DATA SHEET ANTI-SULFURATED CHIP RESISTORS AF122 (4Pin/2R) / AF124 (8Pin/4R) / AF164 (8Pin/ 4R) 5%, 1% sizes 2 × 0402, 4 x 0402, 4 x 0603 Product specification –May 29, 2015 V.2 RoHS compliant Product specification Chip Resistor Surface Mount SCOPE This specification describes AF122/AF124/AF164 (convex)series chip resistor arrays with lead-free terminations made by thick film process. AF 2 8 122/124/164 (RoHS Compliant) SERIES ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC Both part numbers are identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and resistance value. YAGEO BRAND ordering code GLOBAL PART NUMBER (PREFERRED ) AF XX X - X X X XX XXXX L APPLICATIONS Industrial Equipment (1) (2) (3) (4) (5) (6) (1) SIZE Power Application 12 = 0402 x 2 (0404) Networking Application 12 = 0402 x 4 (0408) High-end Computer & Multimedia Electronics in high sulfur environment 16 = 0603 x 4 (0612) FEATURES RoHS compliant Products with lead free terminations meet RoHS requirements Pb-glass contained in electrodes Resistor element and glass are exempted by RoHS Reducing environmentally hazardous wastes High component and equipment reliability (2) NUMBER OF RESISTORS 2 = 2 resistors 4 = 4 resistors (3) TOLERANCE F = ±1% J = ±5% (for Jumper ordering, use code of J) (4) PACKAGING TYPE R = Paper taping reel (5) TEMPERATURE COEFFICIENT OF RESISTANCE – = Base on spec (6) TAPING REEL 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel Saving of PCB space None forbidden-materials used in products/production (7) (7) RESISTANCE VALUE There are 2~4 digits indicated the resistor value. Letter R/K/M is decimal point, no need to mention the last zero after R/K/M, e.g.1K2, not 1K20. Halogen Free Epoxy Detailed resistance rules show in table of “Resistance rule of global part number”. Moisture sensitivity level: MSL 1 (8) DEFAULT CODE Letter L is the default only. (Note) Resistance rulesystem of global partcode for ordering O RDERING EXAMPLE number Resistance code rule 0R Example 0R = Jumper XRXX (1 to 9.76 Ω) 1R = 1 Ω 1R5 = 1.5 Ω 9R76 = 9.76 Ω XXRX (10 to 97.6 Ω) 10R = 10 Ω 97R6 = 97.6 Ω XXXR (100 to 976 Ω) 100R = 100 Ω XKXX (1 to 9.76 KΩ) 1K = 1,000 Ω 9K76 = 9760 Ω XM (1 MΩ) The ordering code of a AF122 convex chip resistor array, value 1,000Ω with ± 5% tolerance, supplied in 7-inch tape reel is: AF122-JR-071KL. NOTE 1. All our R-Chip products meet RoHS compliant. "LFP" of the internal 2D reel label mentions "Lead Free Process" 2. On customized label, "LFP" or specific symbol printed and the optional "L" at the end of GLOBAL PART NUMBER 1M = 1,000,000 Ω www.yageo.com May 29, 2015 V.2 Product specification Chip Resistor Surface Mount AF SERIES 3 8 122/124/164 (RoHS Compliant) MARKING AF122 No marking Fig. 1 AF124 / 164 I-Digit marking Fig. 2 Value = 0Ω 1% E-24/E-96: R≧ 100Ω 4digits First three digits for significant figure and 4th digit for number of zeros Fig. 3 Value = 316KΩ 5% E-24: R≧ 10Ω First two digits for significant figure and 3rd digit for number of zeros Fig. 3 Value = 240KΩ For further marking information, please refer to data sheet “Chip resistors marking”. CONSTRUCTION The resistor is constructed on top of a high-grade ceramic body. Internal metal electrodes are added on each end to make the contacts to the thick film resistive element. The composition of the resistive element is a noble metal imbedded into a glass and covered by a second glass to prevent environment influences. The resistor is laser trimmed to the rated resistance value. The resistor is covered with a protective epoxy coat, finally the external terminations (matte tin on Nibarrier) are added as shown in Fig.4. OUTLINES Fig. 4 Chip resistor outlines DIMENSIONS Table 1 TYPE AF122 AF124 AF164 B (mm) 0.24±0.10 0.25±0.15 0.35±0.15 H (mm) 0.30+0.10/-0.05 0.45±0.05 0.65±0.05 --- 0.30±0.05 0.50±0.15 P (mm) 0.67±0.05 0.50±0.05 0.80±0.05 L (mm) 1.00±0.10 2.00±0.10 3.20±0.15 T (mm) 0.30±0.10 0.45±0.10 0.60±0.10 W1 (mm) 0.25±0.10 0.30±0.15 0.30±0.15 W2 (mm) 1.00±0.10 1.00±0.10 1.60±0.15 H1 (mm) For dimension, please refer to Table 1 AF124 / 164 AF122 Fig. 5 AF122/124/164 series chip resistors dimension www.yageo.com May 29, 2015 V.2 4 Product specification Chip Resistor Surface Mount AF SERIES 8 122/124/164 (RoHS Compliant) SCHEMATIC For dimension, please refer to Fig. 5 and Table 1 AF122 AF124/ 164 Fig. 6 Equivalent circuit diagram R1=R2=R3=R4 ELECTRICAL CHARACTERISTICS Table 2 CHARACTERISTICS AF122 AF124 AF164 –55 °C to +125 °C –55 °C to +155 °C –55 °C to +155 °C 1/16 W 1/16 W 1/16W Maximum Working Voltage 50 V 25 V 