Handling Instruction

flowSCREW 4w packages
Copyright Vincotech
Handling Instructions
for all flowSCREW 4w module housing types:
flowSCREW4w, 2xflowSCREW4w, 3xflowSCREW4w
Handling Instruction
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Table of contents:
1
General remarks .........................................................................................................................................................4
2
Specification for the driver PCB ..................................................................................................................................5
2.1
PCB assembly with press-fit technology ........................................................................................................................6
2.2
PCB assembly with soldered Press-fit pin modules ........................................................................................................6
3
Base plate surface specification ..................................................................................................................................6
4
Heatsink specification ................................................................................................................................................8
5
Thermal grease specification ......................................................................................................................................8
5.1
Option 1: Uniform layer of thermal paste .....................................................................................................................8
5.2
Option 2: Module with pre-applied thermal phase change material ............................................................................8
6
Screw and torque specifications for fastening the module to the heatsink.................................................................9
7
Screw specification for fastening main terminals to bus bars ...................................................................................11
8
flowSCREW 4w modules in parallel mode ................................................................................................................11
8.1
Mounting the M4 hex nut-holder for side connection .................................................................................................11
8.2
Interconn PCB ..............................................................................................................................................................12
9
Press-fitting ..............................................................................................................................................................13
9.1 Press-in setup ..............................................................................................................................................................13
9.1.1
Press-in tool .......................................................................................................................................................14
9.1.2
Support plate .....................................................................................................................................................14
9.2 Press-fitting parameters ..............................................................................................................................................14
9.2.1
Basic requirements for press-fitting ..................................................................................................................15
9.3
Process control parameters .........................................................................................................................................15
9.4
Disassembling a driver PCB .........................................................................................................................................16
10
Recommendation for soldering ................................................................................................................................17
10.1
Wave soldering modules with solder pins ..............................................................................................................17
10.2
Hand soldering parameters ....................................................................................................................................18
11
Accessories and application support ........................................................................................................................18
12
ESD protection..........................................................................................................................................................18
13
Disclaimer ................................................................................................................................................................18
Handling Instruction
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Table of figures:
Figure 1: Module with driver PCB and heatsink ................................................................................................... 4
Figure 2: Height of the pinhead's center line from the bottom of the base plate ............................................. 5
Figure 3: Recommended hole and cutout sizes on the driver PCB ................................................................... 5
Figure 4: Scratch and etching hole dimensions .................................................................................................. 7
Figure 5: Polished surface ...................................................................................................................................... 7
Figure 6: Surface discoloration .............................................................................................................................. 7
Figure 7: Fingerprint on the surface ...................................................................................................................... 8
Figure 8: Thermal paste in a honeycomb pattern .................................................... Error! Bookmark not defined.
Figure 9: Screws positions in sequence ............................................................................................................. 10
Figure 10: Mounting an M4 hex nut holder ......................................................................................................... 11
Figure 11: Interconn PCB...................................................................................................................................... 12
Figure 12: Recommended setup for press-fitting .............................................................................................. 13
Figure 13: Recommended dimensions for the press-in tool............................................................................. 14
Figure 14: Press-in depth in a PCB ...................................................................................................................... 15
Figure 15: Diagram of a typical press-fitted 20-pin module .............................................................................. 16
Figure 16: Cutting edge......................................................................................................................................... 16
Figure 17: Plated through hole, well soldered .................................................................................................... 17
Figure 18: Typical profile for wave soldering ..................................................................................................... 17
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1 General remarks
Figure 1 shows the basic structure of the flowSCREW 4w type module. It attaches to a
heatsink with the driver PCB to be mounted on the top of the module. Electrical connections
between the module and driver PCB are soldered or press-fitted. Fasten main terminals to bus
bars using the screw types specified in section 7. The hex nut holders shown in Figure 1 are
used for applications where modules operate in multiphase systems or in parallel. An optional
connector PCB is available on demand for such applications. See section 9 for details.
