FPF1039 Low On-Resistance, Slew-Rate-Controlled Load Switch Features Description 1.2 V to 5.5 V Input Voltage Operating Range The FPF1039 advanced load-management switch target applications requiring a highly integrated solution for disconnecting loads powered from DC power rail (<6 V) with stringent shutdown current targets and high load capacitances (up to 200 µF). The FPF1039 consists of slew-rate controlled low-impedance MOSFET switch (21 mΩ typical) and other integrated analog features. The slew-rate controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on power rails. Typical RON: 20 mΩ at VIN=5.5 V 21 mΩ at VIN=4.5 V 37 mΩ at VIN=1.8 V 75 mΩ at VIN=1.2 V Slew Rate / Inrush Control with tR: 2.7 ms (Typical) This device has exceptionally low shutdown current drain (<1 µA maximum) that facilitates compliance in low standby power applications. The input voltage range operates from 1.2 V to 5.5 V DC to support a wide range of applications in consumer, optical, medical, storage, portable, and industrial device power management. 3.5 A Maximum Continuous Current Capability Output Capacitor Discharge Function Low <1 µA Shutdown Current ESD Protected: Above 8 kV HBM, 1.5 kV CDM GPIO / CMOS-Compatible Enable Circuitry Switch control is managed by a logic input (active HIGH) capable of interfacing directly with low-voltage control signal / GPIO with no external pull-up required. The device is packaged in advanced fully “green” 1mm x1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP); providing excellent thermal conductivity, small footprint, and low electrical resistance for wider application usage. Applications HDD, Storage, and Solid-State Memory Devices Portable Media Devices, UMPC, Tablets, MIDs Wireless LAN Cards and Modules SLR Digital Cameras Portable Medical Devices GPS and Navigation Equipment Industrial Handheld and Enterprise Equipment Ordering Information Part Number Top Mark Switch RON (Typical) at 4.5 VIN Input Buffer Output Discharge FPF1039UCX QF 21 mΩ CMOS 65Ω Active HIGH 2.7 ms 65Ω 6-Bump, WLCSP with Backside Laminate, Active HIGH 2.7 ms 1.0 mm x 1.5 mm, 0.5 mm Pitch FPF1039BUCX QF 21 mΩ © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 CMOS ON Pin Activity tR Package 6-Bump, WLCSP, 1.0 mm x 1.5 mm, 0.5 mm Pitch www.fairchildsemi.com FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch April 2015 VIN VIN VOUT VOUT FPF1039 OFF ON ON GND VIN:1.2V – 5.5V COUT: 0 – 200µF CIN Figure 1. Typical Application Functional Block Diagram VIN VOUT FPF1039 CONTROL LOGIC ON Turn-On Slew Rate Controlled Driver R ESD Protection Output Discharge Figure 2. Functional Block Diagram © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 www.fairchildsemi.com 2 FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Application Diagram FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Pin Configuration VOUT A1 A2 VIN VIN A2 A1 VOUT VOUT B1 B2 VIN VIN B2 B1 VOUT GND C1 C2 ON ON C2 C1 GND Figure 3. Top View Figure 4. Bottom View Pin Definitions Pin # Name A1, B1 VOUT A2, B2 VIN C1 GND C2 ON Description Switch Output Supply Input: Input to the Power Switch Ground ON/OFF Control, Active High - GPIO Compatible © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 www.fairchildsemi.com 3 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameters Min. Max. Unit -0.3 6.0 V VIN VIN, VOUT, VON to GND ISW Maximum Continuous Switch Current 3.5 A PD Power Dissipation at TA=25°C 1.2 W TSTG Storage Junction Temperature -65 +150 °C TA Operating Temperature Range -40 +85 °C JA Thermal Resistance, Junction-to-Ambient ESD Electrostatic Discharge Capability 85 (1) 110 Human Body Model, JESD22-A114 8.0 Charged Device Model, JESD22-C101 1.5 (2) °C/W kV Notes: 1. Measured using 2S2P JEDEC std. PCB. 2. Measured using 2S2P JEDEC PCB COLD PLATE method. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameters Min. Max. Unit VIN Input Voltage 1.2 5.5 V TA Ambient Operating Temperature -40 +85 °C © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 www.fairchildsemi.com 4 FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Absolute Maximum Ratings Unless otherwise noted, VIN=1.2 to 5.5V and TA=-40 to +85°C; typical values are at VIN=4.5V and TA=25°C. Symbol Parameters Conditions Min. Typ. Max. Units Basic Operation VIN Input Voltage 1.2 5.5 V 1.0 μA 0.2 1.0 μA 5.5 8.0 μA VIN=5.5 V, IOUT=1 A 20 24 VIN=4.5 V, IOUT=1 A, TA=25°C 21 25 (3) 24 29 (3) 28 35 VIN=1.8 V, IOUT=250 mA (3) 37 45 VIN=1.2 V, IOUT=250 mA, TA=25°C 75 100 VIN=4.5 V, VON=0 V, IFORCE=20 mA, TA=25°C 65 85 IQ(OFF) Off Supply Current VON=GND, VOUT=Open ISD Shutdown Current VON=GND, VOUT=GND IQ Quiescent Current IOUT=0 mA (3) RON VIN=3.3 V, IOUT=500 mA On Resistance VIN=2.5 V, IOUT=500 mA mΩ Ω RPD Output Discharge RPULL DOWN VIH On Input Logic HIGH Voltage VIL On Input Logic LOW Voltage 0.4 V ION On Input Leakage 1.5 μA 1.0 V Dynamic Characteristics tDON (4) Turn-On Delay tR VOUT Rise Time tON Turn-On Time tDOFF tF tOFF (4) (6) VIN=4.5 V, RL=5 Ω, CL=100 µF, TA=25°C (4,5) Turn-Off Delay (4,5) VOUT Fall Time Turn-Off (5,7) VIN=4.5 V, RL=150 Ω, CL=100 µF, (5) TA=25°C 1.7 ms 2.7 ms 4.4 ms 0.5 ms 10.0 ms 10.5 ms Notes: 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON/tDOFF/tR/tF are defined in Figure 32. 5. Output discharge enabled during off-state. 6. tON=tR + tDON 7. tOFF=tF + tDOFF © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 www.fairchildsemi.com 5 FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Electrical Characteristics Figure 5. Shutdown Current vs. Temperature Figure 6. Shutdown Current vs. Supply Voltage Figure 7. Off Supply Current vs. Temperature (VOUT = 0 V) Figure 8. Off Supply Current vs. Supply Voltage (VOUT = 0 V) Figure 9. Quiescent Current vs. Temperature Figure 10. Quiescent Current vs. Supply Voltage © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 www.fairchildsemi.com 6 FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Typical Characteristics Figure 11. Quiescent Current vs. On Voltage (VIN = 4.5 V) Figure 12. Quiescent Current vs. On Voltage (VIN = 5.5 V) Figure 13. Output Discharge Resistor RPD vs. Temperature Figure 14. Output Discharge Resistor RPD vs. Supply Voltage 90 VIN = 1.2V ON RESISTANCE (mOhm) 80 70 60 50 40 30 VIN = 4.5V 20 ON = VIN [email protected] [email protected]&5.5V VIN = 5.5V 10 0 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (°C) Figure 15. RON vs. Temperature © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 Figure 16. RON vs. Supply Voltage www.fairchildsemi.com 7 FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Typical Characteristics (Continued) Figure 17. On Pin Threshold Low vs. Temperature Figure 18. On Pin Threshold Low vs. VIN Figure 19. On Pin Threshold High vs. Temperature Figure 20. On Pin Threshold High vs. VIN Figure 21. On Pin Threshold vs. Supply Voltage Figure 22. ISW vs. (VIN-VOUT) — SOA Figure 23. tR/tF vs. Temperature © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 www.fairchildsemi.com 8 FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Typical Characteristics (Continued) 3.5 Tr RISE AND ON DELAY TIME (ms) 3.0 2.5 2.0 Tdon 1.5 1.0 VIN = 4.5V CL = 100uF RL = 5 Ohm 0.5 0.0 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (°C) Figure 24. tR/tDON vs. Temperature Figure 25. tR vs. Supply Voltage 4.50 4.00 +85C 3.50 +25C Voltage (V) 3.00 -40C 2.50 2.00 1.50 V ON 1.00 0.50 0.00 0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 Time (ms) Figure 27. Turn-On Response (VIN=4.5 V, CIN=10 µF, CL=1 µF, RL=50 ) Figure 26. tR vs. Supply Voltage 4.5 4.50 4 4.00 +85C 3.50 3.00 3 -40C 2.50 Voltage (V) Voltage (V) 3.5 +25C 2.00 1.50 2.5 +25C 2 1.5 V ON 1.00 1 V ON 0.50 0.5 0.00 0.00 1.00 2.00 3.00 4.00 5.00 6.00 0 7.00 0 Time (ms) 10 15 20 25 30 35 Time (ms) Figure 28. Turn-On Response (VIN=4.5 V, CIN=10 µF, CL=100 µF, RL=5 ) © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 5 Figure 29. Turn-Off Response (VIN=4.5 V, CIN=10 µF, CL=100 µF, without External RL) www.fairchildsemi.com 9 FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Typical Characteristics (Continued) 100 10.000 10 100mF 1.000 500 1 TFALL (ms) TFALL (ms) 50 10mF 0.100 5 0.1 1mF 0.010 0.01 0.001 0.001 1 10 100 1000 10000 0.1 1 10 RLOAD () 100 1000 CLOAD (mF) Figure 31. Fall Time as a Function of External Capacitive Load (RL=5 , 50 , and 500 ) Figure 30. Fall Time as a Function of External Resistive Load (CL=1 µF, 10 µF, and 100 µF) 90% VOUT 90% 10% 10% tR tF 4.5V 50% 50% VON 90% 10% VOUT tDON tDOFF Figure 32. Timing Diagram © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 www.fairchildsemi.com 10 FPF1039 — IntelliMAXTM Advanced Slew Rate Controlled Load Switch Typical Characteristics (Continued) At maximum operational voltage (VIN=5.5 V), device inrush current might