FAIRCHILD FPF1208

FPF1207 / FPF1208
IntelliMAX™ Advanced Load Switch
Features
Description
ƒ
ƒ
1.2V to 4.0V Input Voltage Operating Range
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
Slew Rate Control with tR: 110µs
The FPF1207/08 is an ultra-small integrated IntelliMAX
load switch with integrated P-channel switch and analog
control features. Integrated slew-rate control prevents
inrush current and the resulting excessive voltage drop
on power rail. The input voltage range operates from
1.2V to 4.0V to provide power-disconnect capability for
post-regulated power rails in portable and consumer
products. The low shut-off current of 1µA (maximum)
allows power designs to meet standby and off-power
drain specifications.
™
Typical RON: 50mΩ at VIN=3.3V
77mΩ at VIN=1.8V
150mΩ at VIN=1.2V
Output Discharge Function on FPF1208
Low <1.5µA Quiescent Current
Extra Low <100nA Off Supply Current
ESD Protected: Above 7000V HBM, 2000V CDM
GPIO/CMOS-Compatible Enable Circuitry
4-Bump WLCSP 0.76mm x 0.76mm, 0.4mm Pitch
The FPF1207/08 is controlled by an active-HIGH logic
input (ON pin) compatible with standard CMOS GPIO
circuitry found on Field Programmable Gate Array
(FPGA) and embedded processors. The FPF1207/08 is
available in 0.76mm x 0.76mm 4-bump WLCSP.
Applications
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
Mobile Devices and Smart Phones
Portable Media Devices
Ultra-Portable / Mobile Computing
Advanced Notebook, UMPC, MID
Portable Medical Devices
GPS and Navigation Equipment
Ordering Information
Part Number
Top
Marking
Switch
(Typical)
at 3.3VIN
Output
Discharge
ON Pin
Activity
tR
FPF1207UCX
QG
50mΩ
NA
Active
HIGH
110µs
FPF1208UCX
QH
50mΩ
65Ω
Active
HIGH
110µs
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
Package
4-Ball, Wafer-Level ChipScale Package (WLCSP),
0.76 x 0.76mm, 0.4mm Pitch
www.fairchildsemi.com
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
October 2010
Figure 1. Typical Application
Notes:
1. CIN=1μF, X5R, 0603 (for example, Murata GRM185R60J105KE26).
2. COUT=1μF, X5R, 0805 (for example, Murata GRM216R61A105KA01).
Functional Block Diagram
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Application Diagram
Figure 2. Functional Block Diagram (Output Discharge for FPF1208 Only)
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
2
Figure 3. WLCSP Bumps Facing Up (Top View)
Figure 4. WLCSP Bumps Facing Down (Bottom View)
VOUT
A1
A2
VIN
VIN
A2
A1
VOUT
GND
B1
B2
ON
ON
B2
B1
GND
Figure 5. Pin Assignments (Top View)
Figure 6. Pin Assignments (Bottom View)
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Pin Configurations
Pin Definitions
Pin #
Name
Description
A1
VOUT
Switch Output
A2
VIN
B1
GND
B2
ON
Supply Input: Input to the power switch
Ground
ON/OFF control, active HIGH
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
3
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
-0.3
4.2
V
VIN
VIN, VOUT, VON to GND
ISW
Maximum Continuous Switch Current
1.2
A
PD
Power Dissipation at TA=25°C
1.0
W
TSTG
Storage Junction Temperature
-65
+150
°C
TA
Operating Temperature Range
-40
+85
°C
ΘJA
Thermal Resistance, Junction-to-Ambient
ESD
(3,4)
Electrostatic Discharge Capability
1S2P with One Thermal Via
110
1S2P without Thermal Via
95
Human Body Model,
JESD22-A114
7
Charged Device Model,
JESD22-C101
2
°C/W
kV
Notes:
3. Measured using 2S2P JEDEC std. PCB.
4. Measured using 2S2P JEDEC PCB COLD PLATE Method.
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Absolute Maximum Ratings
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Max.
