5319/5321 - Vectron International

REV
A
DESCRIPTION
DATE
4/23/14
NIR-52398
PREP
DF/SM
APPD
LT
Oscillator Specification, Hybrid VCXO
For
MOUNT HOLLY SPRINGS, PA 17065
THE RECORD OF APPROVAL FOR THIS
DOCUMENT IS MAINTAINED ELECTRONICALLY
WITHIN THE ERP SYSTEM
Hi-Rel Standard, LVPECL Output
CODE IDENT NO
SIZE
00136
A
DWG. NO.
UNSPECIFIED TOLERANCES: N/A
VECTRON INTERNATIONAL PROPRIETARY
REV
DOC204898
A
SHEET 1 0F 17
1.
SCOPE
1.1
General. This specification defines the design, assembly and functional evaluation of high
reliability, hybrid voltage controlled oscillators produced by Vectron International. Devices
delivered to this specification represent the standardized Parts, Materials and Processes
(PMP) Program developed, implemented and certified for advanced applications and
extended environments.
1.2
Applications Overview. The designs represented by these products were primarily developed
for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options
imbedded within DOC204898 bridge the gap between Space and COTS hardware by
providing custom hardware with measures of mechanical, assembly and reliability assurance
needed for Military or Ruggedized COTS environments.
2.
APPLICABLE DOCUMENTS
2.1
Specifications and Standards. The following specifications and standards form a part of this
document to the extent specified herein. The issue currently in effect on the date of quotation
will be the product baseline, unless otherwise specified. In the event of conflict between the
texts of any references cited herein, the text of this document shall take precedence.
Military
MIL-PRF-55310
MIL-PRF-38534
Standards
MIL-STD-202
MIL-STD-750
MIL-STD-883
MIL-STD-1686
Other
DOC204944
QSP-90100
VL-65339
DOC203982
Oscillators, Crystal Controlled, General Specification For
Hybrid Microcircuits, General Specification For
Test Method Standard, Electronic and Electrical Component Parts
Test Method Standard, Test Methods for Semiconductor Devices
Test Methods and Procedures for Microelectronics
Electrostatic Discharge Control Program for Protection of Electrical
and Electronic Parts, Assemblies and Equipment
Test Specification, Hybrid VCXO, Hi-Rel Standard, LVPECL Output
Quality Systems Manual, Vectron International
Identification Common Documents, Materials and Processes, Hi-Rel
XO
DPA Specification
3.
GENERAL REQUIREMENTS
3.1
Classification. All devices delivered to this specification are of hybrid technology
conforming to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S
equivalent specification, options are imbedded within it to also produce Class B, Engineering
Model and Ruggedized COTS devices. Devices carry a Class 2 ESDS classification.
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
2
VECTRON INTERNATIONAL PROPRIETARY
3.2
Item Identification. Unique model number series are utilized to identify device package
configurations as listed in Table 1.
3.3
Absolute Maximum Ratings.
a. Supply Voltage Range (VCC):
b. Storage Temperature Range (TSTG):
c. Junction Temperature (TJ):
d. Lead Temperature (soldering, 10 seconds):
0Vdc to +6.0Vdc
-65°C to +125°C
+150°C
+300°C
3.4
Design, Parts, Materials and Processes, Assembly, Inspection and Test.
3.4.1
Design. The ruggedized designs implemented for these devices are proven in military and
space applications under extreme environments. Designs utilize 4-point crystal mounting in
combination with Established Reliability (MIL-ER) components where possible. When
specified, radiation hardening up to 50krad (Si) (RHA level L) is met by utilizing swept
quartz and active device lots that have passed testing to that level.
3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting
passive chip component values to offset component tolerances, there will not be fundamental
changes to the design or assembly or parts, materials and processes after first product
delivery of that item without written approval from the procuring activity.
