REV - DESCRIPTION NIR-52400 Preliminary Release DATE 2/6/2014 PREP APPD VECTRON INTERNATIONAL MOUNT HOLLY SPRINGS, PA 17065 DATE PREPARED BY Oscillator Specification, Hybrid Clock QUALITY Hi-Rel Standard, High Frequency CMOS ENGINEERING CODE IDENT NO SIZE 00136 A DWG. NO. UNSPECIFIED TOLERANCES: N/A REV DOC204900 - SHEET 1 0F 23 1. SCOPE 1.1 General. This specification defines the design, assembly and functional evaluation of high reliability, hybrid clock oscillators produced by Vectron International. Devices delivered to this specification represent the standardized Parts, Materials and Processes (PMP) Program developed, implemented and certified for advanced applications and extended environments. 1.2 Applications Overview. The designs represented by these products were primarily developed for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options imbedded within DOC204900 bridge the gap between Space and COTS hardware by providing custom hardware with measures of mechanical, assembly and reliability assurance needed for Military or Ruggedized COTS environments. 2. APPLICABLE DOCUMENTS 2.1 Specifications and Standards. The following specifications and standards form a part of this document to the extent specified herein. The issue currently in effect on the date of quotation will be the product baseline, unless otherwise specified. In the event of conflict between the texts of any references cited herein, the text of this document shall take precedence. Military MIL-PRF-55310 MIL-PRF-38534 Standards MIL-STD-202 MIL-STD-883 MIL-STD-1686 Other DOC204951 QSP-90100 VL-65339 DOC203982 Oscillators, Crystal Controlled, General Specification For Hybrid Microcircuits, General Specification For Test Method Standard, Electronic and Electrical Component Parts Test Methods and Procedures for Microelectronics Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment Test Specification, High Frequency CMOS XO, Hi-Rel Standard Quality Systems Manual, Vectron International Identification Common Documents, Materials and Processes, Hi-Rel XO DPA Specification 3. GENERAL REQUIREMENTS 3.1 Classification. All devices delivered to this specification are of hybrid technology conforming to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent specification, options are imbedded within it to also produce Class B, Engineering Model and Ruggedized COTS devices. Devices carry a Class 2 ESDS classification. SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 2 3.2 Item Identification. Unique model number series are utilized to identify device package configurations as listed in Table 1. 3.3 Absolute Maximum Ratings. a. Supply Voltage Range (VCC): b. Storage Temperature Range (TSTG): c. Junction Temperature (TJ): d. Lead Temperature (soldering, 10 seconds): e. Output Source/Sink Current: -0.5Vdc to +7.0Vdc -65°C to +125°C +150°C +300°C ±24 mA 3.4 Design, Parts, Materials and Processes, Assembly, Inspection and Test. 3.4.1 Design. The ruggedized designs implemented for these devices are proven in military and space applications under extreme environments. Designs utilize 4-point crystal mounting in compliment with Established Reliability (MIL-ER) componentry. When specified, radiation lot acceptance testing up to 100krad(Si) (RHA level R) can be included without altering the device’s internal topography. 3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting passive chip component values to offset component tolerances, there will not be fundamental changes to the design or assembly or parts, materials and processes after first product delivery of that item without written approval from the procuring activity. 3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MILPRF-55310. These designs have also passed extended dynamic levels of at least: Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.) Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms) Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms) 3.4.2 Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high reliability devices produced to this specification. a. Gold metallization of package elements without a barrier metal. b. Zinc chromate as a finish. c. Cadmium, zinc, or pure tin external or internal to the device. d. Plastic encapsulated semiconductor devices. e. Ultrasonically cleaned electronic parts. f. Heterojunction Bipolar Transistor (HBT) technology. g. ‘getter’ materials 3.4.3 Assembly. Manufacturing utilizes standardized procedures, processes and verification methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices. MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part numbers to further verify lot pedigree. Traceability of all components and production lots are in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 3 of the deliverable data package. Devices are handled in accordance with MIL-STD-1686 for Class 1 devices. 3.4.4 Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to this document. Inspection conditions and standards are documented in accordance with the Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100. 3.4.5 Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to eliminate costs associated with the development/maintenance of device-specific documentation packages while maintaining performance integrity. 3.4.6 Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310. 3.4.7 Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the same robust designs found in the other device pedigrees. They do not include the provisions of traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1. 4. DETAIL REQUIREMENTS 4.1 Components 4.1.1 Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the devices. The optional use of Premium Q swept quartz can, because of its processing to remove impurities, be specified for better frequency aging characteristics. In accordance with MILPRF-55310, the manufacturer has a documented crystal element evaluation program. 4.1.2 Passive Components. Established Reliability (ER) failure level R minimum passive components are procured from QPL suppliers. Lot evaluations are in accordance with MILPRF-55310 or Enhanced Element Evaluation as specified in Table 7. 4.1.3 Class S Active Devices. Devices are assembled with a bipolar semiconductor and an ACMOS chip used to provide the ACMOS output. The bipolar semiconductor is procured from wafer lots that have passed MIL-PRF-55310 Lot Acceptance Tests for Class S devices. The ACMOS microcircuit die was sourced from a wafer lot also used to manufacture an equivalent Standard Microcircuit Drawing 5962R87549, Class V (MIL-PRF-38535) qualified device. Although radiation testing is not performed at the oscillator level, active devices are acceptable for use in environments of up to 100 krads total dose by analysis, design or certification of the individual components. In addition, the bipolar semiconductor is considered insensitive to Single Event Effects. The microcircuit was certified to 5962R8754903VCA as part of the Class V qualification. 4.1.3.1 Class B Active Devices. Active devices for design Pedigree letters “B” and “C” are procured from wafer lots that have passed MIL-PRF-55310 element evaluations for Class B devices, at a minimum. SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 4 4.1.4 Packages. Packages are procured that meet the construction, lead materials and finishes as specified in MIL-PRF-55310. Package lots are upscreened in accordance with the requirements of MIL-PRF-38534 as applicable. 4.1.5 Traceability. Class S active device lots are homogenous and traceable to the manufacturer’s individual wafer. Swept Quartz Crystals are traceable to the quartz bar and the processing details of the autoclave lot, as applicable. All other elements and materials are traceable to their manufacturer and incoming inspection lots. 4.1.6 Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, semiconductors and passive elements with Enhanced Element Evaluation as listed in Table 6 and 7 shall be implemented. Since the microcircuit used is from a lot that has been qualified to Standard Microcircuit Drawing 5962-87549, Class V (MIL-PRF-38535), additional element evaluation is not performed. 