UM5204EEXF - Union Semiconductor

UM5204EEXF
Quad Channel Low Capacitance ESD Protection Array
UM5204EEAF SC70-6/SC88/SOT363
UM5204EEBF SC89-6/SOT563/SOT666
UM5204EECF TSOP-6/SOT23-6
General Description
UM5204EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series
has been specifically designed to protect sensitive components which are connected to data and
transmission lines from over-voltage caused by ESD (electrostatic discharge).
The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a
single package. During transient conditions, the steering diodes direct the transient to either the
positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage on
the power line, protecting any downstream components.
The low capacitance array configuration allows the user to protect four high-speed data or
transmission lines. The low inductance construction minimizes voltage overshoot during high current
surges. This device is optimized for ESD protection of portable electronics. They may be used to meet
the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge).
Applications
Features








USB 2.0
USB OTG
Monitors and Flat Panel Displays
Digital Visual Interface (DVI)
High-Definition Multimedia Interface
(HDMI)
SIM Ports
IEEE 1394 Firewire Ports







Pin Configurations
Transient Protection for High-Speed Data Lines to
IEC 61000-4-2 (ESD) ± 15kV (Air), ± 8kV
(Contact)
Array of Surge Rated Diodes with Internal TVS
Diode
Protects up to Four I/O Lines & Power Line
Low Capacitance (<2pF) for High-Speed Interfaces
No Insertion Loss to 2.0GHz
Low Leakage Current and Clamping Voltage
Low Operating Voltage: 5.0V
Solid-State Silicon-Avalanche Technology
Top View
M: Month Code
UM5204EEAF
SC70-6/SC88/SOT363
M: Month Code
UM5204EEBF
SC89-6/SOT563/SOT666
XX: Week Code
UM5204EECF
TSOP-6/SOT23-6
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UM5204EEXF
Ordering Information
Part Number
Working
Voltage
Packaging Type
Channel
UM5204EEAF
UM5204EEBF
UM5204EECF
5.0V
SC70-6/ SC88/ SOT363
SC89-6/SOT563/SOT666
TSOP-6/SOT23-6
4
Marking
Code
UAF
UBF
UCF
Shipping Qty
3000pcs/7 Inch
Tape & Reel
Absolute Maximum Ratings
RATING
SYMBOL
VALUE
UNITS
Ppk
150
Watts
IPP
A
kV
°C
Peak Pulse Power (tp = 8/20µs)
Peak Pulse Current (tp = 8/20µs )
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
Operating Temperature
VESD
TJ
6
±15
±8
-55 to +125
Storage Temperature
TSTG
-55 to +150
°C
Electrical Characteristics
PARAMETER
Reverse Stand-Off
Voltage
Reverse Breakdown
Voltage
Reverse Leakage
Current
SYMBOL
TEST CONDITIONS
MIN
VRWM
VBR
IR
Clamping Voltage
VC
Clamping Voltage
VC
Junction Capacitance
Cj
TYP
MAX UNIT
5.0
It = 1mA Pin 5 to 2
VRWM = 5V, T=25ºC
Pin 5 to 2
IPP = 1A, 8/20µs
Any pin to pin 2
IPP = 6A, 8/20µs
Any pin to pin 2
VR = 0V, f = 1MHz
Any I/O pin to pin 2
VR = 0V, f = 1MHz
Between I/O pins
6.0
V
V
2
µA
15
V
25
V
2
pF
1
pF
Note 1: I/O pins are pin 1, 3, 4, and 6
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UM5204EEXF
Typical Operating Characteristics
Power Derating Curve
Non-Repetitive Peak Pulse Power vs. Pulse Time
110
10
90
% of Rated Power or Ipp
Peak Pulse Power – PPK (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0.01
0.1
10
1
100
0
1000
0
50
75
100
Pulse Waveform
Clamping Voltage vs. Peak Pulse Current
150
28
90
80
Clamping Voltage – Vc (V)
Waveform
Parameters:
tr=8μs
td=20μs
100
e-t
70
60
50
td=IPP/2
40
30
20
24
Pin 1, 3, 4, 6 to
Pin 2
20
16
Pin 5 to Pin 2
Waveform
Parameters:
tr=8μs
td=20μs
12
10
8
0
0
5
10
15
20
25
0
30
1
2
3
4
5
6
Peak Pulse Current – Ipp (A)
Time (µs)
Forward Voltage vs. Forward Current
Junction Capacitance vs. Reverse Voltage
3
8
f=1MHz
2.5
6
Capacitance – Cj (pF)
Forward Voltage – VF (V)
125
Ambient Temperature - TA(℃)
110
Percent of Ipp
25
Pulse Duration – tp (µs)
4
Waveform
Parameters:
tr=8μs
td=20μs
2
0
0
1
2
3
4
Forward Current – IF (A)
5
2
Any I/O Pin
to Pin2
1.5
1
0.5
0
6
0
1
2
3
4
5
Reverse Voltage – VR (V)
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UM5204EEXF
Applications Information
Device Connection Options for Protection of Four High-Speed Data Lines
This device is designed to protect data lines by clamping them to a fixed reference. When the voltage
on the protected line exceeds the reference voltage the steering diodes are forward biased, conducting
the transient current away from the sensitive circuitry. Data lines are connected at pins 1, 3, 4 and 6.
