SPECIFICATION SPEC. No. C-LowT-a D A T E : 2013 Sep. To Non-Controlled Copy Upon the acceptance of this spec. previous spec. (C2004-816-031) shall be abolished. CUSTOMER’S PRODUCT NAME TDK PRODUCT NAME MULTILAYER CERAMIC CHIP CAPACITORS CGB Series / Commercial Grade L ow P r o f il e Please return this specification to TDK representatives. If orders are placed without returned specification, please allow us to judge that specification is accepted by your side. RECEIPT CONFIRMATION DATE: TDK Corporation Sales Electronic Components Sales & Marketing Group APPROVED Person in charge YEAR MONTH DAY TDK-EPC Corporation Engineering Ceramic Capacitors Business Group APPROVED CHECKED Person in charge 1. SCOPE This specification is applicable to chip type multilayer ceramic capacitors with a priority over the other relevant specifications. Production places defined in this specification shall be TDK-EPC Corporation Japan, TDK (Suzhou) Co., Ltd and TDK Components U.S.A. Inc. EXPLANATORY NOTE: This specification warrants the quality of the ceramic chip capacitors. The chips should be evaluated or confirmed a state of mounted on your product. If the use of the chips goes beyond the bounds of the specification, we can not afford to guarantee. 2. CODE CONSTRUCTION (Example) Catalog Number : CGB2 (1) (Web) A (2) 3 (3) X5R (4) 0J (5) 105 (6) K (7) 033 (8) B (9) Item Description : CGB2 (1) A (2) 3 (3) X5R (4) 0J (5) 105 (6) K (7) T (11) xxxx (12) (1) Type Terminal electrode B L G W B T Internal electrode Ceramic dielectric Please refer to product list for the dimension of each product. (2) Thickness (3) Life Test Voltage Condition (Max. operating Temp./1000h) —1— Symbol Thickness A 0.33 mm max. B 0.55 mm max. C 0.65 mm max. T 0.22 mm max. Symbol Condition 1 1 x Rated voltage 2 2 x Rated voltage 3 1.5 x Rated voltage B (10) (4) Temperature Characteristics (Details are shown in table 1 No.6 at page 4) (5) Rated Voltage Symbol Rated Voltage 1E DC 25 V 1C DC 16 V 1A DC 10 V 0J DC 6.3 V 0G DC 4 V (6) Rated Capacitance Stated in three digits and in units of pico farads (pF). The first and Second digits identify the first and second significant figures of the capacitance, the third digit identifies the multiplier. R is designated for a decimal point. Example 105 → 1,000,000pF (1μF) (7) Capacitance tolerance Symbol Tolerance K ± 10 % M ± 20 % Symbol Packaging B Bulk T Taping (8) Thickness code (Only Catalog Number) (9) Package code (Only Catalog Number) (10) Special code (Only Catalog Number) (11) Packaging (Only Item Description) (Bulk is not applicable for CGB2 type) (12) Internal code (Only Item Description) —2— 3. RATED CAPACITANCE AND CAPACITANCE TOLERANCE 3.1 Standard combination of rated capacitance and tolerances Temperature Characteristics Capacitance tolerance Rated capacitance J B X5R X6S X7R X7S K (± 10 %) M (± 20 %) E – 6 series 3.2 Capacitance Step in E series E series E- 6 Capacitance Step 1.0 1.5 2.2 3.3 4.7 6.8 4. OPERATING TEMPERATURE RANGE T.C. Min. operating Temperature Max. operating Temperature Reference Temperature JB -25°C 85°C 20°C X5R -55°C 85°C 25°C X6S -55°C 105°C 25°C X7R/X7S -55°C 125°C 25°C 5. STORING CONDITION AND TERM 5 to 40°C at 20 to 70%RH 6 months Max. 6. INDUSTRIAL WASTE DISPOSAL Dispose this product as industrial waste in accordance with the Industrial Waste Law. —3— 7. PERFORMANCE table 1 No. Item Performance Test or inspection method 1 External Appearance No defects which may affect performance. Inspect with magnifying glass (3×). 2 Insulation Resistance 10,000MΩ or 500MΩ·μF min. (As for the capacitors of rated voltage 16,10,6.3 and 4V DC, 10,000 MΩ or 100MΩ·μF min.,) whichever smaller. Apply rated voltage for 60s. 3 Voltage Proof Withstand test voltage without insulation breakdown or other damage. 2.5 times of rated voltage Above DC voltage shall be applied for 1 to 5s. Charge / discharge current shall not exceed 50mA. 4 Capacitance Within the specified tolerance. Rated Voltage Measuring frequency Measuring voltage 1E,1C,1A 1kHz±10% 1.0±0.2Vrms. 0J, 0G 1kHz±10% 0.5±0.2Vrms. 1.0±0.2Vrms. For information which product has which measuring voltage, please contact with our sales representative. 