3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of
MIL-PRF-55310. These designs have also passed extended dynamic levels of at least:
Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)
Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms)
Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)
3.4.2
Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high
reliability devices produced to this specification.
a. Gold metallization of package elements without a barrier metal.
b. Zinc chromate as a finish.
c. Cadmium, zinc, or pure tin external or internal to the device.
d. Plastic encapsulated semiconductor devices.
e. Ultrasonically cleaned electronic parts.
f. Heterojunction Bipolar Transistor (HBT) technology.
g. ‘getter’ materials
3.4.3
Assembly. Manufacturing utilizes standardized procedures, processes and verification
methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.
MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part
numbers to further verify lot pedigree. Traceability of all components and production lots
are in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a
part of the deliverable data package. Devices are handled in accordance with MIL-STD1686 for Class 1 devices.
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
3
VECTRON INTERNATIONAL PROPRIETARY
3.4.4
Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to
this document. Inspection conditions and standards are documented in accordance with the
Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100.
3.4.5
Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to
eliminate costs associated with the development/maintenance of device-specific
documentation packages while maintaining performance integrity.
3.4.6
Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.
3.4.7
Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the
same robust designs found in the other device pedigrees. They do not include the provisions
of traceability or the Class-qualified components noted in paragraphs 3.4.3 and 4.1.
4.
DETAIL REQUIREMENTS
4.1
Components
4.1.1
Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for
the devices. The optional use of Premium Q swept quartz can, because of its processing to
remove impurities, be specified for better frequency aging characteristics. In accordance
with MIL-PRF-55310, the manufacturer has a documented crystal element evaluation
program.
4.1.2
Passive Components. Established Reliability (ER) failure level R minimum passive
components are procured from QPL suppliers where possible. Lot evaluations are in
accordance with MIL-PRF-55310 or Enhanced Element Evaluation as specified in Table 8.
4.1.3
Class S Active Devices. Active Devices are procured from wafer lots that have passed MILPRF-55310 Lot Acceptance Tests for Class S devices. When optionally specified, further
testing in accordance with MIL-PRF-55310 and MIL-PRF-38534 is performed for radiation
hardness assurance (excluding varactor diodes) and for Enhanced Element Evaluation as
specified in Tables 6 and 7. Varactor diodes are considered radiation tolerant by design.
Those active devices, identified by a unique part number, are certified for 50krad (Si)
ELDRS.
4.1.3.1 Class B Active Devices. When specified, active devices assembled into DOC204898 design
pedigree letters “B” and “C” devices (¶ 5.2a) are procured from wafer lots that have passed
MIL-PRF-55310 element evaluations for Class B devices.
4.1.4
Packages. Packages are procured that meet the construction, lead materials and finishes as
specified in MIL-PRF-55310. Package lots are upscreened in accordance with the
requirements of MIL-PRF-38534 as applicable.
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
4
VECTRON INTERNATIONAL PROPRIETARY
4.1.5
Traceability. Class S active device lots are homogenous and traceable to the manufacturer’s
individual wafer. Swept Quartz Crystals are traceable to the quartz bar and the processing
details of the autoclave lot, as applicable. All other elements and materials are traceable to
their manufacturer and incoming inspection lots.
4.1.6
Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and
passive devices with Enhanced Element Evaluation as listed in Table 6, 7 and 8 shall be
implemented for the highest reliability preference.
4.2
Mechanical.
4.2.1
Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to
a corresponding package style. Mechanical Outline information of each package style is
found in the referenced Figure.
4.2.2
Thermal Characteristics. The worst case thermal characteristics of each package style and
active device are found in Table 4.
4.3
Electrical.
4.3.1
Input Power. Devices are designed for standard +3.3 volt dc operation, ±5%. Current is
measured, no load, at maximum rated operating Voltage.
4.3.2
Temperature Range. Operating range is -40°C to +85°C.
4.3.3
Absolute Pull Range. Absolute pull range is defined as the minimum guaranteed amount the
VCXO can be varied, about the center frequency (fo). It accounts for degradations including
temperature stability (-40 to 85°C), aging (15 years), radiation effects, power supply
variations (±5%) and load variations (±10%).
4.3.4
Frequency Aging. When tested in accordance with MIL-O-55310 Group B inspection, the
15-year aging projection shall not cause the minimum APR limit to be exceeded.
