SPECIFICATION - Products of TDK

SPECIFICATION
SPEC. No. A-ESD-a
D A T E : 2014 Jan.
To
Non-Controlled Copy
Upon the acceptance of this spec.
previous spec. (C2005-1420)
shall be abolished.
CUSTOMER’S PRODUCT NAME
TDK PRODUCT NAME
MULTILAYER CERAMIC CHIP CAPACITORS
CGA Series / Automotive Grade
ESD Protection CGA3EA Series
Please return this specification to TDK representatives.
If orders are placed without returned specification, please allow us to judge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE:
TDK Corporation
Sales
Electronic Components
Sales & Marketing Group
APPROVED
Person in charge
YEAR
MONTH
DAY
TDK-EPC Corporation
Engineering
Ceramic Capacitors Business Group
APPROVED
CHECKED
Person in charge
1. SCOPE
This specification is applicable to chip type multilayer ceramic capacitors with a priority over the
other relevant specifications.
Production places defined in this specification shall be TDK-EPC Corporation Japan,
TDK (Suzhou) Co., Ltd and TDK Components U.S.A. Inc.
EXPLANATORY NOTE:
This specification warrants the quality of the ceramic chip capacitor. The chips should be
evaluated or confirmed a state of mounted on your product.
If the use of the chips go beyond the bounds of this specification, we can not afford to guarantee.
2. CODE CONSTRUCTION
(Example)
Catalog Number : CGA3
(1)
(Web)
Item Description : CGA3
(1)
E
(2)
A
(3)
C0G
(4)
2 A
(5)
103
(6)
J
(7)
080
(8)
A
(9)
E
(2)
A
(3)
C0G
(4)
2 A
(5)
103
(6)
J
(7)
T
(11)
xxxx
(12)
(1) Type
Terminal electrode
B
L
G
W
B
T
Internal electrode
Ceramic dielectric
Please refer to product list for the dimension of each product.
(2) Thickness
* As for dimension tolerance, please contact with our
sales representative.
(3) Identification for ESD capacitor
(Details are shown in table 1 No.16 at page 6)
Thickness
Dimension (mm)
E
0.80
Symbol
Identification
A
ESD Capacitor
(4) Temperature Characteristics (Details are shown in table 1 No.6 at page 3)
—1—
C
(10)
(5) Rated Voltage
Symbol
Rated Voltage
2A
DC 100 V
(6) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and second significant figures of the capacitance,
the third digit identifies the multiplier.
Example 103 → 10,000pF
(7) Capacitance tolerance
Symbol
J
Tolerance
±
5%
(8) Thickness code (Only Catalog Number)
(9) Package code (Only Catalog Number)
(10) Special code (Only Catalog Number)
(11) Packaging (Only Item Description)
(Bulk is not applicable for CGA1 and CGA2 type.)
Symbol
Packaging
B
Bulk
T
Taping
(12) Internal code (Only Item Description)
3. OPERATING TEMPERATURE RANGE
Min. operating
Max. operating
T.C.
Temperature
Temperature
Reference
Temperature
C0G
-55°C
125°C
25°C
NP0
-55°C
150°C
25°C
4. STORING CONDITION AND TERM
5 to 40°C at 20 to 70%RH
6 months Max.
5. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
—2—
6. PERFORMANCE
table 1
No.
Item
Performance
Test or inspection method
1
External Appearance
No defects which may affect
performance.
Inspect with magnifying glass (3×).
2
Insulation Resistance
10,000MΩ min.
Apply rated voltage for 60s.
3
Voltage Proof
Withstand test voltage without
insulation breakdown or other
damage.
3 times of rated voltage
Above DC voltage shall be applied for
1 to 5s.
Charge / discharge current shall not
exceed 50mA.
4
Capacitance
Within the specified tolerance.
Capacitance
Measuring
frequency
1000pF and
under
1MHz±10%
Over 1000pF
1kHz±10%
Measuring
voltage
0.5 - 5 Vrms.
