TSP15U50S - Taiwan Semi

TSP15U50S
Taiwan Semiconductor
Trench Schottky Rectifier
FEATURES
- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Lower power loss/ High efficiency
- High forward surge capability
- Ideal for automated placement
- Moisture sensitivity level : level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
TO-277A (SMPC)
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case: TO-277A (SMPC)
Molding compound, UL flammability classification rating 94V-0
Part no. with suffix "M" means commercial grade
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.095 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
TSP15U50S
Symbol
Marking code
UNIT
15U50
Maximum repetitive peak reverse voltage
VRRM
50
V
Maximum average forward rectified current
IF(AV)
15
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load per diode
IFSM
200
A
Maximum instantaneous forward voltage
per diode (Note 1)
MIN
TYP
MAX
IF = 5A
-
0.37
-
IF = 7.5A TJ = 25°C
-
0.40
-
-
0.48
0.56
IF = 5A
-
0.26
-
IF = 7.5A TJ = 125°C
-
0.31
-
IF = 15A
-
0.44
0.50
-
140
2000
μA
-
60
140
mA
VF
IF = 15A
Maximum instantaneous reverse current per diode at
rated reverse voltage
TJ = 25°C
TJ = 125°C
IR
V
Maximum DC reverse voltage
VDC
35
V
Typical thermal resistance per diode
RθJL
10
°C/W
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
Operating temperature range
Storage temperature range
Note1: Pulse Test with Pulse Width=300μs, 1% Duty Cycle
Document Number: DS_D1410081
Version: C14
TSP15U50S
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
SUFFIX
S1
M
TSP15U50S
PACKING CODE
PACKING CODE
G
S2
PACKAGE
PACKING
SMPC
1,500/ 7" Plastic reel
SMPC
6,000/ 13" Plastic reel
Note: Whole series with green compound
EXAMPLE
PREFERRED P/N
PART NO.
TSP15U50SMS1G
TSP15U50S
PART NO.
PACKING CODE
PACKING CODE
SUFFIX
M
SUFFIX
S1
DESCRIPTION
Commercial grade
Green compound
G
RATINGS AND CHARACTERISTICS CURVES
(TA=25oC unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
100
INSTANTANEOUS FORWARD CURRENT (A)
AVERAGE FORWARD CURRENT (A)
20
15
10
5
WITH HEATSINK
30mm x 30mm 4 oz.
pad PCB
0
0
25
50
75
100
125
TJ=150oC
10
TJ=125oC
1
TJ=100oC
0.1
TJ=25oC
0.01
150
0
0.2
0.4
0.8
FORWARD VOLTAGE (V)
LEAD TEMPERATURE (oC)
FIG. 3 TYPICAL REVERSE CHARACTERISTICS
FIG. 4 TYPICAL JUNCTION CAPACITANCE
100
10000
TJ=125oC
10
TJ=100oC
1
CAPACITANCE (pF)
INSTANTANEOUS REVERSE CURRENT (mA)
0.6
0.1
TJ=25oC
0.01
1000
f=1.0MHz
Vsig=50mVp-p
0.001
0.0001
10
20
30
40
50
60
70
80
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
Document Number: DS_D1410081
90
100
100
0.1
1
10
100
REVERSE VOLTAGE (V)
Version: C14
TSP15U50S
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
TO-277A (SMPC)
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
5.650
5.750
0.222
0.226
B
6.350
6.650
0.250
0.262
C
4.550
4.650
0.179
0.183
D
3.540
3.840
0.139
0.151
E
4.235
4.535
0.167
0.179
F
1.850
2.150
0.073
0.085
G
3.170
3.470
0.125
0.137
H
I
1.043
1.000
1.343
1.300
0.041
0.039
0.053
0.051
J
1.930
2.230
0.076
0.088
K
0.175
0.325
0.007
0.013
L
1.000
1.200
0.039
0.047
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
4.80
0.189
B
4.72
0.186
C
1.40
0.055
D
1.27
0.050
E
6.80
0.268
F
1.04
0.041
MARKING DIAGRAM
P/N
= Marking Code
YW
= Date Code
F
= Factory Code
Document Number: DS_D1410081
Version: C14
TSP15U50S
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1410081
Version: C14