1404/1420 - Vectron International

REV
-
DESCRIPTION
NIR-52400 Preliminary Release
DATE
2/6/2014
PREP
APPD
VECTRON INTERNATIONAL
MOUNT HOLLY SPRINGS, PA 17065
DATE
PREPARED BY
Oscillator Specification, Hybrid Clock
QUALITY
Hi-Rel Standard, High Frequency CMOS
ENGINEERING
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1.
SCOPE
1.1
General. This specification defines the design, assembly and functional evaluation of high
reliability, hybrid clock oscillators produced by Vectron International. Devices delivered to
this specification represent the standardized Parts, Materials and Processes (PMP) Program
developed, implemented and certified for advanced applications and extended environments.
1.2
Applications Overview. The designs represented by these products were primarily developed
for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options
imbedded within DOC204900 bridge the gap between Space and COTS hardware by providing
custom hardware with measures of mechanical, assembly and reliability assurance needed for
Military or Ruggedized COTS environments.
2.
APPLICABLE DOCUMENTS
2.1
Specifications and Standards. The following specifications and standards form a part of this
document to the extent specified herein. The issue currently in effect on the date of quotation
will be the product baseline, unless otherwise specified. In the event of conflict between the
texts of any references cited herein, the text of this document shall take precedence.
Military
MIL-PRF-55310
MIL-PRF-38534
Standards
MIL-STD-202
MIL-STD-883
MIL-STD-1686
Other
DOC204951
QSP-90100
VL-65339
DOC203982
Oscillators, Crystal Controlled, General Specification For
Hybrid Microcircuits, General Specification For
Test Method Standard, Electronic and Electrical Component Parts
Test Methods and Procedures for Microelectronics
Electrostatic Discharge Control Program for Protection of Electrical and
Electronic Parts, Assemblies and Equipment
Test Specification, High Frequency CMOS XO, Hi-Rel Standard
Quality Systems Manual, Vectron International
Identification Common Documents, Materials and Processes, Hi-Rel XO
DPA Specification
3.
GENERAL REQUIREMENTS
3.1
Classification. All devices delivered to this specification are of hybrid technology conforming
to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent
specification, options are imbedded within it to also produce Class B, Engineering Model and
Ruggedized COTS devices. Devices carry a Class 2 ESDS classification.
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3.2
Item Identification. Unique model number series are utilized to identify device package
configurations as listed in Table 1.
3.3
Absolute Maximum Ratings.
a. Supply Voltage Range (VCC):
b. Storage Temperature Range (TSTG):
c. Junction Temperature (TJ):
d. Lead Temperature (soldering, 10 seconds):
e. Output Source/Sink Current:
-0.5Vdc to +7.0Vdc
-65°C to +125°C
+150°C
+300°C
±24 mA
3.4
Design, Parts, Materials and Processes, Assembly, Inspection and Test.
3.4.1
Design. The ruggedized designs implemented for these devices are proven in military and
space applications under extreme environments. Designs utilize 4-point crystal mounting in
compliment with Established Reliability (MIL-ER) componentry. When specified, radiation
lot acceptance testing up to 100krad(Si) (RHA level R) can be included without altering the
device’s internal topography.
3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting
passive chip component values to offset component tolerances, there will not be fundamental
changes to the design or assembly or parts, materials and processes after first product delivery
of that item without written approval from the procuring activity.
3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MILPRF-55310. These designs have also passed extended dynamic levels of at least:
Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)
Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms)
Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)
3.4.2
Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high
reliability devices produced to this specification.
a. Gold metallization of package elements without a barrier metal.
b. Zinc chromate as a finish.
c. Cadmium, zinc, or pure tin external or internal to the device.
d. Plastic encapsulated semiconductor devices.
e. Ultrasonically cleaned electronic parts.
f. Heterojunction Bipolar Transistor (HBT) technology.
g. ‘getter’ materials
3.4.3
Assembly. Manufacturing utilizes standardized procedures, processes and verification
methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.
MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part
numbers to further verify lot pedigree. Traceability of all components and production lots are
in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part
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of the deliverable data package. Devices are handled in accordance with MIL-STD-1686 for
Class 1 devices.
