FPF1048 IntelliMAX™ 3 A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Current Blocking Features Description The FPF1048 advanced load management switch targets applications requiring a highly integrated solution. It disconnects loads powered from the DC power rail (<6 V) with stringent off-state current targets and high load capacitances (up to 100 µF). The FPF1048 consists of slew-rate controlled lowimpedance MOSFET switch (23 mΩ typical) and integrated analog features. The slew-rate controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on power rails. Input Voltage Operating Range: 1.5 V to 5.5 V Typical RDS(ON): - 21 mΩ at VIN=5.5 V - 23 mΩ at VIN=4.5 V - 41 mΩ at VIN=1.8 V - 90 mΩ at VIN=1.5 V Slew Rate/Inrush Control with tR: 2.7 ms (Typ.) ESD Protected: - Human Body Model: >8 kV 3 A Maximum Continuous Current Capability The FPF1048 has a True Reverse Current Blocking (TRCB) function that obstructs unwanted reverse current from VOUT to VIN during both ON and OFF states. The exceptionally low off-state current drain (<1µA maximum) facilitates compliance with standby power requirements. The input voltage range operates from 1.5 V to 5.5 VDC to support a wide range of applications in consumer, optical, medical, storage, portable, and industrial-device power management. Switch control is managed by a logic input (active HIGH) capable of interfacing directly with low-voltage control signal / General-Purpose Input / Output (GPIO) without an external pull-down resistor. Low Off Switch Current: <1 µA True Reverse Current Blocking (TRCB) Logic CMOS IO Meets JESD76 Standard for GPIO Interface and Related Power Supply Requirements - Charged Device Model: >1.5 kV - IEC 61000-4-2 Air Discharge: >15 kV - IEC 61000-4-2 Contact Discharge: >8 kV The device is packaged in advanced, fully “green” compliant, 1.0 mm x 1.5 mm, Wafer-Level Chip-Scale Package (WLCSP) with backside lamination. Applications Smart Phones, Tablet PCs Storage, DSLR, and Portable Devices Ordering Information Part Number Top Mark Switch RON (Typical) at 4.5VIN FPF1048BUCX RA 23 mΩ © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 Input Output ON Pin Buffer Discharge Activity CMOS NA Active HIGH tR Package 2.7 ms 6-Ball, WLCSP with Backside Laminate, 2x3 Array, 0.5 mm Pitch, 300 µm Balls www.fairchildsemi.com FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking April 2015 VOUT VIN + COUT FPF1048 1.5~5.5V OFF ON CIN ON GND Figure 1. General Application VOUT VIN VIN=5V CIN 1µF~22µF RIN Figure 2. + RPU 10MΩ COUT 0.1µF~100µF FPF1048 ON ROUT (optional) RPD NC GND Specific Application with 10 MΩ Pull-Up Resistor at ON Pin Notes: 1. Turn-on operation with a 10 MΩ pull-up resistor at ON pin is acceptable. 2. VIN should be high enough to generate VON greater than VIH at the ON pin. 3. NC means no connection. 4. RIN and ROUT can be added to reduce transient peak voltage. 1 Ω~10 Ω is recommended. © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Application Diagram www.fairchildsemi.com 2 TRCB VIN VOUT FPF1048 CONTROL LOGIC ON Turn-On Slew Rate Controlled Driver ESD Protection RON GND Figure 3. Functional Block Diagram Pin Configurations Pin 1 VOUT A1 A2 VIN VIN A2 A1 VOUT VOUT B1 B2 VIN VIN B2 B1 VOUT GND C1 C2 ON ON C2 C1 GND Figure 4. Pin Assignments (Top View) Figure 5. Pin Description Pin # Name A1, B1 VOUT A2, B2 VIN C1 GND C2 ON Pin Assignments (Bottom View) FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Functional Block Diagram Description Switch Output Supply Input: Input to the Power Switch Ground ON/OFF Control, Active High, GPIO Compatible © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 www.fairchildsemi.com 3 