OL2300 Demo board user manual

UM10473
OL2300 Demo board user manual
Rev. 01 — 29 August 2011
User manual
Document information
Info
Content
Keywords
OL2300, User manual, UHF, RF, transmitter, fractional-N-PLL
Abstract
This user manual describes the architecture and functionalities of the
OL2300 UHF transmitter evaluation board.
UM10473
NXP Semiconductors
OL2300 Demo board user manual
Revision history
Rev
Date
Description
v.1
20110829
initial version
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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User manual
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OL2300 Demo board user manual
1. Introduction
OL2300 is a UHF ASK/FSK fractional-N transmitter IC. The device provides a fully
integrated fractional-N PLL frequency synthesizer and a power amplifier to drive an
external antenna.
The purpose of this manual is to provide an introduction to the evaluation board named
"LID1204", which is intended to evaluate the internal functional blocks of the OL2300..
The evaluation board is equipped with a serial RS232 interface to connect the board to a
PC. A Windows GUI provides a means to access the different special function registers of
OL2300. The onboard controller PCF7941 acts as a logical interface between RS232 and
OL2300 and it is programmed accordingly.
The power amplifier output of OL2300 is matched to 50  and can be directly connected
to appropriate measurement devices.
The evaluation board is available in two versions; one for the 315 MHz and one for the
434 MHz ISM frequency bands. Each version has a different mounting for the crystal and
different matching network of the 50  SMA connector output.
An 868 MHz version can be created by using the 434 MHz board, and changing some of
the component values (see Figure 1).
Section 2 “Evaluation board schematic” gives details of component placement, usage and
typical measurement results.
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2. Evaluation board schematic
The schematic of the evaluation board is shown in Figure 1.
The 125 kHz transponder antenna of the PCF7941 and the three switches are not
mounted.
The transmitter section of the board is isolated by removing the following six jumpers:
TX_SUPPLY, EN, SCK, SDIO, CKOUT, SDO. The jumpers allow the following:
• evaluation of the onboard OL2300 IC in combination with another µC
• monitoring of the SPI connection
• current measurements
The crystal which is connected to the oscillator pins of OL2300 is an NDK NX5032GA. A
frequency of 13.28963 MHz is chosen to cover the 434 MHz band as well as the 868 MHz
and the 915 MHz bands. However, for the 868 MHz and 915 MHz band, the matching
network must be adapted accordingly.
In the 315 MHz version, the crystal frequency is 18.37036 MHz. The reference clock
frequency is divided by two to keep the PLL frequency below the specified maximum of
920 MHz. To achieve this frequency limitation, the internal XTAL clock divider is set to
XOSL = 1.
The UHF matching network is adapted to transform the 50  terminated output
impedance of connector X2 to the optimal impedance of the RF power amplifier. This is
done in a way to attain the highest possible output power in power mode III (PAM=3) with
a harmonic suppression of at least 50 dBc.
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User manual
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UM10473
User manual
Rev. 01. — 29 August 2011
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Schematic of OL2300 RF evaluation board
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Fig 1.
OL2300 Demo board user manual
aaa-000050
UM10473
NXP Semiconductors
OL2300 Demo board user manual
3. Component placement
Figure 2 shows the component layout on the evaluation board as viewed from the top
side.
55
45
aaa-000051
Fig 2.
UM10473
User manual
Component layout - evaluation board top side
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4. Usage
Connect a supply voltage (2.1 V up to 3.6 V) to the supply connector, according to the
indications on the board layout. For safety reasons, the maximum current is limited to
50 mA.
When a serial connection between the evaluation board and a PC is established, the
Windows software 'Frantic.exe' can be run. On start-up, the program initializes the special
function register set of OL2300 using the first available COM port. The communication
port used by the progam is shown in the left lower corner of the GUI. Each interaction with
the Windows program is immediately transferred to reflect the changes in the register set
of OL2300. The Windows program provides context-sensitive help.
A 50  spectrum analyzer is directly connected to X2. Ensure that the analyzer input
attenuator setting matches the RF output power level of the evaluation board using a
starting reference value of +20 dBm.
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5. Measurement results
The evaluation board measurements are made under the following conditions, unless
otherwise stated:
•
•
•
•
•
Supply voltage VCC = 2.7 V
Power mode PAM = 3 with CASC = 0 and ENRAD = 0
Output amplitude AMH = 15
Temperature T = room temperature
Carrier frequency fC = 433.92 MHz
Detailed measurements have been performed for the 434 MHz version of the evaluation
board only.