5 6 Dissipation Factor Temperature Characteristics of Capacitance T.C. D. F. J B X5R X6S X7R X7S 0.10 max. 0.075 max. 0.05 max. Capacitance Change (%) No voltage applied J B : ± 10 X5R : ± 15 X7R X6S : ± 22 X7S —4— See No.4 in this table for measuring condition. For information which product has which Dissipation Factor, please contact with our sales representative. Capacitance shall be measured by the steps shown in the following table after thermal equilibrium is obtained for each step. ∆C be calculated ref. STEP3 reading Step Temperature(°C) 1 Reference temp.±2 2 Min. operating temp±2 3 Reference temp.±2 4 Max. operating temp±2 (continued) No. 7 Item Robustness of Terminations Performance No sign of termination coming off, breakage of ceramic, or other abnormal signs. Test or inspection method Reflow solder the capacitors on a P.C.Board shown in Appendix 1 and apply a pushing force of 5N(CGB3,CGB4 type) 2N(CGB2 type) for 10±1s. Pushing force P.C.Board Capacitor 8 Bending No mechanical damage. Reflow solder the capacitors on a P.C.Board shown in Appendix 2a or Appendix 2b and bend it for 1mm. 20 50 F R230 45 1 45 (Unit : mm) 9 Solderability New solder to cover over 75% of termination. 25% may have pin holes or rough spots but not concentrated in one spot. Ceramic surface of A sections shall not be exposed due to melting or shifting of termination material. A section —5— Completely soak both terminations in solder at 235±5°C for 2±0.5s. Solder : H63A (JIS Z 3282) Flux : Isopropyl alcohol (JIS K 8839) Rosin(JIS K 5902) 25% solid solution. (continued) No. 10 Item Resistance to solder heat External appearance Performance No cracks are allowed and terminations shall be covered at least 60% with new solder. Capacitance Characteristics Change from the value before test J B X5R X6S X7R X7S 11 Vibration ± 7.5 % Insulation Resistance Meet the initial spec. Voltage proof No insulation breakdown or other damage. External appearance No mechanical damage. Change from the value before test J B X5R X6S X7R X7S Temperature cycle ± 7.5 % D.F. Meet the initial spec. External appearance No mechanical damage. Capacitance Characteristics JB X5R X6S X7R X7S Preheating condition Temp. : 150±10°C Time: 1 to 2min. Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Leave the capacitors in ambient condition for 24 ± 2h before measurement. Meet the initial spec. Capacitance 12 Completely soak both terminations in solder at 260±5°C for 5±1s. Solder : H63A (JIS Z 3282) D.F. Characteristics Test or inspection method Change from the value before test ± 7.5 % Reflow solder the capacitors on a P.C.Board shown in Appendix 1 before testing. Vibrate the capacitors with amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55Hz and back to 10Hz in about 1min. Repeat this for 2h each in 3 perpendicular directions. Reflow solder the capacitors on a P.C.Board shown in Appendix 1 before testing. Expose the capacitors in the condition step1 through step 4 and repeat 5 times consecutively. ± 10 % Leave the capacitors in ambient ± 12.5 % condition for 24 ± 2h before measurement. * Applied for some parts. D.F. Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage proof No insulation breakdown or other damage. —6— Step Temperature(°C) Time(min.) 1 Min. operating temp.±3 30 ± 3 2 Reference Temp. 2-5 3 Max. operating temp±2 30 ± 2 4 Reference Temp. 2-5 (continued) No. Item 13 Moisture External Resistance appearance (Steady Capacitance State) Performance No mechanical damage. Characteristics JB X5R X6S X7R X7S Change from the value before test ± 10 % ± 12.5 % ± 25 % * Applied for some parts. 