Unit
VIN
Supply Voltage
1.2
4.0
V
TA
Ambient Operating Temperature
-40
+85
°C
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
4
Unless otherwise noted, VIN=1.2 to 4.0V and TA=-40 to +85°C. Typical values are at VIN=3.3V and TA=25°C.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
4.0
V
Basic Operation
VIN
Supply Voltage
1.2
IQ(OFF)
Off Supply Current
VON=GND, VOUT=Open, VIN=4V
ISD(OFF)
Off Switch Current
VON=GND, VOUT=GND
IQ
Quiescent Current
IOUT=0mA
VIN=3.3V, IOUT=200mA, TA=25°C
RON
On Resistance
50
100
nA
1
μA
1.5
μA
66
VIN=1.8V, IOUT=200mA, TA=25°C
77
91
VIN=1.2V, IOUT=200mA, TA=25°C
150
160
VIN=1.8V, IOUT=200mA, TA=85°C
mΩ
100
VIN=3.3V, VON=0V, IFORCE=20mA,
TA=25°C, FPF1208
RPD
Output Discharge RPULL DOWN
VIH
On Input Logic HIGH Voltage
VIL
On Input Logic LOW Voltage
VIN=1.2V to 4.0V
0.75
V
ION
On Input Leakage
VON=VIN or GND
1
μA
Dynamic Characteristics
tDON
(6)
VOUT Rise Time
Turn-On Time
tDOFF
Turn-Off Delay
(6)
VIN=1.5V to 4.0V
1.1
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C
(6)
(6)
VOUT Fall Time
(6)
tOFF
Turn-Off Time
tDOFF
Turn-Off Delay
tF
VOUT Fall Time
tOFF
Turn-Off Time
tDOFF
Turn-Off Delay
tF
VOUT Fall Time
Turn-Off Time
(6)
tDOFF
Turn-Off Delay
tF
VOUT Fall Time
tOFF
0.9
(6)
Turn-On Delay
tR
tOFF
VIN <1.5V
110
Ω
V
(5)
tON
tF
65
Turn-Off Time
(6)
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C, FPF1207
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C, FPF1208
VIN=3.3V, RL=500Ω, CL=0.1µF,
TA=25°C, FPF1207
VIN=3.3V, RL=500Ω, CL=0.1µF,
(7)
TA=25°C, FPF1208
110
110
μs
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Electrical Characteristics
220
7
2
μs
9
2.0
1.9
μs
3.9
10
95
μs
105
7.0
10.5
μs
17.5
Notes:
5. These parameters are guaranteed by design and characterization; not production tested.
6. tDON/tDOFF/tR/tF are defined in Figure 25.
7. Output discharge path is enabled during device off.
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
5
1.00
ON = 0V
0.90
ON = 0V
0.90
VIN SHUTDOWN CURRENT (μA)
VIN SHUTDOWN CURRENT (μA)
1.00
0.80
0.70
0.60
0.50
0.40
0.30
VIN = 4.0V
VIN = 3.3V
0.20
VIN = 1.2V
0.10
0.00
0.80
0.70
0.60
0.50
0.40
0.30
85°C
0.20
-40°C
0.10
25°C
0.00
-40
-15
10
35
60
85
1.0
1.5
2.0
TJ, JUNCTION TEMPERATURE (°C)
0.30
ON = 0V
0.25
0.20
0.15
0.10
VIN = 3.3V
VIN = 1.2V
0.00
4.0
4.5
5.0
5.
ON = 0V
0.25
0.20
0.15
-40°C
0.10
25°C
0.05
85°C
0.00
-40
-15
10
35
60
85
1.0
1.5
2.0
TJ, JUNCTION TEMPERATURE (°C)
2.5
3.0
3.5
4.0
4.5
5.0
5.