4.3.5
Operating Characteristics. Symmetrical square wave limits are dependent on the device
frequency and are in accordance with Table 2 and Figure 1. Start-up time is 10.0 msec.
maximum.
4.3.6
Output Load. 50Ω to Vcc-2.0V (each output)
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
5
VECTRON INTERNATIONAL PROPRIETARY
5.
QUALITY ASSURANCE PROVISIONS AND VERIFICATION
5.1
Verification and Test. Device lots shall be tested prior to delivery in accordance with the
applicable Screening Option letter as stated by the 15th character of the part number. Table 5
tests are conducted in the order shown and annotated on the appropriate process travelers and
data sheets of the governing test procedure. For devices that require Screening Options that
include MIL-PRF-55310 Group A testing, the Post-Burn-In Electrical Test and the Group A
Electrical Test are combined into one operation.
5.1.1
Screening Options. The Screening Options, by letter, are summarized as:
A
Modified MIL-PRF-38534 Class K
B
Modified MIL-PRF-55310 Class B Screening & Group A Quality
Conformance Inspection (QCI)
C
Modified MIL-PRF-55310 Class S Screening & Group A QCI
E
Modified MIL-PRF-55310 Class B Screening, Groups A & B QCI
F
Modified MIL-PRF-55310 Class S Screening, Groups A & B QCI
G
Modified MIL-PRF-55310 Class B Screening & Post Burn-in Nominal
Electricals
X
Engineering Model (EM)
5.2
Optional Design, Test and Data Parameters. The following is a list of design, assembly,
inspection and test options that can be selected or added by purchase order request.
a. Design Pedigree (choose one as the 5th character in the part number):
(E) Enhanced Element Evaluation, 50krad Class S die, Premium Q Swept Quartz
(R) Hi-Rel design w/ 50krad Class S die, Premium Q Swept Quartz
(V) Hi-Rel design w/ 50krad Class S die, Cultured Quartz
(X) Hi-Rel design w/ Cultured Quartz, Class S die
(B) Hi-Rel design w/ Swept Quartz, Class B die
(C) Hi-Rel design w/ Cultured Quartz, Class B die
(D) Hi-Rel design w/ Cultured Quartz and commercial grade components
b. Input Voltage, (B) for 3.3V as the 14th character
c. Frequency-Temperature Slew Test
d. Radiographic Inspection
e. Group C Inspection: MIL-PRF-55310 (requires 8 test specimens)
f. Group C Inspection: MIL-PRF-38534 [requires 8 test specimens – Life (5), RGA (3)]
g. Internal Water-Vapor Content (RGA) samples and test performance
h. MTBF Reliability Calculations
i. Worst Case/Derating Analysis (MIL-HDBK-1547) with Tj Max = +105°C;
Derated Maximum Operating Temp = Tj Max - ∆Tj
j. Deliverable Process Identification Documentation (PID)
k. Customer Source Inspection (pre-cap / final)
l. Destruct Physical Analysis (DPA): MIL-STD-1580 with exceptions as specified in
Vectron DOC203982.
5.3
Test Conditions. Unless otherwise stated herein, inspections are performed in accordance
with those specified in MIL-PRF-55310 and MIL-PRF-38534, in that order. Process
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
6
VECTRON INTERNATIONAL PROPRIETARY
travelers identify the applicable methods, conditions and procedures to be used. Examples of
electrical test procedures that correspond to MIL-PRF-55310 requirements are shown in
Table 3.
5.4
Special Tests and Descriptions.
5.4.1
Frequency-Temperature Slew. Frequency-Temperature Slew Test has been developed as an
indicator of higher than normal internal water vapor content. The incremental temperature
sweep from +85°C to -40°C and back to +85°C records output frequency fluctuations
emulating the mass loading of moisture deposited on the crystal blank surface. Though not
replacing a customer’s internal water-vapor content (RGA) requirement, confidence is
increased without destructively testing otherwise good devices.
