FDZ2040L Integrated Load Switch Features General Description Optimized for Low-Voltage Core ICs in Portable Systems Very Small Package Dimension: WL-CSP 0.8 X 0.8 X 0.5 mm3 Current = 1.2 A, VIN max. = 4 V This device is particularly suited for compact power management in portable applications where 1.6 V to 4 V input and 1.2 A output current capability are needed. This load switch integrates a level-shifting function that drives a P-channel power MOSFET in the very small 0.8 X 0.8 X 0.5 mm3 WL-CSP package. Current = 2 A, VIN max. = 4 V (Pulsed) RDS(ON) = 80 mΩ at VON = 0 V, VIN = 4 V RDS(ON) = 85 mΩ at VON = 0 V, VIN = 3.6 V RDS(ON) = 90 mΩ at VON = 0 V, VIN = 3 V Applications Load Switch Power Management in Portable Applications RoHS Compliant Ordering Information Part Number Device Marking Ball Pitch Operating Temperature Range Switch Package Packing Method FDZ2040L ZL 0.4 mm -25 to 75°C 80 mΩ, P-Channel MOSFET 0.8x0.8x0.5 mm3 WL-CSP Tape and Reel © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 www.fairchildsemi.com FDZ2040L — Integrated Load Switch June 2013 FDZ2040L — Integrated Load Switch Application Diagram and Block Diagram Figure 1. Block Diagram and Typical Application Pin Configuration Figure 2. Pin Assignment Pin Definitions Pin # Name Description A1 VIN A2 VOUT Switch Output: Output of the load switch B1 ON ON/OFF Control Input, Active LOW B2 GND Supply Input: Input to the load switch Ground © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 www.fairchildsemi.com 2 Parameter VIN, VOUT, ON to GND Min. Max. Unit -0.3 4.2 V 1.2 A 2 A (1a) IOUT – Load Current (Continuous) IOUT – Load Current (Pulsed) (2) (1a) Power Dissipation @ TA = 25°C 0.9 W Operating Temperature Range -40 105 °C Storage Temperature -65 150 °C Electrostatic Discharge Capability Human Body Model, JESD22-A114 8 Charged Device Model, JESD22-C101 2 kV FDZ2040L — Integrated Load Switch Absolute Maximum Ratings Thermal Characteristics Parameter Max. Unit 117 °C/W Min. Max. Unit VIN 1.6 4.0 V Ambient Operating Temperature, TA -25 75 °C Thermal Resistance, Junction to Ambient Min. (1a) Recommended Operating Conditions Parameter Notes: 1. RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RӨJC is guaranteed by design while RӨJA is determined by the user’s board design. 2. Pulse Test: Pulse Width < 300 μs, Duty Cycle < 2.0%. © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 www.fairchildsemi.com 3 TJ = 25 °C unless otherwise noted. Symbol VIN VIL VIH Parameter Test Conditions Max. Unit 4.0 V VIN = 1.6 V, Ramp-Down VON from 1 V to 0 V, VOUT LOW to HIGH, TJ = -25 to 75°C 0.35 V VIN = 4 V, Ramp-Down VON from 1 V to 0 V, VOUT LOW to HIGH, TJ = -25 to 75°C 0.35 V Operation Voltage ON Input Logic LOW Voltage ON Input Logic HIGH Voltage Min. Typ. 1.6 VIN = 1.6 V, Ramp-Up VON from 0 V to 1 V, VOUT HIGH to LOW, TJ = -25 to 75°C 1.35 V VIN = 4 V, Ramp-Up VON from 0 V to 1 V, VOUT HIGH to LOW, TJ = -25 to 75°C 1.35 V IQ Quiescent Current VIN = 3 V, VON = 0.35 V, IOUT = 0 A, TJ = -25 to 75°C 1.55 2.50 µA IQ_off Off Supply Current VIN = 3 V, VON = 1.3 V, IOUT = 0 A, TJ = -25 to 75°C 2.4 6.5 µA ISD_off Off Switch Current VIN = 3 V, VON = 1.3 V, VOUT = 0 V, TJ = -25 to 75°C 0.1 3.5 µA IQ_off Off Supply Current with ON Pin Floating VIN = 3 V, VON = Floating, IOUT = 0 A 1.6 2.3 µA VIN = 3 V, VON = Floating, IOUT = 0 A, TJ = -25 to 75°C 1.6 4.0 µA (VON float) RPULL-DOWN Output Pull-Down Resistance VIN=3 V, IOUT=10 mA RDS(ON) On Resistance 