Measurement instruments:
• Spectrum Analyzer: Rohde & Schwarz FSP7
• Multimeter: Agilent 34401A
The following results indicate typical values only and vary as a result of device spreads,
component tolerances or temperature changes.
5.1 General
Table 1.
Typical performance
Symbol
Parameter
User manual
Version (MHz)
Unit
315
434
868
Ipd
power-down current
-
<10
<10
<10
nA
ICC
supply current
XTAL on
250
250
250
A
PLL locked
2.1
2.7
2.7
mA
PA enabled
12.1
13.5
13
mA
Po
output power
-
9.8
9.3
8.5
dBm
Psp
spurious output power
reference
47
47
42
dBc
harmonic
54
52
46
dBc
•
•
•
•
UM10473
Conditions
Center frequency: 315 MHz
Data rate: 4.8 kbps Manchester coded (symbol rate = 9600 chips/s)
Modulation type: FSK
Frequency deviation: 4.8 kHz
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aaa-000052
-80
Phase Noise
(dBc/Hz)
-90
-100
-110
-120
103
Fig 3.
104
105
106
107
Frequency Offset (Hz)
Carrier phase noise
5.2 Output power (Po)
5.2.1 Po = f(AMH, PAM)
The data provided in Table 2 is based on the power of the carrier when measured during
CW operation.
Table 2.
Output power [f(AMH, PAM)]
AMH
Po = (dBm)
ICC (mA)
PAM = 0
PAM = 1
PAM = 2
PAM = 3
PAM = 0
PAM = 1
PAM = 2
PAM = 3
0
75
75
75
75
2.62
2.62
2.62
2.62
1
21.97
19.40
15.20
10.30
2.86
2.94
3.16
3.66
2
15.70
13.14
8.98
4.10
3.10
3.27
3.70
4.71
3
12.14
9.66
5.58
0.76
3.35
3.60
4.24
5.71
4
9.32
7.05
3.12
1.60
3.60
3.91
4.74
6.66
5
7.55
5.25
1.30
3.35
3.84
4.22
5.25
7.60
6
6.27
3.87
0.18
4.77
4.03
4.49
5.73
8.49
7
4.93
2.56
1.45
5.84
4.28
4.81
6.23
9.29
8
3.55
1.30
2.54
6.64
4.52
5.12
6.71
9.99
9
2.80
0.50
3.41
7.27
4.71
5.37
7.15
10.62
10
2.06
0.30
4.24
7.79
4.89
5.63
7.59
11.21
11
1.38
1
4.95
8.20
5.09
5.90
8.01
11.72
12
0.52
1.79
5.63
8.54
5.32
6.19
8.44
12.20
13
0.01
2.34
6.17
8.82
5.51
6.44
8.83
12.63
14
0.41
2.80
6.65
9.06
5.65
6.64
9.18
13.03
15
0.93
3.32
7.09
9.27
5.84
6.90
9.54
13.41
Figure 4 is based on measurement data provided in Table 2
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aaa-000053
10
Output Power
(dBm)
5
32
η
(%)
27
22
0
(1)
17
-5
(2)
(5)
-10
12
(3)
(6)
-15
(4)
7
(7)
-20
2
(8)
-25
0
3
6
9
12
15
AMH
Fig 4.
Plot (1) represents output power PAM = 3
Plot (5) represents efficiency PAM = 3
Plot (2) represents output power PAM = 2
Plot (6) represents efficiency PAM = 2
Plot (3) represents output power PAM = 1
Plot (7) represents efficiency PAM = 1
Plot (4) represents output power PAM = 0
Plot (8) represents efficiency PAM = 0
Output power as a function of AMH and PAM
5.2.2 Po = f (VCC, CASC, ENRAD)
Table 3.
