FSMD0805 Series

Surface Mount PPTC
FSMD0805 Series
RoHS Compliant &
Halogen Free
Application : All high-density boards
Product Features : Small surface mountable, Solid state,
Faster time to trip than standard SMD devices, Lower
resistance than standard SMD devices
Operation Current : 0.1A~1.0A
Maximum Voltage : 6V~15VDC
Temperature Range : -40℃ to 85℃
Agency Recognition : UL (E211981)
C-UL (E211981)
TÜV (R50090556)
Electrical Characteristics(23℃
℃)
Part
Number
FSMD010-0805-R
FSMD020-0805-R
FSMD035-0805-R
FSMD050-0805R
FSMD075-0805R
FSMD100-0805R
Hold
Trip
Current Current
Rated
Max
Typ.
Max Time to Trip
Resistance
Voltage
Current
Power
Current
Time
RMIN
R1MAX
IH, A
IT, A
VMAX, VDC
IMAX, A
Pd, W
A
Sec
Ohms
Ohms
0.10
0.20
0.35
0.50
0.75
1.00
0.30
0.50
0.75
1.00
1.50
1.95
15
9
6
6
6
6
100
100
100
100
40
40
0.5
0.5
0.5
0.5
0.6
0.6
0.50
8.00
8.00
8.00
8.00
8.00
1.50
0.02
0.10
0.10
0.20
0.30
0.700
0.400
0.250
0.150
0.090
0.060
6.000
3.500
1.200
0.850
0.350
0.210
Termination pad characteristics
Termination pad materials: Pure Tin
Thermal Derating for PPTC Device at Various Ambient Temperatures
TEMPERATURE
DERATING %
-40
-20
145%
130%
0
116%
23
30
40
50
60
70
85
100%
91%
84%
76%
69%
61%
53%
A
B
C
FSMD0805 Product Dimensions (mm)
Part
Number
D
E
Min Max Min Max Min Max Min Max Min Max
FSMD010-0805-R 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45
FSMD020-0805-R 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45
FSMD035-0805-R 2.00 2.30 1.20 1.50 0.45 0.75 0.20 0.60 0.10 0.45
FSMD050-0805R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45
FSMD075-0805R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45
FSMD100-0805R 2.00 2.30 1.20 1.50 0.75 1.80 0.20 0.60 0.10 0.45
Surface Mount PPTC
Thermal Derating Curve
Thermal Derating Curve, FSMD 0805R Series
Percent of Rated Hold and Trip
Current
200%
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Temperature (C)
Typical Time-To-Trip at 23℃
℃
A =FSMD010-0805-R
B =FSMD020-0805-R
C =FSMD035-0805-R
D =FSMD050-0805R
E =FSMD075-0805R
F =FSMD100-0805R
A
100
B
C
D
E
F
Time-to-trip (s)
10
1
0.1
0.01
0.1
1
10
Fault current (A)
Part Numbering System
Part Marking System
F S M D □ □ □ - 0805 - R
F1
F
□
Part Identification
Current Rating
Example
Standard Package
FSMD010-0805-R~FSMD035-0805-R
FSMD050-0805R~FSMD100-0805R
:
:
4.0K Reel/Tape
3.0K Reel/Tape
F1 =FSMD010-0805-R
F2 =FSMD020-0805-R
F3 =FSMD035-0805-R
F5 =FSMD050-0805R
F7 =FSMD075-0805R
F0 =FSMD100-0805R
Surface Mount PPTC
Pad Layouts、
、Solder Reflow Recommendations
The dimensions in the table below provide the recommended pad layout for Surface Mount Device in
different footprints.
Pad dimensions (Millimeter)
A
Device
Nominal
All 2920 Series
5.10
All 1812 Series
3.45
All 1210 Series
2.00
All 1206 Series
2.00
All 0805 Series
1.20
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.
Preheat :
Temperature Min (Tsmin)
150 ℃
Temperature Max (Tsmax)
200 ℃
Time (tsmin to tsmax)
60-180 seconds
Time maintained above:
Temperature(TL)
217 ℃
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃
℃ of actual Peak :
20-40 seconds
Temperature (tp)
Ramp-Down Rate :
6 ℃/second max.
8 minutes max.
Time 25 ℃ to Peak Temperature :
Note 1: All temperatures refer to the package,
measured on the package body surface.
B
Nominal
2.30
1.78
1.00
1.00
1.00
C
Nominal
5.60
3.50
2.80
1.90
1.50
Solder reflow
※ Due to “Lead Free” nature, Temperature and
Dwelling Time for the soldering zone is higher
than those for Regular. This may cause
damage to other components.
1. Recommended max paste thickness >
0.25mm.
2. Devices can be cleaned using standard
methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Environment : < 30℃ / 60%RH
Caution:
1. If reflow temperatures exceed the
recommended profile, devices may not meet
the performance requirements.
2. Devices are not designed to be wave soldered
to the bottom side of the board