14 Moisture Resistance D. F. 200% of initial spec. max Insulation Resistance 1,000MΩ or 50MΩ·μF min. (As for the capacitors of rated voltage 16,10,6.3 and 4V DC, 1,000 MΩ or 10MΩ·μF min.,) whichever smaller. External appearance No mechanical damage. Capacitance Characteristics JB X5R X6S X7R X7S Change from the value before test ± 10 % ± 12.5 % ± 25 % * Applied for some parts. D. F. 200% of initial spec. max Insulation Resistance 500MΩ or 25MΩ·μF min. (As for the capacitors of rated voltage 16,10,6.3 and 4V DC, 500 MΩ or 5MΩ·μF min.,) whichever smaller. —7— Test or inspection method Reflow solder the capacitors on a P.C.Board shown in Appendix 1 before testing. Leave at temperature 40±2°C, 90 to 95%RH for 500 +24,0h. Leave the capacitors in ambient condition for 24 ± 2h before measurement. Reflow solder the capacitors on a P.C.Board shown in Appendix 1 before testing. Apply the rated voltage at temperature 40 ± 2°C and 90 to 95%RH for 500 +24,0h. Charge/discharge current shall not exceed 50mA. Voltage conditioning Voltage treat the capacitors under testing temperature and voltage for 1 hour. Leave the capacitors in ambient condition for 24 ± 2h before measurement. Use this measurement for initial value. (continued) No. 15 Item Life External appearance Performance No mechanical damage. Capacitance Characteristics JB X5R X6S X7R X7S Change from the value before test ± 12.5 % Test or inspection method Reflow solder the capacitors on a P.C.Board shown in Appendix 1 before testing. Below the voltage shall be applied at Max. operating temp ± 2°C for 1,000 +48, 0h. ± 15 % Applied voltage ± 25 % Rated voltage × 2 Rated voltage × 1.5 * Applied for some parts. D. F. Insulation Resistance Rated voltage × 1 200% of initial spec. max 1,000MΩ or 50MΩ·μF min. (As for the capacitors of rated voltage 16,10,6.3 and 4V DC, 1,000 MΩ or 10MΩ·μF min.,) whichever smaller. For information which product has which applied voltage, please contact with our sales representative. Charge/discharge current shall not exceed 50mA. Voltage conditioning Voltage treat the capacitors under testing temperature and voltage for 1 hour. Leave the capacitors in ambient condition for 24 ± 2h before measurement. Use this measurement for initial value. *As for the initial measurement of capacitors on number 8,12,13,14 and 15, leave capacitors at 150 -10,0°C for 1 hour and measure the value after leaving capacitors for 24 ± 2h in ambient condition. —8— Appendix - 1 P.C. Board for reliability test 100 40 a b c Copper Solder resist (Unit：mm) Appendix - 2a Appendix - 2b P.C. Board for bending test P.C. Board for bending test Applied for CGB2 Applied for CGB3,CGB4 100 100 b b 40 40 c 1.0 1.0 a Copper Solder resist Solder resist c a (Unit : mm) (Unit : mm) b Copper Material : Glass Epoxy ( As per JIS C6484 GE4 ) P.C. Board thickness : Appendix-2a Appendix-1, 2b TDK (EIA style) 0.8mm 1.6mm Copper ( thickness 0.035mm ) Solder resist —9— Dimensions (mm) a b c CGB2 (CC0402) 0.4 1.5 0.5 CGB3 (CC0603) 1.0 3.0 1.2 CGB4 (CC0805) 1.2 4.0 1.65 8. INSIDE STRUCTURE AND MATERIAL 3 4 5 2 1 No. NAME MATERIAL 1 Dielectric BaTiO 3 2 Electrode Nickel (Ni) 3 4 Copper (Cu) Termination Nickel (Ni) 5 Tin (Sn) 9. SOLDERING CONDITION As for CGB2 type, reflow soldering only. — 10 — 12. Caution No. 1 2 Process Condition 1-1. Storage 1) The capacitors must be stored in an ambient temperature of 5 to 40°C with a relative humidity of 20 to 70%RH. The products should be used within 6 months upon receipt. 2) The capacitors must be operated and stored in an environment free of dew condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate, Chlorine, Ammonia and sulfur. 3) Avoid storing in sun light and falling of dew. 4) Do not use capacitors under high humidity and high and low atmospheric pressure which may affect capacitors reliability. 5) Capacitors should be tested for the solderability when they are stored for long time. 1-2. Handling in transportation In case of the transportation of the capacitors, the performance of the capacitors may be deteriorated depending on the transportation condition. (Refer to JEITA RCR-2335B 9.2 Handling in transportation) 2-1. Operating temperature Circuit design Operating temperature should be followed strictly within this specification, especially Caution be careful with maximum temperature. 