5.4.2
Burn-in Delta Frequency Aging (in Option D). The frequency measurement for burn-in delta
measurements is performed at the crystal’s upper turning point temperature where its effects
on repeatable frequency accuracy are maximized. Dependent on the crystal specified, this
temperature is typically between +65°C and +85°C, ±0.2°C.
5.5
Deliverable Data. The manufacturer supplies the following data, as a minimum, with each
lot of devices:
a. Completed assembly and screening lot travelers, including rework history.
b. Electrical test variables data, identified by unique serial number.
c. Frequency-Temperature Slew plots, Radiographic films, Group C data and RGA data
as required by purchase order.
5.6
Discrepant Material. All MRB authority resides with the procuring activity.
5.7
Failure Analysis. Any catastrophic failure (no clocking, no current) at Post Burn-In or after
will be evaluated for root cause. The customer will be notified after occurrence and upon
completion of the evaluation.
6.
PREPARATION FOR DELIVERY
6.1
Packaging. Devices will be packaged in a manner that prevents handling and transit damage
during shipping. Devices will be handled in accordance with MIL-STD-1686 for Class 1
devices.
7.
ORDERING INFORMATION
7.1
Ordering Part Number. The ordering part number is made up of an alphanumeric series
of 15 characters. Design-affected product options, identified by the parenthetic letter
on the Optional Parameters list (¶ 5.2a and b), are included within the device part
number.
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
7
VECTRON INTERNATIONAL PROPRIETARY
The Part Number breakdown is described as:
5319 R 156M2500 B F
Model # (Table 1)
Screening Option
per Table 5, 5.1.1
Input Voltage
B = 3.3V
Design Pedigree
E = Enhanced Element Evaluation,
50krad Class S die, Swept Quartz
Frequency
R = 50krad Class S die, Swept Quartz
V = 50krad Class S die, Non-Swept
Quartz
X = Class S die, Non-Swept Quartz
B = Class B die, Swept Quartz
C = Class B die, Non-Swept Quartz
D = Ruggedized COTS: Commercial
Grade Components, Non-Swept
Quartz
7.1.1
Model Number. The device model number is the four (4) digit number assigned to a
corresponding package and output combination per Table 1.
7.1.2
Design Pedigree. Class S variants correspond to either letter “E”, “R”, “V” or “X” and are
described in paragraph 5.2a. Class B variants correspond to either letter “B” or “C” and are
described in paragraph 5.2a. Ruggedized COTS, using commercial grade components,
corresponds to letter “D”.
7.1.3
Output Frequency. The nominal output frequency is expressed in the format as specified in
MIL-PRF-55310 utilizing eight (8) characters.
7.1.4
Input Voltage. Voltage is the 14th character, letter “B” represents +3.3V.
7.1.5
Screening Options. The 15th character is the Screening Option (letter A thru G or X) selected
from Table 5.
7.2
Optional Design, Test and Data Parameters. Test and documentation requirements above
that of the standard high reliability model shall be specified by separate purchase order line
items (as listed in ¶ 5.2c thru k).
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
8
VECTRON INTERNATIONAL PROPRIETARY
HI-REL
STANDARD
MODEL #
5319
PACKAGE
PIN I/O 1/
Q Qnot
Vcc
Vc
16 Lead Flatpack
16
1
7
5321
16 Lead Flatpack
16
1
7
Gnd/Case
MECHANICAL
OUTLINE
8
9, 11
FIGURE 2
8
9, 11
FIGURE 3
1/. All unassigned pins have no internal connections or ties.
TABLE 1 - Item Identification and Package Outline
Frequency Range @ 3.3V Operation: 100 MHz to 320 MHz 1/
Temperature Range: -40°C to +85°C
Absolute Pull Range: ±20 ppm min.
Control Voltage (Vc) Range: 0.0V to +3.3V
Slope: Positive
Linearity: ±10% max.
F vs. V Gain: 55 ppm/V typical
Sub-Harmonics: -30 dBc max.
