
heat sink
I-Shape, Al-Original, WD
62 mm  21 mm, t = 2 mm
For D5
heat sink
L-Shape, Al-Original, WD
34 mm  21 mm  8 mm, t = 2 mm
Main PCB
PCB
single side, CEM-3, 1-OZ, APBADC051
Version A
91 mm  40 mm  1.2 mm
F1
T3.15 A; 250 V
fuse, Time lag, LT-5/Littlefuse
Axial lead
For Q1
screw
Flat head 5.0, NI Shouh-Pin
M3  8
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Table 10.
Bill of materials …continued
Reference
Value
Description
Package
For D5
screw
Flat head 5.0, NI Shouh-Pin
M3  8
For Q1
nut
HEX/GW, LF, NI Shouh-Pin
M3  8
For D5
nut
HEX/GW, LF, NI Shouh-Pin
M3  8
Inlet
inlet
TU-333-BZ-315-P3D/TECK
L3P
Cable
cable
16AWG/1571
2.5  5.5  12 (kk,fk), L = 1200 mm
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6. Transformer specification
6.1 Transformer schematic diagram
Primary
Secondary
2
5
N4
N3, N5
6
A
N1
1
3
N2
4
S1, S2 & S3
014aab159
014aab158
Fig 14. Transformer winding diagram
Fig 15. Transformer side view
6.2 Winding specification
Table 11.
Winding table
Winding
order[1]
Pin
Start
Finish
1
N1
1
A
0.4 mm   1
22
2
N2
3
4
0.15 mm   3
3
S1
4
0.025 mm  7 mm
4
N3
6
5
S2
6
N4
7
S3
8
N5
5
A[2]
5
Wire
Turns
Insulation
Width
22
1
10 mm
8
8
1
10 mm
1
1
1
10 mm
0.35 mm  (3L)  2
8
8
1
10 mm
4
0.025 mm  7 mm
1
1
1
10 mm
2
0.4 mm   1
22
22
1
10 mm
4
0.025 mm  7 mm
1
1
1
10 mm
6
0.35 mm  (3L)  2
8
8
1
10 mm
S1, S2, S3 are copper shields connected to the primary ground (pin4).
[2]
Intermediate connection A is not connected to a pin.
User manual
Winding Method
Turn
[1]
UM10385
Turns /
Layer
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6.3 Electrical characteristics
Table 12.
Electrical characteristics
Description
Pin
Specification
Remark
Inductance
1 to 2
650 H ± 5 %
65 kHz; 1 V
Leakage inductance
1 to 2
10 H
secondary side all shorted
6.4 Core and bobbin
Core: RM-10 (A-Core, JPP-95 or equivalent)
Bobbin: RM-10 (TBI, RM10-18.6-6P-TH-H-12, 6 pin, vertical type)
Ae : 96.6 mm2
6.5 Marking
Marking: APBADC051
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All information provided in this document is subject to legal disclaimers.
Rev. 02 — 2 June 2010
© NXP B.V. 2010. All rights reserved.
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GreenChip 65 W TEA1733(L)T demo board
7. Layout of the 65 W TEA1733(L)T demo board
014aab160
Fig 16. Copper layout (bottom view)
HS1
B01
R11
Q1
C2
-V
+V
C14
CY1
J1
LF2
BC1
INLET
C1
J4
J3
J5
C13
CX1
T3.15A/250V
D5
J2
F1
T1
LF1
APBADC051
Ver. A
C11
HS2
RT1
014aab161
Fig 17. Silk screen component side (top view)
UM10385
User manual
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 2 June 2010
© NXP B.V. 2010. All rights reserved.
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8. Alternative circuit options
8.1 Changing the output voltage
By changing the following components, the output voltage can be changed. For additional
information on this topic please refer to the TEA1733(L) application note.
R23/R24
The resistor dividers R23 and R24 determine the output voltage.
V o = 2.5 V   R23 + R24    R24 
C13/C14
The voltage rating of these electrolytic capacitors must be chosen higher than the output
voltage. For lower output currents the capacity value can be decreased.
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All information provided in this document is subject to legal disclaimers.
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9. Legal information
9.1
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
9.2
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
Safety of high-voltage evaluation products — The non-insulated high
voltages that are present when operating this product, constitute a risk of
electric shock, personal injury, death and/or ignition of fire. This product is
intended for evaluation purposes only. It shall be operated in a designated
test area by personnel that is qualified according to local requirements and
labor laws to work with non-insulated mains voltages and high-voltage
circuits.
The product does not comply with IEC 60950 based national or regional
safety standards. NXP Semiconductors does not accept any liability for
damages incurred due to inappropriate use of this product or related to
non-insulated high voltages. Any use of this product is at customer’s own risk
and liability. The customer shall fully indemnify and hold harmless NXP
Semiconductors from any liability, damages and claims resulting from the use
of the product.
9.3
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
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User manual
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 2 June 2010
© NXP B.V. 2010. All rights reserved.
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UM10385
NXP Semiconductors
GreenChip 65 W TEA1733(L)T demo board
10. Contents
1
1.1
2
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
4
5
5.1
6
6.1
6.2
6.3
6.4
6.5
7
8
8.1
9
9.1
9.2
9.3
10
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Power supply specification. . . . . . . . . . . . . . . . 4
Performance data. . . . . . . . . . . . . . . . . . . . . . . . 5
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
No load power consumption . . . . . . . . . . . . . . . 5
Output regulation . . . . . . . . . . . . . . . . . . . . . . . 6
VCC voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Brownout and start level . . . . . . . . . . . . . . . . . . 6
Over voltage protection. . . . . . . . . . . . . . . . . . . 6
Startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Dynamic loading . . . . . . . . . . . . . . . . . . . . . . . . 7
Output ripple and noise . . . . . . . . . . . . . . . . . . 8
EMI performance . . . . . . . . . . . . . . . . . . . . . . . 8
Schematic 65 W TEA1733(L)T demo board . . 10
Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . 11
Components list . . . . . . . . . . . . . . . . . . . . . . . 11
Transformer specification . . . . . . . . . . . . . . . . 14
Transformer schematic diagram . . . . . . . . . . . 14
Winding specification . . . . . . . . . . . . . . . . . . . 14
Electrical characteristics . . . . . . . . . . . . . . . . . 15
Core and bobbin . . . . . . . . . . . . . . . . . . . . . . . 15
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Layout of the 65 W TEA1733(L)T demo board 16
Alternative circuit options. . . . . . . . . . . . . . . . 17
Changing the output voltage. . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 2 June 2010
Document identifier: UM10385