3.4.4
Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to
this document. Inspection conditions and standards are documented in accordance with the
Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100.
3.4.5
Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to
eliminate costs associated with the development/maintenance of device-specific documentation
packages while maintaining performance integrity.
3.4.6
Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.
3.4.7
Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the
same robust designs found in the other device pedigrees. They do not include the provisions of
traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1.
4.
DETAIL REQUIREMENTS
4.1
Components
4.1.1
Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the
devices. The optional use of Premium Q swept quartz can, because of its processing to remove
impurities, be specified for better frequency aging characteristics. In accordance with MILPRF-55310, the manufacturer has a documented crystal element evaluation program.
4.1.2
Passive Components. Established Reliability (ER) failure level R minimum passive
components are procured from QPL suppliers. Lot evaluations are in accordance with MILPRF-55310 or Enhanced Element Evaluation as specified in Table 7.
4.1.3
Class S Active Devices. Devices are assembled with a bipolar semiconductor and an ACMOS
chip used to provide the ACMOS output. The bipolar semiconductor is procured from wafer
lots that have passed MIL-PRF-55310 Lot Acceptance Tests for Class S devices. The ACMOS
microcircuit die was sourced from a wafer lot also used to manufacture an equivalent Standard
Microcircuit Drawing 5962R87549, Class V (MIL-PRF-38535) qualified device. Although
radiation testing is not performed at the oscillator level, active devices are acceptable for use in
environments of up to 100 krads total dose by analysis, design or certification of the individual
components. In addition, the bipolar semiconductor is considered insensitive to Single Event
Effects. The microcircuit was certified to 5962R8754903VCA as part of the Class V
qualification.
4.1.3.1 Class B Active Devices. Active devices for design Pedigree letters “B” and “C” are procured
from wafer lots that have passed MIL-PRF-55310 element evaluations for Class B devices, at a
minimum.
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4.1.4
Packages. Packages are procured that meet the construction, lead materials and finishes as
specified in MIL-PRF-55310. Package lots are upscreened in accordance with the
requirements of MIL-PRF-38534 as applicable.
4.1.5
Traceability. Class S active device lots are homogenous and traceable to the manufacturer’s
individual wafer. Swept Quartz Crystals are traceable to the quartz bar and the processing
details of the autoclave lot, as applicable. All other elements and materials are traceable to
their manufacturer and incoming inspection lots.
4.1.6
Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, semiconductors
and passive elements with Enhanced Element Evaluation as listed in Table 6 and 7 shall be
implemented. Since the microcircuit used is from a lot that has been qualified to Standard
Microcircuit Drawing 5962-87549, Class V (MIL-PRF-38535), additional element evaluation
is not performed.
4.2
Mechanical.
4.2.1
Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a
corresponding package style. Mechanical Outline information of each package style is found
in the referenced Figure.
4.2.2
Thermal Characteristics. The worst case thermal characteristics of each package style are
found in Table 4.
4.3
Electrical.
4.3.1
Input Power. Devices are designed for standard +3.3 volt dc operation, ±10%. Current is
measured, no load, at maximum rated operating voltage.
4.3.2
Temperature Range. Operating range is -55°C to +125°C.
4.3.3
Frequency Tolerance. Initial accuracy at +23°C is ±15 ppm maximum. FrequencyTemperature Stability is ±50 ppm maximum from +23°C reference. Frequency-Voltage
Tolerance is ±4 ppm maximum.
4.3.4
Frequency Aging. Aging limits, and when tested in accordance with MIL-PRF-55310 Group B
inspection, shall not exceed ±1.5 ppm the first 30 days, ±5 ppm Year 1 and ±2 ppm per year
thereafter.
4.3.4.1 Frequency Aging Duration Option. By customer request, the Aging test may be terminated
after 15 days if the measured aging rate is less than half of the specified aging rate. This is a
common method of expediting 30-Day Aging without incurring risk to the hardware and used
quite successfully for numerous customers. It is based on the ‘least squares fit’ determinations
of MIL-PRF-55310 paragraph 4.8.35. The ‘half the time/half the spec’ limit is generally
SIZE
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conservative as roughly 2/3 of a unit’s Aging deviation occurs within that period of time.