4.2 Mechanical. 4.2.1 Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a corresponding package style. Mechanical Outline information of each package style is found in the referenced Figure. 4.2.2 Thermal Characteristics. The worst case thermal characteristics of each package style are found in Table 4. 4.3 Electrical. 4.3.1 Input Power. Devices are designed for standard +3.3 volt dc operation, ±10%. Current is measured, no load, at maximum rated operating voltage. 4.3.2 Temperature Range. Operating range is -55°C to +125°C. 4.3.3 Frequency Tolerance. Initial accuracy at +23°C is ±15 ppm maximum. FrequencyTemperature Stability is ±50 ppm maximum from +23°C reference. Frequency-Voltage Tolerance is ±4 ppm maximum. 4.3.4 Frequency Aging. Aging limits, and when tested in accordance with MIL-PRF-55310 Group B inspection, shall not exceed ±1.5 ppm the first 30 days, ±5 ppm Year 1 and ±2 ppm per year thereafter. 4.3.4.1 Frequency Aging Duration Option. By customer request, the Aging test may be terminated after 15 days if the measured aging rate is less than half of the specified aging rate. This is a common method of expediting 30-Day Aging without incurring risk to the hardware and used quite successfully for numerous customers. It is based on the ‘least squares fit’ determinations of MIL-PRF-55310 paragraph 4.8.35. The ‘half the time/half the spec’ limit is generally SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 5 conservative as roughly 2/3 of a unit’s Aging deviation occurs within that period of time. Vectron’s automated aging systems take about 6 data points per day, so a lot of data is available to do very accurate projections, much more data than what is required by MIL-PRF55310. The delivered data would include the Aging plots projected to 30 days. If the units would not perform within that limit then they would continue to full 30 Day term. Please advise by purchase order text if this may be an acceptable option to exercise as it assists in Production Test planning. 4.3.5 Operating Characteristics. Symmetrical square wave limits are dependent on the device frequency and are in accordance with Tables 2 and 2A. Waveform measurement points and logic limits are in accordance with MIL-PRF-55310. Start-up time is 10.0 msec. maximum. 4.3.6 Output Load. ACMOS (100MHz to 125MHz = 10kΩ, 15pF and >125MHz to 160MHz = 10KΩ, 5pF) Test load configurations are in accordance with MIL-PRF-55310. 5. QUALITY ASSURANCE PROVISIONS AND VERIFICATION 5.1 Verification and Test. Device lots shall be tested prior to delivery in accordance with the applicable Screening Option letter as stated by the 15th character of the part number. Table 5 tests are conducted in the order shown and annotated on the appropriate process travelers and data sheets of the governing test procedure. For devices that require Screening Options that include MIL-PRF-55310 Group A testing, the Post-Burn-In Electrical Test and the Group A Electrical Test are combined into one operation. 5.1.1 Screening Options. The Screening Options, by letter, are summarized as: A Modified MIL-PRF-38534 Class K B Modified MIL-PRF-55310 Class B Screening & Group A Quality Conformance Inspection (QCI) C Modified MIL-PRF-55310 Class S Screening & Group A QCI D Modified MIL-PRF-38534 Class K with Burn-in Delta Aging E Modified MIL-PRF-55310 Class B Screening, Groups A & B QCI F Modified MIL-PRF-55310 Class S Screening, Groups A & B QCI G Modified MIL-PRF-55310 Class B Screening & Post Burn-in Nominal Electricals X Engineering Model (EM) 5.2 Optional Design, Test and Data Parameters. The following