SUPPLY VOLTAGE (V)
Figure 9. Off Supply Current vs. Temperature
(FPF1207, VOUT Floating)
Figure 10. Off Supply Current vs. Supply Voltage
(FPF1207, VOUT Floating)
1.40
1.80
ON = VIN
1.60
1.20
VIN = 4.0V
1.00
SUPPLY CURRENT (μA)
SUPPLY CURRENT (μA)
3.5
Figure 8. Shutdown Current vs. Supply Voltage
OFF SUPPLY CURRENT (μA)
OFF SUPPLY CURRENT (μA)
0.30
0.05
3.0
SUPPLY VOLTAGE (V)
Figure 7. Shutdown Current vs. Temperature
VIN = 4.0V
2.5
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Typical Performance Characteristics
0.80
VIN = 3.3V
0.60
0.40
VIN = 1.2V
0.20
ON = VIN
1.40
1.20
25°C
1.00
85°C
0.80
-40°C
0.60
0.40
0.20
0.00
0.00
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (°C)
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.
SUPPLY VOLTAGE (V)
Figure 11. Quiescent Current vs. Temperature
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
1.0
Figure 12. Quiescent Current vs. Supply Voltage
www.fairchildsemi.com
6
160
160
VIN = 1.2V
120
100
80
VIN = 3.3V
60
40
ON = VIN
IOUT = 200mA
140
ON RESISTANCE (mΩ)
ON RESISTANCE (mΩ)
140
120
100
80
-40°C
ON = VIN
IOUT = 200mA
0
25°C
40
VIN = 4.0V
20
85°C
60
20
0
-40
-15
10
35
60
85
1.2
1.7
2.2
TJ, JUNCTION TEMPERATURE (°C)
4.2
4.7
1000
1.05
1.00
VIH
0.95
0.90
VIL
0.85
5.2
VIN = 3.3V
CL = 0.1µF
RL = 10Ω
1.10
RISE/FALL TIME (us)
ON INPUT LOGIC VOLTAGE (V)
3.7
Figure 14. RON vs. Supply Voltage
25°C
1.15
3.2
SUPPLY VOLTAGE (V)
Figure 13. RON vs. Temperature
1.20
2.7
tR
100
10
0.80
tF
0.75
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Typical Performance Characteristics
1
0.70
1.0
1.5
2.0
2.5
3.0
3.5
-40
4.0
-15
10
SUPPLY VOLTAGE (V)
60
85
Figure 16. VOUT Rise and Fall Time vs. Temperature
at RL=10Ω
Figure 15. ON-Pin Threshold vs. VIN
100
VIN = 3.3V
CL = 0.1µF
RL = 10Ω
90
ON/OFF DELAY TIME (µs)
35
TJ, JUNCTION TEMPERATURE (°C)
80
tdon
70
60
50
40
30
20
tdoff
10
0
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (°C)
Figure 17. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=10Ω
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
7
90
100
85
80
75
tR
70
65
60
VIN = 3.3V
CL = 0.1µF
RL = 500Ω
55
50
-40
-15
10
VIN = 3.3V
CL = 0.1µF
RL = 500Ω
80
tF
90
ON/OFF DELAY TIME (µs)
RISE/FALL TIME (μs)
95
35
60
70
tdon
60
50
40
30
20
tdoff
10
0
-40
85
TJ, JUNCTION TEMPERATURE (°C)
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (°C)
Figure 18. VOUT Rise and Fall Time vs. Temperature
at RL=500Ω
Figure 19. VOUT Turn-On and Turn-Off Delay
vs. Temperature at RL=500Ω
Figure 20. Turn-On Response (VIN=3.3V, CIN=1µF,
COUT=0.1µF, RL=10Ω)
Figure 21. Turn-Off Response (VIN=3.3V, CIN=1µF,
COUT=0.1µF, RL=10Ω)
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Typical Performance Characteristics
Figure 22. Turn-Off Response (FPF1207 = No Output Pull-Down Resistor)
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω)
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
8
100
10ms
100ms
10
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
100
1s
10s
1
RDS(ON) LIMIT
DC
0.1
VGS = 10.0V
SINGLE PULSE
RθJA = 125oC/W
TA = 25oC
0.01
0.0100
0.1000
1.0000
10.0000
VDS, DRAIN-SOURCE VOLTAGE (V)
10ms
100ms
10
1s
10s
1
RDS(ON) LIMIT
VGS = 10.0V
SINGLE PULSE
RθJA = 125oC/W
TA = 25oC
0.1
0.01
0.0100
100.0000
Figure 23. ISW vs. VDS -- SOA of FPF1207
DC
0.1000
1.0000
10.0000
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 24. ISW vs. VDS -- SOA of FPF1208
Timing Diagram
90%
VOUT
100.0000
90%
10%
10%
tR
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Typical Performance Characteristics
tF
3.3V
50%
50%
VON
90%
10%
VOUT
tDOFF
tDON
Figure 25. Timing Diagram
Notes:
8. tON=tR + tDON.