VCC (V)
Output power [f (VCC, CASC, ENRAD)]
CASC = 0, ENRAD = 0
CASC = 1, ENRAD = 1
Po = (dBm)
ICC (mA)
Po = (dBm)
ICC (mA)
2.1
6.86
10.81
6.42
10.01
2.2
7.32
11.30
6.74
10.27
2.3
7.76
11.76
7.04
10.51
2.4
8.17
12.19
7.31
10.74
2.5
8.55
12.61
7.57
10.96
2.6
8.91
13.02
7.80
11.17
2.7
9.25
13.41
8.02
11.37
2.8
9.58
13.78
8.21
11.56
2.9
9.88
14.15
8.39
11.74
3.0
10.17
14.51
8.54
11.90
3.1
10.43
14.82
8.68
12.06
3.2
10.68
15.11
8.80
12.20
3.3
10.91
15.39
8.90
12.33
3.4
11.14
15.65
8.98
12.45
3.5
11.34
15.91
9.06
12.56
3.6
11.54
16.16
9.11
12.66
Figure 5 is based on measurement data provided in Table 3
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OL2300 Demo board user manual
aaa-000054
12
Output Power
(dBm)
28
η
(%)
10
24
(1)
(2)
8
20
(3)
(4)
6
2.0
2.4
2.8
16
3.6
3.2
Supply Voltage (V)
Plot (1) is efficiency CASC = 0, ENRAD = 0
Plot (3) is output power CASC = 0, ENRAD = 0
Plot (2) is efficiency CASC = 1, ENRAD = 1
Plot (4) is output power CASC = 1, ENRAD = 1
Fig 5.
Output as a function of supply voltage and flags CASC and ENRAD
5.3 Output Spectrum
The most significant spurious RF outputs of the OL2300 as measured at the RF output
connector are shown in Figure 6 to Figure 9. The spectrum analyzer is connected directly
to the evaluation board. The spectrum analyzer settings can be seen. Measurements are
made under conditions: CW, VCC = 2.7 V, AMH = 15.
5.3.1 315 MHz
* At t
Re f 1 1 0 d Bm
10
20 dB
* RB W 3 0 0 k H z
VB W 1 MH z
SW T 1 1 5 ms
0
1 PK *
AVG
- 10
- 20
De l t a
4 [ T1 ]
- 71. 99
945. 000000000
Ma r k e r 1 [ T 1 ]
10. 25
315. 000000000
De l t a 2 [ T 1 ]
- 58. 91
315. 000000000
De l t a 3 [ T 1 ]
- 54. 19
630. 000000000
dB
M Hz
d Bm
MHz
B
SG L
dB
MHz
dB
MHz
- 30
- 40
SW P
3
2 100 of
100
3 DB
- 50
4
- 60
- 70
- 80
- 90
Ce n t e r
2 . 1 GHz
4 0 0 MHz /
Sp a n 4 GHz
aaa-000055
Fig 6.
UM10473
User manual
Harmonic spurious signals
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Re f
10
* At t
1 0 d Bm
20 dB
1
* RB W 3 k H z
VB W 1 0 k H z
SW T 2 2 . 5 s
Ma r k e r
1 [ T1 ]
10. 26
315. 000000000
De l t a 2 [ T 1 ]
- 46. 88
9. 175000000
0
1 PK *
AVG
De l t a 3 [ T 1 ]
- 53. 22 dB
1 8 . 3 7 5 0 0 0 0 0 0 MH z
- 10
d Bm
MHz
A
SG L
dB
MHz
- 20
- 30
2
- 40
3
SWP
10 of
10
3 DB
- 50
- 60
- 70
- 80
- 90
Ce n t e r
2 0 MH z /
3 1 5 MHz
Sp a n 2 0 0 MHz
aaa-000056
Fig 7.
Reference spurious signals
5.3.2 434 MHz
Re f
10
* At t
110 d B m
20 dB
* RB W 3 0 0 k Hz
VB W 1 M Hz
SWT 1 1 5 m s
1 [ T1 ]
9 . 9 0 d Bm
4 3 4 . 0 0 0 0 0 0 0 0 0 M Hz
De l t a 2 [ T 1 ]
- 51. 88
434. 000000000
De l t a 3 [ T 1 ]
- 58. 47
868. 000000000
De l t a 4 [ T 1 ]
- 62. 15
1. 735500000
0
1 PK *
AVG
Mar k er
- 10
- 20
dB
MHz
B
SG L
dB
MHz
dB
GHz
- 30
2
- 40
SWP
100 of
1 030
3 DB
4
- 50
- 60
- 70
- 80
- 90
Ce n t e r
2 . 1 GH z
4 0 0 M Hz /
Sp a n 4 GHz
aaa-000057
Fig 8.
