Debut of Flip Chip Bonding system that meets the needs of your production TDK, an electronic supplier, has completely evaluated the production to find the needs of users and produced this high-reliable, space-saving, high-speed equipment for your specific needs. Upgraded Technical Proposal for Total Solutions AFM-15 （Ultrasonic process）（type : 1503,1504） Features 1. Excellent mounting tact time 0.75sec/chip （including 0.2sec process time） 2. Excellent mounting accuracy（±7μm/3σ） 3. Smallest Footprint（0.99m2） 4. Low energy connection 5. 12inch wafer capability Ultra low-cost and space-saving AFM-25 （Heat Compression / C4） Features High stable & high accuracy MDM-50 （Multi-Dispenser） Features 1. Mounting tact time 2.5sec/chip 1. Continuous stable amount of dispense 2. Excellent mounting accuracy（±2μm/3σ） 2. Excellent dispense nozzle positioning accuracy（±3μm） 3. Smallest Footprint（0.68m2） 3. Smallest footprint（0.84m2） 4. Modular system for various bond process 4. Dispense monitoring system for traceability control ■Specifications AFM-15 Model Type 1503 1504 AFM-25 MDM-50 Bonding Process Termosonic Heat compression（NCP, ACP, NCF, ACF）、C4 Glue dispensing Products LED, CMOS Sensor, TCXO, SAW, Opto, High Frequency Devices and so on Module・Opto and so on All of left products Chip MAX：2.5W 2.5D 1.0Tmm MIN：0.3W 0.3D 0.1Tmm MAX：2.5W 2.5D 1.0Tmm MIN：0.3W 0.3D 0.1Tmm MAX：30W 30D 1.0Tmm MIN：3W 3D 0.1Tmm Substrate MAX：180W 120D 3.0Tmm MIN：50W 50D 0.3Tmm MAX：170W 105D 3.0Tmm MIN：50W 50D 0.3Tmm MAX：200W 120D 1.6Tmm MIN：50W 50D 0.4Tmm MAX：200W 150D 2.0Tmm MIN：30W 30D 0.3Tmm 2.5sec/chip （excluding process time） （Option : Max 7.0W 7.0Dmm） （Option: MAX 8 inch Wafer） Mounting tact Time 0.8sec/chip 0.75sec/chip （including 0.2sec process time） （including 0.2sec process time） Accuracy 7μm/3σ MAX Load 3μm 2μm/3σ 25N（option：50N , 100N） 372.4N Chip Supply 5,6,8.12inch wafer etc. Wafer magazine auto loading 5,6inch wafer etc. Wafer ring auto loading 2inch tray etc. Size 1,200W 1,450D 1,650Hmm 980W 1,020D 1,860Hmm 750W 910D 1,760Hmm 740W 1,140D 1,650Hmm Weight About 1,800kg About 1,500kg About 1,100kg About 600kg Pre heater table Bond heater table Auto nozzle cleaning Ultrasonic checking Bump collapse height measurement Bump absence detection Bad mark detection Wafer theta axis correction Wafer expansion Hot blow Nozzle surface monitoring LAN Nozzle bonding counter Production management data Bond heater table Parallelism verification Bonding position verification Temperature calibration Bad mark detection Production management data Pre heater table Dispense heater table Various dispense features （Line,Dot etc.） Magazine Loader/Unloader Hepa-filter Ionizer Profile monitor（US,Load,Bump height） Chip tray supply Map data（between bump bonder etc） Bond nozzle heater Substrate（package）special clamp Bond inspection（Pre , Post） Bond nozzle polishing jig Ultrasonic horn（For large chip） Magazine Loader/Unloader Hepa-filter Ionizer Pre heater table Post heater table Chip tray supply（3,4 inch） Chip wafer supply（6 inch） Custom tray supply Smaller chip handling Flux dispenser Multi-chip handling Standard Features Option and Special Features Auto needle cleaning Substrate height detection （contact type） Bad mark detection Production management data Magazine Loader/Unloader Hepa-filter Post heater table Actual dispense monitoring Substrate height detection （Non-contact type） Various dispense head （Mechanical, Jet, Air etc） ●Contact us for specifications other than the above. ●Specification and design may be changed without prior notice. TDK Corporation 2-15-7, Higashi-Ohwada, Ichikawa-shi, Chiba 272-8558 Japan Phone +81-47-378-9225, Fax +81-47-378-9242 ww w . t d k . co.jp/FA/ This pamphlet uses paper certified by the Forest Stewardship Council and soybean ink. 011101.5k