is a list of design, assembly, inspection and test options that can be selected or added by purchase order request. a. Design Pedigree (choose one as the 5th character in the part number): (E) Enhanced Element Evaluation, 100krad Class S die, Premium Q Swept Quartz (R) Hi-Rel design w/ 100krad Class S die, Premium Q Swept Quartz (V) Hi-Rel design w/ 100krad Class S die, Cultured Quartz SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 6 (X) Hi-Rel design w/ Cultured Quartz, Class S die (B) Hi-Rel design w/ Swept Quartz, Class B die (C) Hi-Rel design w/ Cultured Quartz, Class B die (D) Hi-Rel design w/ Cultured Quartz and commercial grade components b. Input Voltage, (A) for 5.0V, (B) for 3.3V as the 14th character c. Frequency-Temperature Slew Test d. Radiographic Inspection e. Group C Inspection: MIL-PRF-55310 (requires 8 pc. sample) f. Group C Inspection: MIL-PRF-38534 (requires 8 pc. sample – 5 pc. Life, 3 pc. RGA) g. Internal Water-Vapor Content (RGA) samples and test performance h. MTBF Reliability Calculations i. Worst Case/Derating Analysis: MIL-HDBK-1547 with Tj Max = +105°C; Derated Maximum Operating Temp = Tj Max - ∆Tj j. Deliverable Process Identification Documentation (PID) k. Customer Source Inspection (pre-cap / final) l. Destruct Physical Analysis (DPA): MIL-STD-1580 with exceptions as specified in Vectron DOC203982. 5.3 Test Conditions. Unless otherwise stated herein, inspections are performed in accordance with those specified in MIL-PRF-55310 and MIL-PRF-38534, in that order. Process travelers identify the applicable methods, conditions and procedures to be used. Examples of electrical test procedures that correspond to MIL-PRF-55310 requirements are shown in Table 3. 5.4 Special Tests and Descriptions. 5.4.1 Frequency-Temperature Slew. Frequency-Temperature Slew Test has been developed as an indicator of higher than normal internal water vapor content. The incremental temperature sweep from +125°C to -55°C and back to +125°C records output frequency fluctuations emulating the mass loading of moisture deposited on the crystal blank surface. Though not replacing a customer’s internal water-vapor content (RGA) requirement, confidence is increased without destructively testing otherwise good devices. 5.4.2 Burn-in Delta Frequency Aging (in Option D). The frequency measurement for burn-in delta measurements is performed at the crystal’s upper turning point temperature where its effects on repeatable frequency accuracy are maximized. Dependent on the crystal specified, this temperature is typically between +65°C and +85°C, ±0.2°C. 5.5 Deliverable Data. The manufacturer supplies the following data, as a minimum, with each lot of devices: a. Completed assembly and screening lot travelers, including rework history. b. Electrical test variables data, identified by unique serial number. c. Frequency-Temperature Slew plots, Radiographic films, Group C data and RGA data as required by purchase order. 5.6 Discrepant Material. All MRB authority resides with the procuring activity. SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 7 5.7 Failure Analysis. Any catastrophic failure (no clocking, no current) at Post Burn-In or after will be evaluated for root cause. The customer will be notified after occurrence and upon completion of the evaluation. 6. PREPARATION FOR DELIVERY 6.1 Packaging. Devices will be packaged in a manner that prevents handling and transit damage during shipping. Devices will be handled in accordance with MIL-STD-1686 for Class 1 devices. 