UM10339 User Manual for the BGU7003 GPS LNA demo boards v2.0 Rev. 1 — 15 September 2011 User manual Document information Info Content Keywords LNA, GPS, BGU7003 Abstract This document explains the BGU7003 GPS LNA evaluation Board UM10339 NXP Semiconductors User manual Revision history Rev Date Description 1 Initial document 20110915 Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] UM10339 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 2 of 13 UM10339 NXP Semiconductors User manual 1. Introduction The BGU7003 is a wideband Silicon Germanium Amplifier MMIC for high speed, low noise applications. It can be used mainly for LNA applications up to 6 GHz like GPS, satellite radio, cordless phone. The BGU7003 contains one RF stage and internal bias that is temperature stabilized. It also contains a power down function to shutdown the amplifier by means of a logic signal on the enable pin. The BGU7003 is ideal for use in portable electronic devices, such as mobile phones, Personal Digital Assistants (PDAs), Personal Navigation Devices (PNDs) etc. The GPS LNA EValuation Board (EVB) is designed to evaluate the performance of the BGU7003 applied as a GPS LNA. In this document, the application diagram, board layout, bill of material, and some typical results are given. Figure Fig 1 shows the evaluation board. Fig 1. BGU7003_GPS LNA evaluation board UM10339 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 3 of 13 UM10339 NXP Semiconductors User manual 2. General description The BGU7003 design is a wideband Silicon Germanium (SiGe) transistor with internal bias circuit. This bias circuit is temperature stabilized, which keeps the current constant over temperature. The bias current for the RF stage can be set via an external bias resister in order to give the designer flexibility in choosing the bias current. The MMIC is also supplied with a power-down function that allows the designer to control the MMIC via a logic signal. This power-down mode only consumes 0.4 µA. In Figure Fig 2 the simplified internal circuit of the BGU7003 is given. 1 Rb 6 Bias AND Enable Circuit RFin GND 2 5 3 6 Vcc Enable RFout Fig 2. Simplified internal circuit of the BGU7003 The BGU7003 is not internally matched so for both input and output a matching circuit needs to be designed. The fact that no internal matching is available makes the product suitable for different application areas. In the next paragraphs the BGU7003 applied as a GPS LNA is described. 3. Application board The BGU7003 EVB simplifies the evaluation of the BGU7003 wideband amplifier MMIC, for the GPS application area. The EVB enables testing of the device performance and requires no additional support circuitry. The board is fully assembled with the BGU7003 IC, including input- and output matching, to optimize the performance. The board is connectorized with signal input and output SMA connectors for connection to RF test equipment. UM10339 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 4 of 13 UM10339 NXP Semiconductors User manual 3.1 Application circuit In Figure Fig 3 the application diagram as supplied on the evaluation board is given. Fig 3. Circuit diagram of the evaluation board 3.2 Board layout Figure Fig 4 shows the board layout with the component identifiers. Fig 4. Printed-Circuit Board (PCB) of the BGU7003 evaluation board UM10339 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 5 of 13 UM10339 NXP Semiconductors User manual 3.3 PCB layout A good PCB Layout is an essential part of an RF circuit design. The EVB of the BGU7003 can serve as a guideline for laying out a board using the BGU7003. Use controlled impedance lines for all high frequency inputs and outputs. Bypass V CC with decoupling capacitors, preferable located as close as possible to the device. For long bias lines it may be necessary to add decoupling capacitors along the line further away from the device. Proper grounding the GND pin is also essential for the performance. Either connect the GND pin directly to the ground plane or through vias, or do both. The material that has been used for the EVB is FR4 using the stack shown in figure Fig 5. Fig 5. Stack of the PCB material Material supplier is ISOLA DURAVER; r = 4.6 to 4.9; tan = 0.02. 3.4 Bill of materials Table 1. BOM of the BGU7003 evaluation board Component Description Footprint Value Supplier name / type Remarks C1, C2 capacitor 0402 100 pF MurataGRM1555 DC blocking C3 capacitor 0402 180 pF MurataGRM1555 decoupling L1 inductor 0402 2.7 nH input matching L2 inductor 0402 30 nH L3 inductor 0402 33 nH Murata/LQW15A high quality factor, low series resistance Murata/LQW15A high quality factor, low series resistance Murata/LQG15HS output matching / DC Bias L4 inductor 0402 3.9 nH Murata/LQG15HS output matching R1 resistor 0402 180 R2 resistor 0402 0 bridge, proper routing makes it not necessary R3 resistor 0402 3300 bias setting X1, X2 SMA RF connector - Johnson, end launch SMA input matching RF input / RF output 142-0701-841 X3 UM10339 User manual DC header - Molex, PCB header, right angle, 1 row, 4 way 90121-0764 All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 bias connector © NXP B.V. 2011. All rights reserved. 6 of 13 UM10339 NXP Semiconductors User manual 4. Required equipment In order to measure the evaluation board the following is necessary. A DC power supply up to 30 mA at 2 V to 2.8 V (up to 15V for bias control). An RF signal generator capable of generating an RF signal at the operating frequency of 1575.42 MHz. An RF spectrum analyzer that covers at least the operating frequency of 1575.42 MHz as well as a few of the harmonics, so up to 6 GHz should be sufficient. ”Optional” a version with the capability of measuring noise figure is convenient. An amp meter to measure the supply current (optional). A network analyzer for measuring gain, return loss and reverse isolation. A noise figure analyzer. 