1/4 STRUCTURE Silicon monolithic integrated circuits PRODUCT SERIES Bipolar stepping motor driver TYPE BD6290EFV FUNCTION ・PWM constant current controllable two H bridge driver ・Full, Half, Quarter step ・Parallel IN control ○Absolute maximum ratings(Ta=25℃) Item Supply voltage Symbol VM1,2 Limit Unit -0.2～+36.0 V 1.1※1 W Power dissipation Pd 4.0※2 W Input voltage for control pin VIN -0.2～+7.0 V Maximum input voltage for RNF VRNF 0.5 V ※3 Maximum output current IOUT 0.8 A/phase Operating temperature range Topr -25～+85 ℃ Storage temperature range Tstg -55～+150 ℃ Junction temperature Tjmax +150 ℃ ※1 70mm x 70mm x 1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃. ※2 4 layers recommended board. Derating in done at 32.0mW/℃ or operating above Ta=25℃. ※3 Do not, however exceed Pd, ASO and Tjmax=150℃. ○Operating conditions (Ta=-25～+85℃) Item Symbol Supply voltage VM1,2 Output current IOUT ※4 Do not, however exceed Pd, ASO. Min 19 - Typ 24 0.3 This product isn’t designed for protection against radioactive rays. REV. B Max 28 0.5※4 Unit V A/phase 2/4 ○Electrical characteristics (Unless otherwise specified Ta=25℃, VM1,2=24V) Item Min Limit Typ Max - 0.6 3.0 2.0 25 - RON Symbol Unit Conditions 1.5 7.0 mA mA PS=L PS=H, VREF=2V 50 0 5.5 0.8 80 10 V V μA μA Input Voltage=5V Input Voltage=0V - 2.8 3.6 Ω ILEAK - - 10 μA IRNF IVREF VREF VCTHLL VCTHHL VCTHLH TONMIN -40 -1.0 0 0.340 0.227 0.113 0.3 -20 -0.1 0.400 0.267 0.133 0.5 2.0 0.460 0.307 0.153 1.0 μA μA V V V V μsec Whole Circuit current at standby IVMST Circuit current IVM Control input (PHA1,PHA2,I01,I11,I02,I12,PS) H level input voltage VINH L level input voltage VINL H level input current IINH L level input current IINL Output (OUT1A,OUT1B,OUT2A,OUT2B) Output ON resistance Output leak current Current control RNFX input current VREF input current VREF input voltage range Comparator threshold 100% Comparator threshold 67% Comparator threshold 33% Minimum on time REV. B IOUT=0.3A, Sum of upper and lower RNFX=0V VREF=0V VREF=2V, I0x=L, I1x=L VREF=2V, I0x=H, I1x=L VREF=2V, I0x=L, I1x=H R=39kΩ, C=1000pF 3/4 ○Package outline Product No. BD6290 Lot No. HTSSOP-B24 (Unit:mm) ○Block diagram ○Pin No. / Pin name Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 3 VM1 4 OUT1A PHA1 1 CR1 21 I01 24 I11 23 ONE SHOT LOGIC Predriver 6 OUT1B 5 RNF1 OCP DAC Current Limit Comp. 9 OUT2A PHA2 12 CR2 16 I02 13 I12 14 10 VM2 ONE SHOT LOGIC Predriver 7 OUT2B 8 RNF2 OCP DAC Current Limit Comp. VREF 22 Pin Name PHA1 PGND VM1 OUT1A RNF1 OUT1B OUT2B RNF2 OUT2A VM2 NC PHA2 2 PGND Buffer NC : Non Connection TSD PS 20 17 TEST RESET UVLO OVLO GND 19 REV. B Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Pin Name I02 I12 NC CR2 TEST NC GND PS CR1 VREF I11 I01 4/4 ○Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Power supply lines As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) GND potential The potential of GND pin must be minimum potential in all operating conditions. (4) Metal on the backside (Define the side where product markings are printed as front) The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than GND. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (6) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (7) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (8) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (9) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. (10) Mounting errors and Inter-pin short When attaching to a printed circuit board, pay attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (11) TEST pin Be sure to connect TEST pin to GND. REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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