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameters VIN VIN, VOUT, VON to GND ISW Maximum Continuous Switch Current Min. Max. Unit -0.3 6.0 V 3.0 A PD Power Dissipation at TA=25°C 1.2 W TSTG Storage Junction Temperature -65 +150 °C TA Operating Temperature Range -40 +85 °C 85 JA Thermal Resistance, Junction-to-Ambient ESD Human Body Model, JESD22-A114 Electrostatic Charged Device Model, JESD22-C101 Discharge IEC61000-4-2 Air Discharge (VIN, VON, VOUT to GND) Capability System Level Contact Discharge (VIN, VON, VOUT to GND) (5) 110 (6) °C/W 8.0 1.5 kV 15.0 8.0 Notes: 5. Measured using 2S2P JEDEC std. PCB. 6. Measured using 2S2P JEDEC PCB cold plate method. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameters Min. Typ. Max. Unit VIN Input Voltage 1.5 5.5 V TA Ambient Operating Temperature -40 +85 °C ISW Continuous Switch Current 3 A © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 2.5 FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Absolute Maximum Ratings www.fairchildsemi.com 4 Unless otherwise noted, VIN=1.5 to 5.5 V, TA=-40 to +85°C; typical values are at VIN=4.5 V and TA=25°C. Symbol Parameters Conditions Min. Typ. Max. Units Basic Operation VIN Input Voltage 1.5 IQ(OFF) Off Supply Current VON=GND, VOUT=Open ISD Shutdown Current VON=GND, VOUT=GND, TA= -40 to +85°C IQ Quiescent Current IOUT=0 mA 0.2 VIN=5.5 V, IOUT=3 A (7) 22.0 VIN=5.5 V, IOUT=2 A (7) 21.5 VIN=5.5 V, IOUT=1 A, TA=25°C RON VIH On Resistance ON Input Logic High Voltage VIN=4.5 V, IOUT=3 A 24.0 VIN=4.5 V, IOUT=2 A (7) 23.5 V 1 μA 4.0 μA 11 μA 28.0 VIN=4.5 V, IOUT=1 A, TA=25°C 23.0 VIN=3.3 V, IOUT=500 mA, TA=25°C 26.0 VIN=2.5 V, IOUT=500 mA, TA=25°C 30.0 VIN=1.8 V, IOUT=250 mA, TA=25°C 41.0 VIN=1.5 V, IOUT=250 mA, TA=25°C 90.0 110.0 VIN=1.5 V to 5.5 V 30.0 1.15 mΩ V VIN=1.8 V to 5.5 V 0.65 V VIN=1.5 V to 1.8 V 0.60 V 1.0 μA 8.86 MΩ VIL ON Input Logic Low Voltage ION ON Input Leakage VON= VIN or GND Pull-Down Resistance at ON Pin VIN= VON = 1.5 V to 5.5 V, TA= -40 - +85°C RON_PD 21.0 (7) 5.5 6.38 7.65 True Reverse Current Blocking VT_RCB RCB Protection Trip Point VOUT - VIN 45 mV VR_RCB RCB Protection Release Trip Point VIN -VOUT 25 mV 70 mV RCB Hysteresis 2 μA ISD_OUT VOUT Shutdown Current VON = 0, VOUT = 4.5 V, VIN = Short to GND tRCB_ON RCB Response Time, Device ON VOUT - VIN=100 mV, VON = HIGH 4 µs tRCB_OFF RCB Response Time, Device OFF VOUT - VIN=100 mV, VON = LOW 2.5 µs 1.7 ms 2.7 ms 4.4 ms 1.7 ms 1.5 ms 3.2 ms 1.8 ms 34 ms 35 ms Dynamic Characteristics (8,9) tDON Turn-On Delay tR VOUT Rise Time tON Turn-On Time (8,9) Turn-On Delay tR VOUT Rise Time tDOFF VIN=4.5 V, RL=5 Ω, CL=100 µF, TA=25°C (8,9) tDON tON (8,9) Turn-On Time (8,9) (8,9) VIN=4.5 V, RL=150 Ω, CL=100 µF, TA=25°C (8,10) Turn-Off Delay (8,10) tF VOUT Fall Time tOFF Turn-Off Time (8,10) VIN=4.5 V, RL=150 Ω, CL=100 µF, TA=25°C FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Electrical Characteristics Notes: 7. 8. 9. 10. This parameter is guaranteed by design and characterization; not production tested. tDON/tDOFF/tR/tF are defined in Figure 22. tON=tR + tDON. tOFF=tF + tDOFF. © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 www.fairchildsemi.com 5 8.00 8.00 ON = VIN ON = VIN VIN = 5.5V 7.00 VIN = 4.5V 6.00 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 7.00 5.00 4.00 3.00 VIN = 1.5V 2.00 1.00 6.00 25 C 5.00 85 C 4.00 -40 C 3.00 2.00 1.00 0.00 0.00 -40 -25 -10 5 20 35 50 65 80 1.5 2.0 2.5 TJ, JUNCTION TEMPERATURE (°C) Figure 6. Figure 7. 5.00 3.00 VIN = 5.5V 1.00 -1.00 VIN = 1.5V -3.00 -5.00 4.5 5.0 5.5 Supply Current vs. Supply Voltage 2.00 1.50 85 C 1.00 0.50 -40 C 0.00 25 C -0.50 -40 -25 -10 5 20 35 50 65 80 1.5 2.0 2.5 TJ, JUNCTION TEMPERATURE (°C) Figure 8. 