9. tOFF=tF + tDOFF.
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
9
The FPF1207 and FPF1208 are low-RON P-channel load
switches with controlled turn-on. The core of each
device is a 50mΩ P-channel MOSFET and controller
capable of functioning over a wide input operating range
of 1.2-4.0V. The ON pin, an active HIGH GIOP/CMOScompatible input, controls the state of the switch.
board inductance from forcing VOUT below GND when
the switch is on. CIN greater than COUT is highly
recommended. COUT greater than CIN can cause VOUT to
exceed VIN when the system supply is removed. This
could result in current flow through the body diode from
VOUT to VIN.
The FPF1208 contains a 65Ω on-chip load resistor for
quick output discharge when the switch is turned off.
Board Layout
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to
minimize the effect that parasitic trace inductance may
have on normal and short-circuit operation. Using wide
traces or large copper planes for all pins (VIN, VOUT, ON,
and GND) helps minimize the parasitic electrical effects
along with minimizing the case ambient thermal
impedance. However, the VOUT pin of FPF1208 should
not connect directly the battery source due to the
discharge mechanism of the load switch.
Input Capacitor
To limit the voltage drop on the input supply caused by
transient inrush current when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor
must be placed between the VIN and GND pins. A 1µF
ceramic capacitor, CIN, placed close to the pins is
usually sufficient. Higher-value CIN can be used to
reduce the voltage drop in higher-current applications.
Output Capacitor
A 0.1µF capacitor, COUT, should be placed between the
VOUT and GND pins. This capacitor prevents parasitic
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Operation and Application Description
Figure 26. Typical Application
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
10
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
Physical Dimensions
0.03 C
2X
F
E
A
0.40
B
Ø0.20
Cu Pad
A1
0.40
D
BALL A1
INDEX AREA
Ø0.30
Solder Mask
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.292±0.018
0.539
0.461
0.05 C
C
E
0.208±0.021
SEATING PLANE
SIDE VIEWS
D
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.005
B. DIMENSIONS ARE IN MILLIMETERS.
C A B
Ø0.260±0.020
4X
0.40
B
A
0.40
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
(Y)±0.018
F
1 2
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
(X)±0.018
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
BOTTOM VIEW
G. DRAWING FILNAME: MKT-UC004AFrev1.
Figure 27. 4 Ball, 0.76 x 0.76 mm Wafer Level Chip Scale WLCSP Packaging
Product-Specific Dimensions
Product
D
E
X
Y
FPF1207UCX
760µm ± 30µm
760µm ± 30µm
0.180mm± 0.018µm
0.180mm± 0.018µm
FPF1208UCX
760µm ± 30µm
760um ± 30µm
0.180mm± 0.018µm
0.180mm± 0.018µm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for
the most recent package drawing: http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
11
FPF1207 / FPF1208 — IntelliMAX™ Advance Load Switch
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com
12