Pin 2 should be connected directly to a ground plane. The path length is kept as short as possible to
minimize parasitic inductance. The positive reference is connected at pin 5. The options for
connecting the positive reference are as follows:
1. To protect data lines and the power line, connect pin 5 directly to the positive supply rail (VCC). In
this configuration the data lines are referenced to the supply voltage. The internal TVS diode prevents
over-voltage on the supply rail.
2. In applications where the supply rail does not exit the system, the internal TVS may be used as the
reference. In this case, pin 5 is not connected. The steering diodes will begin to conduct when the
voltage on the protected line exceeds the working voltage of the TVS (plus one diode drop).
3. In applications where complete supply isolation is desired, the internal TVS is again used as the
reference and
VCC is connected to one of the I/O inputs. An example of this configuration is the protection of a
SIM port. The
Clock, Reset, I/O, and VCC lines are connected at pins 1, 3, 4, and 6. Pin 2 is connected to ground
and pin 5 is not connected.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin
finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small
compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile
will be determined by the requirements of the solder paste. Therefore, these devices are compatible
with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions,
matte tin does not have any added alloys that can cause degradation of the solder joint.
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UM5204EEXF
Package Information
UM5204EEAF SC70-6/SC88/SOT363
Outline Drawing
D
θ
e1
Symbol
L
e
5
4
1
2
3
L1
E
E1
6
20
c
b
A
End View
A1
A2
Top View
Side View
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
DIMENSIONS
MILLIMETERS
Min
Max
0.900
1.100
0.000
0.100
0.900
1.000
0.150
0.350
0.080
0.150
2.000
2.200
1.150
1.350
2.150
2.450
0.650REF
1.200
1.400
0.525REF
0.260
0.460
0°
8°
INCHES
Min
Max
0.035
0.043
0.000
0.004
0.035
0.039
0.006
0.014
0.003
0.006
0.079
0.087
0.045
0.053
0.085
0.096
0.026REF
0.047
0.055
0.021REF
0.010
0.018
0°
8°
Land Pattern
1.94
1.30
0.80
NOTES:
1. Compound dimension: 2.00×1.25;
2. Unit: mm;
3.General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
0.35
UAF
M
Tape and Reel Orientation
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UM5204EEXF
UM5204EEBF SC89-6/SOT563/SOT666
Outline Drawing
Symbol
A
A1
b
c
D
E
E1
e
L
θ
DIMENSIONS
MILLIMETERS
INCHES
Min
Max
Min
Max
0.525
0.600
0.021
0.024
0.000
0.050
0.000
0.002
0.150
0.300
0.006
0.012
0.090
0.180
0.004
0.007
1.500
1.700
0.059
0.067
1.100
1.300
0.043
0.051
1.500
1.700
0.059
0.067
0.450
0.550
0.018
0.022
0.100
0.300
0.004
0.012
7°REF
7°REF
Land Pattern
NOTES:
1. Compound dimension: 1.60×1.20;
2. Unit: mm;
3.General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
Tape and Reel Orientation
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UM5204EEXF
UM5204EECF TSOP-6/SOT23-6
Outline Drawing
D
θ
b
5
4
1
2
3
L
L1
E
E1
6
e
c
20
e1
Top View
A
A2
A1
End View
Side View
DIMENSIONS
MILLIMETERS
Symbol
Min
Max
A
1.050
1.250
A1
0.000
0.100
A2
1.050
1.150
b
0.300
0.500
c
0.100
0.200
D
2.820
3.020
E
1.500
1.700
E1
2.650
2.950
e
0.950REF
e1
1.800
2.000
L
0.600REF
L1
0.300
0.600
θ
0°
8°
INCHES
Min
Max
0.041 0.049
0.000 0.004
0.041 0.045
0.012 0.020
0.004 0.008
0.111 0.119
0.059 0.067
0.104 0.116
0.037REF
0.071 0.079
0.023REF
0.012 0.024
0°
8°
Land Pattern
2.4
0.9
0.7
0.95
0.95
NOTES:
1. Compound dimension: 2.92×1.60;
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
UCF
XX
Tape and Reel Orientation
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UM5204EEXF
IMPORTANT NOTICE
The information in this document has been carefully reviewed and is believed to be accurate.
Nonetheless, this document is subject to change without notice. Union assumes no
responsibility for any inaccuracies that may be contained in this document, and makes no
commitment to update or to keep current the contained information, or to notify a person or
organization of any update. Union reserves the right to make changes, at any time, in order to
improve reliability, function or design and to attempt to supply the best product possible.
Union Semiconductor, Inc
Add: Unit 606, No.570 Shengxia Road, Shanghai 201210
Tel: 021-51093966
Fax: 021-51026018
Website: www.union-ic.com
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