DB3/ DB3TG Taiwan Semiconductor Small Signal Product 150mW Bi-directional Trigger Diode FEATURES - Designed for through-hole device type mounting - Hermetically sealed glass - High reliability glass passivation insuring parameter d stability and protection against junction contamination - All external surfaces are corrosion resistant and de terminals are readily solderable MECHANICAL DATA - Case: DO-35 Solder Hot Dip Tin (Sn) lead finish DO-35 Axial Lead - High temperature soldering guaranteed: 260°C/10s - Weight: 0.1255 mg (approximately) Hermetically Sealed Glass en - Terminal: Pure tin plated, lead free, solderable per MIL-STD-202, method 208 guaranteed - Pb free and RoHS compliant PARAMETER Repetitive Peak Forward Current Power Dissipation mm MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) Pulse Width = 20µs Thermal Resistance (Junction to Ambient) (Note) Junction and Storage Temperature Range SYMBOL VALUE UNIT IFRM PD 2 150 A mW RθJA 400 TJ, TSTG - 40 to + 125 o C/W o C Notes: Valid provided that electrodes are kept at ambient temperature SYMBOL DB3 MIN TYP MAX 28 32 36 30 32 34 tr e co PARAMETER Break-Over Voltage Break-Over Voltage Symmetry DB3TG DB3 DB3TG DB3 VBO + / -VBO △V 5 Output Voltage VO 5 Leakage Current IB Dynamic Breakdown Voltage Break-Over Current DB3TG DB3 DB3TG IBO ±3 ±2 9 - 10 100 15 TEST CONDITION UNIT C=22nF V C=22nF V IBO to IF=10mA V (Note) VB = 0.5VBO (Max) µA C=22nF µA V No Notes: Test Circuit Document Number: DS_S1407001 Version: E14 DB3/ DB3TG Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 1 Admissible Power Dissipation Curve d 120 80 de Power Dissipation (mW) 160 40 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Ambient Tempeatature (oC) Fig. 3 Repetitive Peak Pulse Current VS. Pulse Duration (Maximum Values) mm Fig. 2 Relative Variation of VBO VS. Junction Temperature (Typical Values) 100 1.08 Repetitive Peak Pulse Current (A) 1.07 1.06 1.05 1.04 1.03 10 1 tr e co VBO [Tj] / VBO [Tj=25°C] en 0 1.02 1.01 1 25 50 75 100 125 0.1 1 10 tp (µs) No Tj (°C) Document Number: DS_S1407001 VBO : Break-Over Voltage IBO : Break-Over Current ∆V : IB : Dynamic Breakover Voltage Leakage Current at VB=0.5*VBO VF : Voltage at Current IF=10mA 100 Version: E14 DB3/ DB3TG Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. MANUFACTURE CODE (Note) PACKING CODE GREEN COMPOUND CODE PACKAGE PACKING MARKING DB3 RI G DO-35 5K / 10" Reel DB3 DB3TG RI G DO-35 5K / 10" Reel DB3TG EXAMPLE DB3 RIG DB3 DB3-N0 RIG DB3 MANUFACTURE CODE PACKING CODE RI N0 GREEN COMPOUND CODE G DESCRIPTION Green compound en PART NO. RI G Green compound No tr e co mm PREFERRED P/N de d Note: Indicator of manufacturing site for manufacture special control, if empty means no special control requirement Document Number: DS_S1407001 Version: E14 DB3/ DB3TG Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS DO-35 DIM. Unit (mm) Unit (inch) Max Min Max A 0.34 0.60 0.013 0.024 B 2.90 5.08 0.114 0.200 C 25.40 38.10 1.000 1.500 D 1.30 2.28 0.051 0.090 No tr e co mm en de d Min Document Number: DS_S1407001 Version: E14 DB3/ DB3TG Taiwan Semiconductor tr e co mm en de d Small Signal Product Notice No Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1407001 Version: E14