UG2JA Taiwan Semiconductor CREAT BY ART FEATURES Surface Mount Ultra Fast Rectifiers - Fast forward recovery time for high frequency operation - Negligible switching losses - Ultrafast reverse recovery time - Reduces switching and conduction losses - High surge current capability - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition DO-214AC (SMA) TYPICAL APPLICATIONS Designed for high frequency switching mode inverters and converters for consumer, computers,lighting, automotive and telecommunications. The low IRRM is an immediately advantage to reduce the switching losses in associated of switching devices. Also suitable as priority protection and other rectifications purposes. MECHANICAL DATA Case: DO-214AC (SMA) Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test, with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.07g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL UG2JA UNIT Maximum repetitive peak reverse voltage VRRM 600 V Maximum RMS voltage VRMS 420 V Maximum DC blocking voltage VDC 600 V Maximum average forward rectified current IF(AV) 2 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 40 A VF 1.30 V Maximum instantaneous forward voltage (Note 1) @2A Maximum reverse current @ rated VR TJ=25 ℃ 2 IR TJ=125 ℃ Reverse recovery time (Note 2) trr Forward recovery time (Note 3) tfr μA 50 Typ. Max. 40 55 Typ. Max. - 100 - 9 ns ns Forward recovery voltage (Note 3) VFP Typical junction capacitance (Note 4) Cj 20 RθjL RθjA 25 70 TJ - 55 to +150 O C - 55 to +150 O C Typical thermal resistance Operating junction temperature range Storage temperature range TSTG V pF O C/W Note 1: Pulse test with PW=300 μs, 1% duty cycle Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Forward Recovery Test Conditions: IF=2A, dIF/dt = 100A/µs, VFR =1.1 x VFmax Note 4: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. Document Number: DS_D1404007 Version: A14 UG2JA Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING CODE AEC-Q101 GREEN COMPOUND PACKING Folded SMA 1,800 / 7" Plastic reel CODE QUALIFIED F3 F2 Prefix "H" UG2JA PACKAGE Suffix "G" F4 Folded SMA 7,500 / 13" Paper reel Folded SMA 7,500 / 13" Plastic reel EXAMPLE PREFERRED P/N PART NO. AEC-Q101 GREEN COMPOUND PACKING CODE QUALIFIED UG2JA F3 UG2JA F3 UG2JA F3G UG2JA F3 UG2JAHF3 UG2JA H DESCRIPTION CODE G Green compound F3 AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE INSTANTANEOUS REVERSE CURRENT (μA) AVERAGE FORWARD CURRENT (A) 2 1.5 1 0.5 RESISTER OR INDUCTIVE LOAD 0 0 25 50 75 100 LEAD TEMPERATURE 125 TJ=25℃ 0.01 0 10 0 100 INSTANTANEOUS FORWARD CURRENT (A) 20 NUMBER OF CYCLES AT 60 Hz 40 60 80 100 FIG. 4 TYPICAL FORWARD CHARACTERISTICS 30 10 20 10 40 Document Number: DS_D1404007 0.1 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 8.3ms Single Half Sine Wave JEDEC Method 1 1 150 60 50 TJ=125℃ 10 (oC) FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT (A) FIG. 2 TYPICAL REVERSE CHARACTERISTICS 100 2.5 TJ=125℃ 1 TJ=25℃ Pulse Width=300μs 1% Duty Cycle 0.1 0.4 0.6 0.8 1 1.2 1.4 FORWARD VOLTAGE (V) 1.6 1.8 Version: A14 UG2JA Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE 60 CAPACITANCE (pF) 50 40 30 20 10 f=1.0MHz Vsig=50mVp-p 0 0.1 1 10 100 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Unit (mm) DIM. Unit (inch) Min Max Min Max A 1.27 1.58 0.050 0.062 B 4.06 4.60 0.160 0.181 C 2.29 2.83 0.090 0.111 D 1.99 2.50 0.078 0.098 E 0.90 1.41 0.035 0.056 F 4.95 5.33 0.195 0.210 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.68 0.066 B 1.52 0.060 C 3.93 0.155 D 2.41 0.095 E 5.45 0.215 MARKING DIAGRAM P/N = Specific Device Code G= Green Compound YW = Date Code F= Factory Code Document Number: DS_D1404007 Version: A14 UG2JA Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1404007 Version: A14