5. Connections and set_up The BGU7003 EVB is fully assembled and tested. Please follow the steps below for a step-by-step guide to operate the EVB and testing the device functions. 1. Connect the DC power supply set to 2.5 V to the VCC, VRb Ven and GND terminals. 2. Connect the RF signal generator and the spectrum analyzer to the RF input and the RF output of the EVB respectively. Do not turn on the RF output of the signal generator yet, set it to 40 dBm output power at 1575.42 MHz. Set the spectrum analyzer on 1575.42MHz center frequency and a reference level of 0 dBm. 3. Turn on the DC power supply and it should read approximately 5.1 mA. 4. Enable the RF output of the generator; the spectrum analyzer displays a tone of 1575.42 MHz at around –21 dBm. 5. In order to evaluate the board on different bias currents through RF stage of the MMIC the voltage on R3 (VRb) can be connected to a separate power supply. One is now able to control the bias current. 6. To evaluate the enable function the Ven terminal of the board can also be connected to a separate DC power supply that either gives a voltage > 0.6 V (amplifier on) or < 0.5 V (amplifier off). 7. Instead of using a signal generator and spectrum analyzer one can also use a network analyzer NWA in order to measure gain as well as in- and output return loss 8. For noise figure evaluation, either a noise figure analyzer or a spectrum analyzer with noise option can be used. The use of a 5 dB noise source, like the Agilent 364A is recommended. When measuring the noise figure of the evaluation board any kind of adaptors, cables etc between the noise source and the EVB should be avoided, since this affects the noise performance. UM10339 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 7 of 13 UM10339 NXP Semiconductors User manual Fig 6. Evaluation board including its connections UM10339 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 8 of 13 UM10339 NXP Semiconductors User manual 6. Typical EVB results Table 2. Typical results measured on the evaluation boards Operating frequency is 1575.42 MHz; VCC, VRb and Ven = 2.5 V; ICC = 5 mA; Tamb = 25 °C; unless otherwise specified. Symbol Parameter NF noise figure Gp power gain 18.2 dB RLin input return loss 5.6 dB RLout output return loss 18 dB ISLrev reverse isolation 24 dB Pi(1dB) input power at 1 dB gain compression 19 dBm Po(1dB) output power at 1 dB gain compression 2 dBm IP3I input third-order intercept point 6 dBm IP3O output third-order intercept point 10.5 dBm on/off switching tsw switching time 0.7 s [1] UM10339 User manual Value [1] Remarks 0.85 dB The NF and Gp figures are measured at the SMA connectors of the EVB, so the losses of the connectors and the PCB are not subtracted. If you do so the NF will improve approximately 0.1 dB. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 9 of 13 UM10339 NXP Semiconductors User manual 7. Legal information 7.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 7.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP UM10339 User manual Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. 7.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 10 of 13 UM10339 NXP Semiconductors User manual 8. List of figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. BGU7003_GPS LNA evaluation board ............. 3 Simplified internal circuit of the BGU7003 ......... 4 Circuit diagram of the evaluation board ............ 5 Printed-Circuit Board (PCB) of the BGU7003 evaluation board ............................................... 5 Stack of the PCB material ................................. 6 Evaluation board including its connections ....... 8 UM10339 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 11 of 13 UM10339 NXP Semiconductors User manual 9. List of tables Table 1. Table 2. BOM of the BGU7003 evaluation board ............ 6 Typical results measured on the evaluation boards 9 UM10339 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 September 2011 © NXP B.V. 2011. All rights reserved. 12 of 13 UM10339 NXP Semiconductors User manual 10. Contents 1. 2. 3. 3.1 3.2 3.3 3.4 4. 5. 6. 7. 7.1 7.2 7.3 8. 9. 10. Introduction ......................................................... 3 General description ............................................. 4 Application board ................................................ 4 Application circuit ............................................... 5 Board layout ....................................................... 5 PCB layout ......................................................... 6 Bill of materials ................................................... 6 Required equipment ............................................ 7 Connections and set_up ..................................... 7 Typical EVB results ............................................. 9 Legal information .............................................. 10 Definitions ........................................................ 10 Disclaimers....................................................... 10 Trademarks ...................................................... 10 List of figures..................................................... 11 List of tables ...................................................... 12 Contents ............................................................. 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 September 2011 Document identifier: UM10339