22 VIN = 1.6 V, VON = 0 V, IOUT = 300m A 68 120 VIN = 3 V, VON = 0 V, IOUT = 300m A 50 90 VIN = 3.6 V, VON = 0 V, IOUT = 300 mA 48 85 VIN = 4 V, VON = 0 V, IOUT = 300 mA, TJ = -25 to 75°C 47 80 CV-ON(INP) ON Input Capacitance TJ = -25 to 75°C ION(PULL-UP) ON Pull-Up Current VIN = 3 V, VON = 0 V, TJ = -25 to 75°C FDZ2040L — Integrated Load Switch Electrical Characteristics m 5 pF 0.30 0.76 1.20 µA Min. Typ. Max. Unit Switching Characteristics Symbol Parameter Test Conditions ton Turn-On Time (VON 50% to VOUT 90%) 45 150 ns tdon Turn-On Delay (VON 50% to VOUT 10%) 35 100 ns trise Turn-On Rise Time (VOUT 10% to 90%) 10 50 ns 60 150 ns VIN=3 V, VON = 0 V as Logic LOW and 1.3 V as Logic HIGH, COUT = 1 nF, RL = 30 Ω, TJ = -25 to 75°C toff Turn-Off Time (VON 50% to VOUT 10%) tdoff Turn-Off Delay (VON 50% to VOUT 90%) 25 100 ns tfall Turn-Off Fall Time (VOUT 90% to 10%) 35 65 ns tdon – tdoff Turn-On Turn-Off Delay Delta 50 ns © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 www.fairchildsemi.com 4 FDZ2040L — Integrated Load Switch Typical Performance Characteristics 2.50 2.5 VIN = 3V VON = 0.35V IOUT = 0A TA = 25(oC) 2.0 Quiescent Current, IQ (uA) Quiescent Current, IQ (uA) 2.25 2.00 1.75 1.50 1.5 1.0 0.5 1.25 1.00 0.0 -55 -35 -15 5 25 45 65 85 105 125 1 1.5 2 Junction Temperature, TJ (oC) Figure 3. Quiescent Current vs. Temperature Figure 4. 15 4.5 Quiescent Current vs. Supply Voltage TA = 25(oC) 3.5 Off Supply Current, IQ_OFF (uA) Off Supply Current, IQ_OFF (uA) 4 4.0 VIN = 3V VON = 1.3V IOUT = 0A 13 11 9 7 5 3 3.0 2.5 2.0 1.5 1.0 0.5 1 0.0 -55 -35 -15 5 25 45 65 85 Junction Temperature, TJ (oC) 105 125 1 Figure 5. Off Supply Current vs. Temperature 1.5 Figure 6. 2 2.5 3 3.5 Supply Voltage, VIN (V) 4 4.5 Off Supply Current vs. Supply Voltage 2.5 15 VIN = 3V VON = float IOUT = 0A 13 Off Supply Current, IQ_OFF (VON FLOAT) (uA) Off Supply Current, IQ_OFF (VON FLOAT) (uA) 2.5 3 3.5 Supply Voltage, VIN (V) 11 9 7 5 3 1 TA = 25(oC) 2.0 1.5 1.0 0.5 0.0 -55 -35 -15 5 25 45 65 85 105 125 1 Junction Temperature, TJ (oC) Figure 7. 2 2.5 3 3.5 4 4.5 Supply Voltage, VIN (V) Figure 8. Off Supply Current (VON Float) vs. Temperature © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 1.5 Off Supply Current (VON Float) vs. Supply Voltage www.fairchildsemi.com 5 0.0 TA = 25(oC) VIN = 3V VON = 0V IOUT = 0A -0.3 ON Pin Pull Up Current, ION(PULLUP) (uA) ON Pin Pull Up Current, ION(PULL-UP) (uA) 0.0 -0.6 -0.9 -1.2 -1.5 -0.3 -0.6 -0.9 -1.2 -1.5 -55 -35 -15 5 25 45 65 85 105 125 1.0 1.5 2.0 Junction Temperature, TJ (oC) Figure 9. 4.0 4.5 Figure 10. ON Pin Pull-Up Current vs. Supply Voltage ON Pin Pull-Up Current vs. Temperature 0.70 0.70 TA = 25(oC) ON Pin Logic High Voltage, VIH (V) VIN = 3V ON Pin Logic High Voltage, VIH (V) 2.5 3.0 3.5 Supply Voltage, VIN (V) FDZ2040L — Integrated Load Switch Typical Performance Characteristics (Continued) 0.65 0.60 0.55 0.65 0.60 0.55 0.50 -55 -35 -15 5 25 45 65 85 Junction Temperature, TJ (oC) 105 0.50 125 1 Figure 11. ON Pin Logic HIGH Voltage vs. Temperature 2 2.5 3 3.5 Supply Voltage, VIN (V) 4 4.5 Figure 12. ON Pin Logic HIGH Voltage vs. Supply Voltage 0.70 0.70 VIN = 3V TA = 25(oC) ON Pin Logic Low Voltage, VIL (V) ON Pin Logic Low Voltage, VIL (V) 1.5 0.65 0.60 0.55 0.65 0.60 0.55 0.50 0.50 -55 -35 -15 5 25 45 65 85 Junction Temperature, TJ (oC) 105 1 125 2 2.5 3 3.5 4 4.5 Supply Voltage, VIN (V) Figure 13. ON Pin Logic LOW Voltage vs. Temperature © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 