Surface Mount PPTC FSMD0805 Series RoHS Compliant & Halogen Free Application : All high-density boards Product Features : Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices Operation Current : 0.1A~1.0A Maximum Voltage : 6V~15VDC Temperature Range : -40℃ to 85℃ Agency Recognition : UL (E211981) C-UL (E211981) TÜV (R50090556) Electrical Characteristics(23℃ ℃) Part Number FSMD010-0805-R FSMD020-0805-R FSMD035-0805-R FSMD050-0805R FSMD075-0805R FSMD100-0805R Hold Trip Current Current Rated Max Typ. Max Time to Trip Resistance Voltage Current Power Current Time RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms 0.10 0.20 0.35 0.50 0.75 1.00 0.30 0.50 0.75 1.00 1.50 1.95 15 9 6 6 6 6 100 100 100 100 40 40 0.5 0.5 0.5 0.5 0.6 0.6 0.50 8.00 8.00 8.00 8.00 8.00 1.50 0.02 0.10 0.10 0.20 0.30 0.700 0.400 0.250 0.150 0.090 0.060 6.000 3.500 1.200 0.850 0.350 0.210 Termination pad characteristics Termination pad materials: Pure Tin Thermal Derating for PPTC Device at Various Ambient Temperatures TEMPERATURE DERATING % -40 -20 145% 130% 0 116% 23 30 40 50 60 70 85 100% 91% 84% 76% 69% 61% 53% A B C FSMD0805 Product Dimensions (mm) Part Number D E Min Max Min Max Min Max Min Max Min Max FSMD010-0805-R 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45 FSMD020-0805-R 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45 FSMD035-0805-R 2.00 2.30 1.20 1.50 0.45 0.75 0.20 0.60 0.10 0.45 FSMD050-0805R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 FSMD075-0805R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 FSMD100-0805R 2.00 2.30 1.20 1.50 0.75 1.80 0.20 0.60 0.10 0.45 Surface Mount PPTC Thermal Derating Curve Thermal Derating Curve, FSMD 0805R Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (C) Typical Time-To-Trip at 23℃ ℃ A =FSMD010-0805-R B =FSMD020-0805-R C =FSMD035-0805-R D =FSMD050-0805R E =FSMD075-0805R F =FSMD100-0805R A 100 B C D E F Time-to-trip (s) 10 1 0.1 0.01 0.1 1 10 Fault current (A) Part Numbering System Part Marking System F S M D □ □ □ - 0805 - R F1 F □ Part Identification Current Rating Example Standard Package FSMD010-0805-R~FSMD035-0805-R FSMD050-0805R~FSMD100-0805R : : 4.0K Reel/Tape 3.0K Reel/Tape F1 =FSMD010-0805-R F2 =FSMD020-0805-R F3 =FSMD035-0805-R F5 =FSMD050-0805R F7 =FSMD075-0805R F0 =FSMD100-0805R Surface Mount PPTC Pad Layouts、 、Solder Reflow Recommendations The dimensions in the table below provide the recommended pad layout for Surface Mount Device in different footprints. Pad dimensions (Millimeter) A Device Nominal All 2920 Series 5.10 All 1812 Series 3.45 All 1210 Series 2.00 All 1206 Series 2.00 All 0805 Series 1.20 Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max. Preheat : Temperature Min (Tsmin) 150 ℃ Temperature Max (Tsmax) 200 ℃ Time (tsmin to tsmax) 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ ℃ of actual Peak : 20-40 seconds Temperature (tp) Ramp-Down Rate : 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature : Note 1: All temperatures refer to the package, measured on the package body surface. B Nominal 2.30 1.78 1.00 1.00 1.00 C Nominal 5.60 3.50 2.80 1.90 1.50 Solder reflow ※ Due to “Lead Free” nature, Temperature and Dwelling Time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max paste thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment : < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board