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) Shutdown Current vs. Temperature Figure 9. 80.0 Shutdown Current vs. Supply Voltage 80 ON = VIN IOUT = 250mA @ VIN = 1.5-1.8V IOUT = 500mA @ VIN = 2.5-3.3V IOUT = 1A @ VIN = 4.0-5.5V VIN = 1.5V, IOUT = 250mA ON = VIN 70 ON RESISTANCE (mOhm) ON RESISTANCE (mOhm) 4.0 ON = 0V 7.00 70.0 3.5 2.50 VIN SHUTDOWN CURRENT (mA) VIN SHUTDOWN CURRENT (mA) Supply Current vs. Temperature ON = 0V 9.00 3.0 SUPPLY VOLTAGE (V) 60.0 50.0 VIN = 1.8V, IOUT = 250mA 40.0 VIN = 3.3V, IOUT = 500mA 30.0 20.0 VIN = 5.5V, IOUT = 1A 10.0 60 50 40 85 C 30 20 25 C -40 C 10 0.0 0 -40 -25 -10 5 20 35 50 65 80 1.5 2.0 2.5 TJ, JUNCTION TEMPERATURE (°C) Figure 10. 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) RON vs. Temperature © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 3.0 FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Typical Characteristics Figure 11. RON vs. Supply Voltage www.fairchildsemi.com 6 ON INPUT LOGIC LOW VOLTAGE (V) ON INPUT LOGIC LOW VOLTAGE (V) 1.20 1.10 VIN = 5.5V 1.00 0.90 0.80 0.70 VIN = 1.5V 0.60 0.50 0.40 1.00 0.95 25 C 0.90 -40 C 0.85 0.80 85 C 0.75 0.70 0.65 0.60 -40 -25 -10 5 20 35 50 65 80 1.5 2.0 2.5 TJ, JUNCTION TEMPERATURE (°C) VIL vs. Temperature Figure 13. 1.05 ON INPUT LOGIC HIGH VOLTAGE (V) ON INPUT LOGIC HIGH VOLTAGE (V) Figure 12. 1.00 VIN = 5.5V 0.95 0.90 0.85 0.80 0.75 VIN = 1.5V 0.70 0.65 0.60 3.5 4.0 4.5 5.0 5.5 5.0 5.5 VIL vs. Supply Voltage 1.05 1.00 0.95 0.90 -40 C 0.85 25 C 0.80 0.75 85 C 0.70 0.65 0.60 -40 -25 -10 5 20 35 50 65 80 1.5 2.0 2.5 TJ, JUNCTION TEMPERATURE (°C) Figure 14. VIH vs. Temperature Figure 15. 25 C 0.95 VIH 0.90 0.85 VIL 0.80 0.75 0.70 0.65 0.60 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) Figure 16. 3.0 3.5 4.0 4.5 SUPPLY VOLTAGE (V) 1.00 ON INPUT LOGIC VOLTAGE (V) 3.0 SUPPLY VOLTAGE (V) VIH vs. Supply Voltage FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Typical Characteristics On Pin Threshold vs. Supply Voltage © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 www.fairchildsemi.com 7 2.0 35.0 ON/OFF DELAY TIME (ms) RISE/FALL TIME (ms) 30.0 tF 25.0 20.0 15.0 VIN = 4.5V CL = 100µF RL = 150 10.0 tR 5.0 VIN = 4.5V CL = 100µF RL = 150 1.8 1.6 tDON 1.4 1.2 tDOFF 1.0 0.8 0.0 -40 -25 -10 5 20 35 50 65 -40 80 -25 -10 Figure 17. tR / tF vs. Temperature Figure 18. 50.0 20 35 50 RCB REL VOLTAGE (mV) 40.0 35.0 30.0 25.0 20.0 15.0 10.0 80 tDON vs. Temperature 20.0 18.0 16.0 14.0 12.0 10.0 -40 -25 -10 5 20 35 50 65 80 -40 -25 TJ, JUNCTION TEMPERATURE (°C) Figure 19. -10 5 20 35 50 65 TJ, JUNCTION TEMPERATURE (°C) RCB Trip vs. Temperature Figure 20. RCB Release vs. Temperature 80.0 RCB HYSTERISIS VOLTAGE (mV) 65 22.0 45.0 RCB TRIP VOLTAGE (mV) 5 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) 70.0 4.5V 60.0 50.0 40.0 30.0 20.0 80 FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Typical Characteristics 10.0 -40 -25 -10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (°C) Figure 21. RCB Hysteresis vs. Temperature © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 Figure 22. Timing Diagram www.fairchildsemi.com 8 Figure 23. Turn-On Response (VIN=4.5 V, CIN=10 µF, COUT=100 µF, RL=5 Ω) Figure 24. Turn-On Response (VIN=4.5 V, CIN=10 µF, COUT=100 µF, RL=150 Ω) Figure 25. Turn-Off Response (VIN=4.5 V, CIN=10 µF, COUT=100 µF, RL=150 Ω) Figure 26. RCB Response During Off (VIN=Open, Figure 27. VON=GND, VOUT=5.5 V, CIN=10 µF, COUT=100 µF) © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Typical Characteristics RCB Response During On (VIN=VON=3.6 V, VOUT=5 V, CIN=10 µF, COUT=100 µF) www.fairchildsemi.com 9 The FPF1048 is a low-RON P-channel load switch with controlled turn-on and True Reverse Current Blocking (TRCB). The core is a 23 mΩ P-channel MOSFET and controller capable of functioning over a wide input operating range of 1.5 to 5.5 V. The ON pin, an activeHIGH, GPIO/CMOS-compatible input; controls the state of the switch. TRCB functionality blocks unwanted reverse current during both ON and OFF states when higher VOUT than VIN is applied. Input Capacitor To limit the voltage drop on the input supply caused by transient inrush current when the switch turns on into a discharged load capacitor; a capacitor must be placed between the VIN and GND pins. At least 1 µF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher-value CIN can be used to reduce the voltage drop in higher-current applications. Figure 28. Inrush Current Output Capacitor Inrush current occurs when the device is turned on. Inrush current is dependent on output capacitance and slew rate control capability, as expressed by: I INRUSH COUT where: COUT: tR: VIN: VINITIAL: ILOAD: VIN VINITIAL I LOAD tR At least 0.1 µF capacitor, COUT, should be placed between the VOUT and GND pins. This capacitor prevents parasitic board inductance from forcing VOUT below GND when the switch is on. (1) True Reverse Current Blocking The true reverse current blocking feature protects the input source against current flow from output to input regardless of whether the load switch is on or off. Output capacitance; Slew rate or rise time at VOUT; Input voltage; Initial voltage at COUT, usually GND; and Load current. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effect that parasitic trace inductance on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON, and GND) minimizes the parasitic electrical effects and the case-to-ambient thermal impedance. Higher inrush current causes higher input voltage drop, depending on the distributed input resistance and input capacitance. High inrush current can cause problems. FPF1048 has a 2.7 ms of slew rate capability under 4.5 VIN at 1000 µF of COUT and 5 Ω of RL so inrush current can be minimized and no input voltage drop appears. Table 1 and Figure 28 show the values and actual waveforms with CIN=10 µF, COUT=100 µF, and no load current. Table 1. Inrush Current by Input Voltage Inrush Current [mA] VIN [V] tR [ms] 1.5 Measured Calculated with 2.7 ms tR 1.62 76 56 3.3 2.03 140 122 5.0 2.33 196 185 © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 Inrush Current Waveform, Under 5 VIN, COUT=100 μF, no Load FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Operation and Application Description www.fairchildsemi.com 10 0.03 C E 2X F A (Ø0.250) Cu Pad (Ø0.350) SOLDER MASK OPENING B A1 (1.00) BALL A1 INDEX AREA D (0.50) 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.625 0.539 0.05 C C 0.332±0.018 0.250±0.025 E SEATING PLANE D SIDE VIEWS NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 B. DIMENSIONS ARE IN MILLIMETERS. C A B Ø0.315 +/- .025 6X 0.50 C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. C 1.00 B A 0.50 (Y) ±0.018 1 2 E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS ±43 MICRONS (539-625 MICRONS). F F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. (X) ±0.018 BOTTOM VIEW Figure 29. G. DRAWING FILNAME: MKT-UC006AFrev2. 6-Ball WLCSP, 2x3 Array, 0.5 mm Pitch, 300 µm Ball Product-Specific Dimensions Product D E X Y FPF1048BUCX 1460 µm ±30 µm 960 µm ±30 µm 230 µm 230 µm © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8 FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking Physical Dimensions www.fairchildsemi.com 11 FPF1048 — IntelliMAX™ 3A-Capable, Slew-Rate-Controlled Load Switch with True Reverse Blocking 12 www.fairchildsemi.com © 2011 Fairchild Semiconductor Corporation FPF1048 • Rev. 1.8