UM10473
User manual
Harmonic spurious signals
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Re f
10
* At t
1 0 d Bm
20 dB
1
* RB W 3 k H z
VB W 1 0 k H z
SW T 2 2 . 5 s
4 [ T1 ]
- 53. 97 dB
- 2 6 . 5 7 5 0 0 0 0 0 0 MH z
Ma r k e r
1 [ T1 ]
9. 90
433. 920000000
D e lt a 2 [ T1 ]
- 46. 67
- 13. 300000000
D e lt a 3 [ T1 ]
- 47. 56
13. 300000000
0
1 PK *
AVG
De l t a
- 10
- 20
d Bm
MHz
A
SG L
dB
MHz
dB
MHz
- 30
2
- 40
3
4
SWP
10 of
10
3 DB
- 50
- 60
- 70
- 80
- 90
Ce n t e r
4 3 3 . 9 2 M Hz
2 0 M Hz /
Sp a n 2 0 0 M H z
aaa-000058
Fig 9.
UM10473
User manual
Reference spurious signals
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5.4 ASK modulation
The output of OL2300, when set to ASK modulation, is measured in frequency and time
domain for ASK and Soft-ASK. Figure 10 and Figure 11 show the results.
A modulation frequency of 20 kHz is used for the measurements.
VCC = 2.7 V, AMH = 15, AML = 0, RBW = 300 kHz
Re f
* At t
1 0 d Bm
* R BW 1 kH z
V BW 3 kH z
S WT 600 ms
20 dB
10
B
0
1 PK *
AVG
- 10
- 20
- 30
- 40
3 DB
- 50
- 60
- 70
- 80
- 90
Ce n t e r
Re f
4 3 3 . 9 2 MHz
* At t
9 d Bm
6 0 kH z /
R B W 3 0 0 k Hz
* V B W 1 M Hz
SW T 1 0 0 μ s
20 dB
1 00
M ark er
2
90
1 AP
CLRWR
Sp a n 6 0 0 k Hz
De l t a 2 [ T 1 ]
890. 581 %
2 . 32 0000 μs
1 [ T1 ]
- 1 0 . 9 6 d Bm
48 . 91 0000 μs
A
SG L
TRG
80
70
60
50
T RG 5 0 %
3D B
40
30
20
1
10
0
Ce n t e r
Fig 10.
UM10473
User manual
4 3 3 . 9 2 MH z
10 μs /
aaa-000059
ASK signal in frequency and time domain, RMP = 0 > tSA = 0 s
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Re f
* At t
10 dBm
* R BW 1 kH z
V BW 3 kH z
S WT 6 0 0 m s
20 dB
10
B
0
1 PK *
AVG
- 10
- 20
- 30
- 40
3 DB
- 50
- 60
- 70
- 80
- 90
C en t er
Re f
4 3 3 . 9 2 MH z
* At t
9 d Bm
6 0 k Hz /
RB W 3 0 0 k Hz
* V B W 1 MH z
20 dB
SWT 100 μs
1 00
Ma r k e r
2
90
1 AP
CLRWR
Sp a n 6 0 0 k H z
D e lt a 2 [ T 1 ]
885. 336 %
8 . 10 0000 μs
1 [ T1 ]
- 1 0 . 8 9 d Bm
47 . 04 0000 μs
A
SGL
TRG
80
70
60
50
T RG 5 0 %
3 DB
40
30
20
1
10
0
Ce n t e r
4 3 3 . 9 2 MH z
10 μs /
aaa-000060
Fig 11. Soft-ASK signal in frequency and time domain, RMP = 10 > tSA = 11.3 s
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5.5 FSK modulation
The output of OL2300, when set to FSK modulation, is measured in frequency and time
domain for FSK and Soft-FSK. Figure 12 and Figure 13 show the results.
OL2300 was set to a modulation frequency of 20 kHz using an FSK deviation of 20.3 kHz.
VCC = 2.7 V, AMH = 15, AML = 0, RBW = 200 kHz.