For information which product has which
measuring voltage, please contact with our
sales representative.
5
Q
(Class1)
6
Temperature
Characteristics
of Capacitance
(Class1)
1,000 min.
See No.4 in this table for measuring
condition.
T.C.
Temperature Coefficient
C0G
NP0
0 ± 30 (ppm/°C)
0 ± 30 (ppm/°C)
Capacitance drift within ± 0.2% or
± 0.05pF, whichever larger.
7
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Temperature coefficient shall be calculated
based on values at 25°C and 85°C
temperature.
Measuring temperature below 20°C shall
be -10°C and -25°C.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b and apply a pushing force of
17.7N with 10±1s.
Pushing force
Capacitor
—3—
P.C.Board
(continued)
No.
8
Item
Bending
Performance
No mechanical damage.
Test or inspection method
Reflow solder the capacitors on
a P.C.Board shown in Appendix 2a or
Appendix 2b and bend it for 2mm.
20
50
F
R230
45
9
Solderability
New solder to cover over 75% of
termination.
25% may have pin holes or rough
spots but not concentrated in one
spot.
Ceramic surface of A sections
shall not be exposed due to
melting or shifting of termination
material.
2
45
(Unit : mm)
Completely soak both terminations in
solder at 235±5°C for 2±0.5s.
Solder : H63A (JIS Z 3282)
Flux : Isopropyl alcohol (JIS K 8839)
Rosin(JIS K 5902) 25% solid
solution.
A section
10
Resistance
to solder
heat
External
appearance
No cracks are allowed and
terminations shall be covered at
least 60% with new solder.
Capacitance
Change from the
Characteristics
value before test
C0G
NP0
± 2.5%
Completely soak both terminations in
solder at 260±5°C for 5±1s.
Preheating condition
Temp. : 150±10°C
Time : 1 to 2min.
1,000 min.
Flux : Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
Insulation
Resistance
Meet the initial spec.
Solder : H63A (JIS Z 3282)
Voltage
proof
No insulation breakdown or
other damage.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) before
measurement.
Q
(Class1)
—4—
(continued)
No.
11
Item
Vibration
Performance
External
No mechanical damage.
appearance
Capacitance
Q
Characteristics
Change from the
value before test
C0G
NP0
± 2.5%
1,000 min.
(Class1)
12
Temperature External
cycle
appearance
No mechanical damage.
Capacitance
Q
Characteristics
Change from the
value before test
C0G
NP0
± 2.5%
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
Q
± 7.5%
350 min.
Applied force : 5G max.
Frequency : 10-2000Hz
Duration : 20 min.
Cycle : 12 cycles in each 3 mutually
perpendicular directions.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b before testing.
Expose the capacitors in the condition
step1 through step 4 and repeat 1,000
times consecutively.
Temperature(°C)
1
Min. operating
temp. ±3
2
Reference Temp. ±2
3
Max. operating
temp. ±2
4
Reference Temp. ±2
Time (min.)
30 ± 3
2-5
30 ± 2
2-5
Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b before testing.
Leave at temperature 40±2°C, 90 to
95%RH for 500 +24,0h.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) before
measurement.
(Class1)
Insulation
Resistance
Vibrate the capacitor with following
conditions.
Step
Moisture
External
No mechanical damage.
Resistance appearance
(Steady
Capacitance
Change from the
Characteristics
State)
value before test
C0G
NP0
Reflow solder the capacitors on a
P.C.Board shown in Appendix1 before
testing.
Leave the capacitors in ambient
condition for 6 to 24h (Class 1) before
measurement.
1,000 min.
(Class1)
13
Test or inspection method
1,000MΩ min.
—5—
(continued)
No.
Item
14
Moisture
External
Resistance appearance
Performance
Test or inspection method
No mechanical damage.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b before testing.
Capacitance
Q
Characteristics
Change from the
value before test
C0G
NP0
± 7.5%
Charge/discharge current shall not
exceed 50mA.
200 min.
