® WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SVT Package Weight (mg) 45000 Product Group Type No. S30VT60 – S30VT160 S50VT60 – S50VT160 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Nickel Jumper Copper Alloy Substrate Ceramic Encapsulation Baseplate Tolerance EMC Epoxy Case with Heatsink Case MSL Rating N/A Description Bridge Rectifier 35A 600V – 1600V Bridge Rectifier 50A 600V – 1600V Die Leadframe Terminal Finish Nickel (Ni) Copper Alloy Material Mass (mg) Component Mass (%) Component Mass (mg) 100.00 72.00 0.16 72.00 7439-92-1 92.50 532.80 7440-31-5 5.00 28.80 1.28 576.00 Ag 7440-22-4 2.50 14.40 320 Cu 7440-50-8 62.00 1810.71 40238 Substance CAS No. Si 7440-21-3 Pb Sn Material Mass (%) PPM 1600 11840 640 6.49 2920.50 24013 0.05 22.50 500 6.50 2925.00 Zn 7440-66-6 37.00 1080.59 Fe 7439-89-6 1.00 29.21 Ni 7440-02-0 100.00 22.50 Cu 7440-50-8 99.99 2924.71 Fe 7439-89-6 0.01 0.29 Alumina 11092-32-3 95.50 2428.09 Silica 7631-86-9 2.50 63.56 CaO 1305-78-8 2.00 50.85 1130 SiO2 14808-60-7 64.66 3055.19 67893 Epoxy Resin Brominated Epoxy Resin Sb2O3 29690-82-2 29.40 1389.15 6386-73-8 2.97 140.33 1309-64-4 2.97 140.33 3119 Al 7429-90-5 42.73 1280.62 28458 Silica 7631-86-9 41.60 1246.75 Epoxy Resin 29690-82-2 15.67 469.63 10436 Cu 7440-50-8 99.99 28216.68 627037 Fe 7439-89-6 0.01 2.82 649 64994 7 53958 5.65 2542.50 1413 30870 10.50 4725.00 3119 6.66 62.71 2997.00 28219.50 27706 63 ±10% *Dopant and metallization of the silicon die are not reported in this statement where their concentration is less than the minimum reportable level per EIA JIG-101. Data disclosed herewith is approximate and is based on information from suppliers surveys, Material Safety Datasheet, engineering calculations and measurements. Won-Top Electronics(WTE) has checked all information carefully and believes it to be correct and accurate. However, WTE cannot assume any responsibility for inaccuracies. WTE reserves the right to change any or all information herein without further notice. Revision: December, 2012 www.wontop.com RoHS Declaration The European Parliament and of the Council on the Restriction of the use of Certain Hazardous Substances in Electrical and Electronics Equipment (RoHS) directive restricts the concentration of Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr6+), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBD) to 0.1%(1000 PPM) and restricts the concentration of Cadmium (Cd) to 0.01%(100 PPM) in homogeneous materials of electronics products. The product group listed above and the homogenous materials are compliant with the Directive 2011/65/EU. WTE warrants that all its packing, components and/or products supplied to the Customer and/or its affiliated companies or designated contractors do not contain these hazardous substances in quantity levels higher than or equal to the thresholds to this directive. Exemptions as declared for the directive are: 7(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead). 7(c)-I Lead in glass (applicable for glass passivatied silicon die). Revision: December, 2012 www.wontop.com