FSMD1210

SURFACE MOUNT PPTC
FSMD1210 Series
FEATURES
•
•
•
•
•
•
RoHS

AGENCY RECOGNITION
1210 size, Surface mount
Application: All high-density boards
Operation Current: 50mA ~ 2amps
Maximum Voltage: 6V ~ 60V
Temperature Range: -40°C to 85°C
RoHS Compliant
•UL (E211981)
•C-UL (E211981)
•TUV (R50090556)
ELECTRICAL CHARACTERISTICS (23°C)
Part Number
Max Time to Trip
Resistance Tolerance
Hold
Current
Trip
Current
Rated
Voltage
Maximum
Current
Typical
Power
Current
Time
RMIN
R1MAX
IH, A
IT, A
VMAX, Vdc
IMAX, A
Pd, W
Amp
Sec
OHMS
OHMS
FSMD005-1210R
0.05
0.15
60
100
0.60
0.25
3.0
3.6
50
FSMD010-1210R
0.1
0.25
60
100
0.60
0.5
1.5
1.6
15
FSMD020-1210R
0.2
0.4
30
100
0.60
8.0
0.02
0.8
5.0
FSMD035-1210R
0.35
0.7
16
100
0.60
8.0
0.2
0.32
1.3
FSMD050-1210R
0.5
1.0
16
100
0.60
8.0
0.1
0.25
0.9
FSMD075-1210R
0.75
1.5
8
100
0.60
8.0
0.1
0.13
0.4
FSMD075-24-1210R
0.75
1.5
24
100
0.60
8.0
0.1
0.13
0.4
FSMD110-1210R
1.1
2.2
6
100
0.80
8.0
0.3
0.06
0.21
FSMD150-1210R
1.5
3.0
6
100
0.80
8.0
0.5
0.04
0.11
FSMD175-1210R
1.75
4.0
6
100
0.80
8.0
0.6
0.02
0.08
FSMD200-1210R
2.0
4.0
6
100
0.80
8.0
1.0
0.015
0.07
IH=Hold current-maximum current at which the device will not trip at 23°C still air.
IT=Trip current-maximum current at which the device will always trip at 23°C still air.
V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX).
I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment.
R MIN=Minimum device resistance at 23°C prior to tripping.
R1MAX=Maximum device resistance at 23°C measured 1 hour post trip.
Termination pad characteristics
Termination pad materials: Pure Tin
FSMD1210 PRODUCT DIMENSIONS (MILLIMETERS)
D
E
Marking
C
B
Side View
A
Top and Bottom View
Part
Number
FSMD005-1210R
Min
3.0
A
Max
3.43
Min
2.35
B
Max
2.8
Min
0.6
C
Max
1.15
Min
0.25
D
Max
0.75
Min
0.10
E
Max
0.45
FSMD010-1210R
3.0
3.43
2.35
2.8
0.6
1.15
0.25
0.75
0.10
0.45
FSMD020-1210R
3.0
3.43
2.35
2.8
0.4
0.85
0.25
0.75
0.10
0.45
FSMD035-1210R
3.0
3.43
2.35
2.8
0.4
0.80
0.25
0.75
0.10
0.45
FSMD050-1210R
3.0
3.43
2.35
2.8
0.3
0.75
0.25
0.75
0.10
0.45
FSMD075-1210R
3.0
3.43
2.35
2.8
0.3
0.70
0.25
0.75
0.10
0.45
FSMD075-24-1210R
3.0
3.43
2.35
2.8
0.9
0.70
0.25
0.75
0.10
0.45
FSMD110-1210R
3.0
3.43
2.35
2.8
0.6
1.00
0.25
0.75
0.10
0.45
FSMD150-1210R
3.0
3.43
2.35
2.8
0.5
0.90
0.25
0.75
0.10
0.45
FSMD175-1210R
3.0
3.43
2.35
2.8
0.8
1.40
0.25
0.75
0.10
0.45
FSMD200-1210R
3.0
3.43
2.35
2.8
0.8
1.40
0.25
0.75
0.10
0.45
Page 1 of 2
RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected]
C5ED03
C3CG01
2014.02.07
SURFACE MOUNT PPTC
FSMD1210 Series
RoHS

THERMAL DERATING CURVE
Thermal Derating Curve, FSMD1210 Series
Percent of Rated Hold and Trip
Current
200%
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Temperature (C)
TYPICAL TIME-TO-TRIP AT 23°C
B
C
D
E
F G
H
IJ
100
A =FSMD005-1210 -R
B =FSMD010-1210 -R
C =FSMD020-1210 -R
D =FSMD035-1210 -R
E =FSMD050-1210 -R
F =FSMD075-1210 -R
/ 075-24-1210-R
G =FSMD110-1210 -R
H =FSMD150-1210 -R
I =FSMD175-1210-R
J =FSMD200-1210-R
10
Time-to-trip (S)
A
1
0.1
0.01
0.001
0.1
1
10
100
Fault Current (A)
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimension in the table below provide the recommended pad layout for each FSMD1210 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
SOLDER REFLOW
20 to 40 Seconds
260 °C
Ramp-up
3°C/Second Max
2.80
Ramp-down
6°C/Second Max
217 °C
f
200 °C
150 °C
1.0
1.0
Preheat
25 °C
60 to 180 Seconds
2.0
60 to 150 Seconds
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
NOTE: All Specification subject to change without notice.
Page 2 of 2
RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected]
C5ED03
C3CG01
2014.02.07