1.5 Figure 14. ON Pin Logic LOW Voltage vs. Supply Voltage www.fairchildsemi.com 6 FDZ2040L — Integrated Load Switch Typical Performance Characteristics (Continued) 35 35 TA = 25(oC) 30 Output Pull Down Resistance, (Ω) Output Pull Down Resistance (Ω) VIN = 3V 25 20 15 30 25 20 15 10 10 -55 -35 -15 5 25 45 65 85 105 125 1 1.5 2 Junction Temperature, TJ (oC) Figure 15. Figure 16. Output Pull-Down Resistance vs. Temperature 3 3.5 4 4.5 Output Pull-Down Resistance vs. Supply Voltage 80 Static Drain to Source ON Resistance, RDSON (mΩ) 70 Static Drain to Source ON Resistance, RDSON (mΩ) 2.5 Supply Voltage, VIN (V) VIN = 3V IOUT = 300mA 65 60 55 50 45 40 35 TA = 25(oC) IOUT = 300mA 75 70 65 60 55 50 45 40 35 30 30 1 -55 -35 -15 5 25 45 65 85 105 125 1.5 2 2.5 3 3.5 4 4.5 Supply Voltage, VIN (V) Junction Temperature, TJ (oC) Figure 17. Static Drain-to-Source ON Resistance vs. Temperature © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 Figure 18. Static Drain-to-Source ON Resistance vs. Supply Voltage www.fairchildsemi.com 7 FDZ2040L — Integrated Load Switch Typical Performance Characteristics (Continued) VIN = 3.3 V, VON = 0 V, CIN = 1 µF, COUT = 1 nF, RL = 30 Ω Figure 19. tON Response VIN = 3.3 V, VON = 0 V, CIN = 1 µF, COUT = 1 nF, RL = 30 Ω Figure 20. © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 tOFF Response www.fairchildsemi.com 8 The FDZ2040L is a low-RDS(ON) P-channel load switch packaged in space-saving 0.8 x 0.8 WL-CSP. The core of the device is an 80mΩ P-channel MOSFET and capable of functioning over a wide input operating range of 1.6 V-4 V. Applications Information Figure 21. FDZ2040L — Integrated Load Switch Operation Description Typical Application Input Capacitor To reduce device inrush current effect, a 0.1 µF ceramic capacitor, CIN is recommended close to the VIN pin. A higher value of CIN can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. Output Capacitor FDZ2040L switch works without an output capacitor. If parasitic board inductance forces VOUT below GND when switching off, a 1 nF capacitor, COUT, should be placed between VOUT and GND. Note: 3. The intrinsic diode for P-channel load switch would conduct if VOUT is greater than VIN, by a diode drop. Evaluation Board Layout Figure 22. Figure 23. Top View © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 Bottom View www.fairchildsemi.com 9 FDZ2040L — Integrated Load Switch Physical Dimensions F 0.03 C A E 2X 0.40 B Ø0.20 Cu Pad A1 0.40 D BALL A1 INDEX AREA Ø0.30 Solder Mask 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.292±0.018 0.539 0.461 0.05 C C E 0.208±0.021 SEATING PLANE SIDE VIEWS D NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 B. DIMENSIONS ARE IN MILLIMETERS. C A B Ø0.260±0.020 4X 0.40 B A 0.40 C. DIMENSIONS AND TOLERANCE PER ASME Y14.5M, 1994. (Y)±0.018 D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. F 1 2 E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS ±39 MICRONS (461-539 MICRONS). (X)±0.018 F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. BOTTOM VIEW G. DRAWING FILNAME: MKT-UC004AFrev1. Figure 24. 4 Ball, WLCSP, 2 X 2 Array, 0.4 mm Pitch, 250 µm Ball Product-Specific Dimensions Product D E X Y FDZ2040L 0.8 ± 0.03 mm 0.8 ± 0.03 mm 0.21 mm 0.21 mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 www.fairchildsemi.com 10 FDZ2040L — Integrated Load Switch © 2012 Fairchild Semiconductor Corporation FDZ2040L • Rev. B3 www.fairchildsemi.com 11