50V Maximum Overload Voltage 100 V 50 V 100V Dielectric Withstanding Voltage 100 V 100 V 100V Operating Temperature Range Rated Power Resistance Range Temperature Coefficient Jumper Criteria 5% (E24) 1 Ω to 1 MΩ 5% (E24) 1% (E24/E96) 10 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ 1 Ω to 1 MΩ Jumper < 50 mΩ Jumper < 50 mΩ 1 Ω ≤ R < 10 Ω ±250 ppm/°C 1 Ω ≤ R < 10 Ω ±250 ppm/°C 10 Ω ≤ R ≤ 1 MΩ ±200 ppm/°C 10 Ω ≤ R ≤ 1 MΩ ±200 ppm/°C Rated Current Maximum Current 0.5 A Rated Current 1.0 A 1.0 A Maximum Current 2.0 A 5%(E24) 1% (E24/E96) 1Ω to 1MΩ 1Ω to 1MΩ Jumper <50 mΩ ±250 ppm/°C Rated Current 1.0A Maximum Current 2.0A FOOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles, please refer to data sheet “Chip resistors mounting”. PACKING STYLE AND PACKAGING QUANTITY Table 3 Packing style and packaging quantity PACKING STYLE REEL DIMENSION Paper Taping Reel (R) AF122 AF124 AF164 7" (178 mm) 10,000 units 10,000 units 5,000 units 13" (330 mm) 50,000 units 40,000 units 20,000 units NOTE 1. For paper tape and reel specification/dimensions, please refer to data sheet “Chip resistors packing”. www.yageo.com May 29, 2015 V.2 Product specification Chip Resistor Surface Mount AF SERIES 5 8 122/124/164 (RoHS Compliant) FUNCTIONAL DESCRIPTION POWER RATING AF122 / AF124 / AF164 rated power at 70 °C is 1/16 W R ATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: AF124 / 164 AF122 V= (P X R) or max. working voltage whichever is less Where V=Continuous rated DC or AC (rms) working voltage (V) Fig. 7 Maximum dissipation (P) in percentage of rated power as a function of the operating ambient temperature (T amb ) P=Rated power (W) R=Resistance value (Ω) www.yageo.com May 29, 2015 V.2 Product specification Chip Resistor Surface Mount AF SERIES 6 8 122/124/164 (RoHS Compliant) TESTS AND REQUIREMENTS Table 4 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE Life/ Operational Life/ Endurance MIL-STD-202-method 108 High Temperature Exposure MIL-STD-202-method 108 IEC 60115-1 4.25.1 1,000 hours at 70±5 °C applied RCWV 1.5 hours on, 0.5 hour off, still air required REQUIREMENTS ±(2%+0.05 Ω) <100 mΩ for Jumper JIS C 5202-7.10 1,000 hours at maximum operating temperature depending on specification, unpowered ±(1%+0.05 Ω) <50 mΩ for Jumper No direct impingement of forced air to the parts Tolerances: 125±3 °C Moisture Resistance MIL-STD-202-method 106 Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered ±(2%+0.05 Ω) <100 mΩ for Jumper Parts mounted on test-boards, without condensation on parts Measurement at 24±2 hours after test conclusion Thermal Shock MIL-STD-202-method 107 -55/+125 °C ±(1%+0.05 Ω) Note: Number of cycles required is 300. Devices mounted <50 mΩ for Jumper Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air Short Time Overload Board Flex/ Bending IEC60115-1 4.13 IEC60115-1 4.33 2.5 times RCWV or maximum overload voltage whichever is less for 5 sec at room temperature ±(2%+0.05 Ω) Device mounted on PCB test board as described, only 1 board bending required ±(1%+0.05 Ω) 3 mm bending No visible damage <50 mΩ for Jumper No visible damage <50 mΩ for Jumper Bending time: 60±5 seconds Ohmic value checked during bending www.yageo.com May 29, 2015 V.2 Product specification Chip Resistor Surface Mount AF SERIES 7 8 122/124/164 (RoHS Compliant) TEST TEST METHOD PROCEDURE REQUIREMENTS Solderability - Wetting J-STD-002B test B Electrical Test not required Well tinned (≥95% covered) No visible damage Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: leadfree solder bath at 245±3 °C Dipping time: 3±0.5 seconds - Leaching STD-002B test D Leadfree solder, 260 °C, 30 seconds immersion time No visible damage - Resistance to Soldering Heat IEC 60115-1 4.18 Condition B, no pre-heat of samples ±(1%+0.05Ω) MIL-STD-202 Method 210 Leadfree solder, 260 °C, 10 seconds immersion time <50 mΩ for Jumper No visible damage Procedure 2 for SMD: devices fluxed and cleaned with isopropanol FOS ASTM-B-809-95 Sulfur (saturated vapor) 1000 hours, 90±2°C, unpowered. ±(1.0%+0.05Ω) ASTM-B-809-95* Sulfur 750 hours, 105℃, unpowered ±(4.0%+0.05Ω) *Modified www.yageo.com May 29, 2015 V.2 Product specification Chip Resistor Surface Mount AF SERIES 122/124/164 (RoHS Compliant) 8 8 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 2 May 29,2015 - - Add in AF164 Version 1 Aug. 15, 2014 - - Update AF124 dimensions Version 0 Oct. 02, 2013 - - First issue of this specification “ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any product change will be announced by PCN.” www.yageo.com May 29, 2015 V.2