Frequency-Voltage Tolerance: ±4 ppm max. (Vcc ±5%)
Frequency Aging: 15 year projection based on 30 day test included in APR calculation
Start-up Time: 10.0 ms max.
Output Voltage: VOH= Vcc-1.085 to Vcc-0.880, VOL=Vcc-1.830 to Vcc-1.555
Frequency
Current,
Rise / Fall
Duty Cycle
BW Jitter,
Range
No load
Time
(%)
12kHz-20MHz
(MHz)
(mA max)
(ps max.)
(ps rms max)
100 - 200
>200 - 320
65
65
900
600
40 to 60
40 to 60
1.0
0.5
1/. Waveform measurement points and logic limits are in accordance with Figure 1.
2/. Measured with Wavecrest SIA-3000 Signal Integrity Analyzer
TABLE 2 - Electrical Performance Characteristics
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
9
VECTRON INTERNATIONAL PROPRIETARY
OPERATION LISTING
REQUIREMENTS AND
CONDITIONS 1/
@ all Electrical tests
Input Current (no load)
MIL-PRF-55310, Para 4.8.5.1
Initial Accuracy @ Ref. Temp.
MIL-PRF-55310, Para 4.8.6
Output Logic Voltage Levels
MIL-PRF-55310, Para 4.8.21.3
Rise and Fall Times
MIL-PRF-55310, Para 4.8.22
Duty Cycle
MIL-PRF-55310, Para 4.8.23
@ Post Burn-In Electrical only
Overvoltage Survivability
MIL-PRF-55310, Para 4.8.4
Initial Freq. – Temp. Accuracy
MIL-PRF-55310, Para 4.8.10.1
Freq. – Voltage Tolerance
MIL-PRF-55310, Para 4.8.14
Start-up Time (fast/slow start)
MIL-PRF-55310, Para 4.8.29
1/. Waveform measurement points and logic limits are in accordance with Figure 1.
TABLE 3 - Electrical Test Parameters
Model #
Thermal Resistance
∆ Junction Temp. Tj
Typical Weight
Junction to Case
(°C @ max. power)
(Grams)
θjc (°C / W)
5319/5321
39
5.3
7.5
Note. These oscillators contain multiple active devices. This calculation shows the
worst case θjc and temperature rise of those devices.
TABLE 4 - Typical Thermal Characteristics and Weight
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
10
VECTRON INTERNATIONAL PROPRIETARY
OPN.
NO.
OPERATION LISTING
REQUIREMENTS AND CONDITIONS
MIL Class Similarity
SCREENING
1
2
Non-Destruct Bond Pull
Internal Visual
3/
3
Stabilization (Vacuum) Bake
4
Thermal Shock
5
Temperature Cycle
6
Constant Acceleration
7
Particle Impact Noise Detection
8
Electrical Testing, Pre Burn-In
9
Freq-Temp Slew Test
10
1st Burn-In
11
Electrical Testing, Intermediate
12
2nd Burn-In
13
14
Electrical Testing, Post Burn-In
(Group A)
Seal: Fine Leak
15
16
Seal: Gross Leak
Radiographic Inspection
17
18
19
Solderability
External Visual & Mechanical
Aging, 30 Day
(M55310 Group B)
Option
A
K
Option
B
B-
Option
C
S-
Option
E
B
Option
F
S
Option
G
Option
X
EM
100%
100%
100%
100%
100%
100%
100%
MIL-STD-883, Meth 2023
MIL-STD-883, Meth 2017 Class K,
Meth 2032 Class K
MIL-STD-883, Meth 1008, Cond C,
150°C, 48 hours min.
MIL-STD-883, Meth 1011, Cond A
Completed During Assembly
NR
NR
X
NR
X
NR
NR
MIL-STD-883, Meth 1010, Cond. B,
10 cycles min.