Vectron’s automated aging systems take about 6 data points per day, so a lot of data is
available to do very accurate projections, much more data than what is required by MIL-PRF55310. The delivered data would include the Aging plots projected to 30 days. If the units
would not perform within that limit then they would continue to full 30 Day term. Please
advise by purchase order text if this may be an acceptable option to exercise as it assists in
Production Test planning.
4.3.5
Operating Characteristics. Symmetrical square wave limits are dependent on the device
frequency and are in accordance with Tables 2 and 2A. Waveform measurement points and
logic limits are in accordance with MIL-PRF-55310. Start-up time is 10.0 msec. maximum.
4.3.6
Output Load. ACMOS (100MHz to 125MHz = 10kΩ, 15pF and >125MHz to 160MHz =
10KΩ, 5pF) Test load configurations are in accordance with MIL-PRF-55310.
5.
QUALITY ASSURANCE PROVISIONS AND VERIFICATION
5.1
Verification and Test. Device lots shall be tested prior to delivery in accordance with the
applicable Screening Option letter as stated by the 15th character of the part number. Table 5
tests are conducted in the order shown and annotated on the appropriate process travelers and
data sheets of the governing test procedure. For devices that require Screening Options that
include MIL-PRF-55310 Group A testing, the Post-Burn-In Electrical Test and the Group A
Electrical Test are combined into one operation.
5.1.1
Screening Options. The Screening Options, by letter, are summarized as:
A
Modified MIL-PRF-38534 Class K
B
Modified MIL-PRF-55310 Class B Screening & Group A Quality Conformance
Inspection (QCI)
C
Modified MIL-PRF-55310 Class S Screening & Group A QCI
D
Modified MIL-PRF-38534 Class K with Burn-in Delta Aging
E
Modified MIL-PRF-55310 Class B Screening, Groups A & B QCI
F
Modified MIL-PRF-55310 Class S Screening, Groups A & B QCI
G
Modified MIL-PRF-55310 Class B Screening & Post Burn-in Nominal
Electricals
X
Engineering Model (EM)
5.2
Optional Design, Test and Data Parameters. The following is a list of design, assembly,
inspection and test options that can be selected or added by purchase order request.
a. Design Pedigree (choose one as the 5th character in the part number):
(E) Enhanced Element Evaluation, 100krad Class S die, Premium Q Swept Quartz
(R) Hi-Rel design w/ 100krad Class S die, Premium Q Swept Quartz
(V) Hi-Rel design w/ 100krad Class S die, Cultured Quartz
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(X) Hi-Rel design w/ Cultured Quartz, Class S die
(B) Hi-Rel design w/ Swept Quartz, Class B die
(C) Hi-Rel design w/ Cultured Quartz, Class B die
(D) Hi-Rel design w/ Cultured Quartz and commercial grade components
b. Input Voltage, (A) for 5.0V, (B) for 3.3V as the 14th character
c. Frequency-Temperature Slew Test
d. Radiographic Inspection
e. Group C Inspection: MIL-PRF-55310 (requires 8 pc. sample)
f. Group C Inspection: MIL-PRF-38534 (requires 8 pc. sample – 5 pc. Life, 3 pc. RGA)
g. Internal Water-Vapor Content (RGA) samples and test performance
h. MTBF Reliability Calculations
i. Worst Case/Derating Analysis: MIL-HDBK-1547 with Tj Max = +105°C;
Derated Maximum Operating Temp = Tj Max - ∆Tj
j. Deliverable Process Identification Documentation (PID)
k. Customer Source Inspection (pre-cap / final)
l. Destruct Physical Analysis (DPA): MIL-STD-1580 with exceptions as specified in
Vectron DOC203982.
5.3
Test Conditions. Unless otherwise stated herein, inspections are performed in accordance with
those specified in MIL-PRF-55310 and MIL-PRF-38534, in that order. Process travelers
identify the applicable methods, conditions and procedures to be used. Examples of electrical
test procedures that correspond to MIL-PRF-55310 requirements are shown in Table 3.
5.4
Special Tests and Descriptions.