7. ORDERING INFORMATION 7.1 Ordering Part Number. The ordering part number is made up of an alphanumeric series of 15 characters. Design-affected product options, identified by the parenthetic letter on the Optional Parameters list (¶ 5.2a and b), are included within the device part number. The Part Number breakdown is described as: 1404R 160M0000 B F Model # (Table 1) Screening Option per Table 5, 5.1.1 Design Pedigree E = Enhanced Element Evaluation, 100krad Class S die, Swept Quartz Input Voltage B= 3.3V R = 100krad Class S die, Swept Quartz V = 100krad Class S die, Non-Swept Quartz Frequency X = Class S die, Non-Swept Quartz B = Class B die, Swept Quartz C = Class B die, Non-Swept Quartz D = Ruggedized COTS: Commercial Grade Components, Non-Swept Quartz SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 8 7.1.1 Model Number. The device model number is the four (4) digit number assigned to a corresponding package and output combination per Table 1. 7.1.2 Design Pedigree. Class S variants correspond to either letter “E”, “R”, “V” or “X” and are described in paragraph 5.2a. Class B variants correspond to either letter “B” or “C” and are described in paragraph 5.2a. Ruggedized COTS, using commercial grade components, corresponds to letter “D”. 7.1.2.1 Input Voltage. Voltage is the 14th character, letters “A” representing 5.0V and “B” for 3.3V. 7.1.3 Output Frequency. The nominal output frequency is expressed in the format as specified in MIL-PRF-55310 utilizing eight (8) characters. 7.1.4 Screening Options. The 15th character is the Screening Option (letter A thru G or X) selected from Table 5. 7.2 Optional Design, Test and Data Parameters. Test and documentation requirements above that of the standard high reliability model shall be specified by separate purchase order line items (as listed in ¶ 5.2c thru k). HI-REL STANDARD MODEL # 1404 1420 PACKAGE OUTPUT 20 Lead Flatpack 20 Lead Flatpack ACMOS ACMOS PIN I/O 1/ Vcc Out Gnd/Case 13, 20 13, 20 11 11 10 10 MECHANICAL OUTLINE FIGURE 1 FIGURE 2 1/. All unassigned pins have no internal connections or ties. TABLE 1 - Item Identification and Package Outline SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 9 Frequency Range @ 3.3V Operation: 100 MHz to 160.0MHz Temperature Range: -55°C to +125°C Frequency Tolerance, Initial Accuracy @ +23°C: ±15 ppm max. Frequency-Temperature Stability from +23°C ref.: ±50 ppm max. Frequency-Voltage Tolerance: ±4 ppm max. (Vcc ±10%) Frequency Aging: ±1.5 ppm max. 1st 30 days, ±5 ppm max. Year 1, ±2 ppm max. Year 2+ Start-up Time: 10.0 ms max. Frequency Current (mA) Rise / Fall Duty Cycle Load Range (max. no load) Times (%) (MHz) 3.46V (ns max.) 100 – 125 20 3 40 to 60 10KΩ || 15 pF >125-160 30 2 40 to 60 10KΩ || 5 pF 1/. Waveform measurement points and logic limits are in accordance with MIL-PRF-55310. TABLE 2 - Electrical Performance Characteristics REQUIREMENTS AND CONDITIONS OPERATION LISTING VECTRON TEST PROCEDURE @ all Electrical tests Input Current (no load) Initial Accuracy @ Ref. Temp. Output Logic Voltage Levels Rise and Fall Times Duty Cycle MIL-PRF-55310, Para 4.8.5.1 MIL-PRF-55310, Para 4.8.6 MIL-PRF-55310, Para 4.8.21.3 MIL-PRF-55310, Para 4.8.22 MIL-PRF-55310, Para 4.8.23 GR-51681 GR-51596 GR-51597 GR-51599 GR-51601 @ Post Burn-In Electrical only Overvoltage Survivability Initial Freq. – Temp. Accuracy Freq. – Voltage Tolerance Start-up Time (fast/slow start) MIL-PRF-55310, Para 4.8.4 MIL-PRF-55310, Para 4.8.10.1 MIL-PRF-55310, Para 4.8.14 MIL-PRF-55310, Para 4.8.29 GR-37269 GR-51602 GR-51602 GR-61352 TABLE 3 - Electrical Test Parameters SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 10 Model # Typical Thermal ∆ Junction Temp. Typical Weight Resistance Tj (°C @ max. Icc) (Grams) Junction to Case θjc (°C / W) 1404/1420 165 4.5 3.0 Note. These oscillators contain multiple active devices. This calculation shows the worst case θjc and temperature rise of those devices. TABLE 4 - Typical Thermal Characteristics and Weight Frequency 1404/1420 1 sigma (ps) 5 pk-pk (ps) 45 TABLE 4a – Typical Jitter Performance SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 11 OPN. NO. OPERATION LISTING REQUIREMENTS AND CONDITIONS MIL Class Similarity SCREENING 1 2 Non-Destruct Bond Pull Internal Visual 3/ 3 Stabilization (Vacuum) Bake 4 Thermal Shock 5 