RClamp0503F RailClamp® TVS Array for USB OTG Interfaces PROTECTION PRODUCTS - RailClamp® Description Features RailClamps are surge rated diode arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage on the power line, protecting any downstream components. The low capacitance array configuration allows the user to protect three high-speed data or transmission lines. The low inductance construction minimizes voltage overshoot during high current surges. This device is optimized for ESD protection of USB OTG and SIM interfaces. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). Transient protection for high-speed data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Array of surge rated diodes with internal TVS Diode Small package saves board space Protects three I/O lines & power line Low capacitance (<3pF) for high-speed interfaces Low clamping voltage Low operating voltage: 5.0V Solid-state silicon-avalanche technology Mechanical Characteristics EIAJ SC-70 5L package Molding compound flammability rating: UL 94V-0 Lead Finish: Matte Tin Pb-Free, Halogen Free, RoHS/WEEE Compliant Marking : F53 Packaging : Tape and Reel Applications Circuit Diagram USB OTG interfaces SIM Ports Video Graphics Cards Personal Digital Assistants (PDAs) Monitors and Flat Panel Displays Portable Electronics Microcontroller Input Protection Schematic & PIN Configuration 5 1 3 4 2 SC-70 5L (Top View) Revision 10/8/2009 1 www.semtech.com RClamp0503F PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 150 Watts Peak Pulse Current (tp = 8/20μs) IP P 6 A ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) VESD 15 8 kV TJ -55 to +125 °C TSTG -55 to +150 °C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25°C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage VRWM Pi n 5 to 2 5 V Reverse Breakdown Voltage V BR It = 1mA Pi n 5 to 2 Reverse Leakage Current IR VRWM = 5V, T=25°C Pi n 5 to 2 3 μA Clamp ing Voltage VC IPP = 1A, tp = 8/20μs A n y p i n to p i n 2 15 V Clamp ing Voltage VC IPP = 6A, tp = 8/20μs A n y p i n to p i n 2 25 V Junction Cap acitance Cj VR = 0V, f = 1MHz Any I/O p in to p in 2 3 pF VR = 0V, f = 1MHz Between I/O p ins 1.5 pF 6 V Note 1: I/O pins are pin 1, 3, and 4 © 2009 Semtech Corp. 2 www.semtech.com RClamp0503F PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 90 % of Rated Power or IPP Peak Pulse Power - P PP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 Pulse Duration - tp (μs) Pulse Waveform 80 PP Percent of I Clamping Voltage - VC (V) 90 e-t 50 40 100 125 150 25 Waveform Parameters: tr = 8µs td = 20µs 100 60 75 Clamping Voltage vs. Peak Pulse Current 110 70 50 Ambient Temperature - TA (oC) td = IPP/2 30 20 Waveform Parameters: tr = 8µs td = 20µs 20 Any I/O to pin 2 15 Pin 5 to pin 2 10 10 0 0 5 10 15 20 25 5 30 0 1 Time (µs) 2 3 4 Peak Pulse Current - IPP (A) 5 6 Capacitance vs. Reverse Votlage (Normalized to 0V) Forward Voltage vs. Forward Current 2 5 Clamping Voltage (V) 4 Normalized Capacitance f = 1MHz Pin 2 to I/O I/O to Pin 5 3 2 Waveform Parameters: tr = 8μs td = 20μs 1 0 1.5 Any I/O Pin to Pin 2 1 0.5 0 0 1 2 3 4 5 6 0 Peak Pulse Current (A) © 2009 Semtech Corp. 1 2 3 4 5 Reverse Voltage - VR (V) 3 www.semtech.com RClamp0503F PROTECTION PRODUCTS Insertion Loss S21 (I/O to Pin 2) CH1 S21 LOG Insertion Loss S21 (I/O to I/O) CH1 S21 6 dB / REF 0 dB STOP 3000. 000000 MHz START . 030 MHz LOG START . 030 MHz 6 dB / REF 0 dB STOP 3000. 000000 MHz Analog Crosstalk CH1 S21 LOG 20 dB/ REF 0 dB START . 030 MHz © 2009 Semtech Corp. STOP 3000. 000000 MHz 4 www.semtech.com RClamp0503F PROTECTION PRODUCTS Applications Information Data Line and Power Supply Protection Using Vcc as reference Device Connection Options for Protection of Three High-Speed Data Lines This device is designed to protect three data lines from transient over-voltages by clamping them to a fixed reference. When the voltage on the protected line exceeds the reference voltage (plus diode VF) the steering diodes are forward biased, conducting the transient current away from the sensitive circuitry. Data lines are connected at pins 1, 3, and 4. The negative reference is connected at pin 2. This pin should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. Connect pin 5 directly to the positive supply rail (VCC). In this configuration the data lines are referenced to the supply voltage. The internal TVS diode prevents over-voltage on the supply rail. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. © 2009 Semtech Corp. 5 www.semtech.com RClamp0503F PROTECTION PRODUCTS Outline Drawing - SC70-5L A DIM e1 D H N c GAGE PLANE 2X E/2 EI E 0.15 ccc C 2X N/2 TIPS 1 L 01 (L1) 2 e DETAIL A B D aaa C SEATING PLANE A2 A SEE DETAIL A A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .043 .000 .004 .028 .035 .039 .006 .012 .003 .009 .075 .079 .083 .045 .049 .053 .083 BSC .026 BSC .051 .010 .014 .018 (.017) 5 0° 8° .004 .004 .012 1.10 0.00 0.10 0.70 0.90 1.00 0.15 0.30 0.08 0.22 1.90 2.00 2.10 1.15 1.25 1.35 2.10 BSC 0.65 BSC 1.30 BSC 0.26 0.36 0.46 (0.42) 5 0° 8° 0.10 0.10 0.30 SIDE VIEW C A1 bxN bbb C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-203, VARIATION AA. Land Pattern - SC70-5L X DIM C G C G P X Y Z Z Y DIMENSIONS MILLIMETERS INCHES (.073) .039 .026 .016 .033 .106 (1.85) 1.00 0.65 0.40 0.85 2.70 P NOTES: 1. © 2009 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 6 www.semtech.com RClamp0503F PROTECTION PRODUCTS Marking Codes Ordering Information F53 Part Number Lead Finish Qty per Reel Reel Size RClamp0503F.TCT Matte Tin 3,000 7 Inch RailClamp and RClamp are registered marks of Semtech Corporation 1 Tape and Reel Specification F53 F53 F53 F53 F53 F53 F53 F53 Device Orientation in Tape Tape Width B, (Max) D D1 ( M IN ) 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 1.0 mm (.039) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.3 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2009 Semtech Corp. 7 www.semtech.com