(Class1)
15
Life
Insulation
Resistance
External
appearance
Q
Leave the capacitors in ambient
condition for 6 to 24h (Class1) before
measurement
500MΩ min.
No mechanical damage.
Capacitance
Reflow solder the capacitors on a
P.C.Board shown in Appendix 1a or
Appendix 1b before testing.
Characteristics
Change from the
value before test
C0G
NP0
± 7.5%
Below the voltage shall be applied at
maximum operating temperature ±2°C
for 1,000 +48, 0h.
Applied voltage
350 min.
Rated voltage x2
(Class1)
Insulation
Resistance
Apply the rated voltage at temperature
85°C and 85%RH for 1000 +24,0h.
1,000MΩ min.
Rated voltage x1
For information which product has
which applied voltage, please contact
with our sales representative.
Charge/discharge current shall not
exceed 50mA.
15
ESD
Withstand ESD voltage
insulation breakdown.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) before
measurement.
without Solder the capacitors on a P.C.Board
shown in Appendix3 before testing.
Circuit condition : IEC 61000-4-2
( Cs : 150pF / Rd : 330Ω)
Test method : Direct contact
Number of ESD pulse : ±10 times
Rc : Change current limit registor
Rd : Discharge registor
Cs : Energy storage capacitor
As for applied ESD level, please refer
to the table A in the end of the
specification.
After each ESD pulse, dissipation of
residual change shall be done with
applying 1MΩ registance for 1 sec
min.
—6—
Appendix - 1
Appendix - 2
P.C. Board for reliability test
P.C. Board for bending test
100
100
c
b
c
Solder resist
40
40
a
b
1.0
a
Copper
Copper
Solder resist
(Unit : mm)
(Unit:mm)
Appendix - 3
P.C. Board for ESD test
Appendix 1, 2
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix-1, 2, 3
TDK (EIA style)
1.6mm
CGA3 (CC0603)
Dimensions (mm)
a
b
c
1.0
3.0
1.2
Appendix 3
Copper ( thickness 0.035mm )
Solder resist
TDK (EIA style)
CGA3 (CC0603)
—7—
Dimensions (mm)
a
b
c
1.0
3.0
0.75
7. INSIDE STRUCTURE AND MATERIAL
3
4
5
2
1
No.
NAME
MATERIAL
1
Dielectric
CaZrO 3
2
Electrode
Nickel (Ni)
3
4
Copper (Cu)
Nickel (Ni)
Termination
5
Tin (Sn)
8. Setting up for ESD test
ESD Gun
(150pF/330Ω )
Horizonal coupling plane
(HPC)
Non-conductive
(wooden) table
Cable for dissipation of
residual change (1MΩ )
Test board
470kΩ
470kΩ
Power supply
Resistor
Ground reference plane
(GRP)
—8—
9. Caution
No.
Process
1
Operating
Condition
(Storage,
Transportation)
Condition
1-1. Storage
1) The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. The products should be used within 6 months
upon receipt.
2) The capacitors must be operated and stored in an environment free of dew
condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate,
Chlorine, Ammonia and sulfur.
3) Avoid storing in sun light and falling of dew.
4) Do not use capacitors under high humidity and high and low atmospheric pressure
which may affect capacitors reliability.
2
Circuit design
! Caution
5) Capacitors should be tested for the solderability when they are stored for long
time.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335B 9.2 Handling in transportation)
2-1. Operating temperature
Operating temperature should be followed strictly within this specification, especially
be careful with maximum temperature.
1) Do not use capacitors above the maximum allowable operating temperature.
2) Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
——— (1) and (2)
AC or pulse with overshooting, VP-P must be below the rated voltage.
——— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
Voltage
(1) DC voltage
(2) DC+AC voltage
(3) AC voltage
Positional
Measurement V0-P
(Rated voltage)
0
Voltage
VP-P
V0-P
0
(4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement VP-P
(Rated voltage)
0
VP-P
—9—
0
0
No.
Process
Condition
2
Circuit design
! Caution
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied,
the reliability of the capacitors may be reduced.
