ROHM BD6963AFUJ

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STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
Single-Phase Full-Wave Motor Driver for Fan Motor
TYPE
BD6963AFUJ
FEATURES
PWM speed control
Soft switching function
Stand-by function
Hall bias
〇ABSOLUTE MAXIMUM RATINGS
Symbol
Limit
Unit
Supply voltage
Vcc
7
V
Power dissipation
Pd
670*
mW
Parameter
Operating temperature
Topr
-40~+105
℃
Storage temperature
Tstg
-55~+150
℃
Output voltage
Vomax
7
V
Output current
Iomax
1000**
mA
FG signal output voltage
VFG
7
V
FG signal output current
IFG
10
mA
IHB
10
mA
150
℃
Unit
V
V
HB current ability
Tjmax
Junction temperature
*
Reduce by 5.36mW/℃ over Ta=25℃.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
** This value is not to exceed Pd.
〇OPERATING CONDITIONS
Parameter
Symbol
Operating supply voltage range
Vcc
Limit
2.3~5.5
Hall input voltage range
VH
0.4~Vcc-1.1
*This product is not designed for production against radioactive rays.
*This document may be strategic data subject to COCOM regulations.
REV. B
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〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=5V)
Icc1
Min.
1
Limit
Typ.
3
Max.
6
Icc2
-
25
Input frequency
VHOFS
VHYS
VPWMH
VPWML
IPWMH
IPWML
FPWM
±5
2.5
-0.3
-33
0.02
Output voltage
VO
Input-output Gain
Symbol
Parameter
Circuit current 1
Circuit current 2
(Stand-by mode)
Hall input offset
FG hysteresis voltage
PWM input H level
PWM input L level
Unit
Conditions
mA
PWM=OPEN
60
μA
PWM=GND
±10
0
-25
-
±6
±15
Vcc+0.3
0.8
5
-17
50
mV
mV
V
V
μA
μA
kHz
-
0.4
0.6
V
GIO
45
48
51
dB
FG low voltage
VFGL
-
-
0.4
V
FG leak current
IFGL
-
-
10
μA
Lock detection ON time
Lock detection OFF time
Hall bias voltage
〇PACKAGE OUTLINES
TON
TOFF
VHB
0.35
3.5
1.1
0.50
5.0
1.3
0.65
6.5
1.5
s
s
V
PWM input current
PWM=Vcc
PWM=GND
Io=300mA
Upper and Lower total
IFG=5mA,when
SEL=L,FG=1/2FG
VFG=7V,when
SEL=L,FG=1/2FG
IHB=-5mA
3.0±0.1
D 6 9
6 3 A
1
Lot No.
5
0.5
0.145
+0.05
-0.03
1.1Max.
0.85±0.05
0.1±0.05
6
0.45±0.15
0.95±0.2
3.0±0.1
4.9±0.2
10
0.22
0.5
+0.05
-0.04
0.08 S
TSSOP-C10J (UNIT:mm)
〇BLOCK DIAGRAM
OUT2
〇TERMINAL NAME
Pin No.
Terminal
name
1
OUT2
2
SEL
3
H+
4
HB
5
H6
FG
7
PWM
8
Vcc
9
OUT1
10
GND
GND
160kΩ
1
10
580Ω
+
OSC
SEL
2
H+
3
OUT1
9
Lock
Protection
+
-
Vcc
Control
8
Vcc
TSD
190kΩ
HB
4
H-
5
PWM
Hall
Bias
10kΩ
+
580Ω
160kΩ
7
FG
6
REV. B
0.08
M
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〇CAUTIONS ON USE
1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over
rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines.
An external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a
capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have
no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are
reduced at low temperatures)
4) GND potential
The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal
do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may
deflect below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on
use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation
of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error
or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a hysteresis
width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit
is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do
not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing
it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use
similar precaution when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a
single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by
large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of
any external components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible
that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output
and GND below 100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is
applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes
mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner
where parasitic element is actuated.
REV. B
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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The Products specified in this document are intended to be used with general-use electronic
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R1010A