1) Do not use capacitors above the maximum allowable operating temperature. 2) Surface temperature including self heating should be below maximum operating temperature. (Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at high frequencies around its SRF, the heat might be so extreme that it may damage itself or the product mounted on. Please design the circuit so that the maximum temperature of the capacitors including the self heating to be below the maximum allowable operating temperature. Temperature rise at capacitor surface shall be below 20°C) The electrical characteristics of the capacitors will vary depending on the 3） temperature. The capacitors should be selected and designed in taking the temperature into consideration. 2-2. Operating voltage 1) Operating voltage across the terminals should be below the rated voltage. When AC and DC are super imposed, V0-P must be below the rated voltage. — (1) and (2) AC or pulse with overshooting, VP-P must be below the rated voltage. — (3), (4) and (5) When the voltage is started to apply to the circuit or it is stopped applying, the irregular voltage may be generated for a transit period because of resonance or switching. Be sure to use the capacitors within rated voltage containing these Irregular voltage. Operating Condition (Storage, Transportation) Voltage (1) DC voltage Positional V0-P Measurement (Rated voltage) 0 Voltage (2) DC+AC voltage V0-P VP-P 0 (4) Pulse voltage (A) (5) Pulse voltage (B) Positional VP-P Measurement (Rated voltage) 0 VP-P — 11 — (3) AC voltage 0 0 No. Process Condition 2 Circuit design Caution 2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the reliability of the capacitors may be reduced. 3) The effective capacitance will vary depending on applied DC and AC voltages. The capacitors should be selected and designed in taking the voltages into consideration. 2-3. Frequency When the capacitors (Class 2) are used in AC and/or pulse voltages, the capacitors may vibrate themselves and generate audible sound. 3 Designing P.C.board The amount of solder at the terminations has a direct effect on the reliability of the capacitors. 1) The greater the amount of solder, the higher the stress on the chip capacitors, and the more likely that it will break. When designing a P.C.board, determine the shape and size of the solder lands to have proper amount of solder on the terminations. 2) Avoid using common solder land for multiple terminations and provide individual solder land for each terminations. 3) Size and recommended land dimensions. Chip capacitors Solder land C B Solder resist A Flow soldering Type (mm) CGB3 (CC0603) CGB4 (CC0805) C3216 (CC1206) A 0.7 - 1.0 1.0 - 1.3 2.1 - 2.5 B 0.8 - 1.0 1.0 - 1.2 1.1 - 1.3 C 0.6 - 0.8 0.8 - 1.1 1.0 - 1.3 Symbol Reflow soldering CGB2 Type Symbol (CC0402) CGB3 (CC0603) (mm) CGB4 (CC0805) A 0.3 - 0.5 0.6 - 0.8 0.9 - 1.2 B 0.35 - 0.45 0.6 - 0.8 0.7 - 0.9 C 0.4 - 0.6 0.6 - 0.8 0.9 - 1.2 C3216 (CC1206) C3225 (CC1210) C4532 (CC1812) C5750 (CC2220) A 2.0 - 2.4 2.0 - 2.4 3.1 - 3.7 4.1 - 4.8 B 1.0 - 1.2 1.0 - 1.2 1.2 - 1.4 1.2 - 1.4 C 1.1 - 1.6 1.9 - 2.5 2.4 - 3.2 4.0 - 5.0 Type Symbol — 12 — No. 3 Process Designing P.C.board Condition 4) Recommended chip capacitors layout is as following. Disadvantage against bending stress Advantage against bending stress Perforation or slit Perforation or slit Break P.C.board with mounted side up. Break P.C.board with mounted side down. Mounting face Mount perpendicularly to perforation or slit Perforation or slit Mount in parallel with perforation or slit Perforation or slit Chip arrangement (Direction) Closer to slit is higher stress 1 Away from slit is less stress 2 Distance from slit (1 < 2 ) — 13 — (1 < 2 ) No. 3 Process Designing P.C.board Condition 5) Mechanical stress varies according to location of chip capacitors on the P.C.board. E Perforation D C B A Slit The stress in capacitors is in the following order. A>B=C>D>E 6) Layout recommendation Example Use of common solder land Soldering with chassis Lead wire Chassis chip Solder Use of common solder land with other SMD Solder land Excessive solder Need to avoid Excessive solder PCB Adhesive Solder land 1 Missing solder Lead wire Solder land Solder resist Solder resist Recommendation Solder resist 2 2 > 1 — 14 — 4 Process Mounting Condition 4-1. Stress from mounting head If the mounting head is adjusted too low, it may induce excessive stress in the chip capacitors to result in cracking. Please take following precautions. 