Temperature Cycle 6 Constant Acceleration 7 Particle Impact Noise Detection 8 Electrical Testing, Pre Burn-In 9 Freq-Temp Slew Test 10 1st Burn-In 11 Electrical Testing, Intermediate 12 2nd Burn-In 13 14 Electrical Testing, Post Burn-In (Group A) Seal: Fine Leak 15 16 Seal: Gross Leak Radiographic Inspection 17 18 19 Solderability External Visual & Mechanical Aging, 30 Day (M55310 Group B) MIL-STD-883, Meth 2023 MIL-STD-883, Meth 2017 Class K, Meth 2032 Class K MIL-STD-883, Meth 1008, Cond C, 150°C, 48 hours min. MIL-STD-883, Meth 1011, Cond A Option A K Option B B- Option C S- Option E B Option F S Option G Option X EM 100% 100% 100% 100% 100% 100% 100% Completed During Assembly NR NR X NR X NR NR MIL-STD-883, Meth 1010, Cond. B, 10 cycles min. MIL-STD-883, Meth 2001, Cond A, Y1 plane only, 5000 g’s MIL-STD-883, Meth 2020, Cond B X X X X X X NR X X X X X X NR X X X X X NR X Perform tests in Table 3. Nominal Vcc, nominal temperature Operating temp. range, frequency plotted at 1.0°C steps MIL-STD-883, Meth 1015, Condition B X X X X X X X AR AR AR AR AR NR NR X 160 hrs. X X 160 hrs. NR X 240 hrs. NR X 160 hrs. NR X 240 hrs. NR X 160 hrs. NR NR NR X 160 hrs. X NR NR NR NR NR NR X X X X NR X X X X X X nom. Vcc X X X X AR X AR X AR X X X NR X NR 1/ X 2/ NR 1/ X 2/ NR 1/ X 2/ NR 1/ X 2/ 13 pcs. 1/ X 2/ X 1/ X 2/ NR NR X 2/ NR Perform tests in Table 3. Nominal Vcc, nominal temperature MIL-STD-883, Meth 1015, Condition B Perform tests in Table 3. Nominal Vcc & extremes, nominal temperature & extremes MIL-STD-883, Meth 1014, Cond A2 5 x 10-8 atm cc/sec max MIL-STD-202, Meth 112, Cond D MIL-STD-883, Meth 2012 MIL-STD-883, Meth 2003 MIL-STD-883, Meth 2009 MIL-PRF-55310, para. 4.8.35.1 X LEGEND: X = Required, NR = Not Required, AR = As Required TABLE 5 - Test Matrix 1/ Performed at package LAT. Include LAT data sheet 2/ When specified, RGA samples will be removed from the lot after completion of this operation. Use of screening failures requires customer concurrence. 3/. Not performed on Option B, E, G and X units. SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 12 Subgroup Class Test Condition (accept number) Mil-PRF38534 Reference Paragraph Perform at room ambient 100% C.3.3.1 100% C.3.3.2 10(0) or 22(0) (Notes 1 & 2) C.3.3.3 C.3.3.4.2 C.3.3.3 Mil-STD-750 K Method Quantity Element Electrical A. May perform at wafer level B. All failures shall be removed from the lot 1 X 2 X Element Visual 3 X Internal Visual 4 X X Temperature Cycling Surge Current (when applicable) Constant Acceleration X 2069, 2070, 2072, 2073 2069, 2070, 2072, 2073, 2074 1051 4066 C A or B as specified Y1 direction 20,000 G / 10,000 G for Pd ≥ 10W 2006 2001 X 10(0) 22(0) (See Notes 1 & 2) Interim Electrical C.3.3.4.3 1039 1042 1038 X High Temperature Reverse Bias (HTRB) X Interim Electrical & Delta X Burn-In 240 hours X Post Burn-In Electrical 1039, 1042 1038 1040 A B A Complete Within 16 hrs of HTRB completion B A B C.3.3.4.3 1026 1037 1042 1048 X Steady State Life 1000 hours X Final Electrical 5 X Wire Bond Evaluation 2011 6 X SEM 2018 2077 C.3.3.4.3 C.3.3.3 C.3.3.5 10(0) wires or 20(1) wires See method 2018 or 2077 & Note 2 C.3.3.6 TABLE 6 - SEMICONDUCTOR ENHANCED ELEMENT EVALUATION SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 13 Parts Type Ceramic Capacitors M55681 FRL S or M123 (chips) Resistors M55342 FRL R or S Inductors Custom Test Requirement Paragraph Sample size Allowable Reject(s) N/A N/A N/A N/A N/A N/A N/A N/A Group A Group B Mil-Std-981 Mil-Std-981 Mil-Std-981 Mil-Std-981 Mil-Std-981 Mil-Std-981 TABLE 7: PASSIVE COMPONENT ENHANCED ELEMENT EVALUATION FIGURE 1 Model 1404 Package Outline SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 14 FIGURE 2 Models 1420 Package Outline SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 15 DOCUMENT CHANGE RECORD Revision - Change Preliminary Release SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET A 00136 N/A DOC204900 - 16