5.4.1
Frequency-Temperature Slew. Frequency-Temperature Slew Test has been developed as an
indicator of higher than normal internal water vapor content. The incremental temperature
sweep from +125°C to -55°C and back to +125°C records output frequency fluctuations
emulating the mass loading of moisture deposited on the crystal blank surface. Though not
replacing a customer’s internal water-vapor content (RGA) requirement, confidence is
increased without destructively testing otherwise good devices.
5.4.2
Burn-in Delta Frequency Aging (in Option D). The frequency measurement for burn-in delta
measurements is performed at the crystal’s upper turning point temperature where its effects on
repeatable frequency accuracy are maximized. Dependent on the crystal specified, this
temperature is typically between +65°C and +85°C, ±0.2°C.
5.5
Deliverable Data. The manufacturer supplies the following data, as a minimum, with each lot
of devices:
a. Completed assembly and screening lot travelers, including rework history.
b. Electrical test variables data, identified by unique serial number.
c. Frequency-Temperature Slew plots, Radiographic films, Group C data and RGA data as
required by purchase order.
5.6
Discrepant Material. All MRB authority resides with the procuring activity.
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5.7
Failure Analysis. Any catastrophic failure (no clocking, no current) at Post Burn-In or after
will be evaluated for root cause. The customer will be notified after occurrence and upon
completion of the evaluation.
6.
PREPARATION FOR DELIVERY
6.1
Packaging. Devices will be packaged in a manner that prevents handling and transit damage
during shipping. Devices will be handled in accordance with MIL-STD-1686 for Class 1
devices.
7.
ORDERING INFORMATION
7.1
Ordering Part Number. The ordering part number is made up of an alphanumeric series
of 15 characters. Design-affected product options, identified by the parenthetic letter on
the Optional Parameters list (¶ 5.2a and b), are included within the device part number.
The Part Number breakdown is described as:
1404R 160M0000 B F
Model # (Table 1)
Screening Option
per Table 5, 5.1.1
Design Pedigree
E = Enhanced Element Evaluation,
100krad Class S die, Swept Quartz
Input Voltage
B= 3.3V
R = 100krad Class S die, Swept
Quartz
V = 100krad Class S die, Non-Swept
Quartz
Frequency
X = Class S die, Non-Swept Quartz
B = Class B die, Swept Quartz
C = Class B die, Non-Swept Quartz
D = Ruggedized COTS: Commercial
Grade Components, Non-Swept
Quartz
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7.1.1
Model Number. The device model number is the four (4) digit number assigned to a
corresponding package and output combination per Table 1.
7.1.2
Design Pedigree. Class S variants correspond to either letter “E”, “R”, “V” or “X” and are
described in paragraph 5.2a. Class B variants correspond to either letter “B” or “C” and are
described in paragraph 5.2a. Ruggedized COTS, using commercial grade components,
corresponds to letter “D”.
7.1.2.1 Input Voltage. Voltage is the 14th character, letters “A” representing 5.0V and “B” for 3.3V.
7.1.3
Output Frequency. The nominal output frequency is expressed in the format as specified in
MIL-PRF-55310 utilizing eight (8) characters.
7.1.4
Screening Options. The 15th character is the Screening Option (letter A thru G or X) selected
from Table 5.
7.2
Optional Design, Test and Data Parameters. Test and documentation requirements above that
of the standard high reliability model shall be specified by separate purchase order line items
(as listed in ¶ 5.2c thru k).
HI-REL
STANDARD
MODEL #
1404
1420
PACKAGE
OUTPUT
20 Lead Flatpack
20 Lead Flatpack
ACMOS
ACMOS
PIN I/O 1/
Vcc
Out Gnd/Case
13, 20
13, 20
11
11
10
10
MECHANICAL
OUTLINE
FIGURE 1
FIGURE 2
1/. All unassigned pins have no internal connections or ties.
TABLE 1 - Item Identification and Package Outline
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Frequency Range @ 3.3V Operation: 100 MHz to 160.0MHz
Temperature Range: -55°C to +125°C
Frequency Tolerance, Initial Accuracy @ +23°C: ±15 ppm max.
Frequency-Temperature Stability from +23°C ref.: ±50 ppm max.