Figure 1: Module with driver PCB and heatsink
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The distance between the top of the heatsink and the center plane of the driver PCB is
20.68±0.2 mm centered on the pinhead as shown in Figure 2.
Figure 2: Height of the pinhead's center line from the bottom of the base plate
During PCB assembly, do not pull or push auxiliary press-fit or soldered pins more than ±0.2
mm, nor exert a force greater than 35 N except when press-fitting pins. Press-fit pins are
designed to prevent pin deformations greater than 0.1 mm when they are pressed in.
After mounting, pin tension may not exceed ±5 N at a maximum substrate temperature of
100 C.
2 Specification for the driver PCB


Printed board material must comply with IEC 61249-2-7.
There is no limit as to the maximum number of conductive layers.
The driver PCB attaches to the module with four type BN82428 (screws D=2.5 mm and
L=6mm). The recommended mounting torque is 0.4Nm. Figure 3 shows the recommended
holes and cutouts on the driver PCB.
Figure 3: Recommended hole and
cutout sizes on the driver PCB
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2.1 PCB assembly with press-fit technology
 The driver PCB may be screwed to the module after press-fitting. This is recommended
if there are cable connectors or plugs on the PCB.
 The driver PCB may be no less than 1.6 mm thick.
 The PCB is to be covered with solder mask on both sides.
 The plated through-hole specification for press-fit pins is as follows:
o Hole size prior to plating: 1.6 +/-0.025 mm
o Thickness of the PTH wall > 25 μm Cu
o The plated hole's final size: 1.45 +0.09 / -0.06 mm
o Minimum Cu width of the annular ring > 0.1 mm
 Plating material:
o Sn: 0.5 µm – 10 µm
The PCB may be disassembled and reused twice.
o Au: 0.05 – 0.2 μm over 2.5 – 5 μm Ni.
The PCB may be used once only!
(Any other kind of plating needs to be tested.)
 Minimum distance between the edge of the PCB and center of the pinhole: 4 mm
 Minimum distance between the center of the pinhole and the component on the PCB: 4
mm
2.2 PCB assembly with soldered Press-fit pin modules
The recommended PCB hole diameter is 1.85 ± 0.1 mm for Press-fit pins that are to be
soldered rather than press-fitted. Note that the annular ring has to be designed to the
standards for through-hole components.
For more on this, please read section 11, Recommendation for soldering.
3 Base plate surface specification
The mounted module's thermal properties will not be affected by surface imperfections if the
following rules are observed:
 The entire nickel plated surface may be polished (see Figure 5) provided that the
copper is not exposed.
 A module is deemed to be scratched when the base plate copper is visible. The
scratch's depth and width may not exceed 200 μm and 800 μm. The length is
undefined, but the total area of scratches may not exceed 5% of the overall substrate
surface.
 The diameter and depth of etching holes must be less than 1000 μm and 200 μm as
shown in Figure 4.
Discolorations and fingerprints on the base plate are merely surface imperfections and do not
adversely affect the module's functions (see Figures 6 and 7).
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Figure 4: Scratch and etching hole dimensions
Figure 5: Polished surface
Figure 6: Surface discoloration
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Figure 7: Fingerprint on the surface
4 Heatsink specification
The heatsink's surface below the module must be plane, clean and free of particles.
 Its flatness must be < 0.025 mm.
 Surface roughness is to be less than Rz = 0.01 mm.
5 Thermal grease specification
The recommended means of applying paste is screen printing. Thermal resistance (Rth)
increases if the paste is thicker than recommended. Modules are also available with phase
change material (option -/2/), whereby the Rthc-h is guaranteed, provided that the heatsink
specification remains unchanged.
5.1 Option 1: Uniform layer of thermal paste
Apply a uniform layer of thermal conductive paste with 0.110 ± 0.015 mm thickness, fully
covered the bottom of the module.
5.2 Option 2: Module with pre-applied thermal phase change material
flowSCREW 4w modules family is offered with pre-applied phase change material as well.