be higher than expected. Spike current should be taken into account if VIN>5 V and the output capacitor is much larger than the input capacitor. Input current can be calculated as: Input Capacitor This IntelliMAX™ switch doesn’t require an input capacitor. To reduce device inrush current, a 0.1 µF ceramic capacitor, CIN, is recommended close to the VIN pin. A higher value of CIN can be used to reduce the voltage drop experienced as the switch is turned on into a large capacitive load. IIN( t ) While this switch works without an output capacitor: if parasitic board inductance forces VOUT below GND when switching off; a 0.1 µF capacitor, COUT, should be placed between VOUT and GND. Estimating VOUT(t)=VIN/10 and using experimental formula for slew rate (dVOUT(t)/dt), spike current can be written as: max IIN Fall Time Device output fall time can be calculated based on RC constant of the external components as follows: tF RL CL 2.2 VIN CLOAD CIN 0.05 VIN 0.255 10RLOAD (4) where supply voltage VIN is in volts, capacitances are in micro farads, and resistance is in ohms. (1) Example: If VIN=5.5V, CLOAD=100 µF, CIN=10 µF, and RLOAD=50 ; calculate the spike current by: where tF is 90% to 10% fall time, RL is output load, and CL is output capacitor. max( IIN ) The same equation works for a device with a pull-down output resistor. RL is replaced by a parallel connected pull-down and an external output resistor combination as: RL RPD CL 2.2 RL RPD (3) where switch and wire resistances are neglected and capacitors are assumed ideal. Output Capacitor tF VOUT ( t ) dV (t ) (CLOAD CIN ) OUT RLOAD dt 5.5 10 50 (100 10 )(0.05 5.5 0.255 )A 1.8A (5) Maximum spike current is 1.8 A, while average rampup current is: IIN( t ) (2) VOUT ( t ) dV ( t ) (CLOAD CIN ) IN RLOAD dt (6) 2.75 / 50 100 0.0022 0.275 A where tF is 90% to 10% fall time, RL is output load, RPD=65 is output pull-down resistor, and CL is the output capacitor. Output Discharge FPF1039 contains a 65 Ω on-chip pull-down resistor for quick output discharge. The resistor is activated when the switch is turned off. Resistive Output Load If resistive output load is missing, the IntelliMAX switch without a pull-down output resistor does not discharge the output voltage. Output voltage drop depends, in that case, mainly on external device leaks. Recommended Layout For best thermal performance and minimal inductance and parasitic effects, it is recommended to keep input and output traces short and capacitors as close to the device as possible. Figure 34 is a recommended layout for this device to achieve optimum performance. Application Specifics Vout Vin + FPF1039 VIN CIN OFF ON CLOAD RLOAD ON GND Figure 33. Device Setup Figure 34. © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 Recommended Land Pattern, Layout www.fairchildsemi.com 11 FPF1039 — Advance Load Management Switch Management Switch Advance Load Management Switch Application Information 0.03 C E 2X F A (Ø0.250) Cu Pad (Ø0.350) SOLDER MASK OPENING B A1 (1.00) BALL A1 INDEX AREA D (0.50) 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.625 0.539 0.05 C C 0.332±0.018 0.250±0.025 E SEATING PLANE D SIDE VIEWS NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 Ø0.315 +/- .025 6X 0.50 C 1.00 B A 0.50 (Y) ±0.018 1 2 F (X) ±0.018 BOTTOM VIEW Figure 35. © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 C A B B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS ±43 MICRONS (539-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILNAME: MKT-UC006AFrev2. 6 Ball, 1.0 x 1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP) www.fairchildsemi.com 12 FPF1039 — Advance Load Management Switch Management Switch Advance Load Management Switch Physical Dimensions Bump Pitch Overall Package Height Silicon Thickness Solder Bump Height Solder Bump Diameter 0.5 mm 0.582 mm 0.332 mm 0.250 mm 0.315 mm Product-Specific Dimensions Product D E X Y FPF1039UCX 1.46 mm ±0.03 0.96 mm ±0.03 0.230 mm 0.230 mm FPF1039BUCX 1.46 mm ±0.03 0.96 mm ±0.03 0.230 mm 0.230 mm © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5 www.fairchildsemi.com 13 FPF1039 — Advance Load Management Switch Management Switch Advance Load Management Switch Nominal Values FPF1039 — Advance Load Management Switch Management Switch Advance Load Management Switch 14 www.fairchildsemi.com © 2010 Fairchild Semiconductor Corporation FPF1039 • Rev. 1.5