MIL-STD-883, Meth 2001, Cond A,
Y1 plane only, 5000 g’s
MIL-STD-883, Meth 2020, Cond B
X
X
X
X
X
X
NR
X
X
X
X
X
X
NR
X
X
X
X
X
NR
X
Perform tests in Table 3. Nominal Vcc, nominal
temperature
Operating temp. range, frequency plotted at 1.0°C
steps
MIL-STD-883, Meth 1015, Condition B
X
X
X
X
X
X
X
AR
AR
AR
AR
AR
NR
NR
X
160 hrs.
X
X
160 hrs.
NR
X
240 hrs.
NR
X
160 hrs.
NR
X
240 hrs.
NR
X
160 hrs.
NR
NR
X
160 hrs.
X
NR
NR
NR
NR
NR
NR
X
X
X
X
NR
X
X
X
X
X
X
nom. Vcc
X
X
X
X
AR
X
AR
X
AR
X
X
X
NR
X
NR
1/
X
NR
1/
X 2/
NR
1/
X 2/
NR
1/
X 2/
13 pcs.
1/
X 2/
X
1/
X 2/
NR
NR
X 2/
NR
Perform tests in Table 3. Nominal Vcc, nominal
temperature
MIL-STD-883, Meth 1015, Condition B
Perform tests in Table 3. Nominal Vcc & extremes,
nominal temperature & extremes
MIL-STD-883, Meth 1014, Cond A2
5 x 10-8 atm cc/sec max
MIL-STD-202, Meth 112, Cond D
MIL-STD-883, Meth 2012
MIL-STD-883, Meth 2003
MIL-STD-883, Meth 2009
MIL-PRF-55310, para. 4.8.35.1
LEGEND: X = Required, NR = Not Required, AR = As Required
TABLE 5 - Test Matrix
1/ Performed at package LAT. Include LAT data sheet
2/ When specified, RGA samples will be removed from the lot after completion of this operation. Use of screening failures requires customer concurrence.
3/. Not performed on Option B, E, G and X units.
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
11
VECTRON INTERNATIONAL PROPRIETARY
NR
X
Subgroup
Class
Test
Mil-STD-883
Method
K
(accept number)
Mil-PRF38534
Reference
Paragraph
100%
C.3.3.1
100%
10(0) or 22(0)
C.3.3.2
C.3.3.3
C.3.3.4.2
C.3.3.3
Quantity
Condition
Element Electrical
A. May perform at wafer level
B. All failures shall be removed
from the lot
C. Perform at room ambient
1
X
2
X
Element Visual
2010
3
X
Internal Visual
2010
4
X
X
Temperature Cycling
Mechanical Shock
or
Constant Acceleration
1010
2002
X
2001
C
B, Y1
direction
3,000 G, Y1
direction
10(0)
22(0)
Interim Electrical
C.3.3.4.3
X
Burn-In
1015
X
X
X
Post Burn-In Electrical
Steady State Life
Final Electrical
1005
240 hours
minimum at
+125°C
C.3.3.4.3
5
X
Wire Bond Evaluation
2011
6
X
SEM
2018
C.3.3.4.3
C.3.3.3
C.3.3.5
C.3.3.6
10(0) wires or
20(1) wires
See method 2018
Notes:
Subgroups 3, 4, & 5 shall be performed on a sample of 10 die if the wafer lot is from a QPL/QML line. If the die are
from commercial wafer lots, then the sample size shall be 22 die.