1) Adjust the bottom dead center of the mounting head to reach on the P.C.board surface and not press it. 2) Adjust the mounting head pressure to be 1 to 3N of static weight. 3) To minimize the impact energy from mounting head, it is important to provide support from the bottom side of the P.C.board. See following examples. Not recommended Single sided mounting Recommended Crack Support pin Double-sides mounting Solder peeling Crack Support pin When the centering jaw is worn out, it may give mechanical impact on the capacitors to cause crack. Please control the close up dimension of the centering jaw and provide sufficient preventive maintenance and replacement of it. 4-2. Amount of adhesive a a c c b No. Example : CGB4 (CC0805) a 0.2mm min. b 70 - 100μm c Do not touch the solder land — 15 — Soldering 5-1. Flux selection Although highly-activated flux gives better solderability, substances which increase activity may also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended following. 1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine). Strong flux is not recommended. 2) Excessive flux must be avoided. Please provide proper amount of flux. 3) When water-soluble flux is used, enough washing is necessary. 5-2. Recommended soldering profile by various methods Reflow soldering Wave soldering Soldering Preheating Natural cooling Peak Temp Peak Temp △T 0 Soldering Natural cooling Preheating Temp.. (°C) 5 Condition Temp. (°C) Process Over 60 sec. Over 60 sec. ∆T 0 Over 60 sec. Peak Temp time Peak Temp time Manual soldering (Solder iron) APPLICATION As for CGB3 (CC0603), CGB4 (CC0805) 300 and, applied to wave soldering and reflow soldering. Temp.. (°C) No. As for CGB2 (CC0402), applied only to reflow ∆T soldering. Preheating 0 3sec. (As short as possible) 5-3. Recommended soldering peak temp and peak temp duration Temp./Duration Wave soldering Reflow soldering Peak temp(°C) Duration(sec.) Peak temp(°C) Duration(sec.) Sn-Pb Solder 250 max. 3 max. 230 max. 20 max. Lead Free Solder 260 max. 5 max. 260 max. 10 max. Solder Recommended solder compositions Sn-37Pb (Sn-Pb solder) Sn-3.0Ag-0.5Cu (Lead Free Solder) — 16 — No. Process 5 Soldering Condition 5-4. Avoiding thermal shock 1) Preheating condition Soldering 2) Type Temp. (°C) Wave soldering CGB3(CC0603), CGB4(CC0805) ∆T ≤ 150 Reflow soldering CGB2(CC0402), CGB3(CC0603), CGB4(CC0805) ∆T ≤ 150 Manual soldering CGB2(CC0402), CGB3(CC0603), CGB4(CC0805) ∆T ≤ 150 Cooling condition Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference (∆T) must be less than 100°C. 5-5. Amount of solder Excessive solder will induce higher tensile force in chip capacitors when temperature changes and it may result in chip cracking. In sufficient solder may detach the capacitors from the P.C.board. Higher tensile force in chip capacitors to cause crack Excessive solder Maximum amount Minimum amount Adequate Low robustness may cause contact failure or chip capacitors come off the P.C.board. Insufficient solder 5-6. Solder repair by solder iron 1) Selection of the soldering iron tip Tip temperature of solder iron varies by its type, P.C.board material and solder land size. The higher the tip temperature, the quicker the operation. However, heat shock may cause a crack in the chip capacitors. Please make sure the tip temp. before soldering and keep the peak temp and time in accordance with following recommended condition. (Please preheat the chip capacitors with the condition in 5-4 to avoid the thermal shock.) Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder) Temp. (°C) Duration (sec.) Wattage (W) Shape (mm) 300 max. 3 max. 20 max. Ø 3.0 max. — 17 — No. Process 5 Soldering Condition 2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors may cause crack. Do not touch the ceramic dielectric and the terminations by solder iron. 5-7. Sn-Zn solder Sn-Zn solder affects product reliability. Please contact TDK in advance when utilize Sn-Zn solder. 5-8. Countermeasure for tombstone The misalignment between the mounted positions of the capacitors and the land patterns should be minimized. The tombstone phenomenon may occur especially the capacitors are mounted (in longitudinal direction) in the same direction of the reflow soldering. (Refer to JEITA RCR-2335B Annex 1 (Informative) Recommendations to prevent the tombstone phenomenon) 6 Cleaning 1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may stick to chip capacitors surface to deteriorate especially the insulation resistance. 2) If cleaning condition is not suitable, it may damage the chip capacitors. 2)-1. Insufficient washing (1) Terminal electrodes may corrode by Halogen in the flux. (2) Halogen in the flux may adhere on the surface of capacitors, and lower the insulation resistance. (3) Water soluble flux has higher tendency to have above mentioned problems (1) and (2). 2)-2. Excessive washing When ultrasonic cleaning is used, excessively high ultrasonic energy output can affect the connection between the ceramic chip capacitor's body and the terminal electrode. To avoid this, following is the recommended condition. Power : 20 W/ max. Frequency : 40 kHz max. Washing time : 5 minutes max. 2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may bring the same result as insufficient cleaning. — 18 — No. 7 Process Coating and molding of the P.C.board Condition 1) When the P.C.board is coated, please verify the quality influence on the product. 2) Please verify carefully that there is no harmful decomposing or reaction gas emission during curing which may damage the chip capacitors. 3) Please verify the curing temperature. 8 Handling after chip mounted Caution 1) Please pay attention not to bend or distort the P.C.board after soldering in handling otherwise the chip capacitors may crack. Bend Twist 2) When functional check of the P.C.board is performed, check pin pressure tends to be adjusted higher for fear of loose contact. But if the pressure is excessive and bend the P.C.board, it may crack the chip capacitors or peel the terminations off. Please adjust the check pins not to bend the P.C.board. Item Not recommended Termination peeling Recommended Support pin Board bending Check pin — 19 — Check pin No. 9 Process Handling of loose chip capacitors Condition 1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially, the large case sized chip capacitors are tendency to have cracks easily, so please handle with care. Crack Floor 2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C. board may hit the chip capacitors of another board to cause crack. P.C.board Crack 10 Capacitance aging The capacitors (Class 2) have aging in the capacitance. They may not be used in precision time constant circuit. In case of the time constant circuit, the evaluation should be done well. 11 Estimated life and estimated failure rate of capacitors As per the estimated life and the estimated failure rate depend on the temperature and the voltage. This can be calculated by the equation described in JEITA RCR-2335B Annex 6 (Informative) Calculation of the estimated lifetime and the estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule, Temperature acceleration coefficient : 10°C rule) The failure rate can be decreased by reducing the temperature and the voltage but they will not be guaranteed. — 20 — No. 12 Process Others Caution Condition The products listed on this specification sheet are intended for use in general electronic equipment (AV equipment, telecommunications equipment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement equipment, industrial robots) and automotive application under a normal operation and use condition. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below or for any other use exceeding the range or conditions set forth in this specification sheet. If you intend to use the products in the applications listed below or if you have special requirements exceeding the range or conditions set forth in this specification, please contact us. (1) Aerospace/Aviation equipment (2) Transportation equipment (electric trains, ships, etc. except automotive application) (3) Medical equipment (4) Power-generation control equipment (5) Atomic energy-related equipment (6) Seabed equipment (7) Transportation control equipment (8) Public information-processing equipment (9) Military equipment (10) Electric heating apparatus, burning equipment (11) Disaster prevention/crime prevention equipment (12) Safety equipment (13) Other applications that are not considered general-purpose applications When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing protection circuit/device or providing backup circuits in your equipment. — 21 — 11. Packaging label Packaging shall be done to protect the components from the damage during transportation and storing, and a label which has the following information shall be attached. 1) Inspection No. 2) TDK P/N 3) Customer's P/N 4) Quantity *Composition of Inspection No. Example M 2 A – ΟΟ – ΟΟΟ (a) (b) (c) (d) (e) a) Line code b) Last digit of the year c) Month and A for January and B for February and so on. (Skip I) d) Inspection Date of the month. e) Serial No. of the day 12. Bulk packaging quantity Total number of components in a plastic bag for bulk packaging : 1,000pcs. As for CGB2 type, not available for bulk packaging. — 22 — 13. TAPE PACKAGING SPECIFICATION 1. CONSTRUCTION AND DIMENSION OF TAPING 1-1. Dimensions of carrier tape Dimensions of paper tape shall be according to Appendix 3, 4. 1-2. Bulk part and leader of taping Bulk 160mm Bulk 160mm min Chips Leader Drawing direction 400mm min 1-3. Dimensions of reel Dimensions of Ø178 reel shall be according to Appendix 5. Dimensions of Ø330 reel shall be according to Appendix 6. 1-4. Structure of taping Top cover tape Pitch hole Paper carrier tape Bottom cover tape (Bottom cover tape is not always applied.) 2. CHIP QUANTITY Chip quantity (pcs.) Type Taping Material φ178mm reel φ330mm reel CGB2 paper 10,000 50,000 CGB3 paper 4,000 10,000 CGB4 paper 4,000 10,000 — 23 — 3. PERFORMANCE SPECIFICATIONS 3-1. Fixing peeling strength (top tape) 0.05-0.7N. (See the following figure.) Direction of cover tape pulling Carrier tape Top cover tape 0~15° Direction of pulling 3-2. Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape. 3-3. The missing of components shall be less than 0.1% 3-4. Components shall not stick to fixing tape. 3-5. The fixing tapes shall not protrude beyond the edges of the carrier tape not shall cover the sprocket holes. — 24 — Appendix 3 Paper Tape Pitch hole J E A D C B G H T F (Unit : mm) Symbol Type CGB2 (CC0402) Symbol Type CGB2 (CC0402) A B C D E F ( 0.65 ) ( 1.15 ) 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05 G H J T 2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10 0 ( 0.60 ) * The values in the parentheses ( ) are for reference. Appendix 4 Paper Tape Pitch hole J E A D B T H G C F (Unit : mm) Symbol Type CGB3 (CC0603) CGB4 (CC0805) Symbol Type CGB3 (CC0603) CGB4 (CC0805) A B ( 1.10 ) ( 1.90 ) ( 1.50 ) ( 2.30 ) G H 2.00 ± 0.05 4.00 ± 0.10 C D E F 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10 J T Ø 1.5 +0.10 0 1.10 max. * The values in the parentheses ( ) are for reference. — 25 — Appendix 5 (Material : Polystyrene) W2 E C B D r W1 A (Unit : mm) Symbol A B C D E W1 Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 9.0 ± 0.3 Symbol W2 r Dimension 13.0 ± 1.4 1.0 Appendix 6 (Material : Polystyrene) E C B D r t W A (Unit : mm) Symbol A B C D E W Dimension Ø382 max. (Nominal Ø330) Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 10.0 ± 1.5 Symbol t r Dimension 2.0 ± 0.5 1.0 — 26 —