Frequency-Voltage Tolerance: ±4 ppm max. (Vcc ±10%)
Frequency Aging: ±1.5 ppm max. 1st 30 days, ±5 ppm max. Year 1, ±2 ppm max. Year 2+
Start-up Time: 10.0 ms max.
Frequency
Current (mA)
Rise / Fall
Duty Cycle
Load
Range
(max. no load)
Times
(%)
(MHz)
3.46V
(ns max.)
100 – 125
20
3
40 to 60
10KΩ || 15 pF
>125-160
30
2
40 to 60
10KΩ || 5 pF
1/. Waveform measurement points and logic limits are in accordance with MIL-PRF-55310.
TABLE 2 - Electrical Performance Characteristics
REQUIREMENTS AND
CONDITIONS
OPERATION LISTING
VECTRON
TEST
PROCEDURE
@ all Electrical tests
Input Current (no load)
Initial Accuracy @ Ref. Temp.
Output Logic Voltage Levels
Rise and Fall Times
Duty Cycle
MIL-PRF-55310, Para 4.8.5.1
MIL-PRF-55310, Para 4.8.6
MIL-PRF-55310, Para 4.8.21.3
MIL-PRF-55310, Para 4.8.22
MIL-PRF-55310, Para 4.8.23
GR-51681
GR-51596
GR-51597
GR-51599
GR-51601
@ Post Burn-In Electrical only
Overvoltage Survivability
Initial Freq. – Temp. Accuracy
Freq. – Voltage Tolerance
Start-up Time (fast/slow start)
MIL-PRF-55310, Para 4.8.4
MIL-PRF-55310, Para 4.8.10.1
MIL-PRF-55310, Para 4.8.14
MIL-PRF-55310, Para 4.8.29
GR-37269
GR-51602
GR-51602
GR-61352
TABLE 3 - Electrical Test Parameters
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Model #
Typical Thermal
∆ Junction Temp.
Typical Weight
Resistance
Tj (°C @ max. Icc)
(Grams)
Junction to Case
θjc (°C / W)
1404/1420
165
4.5
3.0
Note. These oscillators contain multiple active devices. This calculation shows the
worst case θjc and temperature rise of those devices.
TABLE 4 - Typical Thermal Characteristics and Weight
Frequency
1404/1420
1 sigma
(ps)
5
pk-pk
(ps)
45
TABLE 4a – Typical Jitter Performance
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OPN.
NO.
OPERATION LISTING
REQUIREMENTS AND CONDITIONS
MIL Class Similarity
SCREENING
1
2
Non-Destruct Bond Pull
Internal Visual
3/
3
Stabilization (Vacuum) Bake
4
Thermal Shock
5
Temperature Cycle
6
Constant Acceleration
7
Particle Impact Noise Detection
8
Electrical Testing, Pre Burn-In
9
Freq-Temp Slew Test
10
1st Burn-In
11
Electrical Testing, Intermediate
12
2nd Burn-In
13
14
Electrical Testing, Post Burn-In
(Group A)
Seal: Fine Leak
15
16
Seal: Gross Leak
Radiographic Inspection
17
18
19
Solderability
External Visual & Mechanical
Aging, 30 Day
(M55310 Group B)
MIL-STD-883, Meth 2023
MIL-STD-883, Meth 2017 Class K,
Meth 2032 Class K
MIL-STD-883, Meth 1008, Cond C,
150°C, 48 hours min.
MIL-STD-883, Meth 1011, Cond A
Option
A
K
Option
B
B-
Option
C
S-
Option
E
B
Option
F
S
Option
G
Option
X
EM
100%
100%
100%
100%
100%
100%
100%
Completed During Assembly
NR
NR
X
NR
X
NR
NR
MIL-STD-883, Meth 1010, Cond. B,
10 cycles min.
MIL-STD-883, Meth 2001, Cond A,
Y1 plane only, 5000 g’s
MIL-STD-883, Meth 2020, Cond B
X
X
X
X
X
X
NR
X
X
X
X
X
X
NR
X
X
X
X
X
NR
X
Perform tests in Table 3. Nominal Vcc, nominal
temperature
Operating temp. range, frequency plotted at 1.0°C
steps
MIL-STD-883, Meth 1015, Condition B
X
X
X
X
X
X
X
AR
AR
AR
AR
AR
NR
NR
X
160 hrs.