TABLE 6 - MICROCIRCUIT ENHANCED ELEMENT EVALUATION
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
12
VECTRON INTERNATIONAL PROPRIETARY
Subgroup
Class
Test
Condition
(accept number)
Mil-PRF38534
Reference
Paragraph
Perform at room
ambient
100%
C.3.3.1
100%
C.3.3.2
10(0) or 22(0)
(Notes 1 & 2)
C.3.3.3
C.3.3.4.2
C.3.3.3
Mil-STD-750
K
Method
Quantity
Element Electrical
A. May perform at wafer level
B. All failures shall be removed
from the lot
1
X
2
X
Element Visual
3
X
Internal Visual
4
X
X
Temperature Cycling
Surge Current
(when applicable)
Constant Acceleration
X
2069, 2070,
2072, 2073
2069, 2070,
2072, 2073, 2074
1051
4066
C
A or B as
specified
Y1 direction
20,000 G /
10,000 G for
Pd ≥ 10W
2006
2001
X
10(0)
22(0)
(See Notes 1 & 2)
Interim Electrical
C.3.3.4.3
1039
1042
1038
X
High Temperature
Reverse Bias (HTRB)
X
Interim Electrical & Delta
X
Burn-In 240 hours
X
Post Burn-In Electrical
X
Steady State Life
1000 hours
X
Final Electrical
1039, 1042
1038
1040
A
B
A
Complete
Within 16 hrs of
HTRB
completion
B
A
B
C.3.3.4.3
1026
1037
1042
1048
5
X
Wire Bond Evaluation
2011
6
X
SEM
2018
2077
C.3.3.4.3
C.3.3.3
C.3.3.5
10(0) wires or
20(1) wires
See method 2018
or 2077 & Note 2
C.3.3.6
TABLE 7: SEMICONDUCTOR ENHANCED ELEMENT EVALUATION
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
13
VECTRON INTERNATIONAL PROPRIETARY
Requirements
Sample Size
Allowable Rejects
Paragraph
Ceramic capacitors (Production lot definition shall be per M55681 or M123 for chips, or M49470 T-level for stacks)
M55681 FRL S or M123
N/A
N/A
N/A
N/A
(chips)
DSCC Dwg COTS (chips)
Ultrasonic scan or CSAM
M123
100%
N/A
Part Type
Test
M123
M123
M123
M123
M123
M123
T-level M49470 (stacked)
Group A
Group B, Subgroups 1 &
2
N/A
N/A
N/A
N/A
General purpose M49470,
Ultrasonic scan or CSAM
M49470 for T-level
100%
N/A
DSCC dwg or COTS
(stacked)
Group A
M49470 for T-level
M49470 for T-level
M49470 for T-level
Group B, Subgroups 2, 4
M49470 for T-level
M49470 for T-level
M49470 for T-level
& 5b
Tantalum Chip Capacitors (Note: Stacking tantalum chips will require a repeat of the entire Group A in M55365 with
minimum Weibull C and surge current option C. Production lot definition shall be per M55365.)
Group A (Weibull C
M55365
minimum with surge
M55365
M55365
M55365
current option C)
Group A (Weibull C
DSCC Dwg, COTS
minimum with surge
M55365
M55365
M55365
current option C)
Group B
M55365
M55365
M55365
Resistor Chips (Note: Gluing one resistor chip on top of another to change a design or save on real estate is not allowable
without extensive design/process verification, long term testing, and hybrid re-qualification. Production lot definition shall be
per M55342).
M55342 FRL R or S
N/A
N/A
N/A
N/A
DSCC Dwg, COTS
Group A
M55342 for T-level
M55342 for T-level
M55342 for T-level
Group B
M55342 for T-level
M55342 for T-level
M55342 for T-level
Magnetics (transformers, inductors, coils) (Note: Stacking magnetics will require a repeat of the thermal cycling plus electrical
measurements as specified in Group A of Mil-STD-981. Design, workmanship and materials/processes shall conform to MilSTD-981 requirements.
Custom
Group A
Mil-STD-981
Mil-STD-981
Mil-STD-981
Group B
Mil-STD-981
Mil-STD-981
Mil-STD-981
TABLE 8: PASSIVE COMPONENT ENHANCED ELEMENT EVALUATION
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
14
VECTRON INTERNATIONAL PROPRIETARY
FIGURE 1
Differential Output Waveform
FIGURE 2
Model 5319 Package Outline
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
15
VECTRON INTERNATIONAL PROPRIETARY
FIGURE 3
Model 5321 Package Outline
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
16
VECTRON INTERNATIONAL PROPRIETARY
DOCUMENT CHANGE RECORD
Revision
-
Change
Preliminary Release
SIZE
CODE IDENT NO.
A
00136
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
N/A
DOC204898
A
17
VECTRON INTERNATIONAL PROPRIETARY