(bottom surface of the module under the active area is covered with a honeycomb pattern).
In order to receive flowSCREW 4w products with applied phase change material please write:
-/3/
at the end of the product ordering code.
Ordering example:
70-W212NMA600SC-M200P-/3/
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6 Screw and torque specifications for fastening the module to the
heatsink





M5 screws (The recommended screw type is DIN 7984.)
Flat washer: D = max. 10 mm, ISO 7092 (DIN 433)
Spring washer: D = max. 10 mm, DIN127 or DIN 128
Mounting torque: 4 Nm < Ma < 6Nm
Thread length into the heatsink: min. 9 mm (depending on the material properties of the
heatsink and screw)
Tighten screws in the sequence given below and shown in Figure 9:
1) Attach the module loosely with two diagonal screws, e.g. 1&3, 1&4 or 1&5.
2)



Tighten screws with 0.5 Nm torque in the following sequence:
flowSCREW4w:
screw 1 – 4 – 2 – 3
2x flowSCREW4w: screw 2 – 5 – 1 – 6 – 3 – 4
3x flowSCREW4w: screw 2 – 7 – 3 – 6 – 1 – 8 – 4 – 5
3) Tighten the screws with 5 Nm torque in the same sequence.
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Figure 8: Screws positions in sequence
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7 Screw specification for fastening main terminals to bus bars




M6 screw: The threaded hole's depth in the module is 12 mm max. from the main
terminal's topside. (See the outline drawing for detailed dimensions.)
Mounting torque: 2.5 Nm < Ma < 5 Nm
Flat washer: ISO 7092 (DIN 433)
Spring washer: DIN127 or DIN 128
8 flowSCREW 4w modules in parallel mode
8.1 Mounting the M4 hex nut-holder for side connection
Push in the M4 hex nut-holders from the side of the module and clip the mounting clips into the
PCB cutouts (see Figure 10). The shape of the cutout may vary for different PCB thicknesses.
M4 hex nut: The hole's depth in the holder is 8 mm max. from the module's topside. (See the
outline drawing for detailed dimensions.)
Figure 9: Mounting an M4 hex nut holder
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8.2 Interconn PCB
If you wish to operate modules in parallel, mount an Interconn PCB to the side connectors (see
Figure 11) after the modules are attached to the heatsink. Use M4 hex nut holders with the
following components and torque to fasten it to modules' side connectors:
 M4 screws
 Mounting torque: 2 < Ma < 2.2 Nm
 Flat washer: ISO 7092 (DIN 433)
 Spring washer: DIN 127 or DIN 128
Please contact the local sales or distribution office to learn more about Interconn PCBs and
ordering codes.
Figure 10: Interconn PCB
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9 Press-fitting
9.1 Press-in setup
We recommend pressing the driver PCB onto the module from the top down as shown in
Figure 11.
Figure 11: Recommended setup for press-fitting
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9.1.1 Press-in tool
Make sure the press-in tool is larger than the driver PCB.
 The recommended diameter of holes/ cutouts for the pins is 1.7 to 4 mm, depending on
positioning accuracy, as shown on Figure 12. Allow for at least 2 mm supporting space
around the pin (see Figure 13). An elongated cutout for several pins may be made if the
pins are close together. The PCB and module must also be positioned. The size and
position of holes and cutouts will be determined by the components on the PCB.
Cutouts for pins are to be 6 mm deep.
Figure 12: Recommended dimensions for the press-in tool
Recommended material for the press-in tool:
 Tempered aluminum alloy grade 7075-T6 with 430 Mpa yield strength and 160 HB
hardness or
 Steel-grade 21 MnCr 5 with 660 Mpa yield strength and 330 HB or better hardness
9.1.2 Support plate
 The support plate positions and supports the module during press-fitting.
 The recommended material for the support plate is:
o ESD-proof POM (polyoxymethylene) or any metal alloy
9.2 Press-fitting parameters


Press-in force: 90 N / pin – 150 N / pin
Press-in speed: 5 mm/s – 10 mm/sThe total press-in force depends on the number of
pins, hole diameter and plating (type/quality) of the PCB.