X
X
160 hrs.
NR
X
240 hrs.
NR
X
160 hrs.
NR
X
240 hrs.
NR
X
160 hrs.
NR
NR
NR
X
160 hrs.
X
NR
NR
NR
NR
NR
NR
X
X
X
X
NR
X
X
X
X
X
X
nom. Vcc
X
X
X
X
AR
X
AR
X
AR
X
X
X
NR
X
NR
1/
X 2/
NR
1/
X 2/
NR
1/
X 2/
NR
1/
X 2/
13 pcs.
1/
X 2/
X
1/
X 2/
NR
NR
X 2/
NR
Perform tests in Table 3. Nominal Vcc, nominal
temperature
MIL-STD-883, Meth 1015, Condition B
Perform tests in Table 3. Nominal Vcc & extremes,
nominal temperature & extremes
MIL-STD-883, Meth 1014, Cond A2
5 x 10-8 atm cc/sec max
MIL-STD-202, Meth 112, Cond D
MIL-STD-883, Meth 2012
MIL-STD-883, Meth 2003
MIL-STD-883, Meth 2009
MIL-PRF-55310, para. 4.8.35.1
X
LEGEND: X = Required, NR = Not Required, AR = As Required
TABLE 5 - Test Matrix
1/ Performed at package LAT. Include LAT data sheet
2/ When specified, RGA samples will be removed from the lot after completion of this operation. Use of screening failures requires customer concurrence.
3/. Not performed on Option B, E, G and X units.
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Subgroup
Class
Test
Condition
(accept number)
Mil-PRF38534
Reference
Paragraph
Perform at room
ambient
100%
C.3.3.1
100%
C.3.3.2
10(0) or 22(0)
(Notes 1 & 2)
C.3.3.3
C.3.3.4.2
C.3.3.3
Mil-STD-750
K
Method
Quantity
Element Electrical
A. May perform at wafer level
B. All failures shall be removed
from the lot
1
X
2
X
Element Visual
3
X
Internal Visual
4
X
X
Temperature Cycling
Surge Current
(when applicable)
Constant Acceleration
X
2069, 2070,
2072, 2073
2069, 2070,
2072, 2073, 2074
1051
4066
C
A or B as
specified
Y1 direction
20,000 G /
10,000 G for
Pd ≥ 10W
2006
2001
X
10(0)
22(0)
(See Notes 1 & 2)
Interim Electrical
C.3.3.4.3
1039
1042
1038
X
High Temperature
Reverse Bias (HTRB)
X
Interim Electrical & Delta
X
Burn-In 240 hours
X
Post Burn-In Electrical
1039, 1042
1038
1040
A
B
A
Complete
Within 16 hrs of
HTRB
completion
B
A
B
C.3.3.4.3
1026
1037
1042
1048
X
Steady State Life
1000 hours
X
Final Electrical
5
X
Wire Bond Evaluation
2011
6
X
SEM
2018
2077
C.3.3.4.3
C.3.3.3
C.3.3.5
10(0) wires or
20(1) wires
See method 2018
or 2077 & Note 2
C.3.3.6
TABLE 6 - SEMICONDUCTOR ENHANCED ELEMENT EVALUATION
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
DOC204900
-
13
Parts Type
Ceramic Capacitors
M55681 FRL S or
M123 (chips)
Resistors
M55342 FRL R or
S
Inductors
Custom
Test
Requirement
Paragraph
Sample size
Allowable Reject(s)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Group A
Group B
Mil-Std-981
Mil-Std-981
Mil-Std-981
Mil-Std-981
Mil-Std-981
Mil-Std-981
TABLE 7: PASSIVE COMPONENT ENHANCED ELEMENT EVALUATION
FIGURE 1
Model 1404 Package Outline
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
DOC204900
-
14
FIGURE 2
Models 1420 Package Outline
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
DOC204900
-
15
DOCUMENT CHANGE RECORD
Revision
-
Change
Preliminary Release
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
DOC204900
-
16