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
2-3. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
3
Designing
P.C.board
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
Solder resist
A
B
Flow soldering
Type
Symbol
(mm)
CGA3
(CC0603)
A
0.7 - 1.0
B
0.8 - 1.0
C
0.6 - 0.8
Reflow soldering
Type
Symbol
(mm)
CGA3
(CC0603)
A
0.6 - 0.8
B
0.6 - 0.8
C
0.6 - 0.8
— 10 —
No.
3
Process
Designing
P.C.board
Condition
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Break P.C.board with
mounted side up.
Break P.C.board with
mounted side down.
Mounting
face
Mount perpendicularly to
perforation or slit
Perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
Away from slit is less stress
ℓ2
ℓ1
Distance from
slit
(ℓ1 < ℓ2 )
— 11 —
(ℓ1 < ℓ2 )
No.
3
Process
Designing
P.C.board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
E
Perforation
D
C
B
A
Slit
The stress in capacitors is in the following order.
A>B=C>D>E
6) Layout recommendation
Example
Use of common
solder land
Soldering with
chassis
Lead wire Chassis
chip
Solder
Use of common
solder land with
other SMD
Solder
land
Excessive solder
Need to
avoid
Excessive solder
PCB Adhesive
Solder land
ℓ1
Missing
solder
Lead wire
Solder land
Solder resist
Solder resist
Recommendation
Solder resist
ℓ2
ℓ2 > ℓ1
— 12 —
4
Process
Mounting
Condition
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Single sided
mounting
Recommended
Crack
Support pin
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
a
a
c
c
b
No.
— 13 —
Soldering
5-1. Flux selection
Although highly-activated flux gives better solderability, substances which increase
activity may also degrade the insulation of the chip capacitors. To avoid such
degradation, it is recommended following.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile by various methods
Reflow soldering
Wave soldering
Soldering
Preheating
Natural cooling
Peak
Temp
Peak
Temp
△T
0
Soldering
Natural cooling
Preheating
Temp.. (°C)
5
Condition
Temp. (°C)
Process
Over 60 sec.
Over 60 sec.
0
∆T
Over 60 sec.
Peak Temp time
Peak Temp time
Manual soldering
(Solder iron)
300
Temp.. (°C)
No.
∆T
Preheating
0
3sec. (As short as possible)
5-3. Recommended soldering peak temp and peak temp duration
Temp./Duration
Wave soldering
Reflow soldering
Peak temp(°C) Duration(sec.)
Peak temp(°C)
Duration(sec.)
Pb-Sn Solder
250 max.
3 max.
230 max.
20 max.
Lead Free Solder
260 max.
5 max.
260 max.
10 max.
Solder
Recommended solder compositions
Sn-37Pb (Pb-Sn solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
— 14 —
No.
Process
5
Soldering
Condition
5-4. Avoiding thermal shock
1) Preheating condition
Soldering
2)
Type
Temp. (°C)
Wave soldering
CGA3(CC0603)
∆T ≤ 150
Reflow soldering
CGA3(CC0603)
∆T ≤ 150
Manual soldering
CGA3(CC0603)
∆T ≤ 150
Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
5-5. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Higher tensile force in
chip capacitors to cause
crack
Excessive
solder
Maximum amount
Minimum amount
Adequate
Low robustness may
cause contact failure or
chip capacitors come off
the P.C.board.
Insufficient
solder
5-6. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition. (Please preheat the
chip capacitors with the condition in 5-4 to avoid the thermal shock.)
— 15 —
No.
Process
5
Soldering
Condition
Recommended solder iron condition (Pb-Sn Solder and Lead Free Solder)
Temp. (°C)
Duration (sec.)
Wattage (W)
Shape (mm)
300 max.
3 max.
20 max.
Ø 3.0 max.
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors
may cause crack. Do not touch the ceramic dielectric and the terminations by
solder iron.
5-7. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-8. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the reflow
soldering.
