TSP10H45S thru TSP10H60S Taiwan Semiconductor CREAT BY ART Trench Schottky Rectifier FEATURES - Patented Trench Schottky technology - Excellent high temperature stability - Low forward voltage - Low power loss/ high efficiency - High forward surge capability - Ideal for automated placement TO-277A (SMPC) - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition TYPICAL APPLICATIONS Trench Schottky barrier rectifier are designed for high frequency miniature switched mode power supplies such as adapters, lighting and on-board DC/DC converters. MECHANICAL DATA Case: TO-277A (SMPC) Molding compound, UL flammability classification rating 94V-0 Standard part no. with suffix "M" means commercial grade Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test Polarity: Indicated by cathode band Weight: 95mg (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL TSP10H45S TSP10H60S UNIT Maximum repetitive peak reverse voltage VRRM 45 60 V Maximum RMS voltage VRMS 32 42 V Maximum average forward rectified current IF(AV) 10 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 180 A IF = 5A Instantaneous forward voltage (Note 1) IF = 10A IF = 5A IF = 10A Maximum instantaneous reverse current at rated reverse voltage TJ = 25°C VF TJ = 125°C TJ = 25°C TJ = 125°C Typical thermal resistance Operating junction temperature range Storage temperature range TYP. MAX. TYP. MAX. 0.44 - 0.45 - 0.48 0.57 0.52 0.64 0.34 - 0.36 - 0.41 0.5 0.46 0.63 IR RθJC V 150 μA 25 mA 10 14 °C/W TJ - 55 to +150 °C TSTG - 55 to +150 °C Note 1: Pulse test with pulse width=300μs, 1% duty cycle Document Number: DS_D1409003 Version: A14 TSP10H45S thru TSP10H60S Taiwan Semiconductor ORDERING INFORMATION PART NO. PART NO. SUFFIX TSP10HXXC (Note 1, 2) M PACKING CODE PACKING CODE SUFFIX S1 PACKAGE PACKING SMPC 1,500/ 7" Plastic reel SMPC 6,000/ 13" Plastic reel G S2 Note 1: "XX" defines voltage from 45V (TSP10H45S) to 60V (TSP10H60S) Note 2: Whole series with green compound (halogen-free) EXAMPLE PREFERRED PART NO. PART NO. PART NO. TSP10H45SMS1G SUFFIX TSP10H45S M PACKING CODE PACKING CODE DESCRIPTION SUFFIX G S1 Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG.2 TYPICAL FORWARD CHARACTERISTICS FIG.1 FORWARD CURRENT DERATING CURVE 100 12 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) TSP10H45S 10 TSP10H45S 8 6 TSP10H60S 4 2 WITH HEATSINK 30mm x 30mm 4 oz. pad PCB 0 50 10 TJ=150oC TJ=125oC 1 0.1 TJ=100oC TJ=25oC 0.01 75 100 125 0 150 0.1 0.2 0.4 0.5 0.6 0.7 0.8 FORWARD VOLTAGE (V) CASE TEMPERATURE (oC) FIG.3 TYPICAL FORWARD CHARACTERISTICS FIG.4 TYPICAL REVERSE CHARACTERISTICS 100 100 TSP10H60S TSP10H45S INSTANTANEOUS REVERSE CURRENT (mA) INSTANTANEOUS FORWARD CURRENT (A) 0.3 10 TJ=150oC TJ=125oC 1 0.1 TJ=100oC TJ=25oC 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 FORWARD VOLTAGE (V) Document Number: DS_D1409003 0.7 0.8 TJ=150oC 10 TJ=125oC TJ=100oC 1 0.1 0.01 TJ=25oC 0.001 10 20 30 40 50 60 70 80 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Version: A14 TSP10H45S thru TSP10H60S Taiwan Semiconductor FIG.5 TYPICAL REVERSE CHARACTERISTICS FIG.6 TYPICAL JUNCTION CAPACITANCE 10000 TSP10H60S TJ=150oC 10 TJ=125oC CAPACITANCE (pF) INSTANTANEOUS REVERSE CURRENT (mA) 100 TJ=100oC 1 0.1 0.01 1000 TJ=25oC f=1.0MHz Vslg=50mVp-p 100 0.001 10 20 30 40 50 60 70 80 90 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Document Number: DS_D1409003 100 0.1 1 10 100 REVERSE VOLTAGE (V) Version: A14 TSP10H45S thru TSP10H60S Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS TO-277A (SMPC) DIM. Unit (mm) Unit (inch) Min Max Min Max A 5.650 5.750 0.222 0.226 B 6.350 6.650 0.250 0.262 C 4.550 4.650 0.179 0.183 D 3.540 3.840 0.139 0.151 E 4.235 4.535 0.167 0.179 F 1.850 2.150 0.073 0.085 G 3.170 3.470 0.125 0.137 H 1.043 1.343 0.041 0.053 I 1.000 1.300 0.039 0.051 J 1.930 2.230 0.076 0.088 K 0.175 0.325 0.007 0.013 L 1.000 1.200 0.039 0.047 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 4.80 0.189 B 4.72 0.186 C 1.40 0.055 D 1.27 0.050 E 6.80 0.268 F 1.04 0.041 MARKING DIAGRAM P/N = Marking Code YW = Date Code F = Factory Code Document Number: DS_D1409003 Version:A14 TSP10H45S thru TSP10H60S Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1409003 Version: A14