Re f
* Att
1 0 d Bm
* RBW 1 k H z
V BW 3 k H z
SW T 6 0 0 m s
20 dB
10
B
0
1 PK *
AVG
- 10
- 20
- 30
- 40
3DB
- 50
- 60
- 70
- 80
- 90
Ce n t e r
R ef
6 0 k Hz /
I FB 300 kH z
4 3 3 . 9 2 MHz
0 Hz
* At t
20 d B
AQT 100 μs
2 6k
1 9. 5k
1 AP
AVG
2
Sp a n 6 0 0 k Hz
D e l t a 2 [ T1 ]
32. 60625878 9 k H z
3. 80000 0 μs
M a rk er 1 [ T1 ]
- 16. 52217382 8 k H z
48. 00000 0 μs
A
1 3k
TRG
6 . 5k
0
- 6. 5k
1
- 13k
- 19. 5k
- 26k
Cent er
433. 92 MH z
10 μs /
F r e q u e n c y M o d u l a t i o n Summary
Co u p l i n g
De v i a t i o n
DC
+peak
- peak
±peak / 2
RMS
27.
- 27.
27.
20.
81
07
44
35
k Hz
k Hz
k Hz
k Hz
Ca r r i e r
Of fs e t
Ca r r i e r
Po w e r
Mo d u la t i o n
F re q u e n c y
Sa mp l i n g
R a te
Re c o r d L e n g th
D e m o d Ba n d w i d th
355. 96
8. 79
19. 9687
250
26
200
Hz
d Bm
kHz
kHz
kHz
aaa-000061
Fig 12.
UM10473
User manual
FSK signal in frequency and time domain, RMP = 0 > tSF = 0 s
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Re f
* At t
1 0 d Bm
* RB W 1 kHz
VB W 3 kHz
SW
WT 6 0 0 ms
2 0 dB
10
B
0
1 PK *
AVG
- 10
- 20
- 30
- 40
3DB
- 50
- 60
- 70
- 80
- 90
Cent e r
Ref
4 3 3 . 9 2 MHz
0 Hz
6 0 k Hz /
I FB 300 k Hz
* At t
20 d B
AQT 100 μs
2 6k
2
1 9. 5k
1 AP
AVG
Sp a n 6 0 0 k Hz
Delt a 2 [ T1 ]
32. 61422363 3 kH z
11. 20000 0 μs
Mar k er 1 [ T1 ]
- 16. 03788183 6 kH z
44. 60000 0 μs
A
1 3k
TRG
6 . 5k
0
- 6. 5k
1
- 13k
- 19. 5k
- 26k
Center
433. 92 MHz
Fr eque nc y
Coup l in g
Dev i at io n
M odu l a t i on
DC
+ peak
- peak
± peak/ 2
RMS
10 μs /
Summary
22.
- 22.
22.
16.
29
08
18
41
k Hz
k Hz
k Hz
k Hz
C ar r ie r
Of f set
C ar r ie r
Power
Modu lat i on Fr e quency
S a m p li ng
Ra t e
Recor d
Lengt h
Demod
Bandwi dth
77. 330
8. 81
20. 0764
250
26
200
Hz
dBm
kHz
kHz
kHz
aaa-000062
Fig 13.
UM10473
User manual
Soft-FSK signal in frequency and time domain, RMP = 2 > tSF = 15 s
All information provided in this document is subject to legal disclaimers.
Rev. 01. — 29 August 2011
© NXP B.V. 2011. All rights reserved.
17 of 19
UM10473
NXP Semiconductors
OL2300 Demo board user manual
6. Legal information
6.1
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
6.2
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
UM10473
User manual
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
6.3
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 01. — 29 August 2011
© NXP B.V. 2011. All rights reserved.
18 of 19
UM10473
NXP Semiconductors
OL2300 Demo board user manual
7. Contents
1
2
3
4
5
5.1
5.2
5.2.1
5.2.2
5.3
5.3.1
5.3.2
5.4
5.5
6
6.1
6.2
6.3
7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Evaluation board schematic . . . . . . . . . . . . . . . 4
Component placement . . . . . . . . . . . . . . . . . . . 6
Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Measurement results . . . . . . . . . . . . . . . . . . . . . 8
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output power (Po). . . . . . . . . . . . . . . . . . . . . . . 9
Po = f(AMH, PAM). . . . . . . . . . . . . . . . . . . . . . . 9
Po = f (VCC, CASC, ENRAD) . . . . . . . . . . . . . 10
Output Spectrum. . . . . . . . . . . . . . . . . . . . . . . 11
315 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
434 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ASK modulation . . . . . . . . . . . . . . . . . . . . . . . 14
FSK modulation . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 August 2011
Document identifier: UM10473