(Refer to JEITA RCR-2335B Annex A (Informative) Recommendations to prevent the
tombstone phenomenon)
6
Cleaning
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower
the insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned
problems (1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20 W/ℓ max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
— 16 —
No.
7
Process
Coating and
molding of the
P.C.board
Condition
1) When the P.C.board is coated, please verify the quality influence on the product.
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
8
Handling after
chip mounted
! Caution
1) Please pay attention not to bend or distort the P.C.board after soldering in handling
otherwise the chip capacitors may crack.
Bend
Twist
2) When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the terminations
off. Please adjust the check pins not to bend the P.C.board.
Item
Not recommended
Recommended
Termination
peeling
Support pin
Board
bending
Check pin
Check pin
9
Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so please
handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
P.C.board
Crack
— 17 —
No.
Process
Condition
10
Capacitance aging
The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11
Estimated life and
estimated failure
rate of capacitors
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335B Annex 6 (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
12
Others
! Caution
The products listed on this specification sheet are intended for use in general
electronic equipment (AV equipment, telecommunications equipment, home
appliances, amusement equipment, computer equipment, personal equipment, office
equipment, measurement equipment, industrial robots) under a normal operation and
use condition.
The products are not designed or warranted to meet the requirements of the
applications listed below, whose performance and/or quality require a more stringent
level of safety or reliability, or whose failure, malfunction or trouble could cause
serious damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (cars, electric trains, ships, etc.)
(3) Medical equipment
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
— 18 —
10. PACKAGING LABEL
Packaging shall be done to protect the components from the damage during
transportation and storing, and a label which has the following information shall be
attached.
1) Inspection No.
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example
F 2
A – ΟΟ – ΟΟΟ
(a) (b) (c)
(d)
(e)
a) Line code
b) Last digit of the year
c) Month and A for January and B for February and so on. (Skip I)
d) Inspection Date of the month.
e) Serial No. of the day
11. BULK PACKAGING QUANTITY
Total number of components in a plastic bag for bulk packaging : 1,000pcs.
— 19 —
12. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 4.
1-2. Bulk part and leader of taping
Bulk
160mm
Chips
Bulk
160mm min
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of Ø178 reel shall be according to Appendix 5.
Dimensions of Ø330 reel shall be according to Appendix 6.
1-4. Structure of taping
Top cover tape
Pitch hole
Paper carrier tape
Bottom cover tape
(Bottom cover tape is not always applied.)
2. CHIP QUANTITY
Chip quantity(pcs.)
Type
Thickness
of chip
Taping
Material
Ø 178mm reel
Ø 330mm reel
CGA3(CC0603)
0.80 mm
Paper
4,000
10,000
— 20 —
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05-0.7N. (See the following figure.)
TYPE 1 (Paper)
Direction of cover tape pulling
Carrier tape
Top cover tape
0~15°
Direction of pulling
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. The fixing tapes shall not protrude beyond the edges of the carrier tape
not shall cover the sprocket holes.
— 21 —
Appendix 4
Paper Tape
Pitch hole
J
E
A
D
B
T
H
C
F
G
(Unit : mm)
Symbol
Type
A
B
C
D
E
F
CGA3
(CC0603)
( 1.10 )
( 1.90 )
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
4.00 ± 0.10
Symbol
Type
G
H
J
T
CGA3
(CC0603)
2.00 ± 0.05
4.00 ± 0.10
Ø 1.5
+0.10
0
* The values in the parentheses ( ) are for reference.
— 22 —
1.20 max.
Appendix 5
(Material : Polystyrene)
E
W2
C
B
D
r
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
Ø178 ± 2.0
Ø60 ± 2.0
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
9.0 ± 0.3
Symbol
W2
r
Dimension
13.0 ± 1.4
1.0
Appendix 6
(Material : Polystyrene)
E
C
B
D
r
t
W
A
(Unit : mm)
Symbol
A
B
C
D
E
W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min.
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
10.0 ± 1.5
Symbol
t
r
Dimension
2.0 ± 0.5
1.0
— 23 —