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9.2.1 Basic requirements for press-fitting
Ensure press-fit pins are pressed into the holes on the PCB at the correct depth. The center of
the press-fit pinhead has to be at least 0.5 mm below the top surface and at least 0.5 mm
above the bottom surface of the PCB (Figure 13).
Figure 13: Press-in depth in a PCB
9.3 Process control parameters
The following values are relevant to quality and should be taken into consideration if the
pressing machine is able to record force-stroke values during the process. Figure 14 diagrams
a normal press-fitting procedure. It shows three different sections:
 First ascending section (blue): The heads of the press-fit pins slide in and deform to fit
into the holes. This section ends with a local maximum.
 Second section (green): The centers of the pinheads are inside the holes. The pins slide
all the way in to reach their final positions. This section ends with a local minimum.
 Second ascending section (red): The pins come to a stop. The press-in tool starts to
bend the PCB.
The pressing action has to stop at the beginning of the second ascending section to prevent
damage to the PCB. The press-in force or the tool's stroke motion has to be controlled so it
stops at this point.
Process control parameters can be set as follows:
 The local maximum value (end of the blue section) of the force-stroke diagram has to
be:
o higher than 90 N x number of pins
o lower than 150 N x number of pins
 These limits are indicated in the diagram. If the press-in force is not within this range,
the plating may be faulty or the holes' diameter may be incorrect.
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Figure 14: Diagram of a typical press-fitted 20-pin module
9.4 Disassembling a driver PCB
If the driver PCB is no larger than the module, the PCB cannot be disassembled by pressing it
out. In this case, the only way to remove the PCB is to cut the pin ends.
Manual disassembly with pliers is an option if the Press-fit pinhead is overlapped by the PCB
so that the spring-end projects out of the PCB. Ensure you cut at level A as indicated in Figure
16, below where the two parts of the pinhead come together. Remove the driver PCB from the
module after clipping off all pinheads.
Figure 15: Cutting edge
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10 Recommendation for soldering
Figure 16: Plated through hole, well soldered
Plated through holes should exhibit a vertical solder fill of 100%, with a fully formed fillet on the
solder side and evidence of 100% wetting on the component side lead, barrel and pad.
10.1 Wave soldering modules with solder pins
Figure 17: Typical profile for wave soldering
Some but not all modules with press-fit pins may also be wave-soldered.
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10.2 Hand soldering parameters
 Max. solder iron temperature: 350 °C
 Max. contact time with component lead: 10 s
 Number of heat cycles: 3
11 Accessories and application support
Vincotech offers the following application boards for products with flowSCREW 4w packaging:
o Interconn-M200-P2 (mounted with 4 screws)
o Interconn-M200-P4 (mounted with 8 screws)
o GD-M200-MASTER (master driver board)
o GD-M200-SLAVE (slave driver board)
Please contact the local sales or distribution office for samples of and documentation on these
adapter boards.
12 ESD protection
Modules are sensitive to electrostatic discharges because these can damage or destroy
sensitive semiconductors. Semi-conductive plastic trays in the shipment box protect all
modules against ESD. We recommend wearing a conductive grounded wristlet and working at
a conductive grounded station when handling and assembling modules.
The modules' ESD sensitivity levels pursuant
follows:
ESD STM5.1-1998 Human Body Model:
ESD STM5.2-1999 Machine Model:
ESD STM5.3.1-1999 Charged Device Model:
to the ESD Association's classification are as
Class 0
Class M1
Class C1
Please also comply with the EN61340-5-1 and ANSI S20.20 standards when handling devices
that are sensitive to electrostatic discharges:
13 Disclaimer
The information given in this document should not be used in substitution for the customer’s
tests because the conditions and circumstances of the application are beyond Vincotech's
control. The content of this document is true and accurate to the best of our knowledge,
reflects current standards, and has been compiled with due care.
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