ZSSC3123 cLite™ Capacitive Sensor Signal Conditioner Brief Description Benefits The ZSSC3123 is a CMOS integrated circuit for accurate capacitance-to-digital conversion and sensor-specific correction of capacitive sensor signals. Digital compensation of sensor offset, sensitivity, and temperature drift is accomplished via an internal digital signal processor running a correction algorithm with calibration coefficients stored in a non-volatile EEPROM. The ZSSC3123 is configurable for capacitive sensors with capacitances up to 260pF and a sensitivity of 125aF/LSB to 1pF/LSB depending on resolution, speed, and range settings. It is compatible with both single capacitive sensors (both terminals must be accessible) and differential capacitive sensors. Measured and corrected 2 sensor values can be output as I C™*, SPI, PDM, or alarms. 2 The I C™ interface can be used for a simple PC-controlled calibration procedure to program a set of calibration coefficients into an on-chip EEPROM. The calibrated ZSSC3123 and a specific sensor are mated digitally: fast, precise, and without the cost overhead of trimming by external devices or laser. Minimized calibration costs: no laser trimming, onepass calibration using a digital interface Wide capacitance range to support a broad portfolio of different sensor elements Excellent for low-power battery applications Features Maximum Target input capacitance: 260pF Sampling rates as fast as 0.7ms at 8-bit resolution; 1.6ms at 10-bit; 5.0ms at 12-bit; 18.5ms at 14-bit st nd Digital compensation of sensor: piece-wise 1 and 2 rd order sensor compensation or up to 3 order singleregion sensor compensation st nd Digital compensation of 1 and 2 order temperature gain and offset drift Internal temperature compensation reference (no external components) Programmable capacitance span and offset Layout customized for die-die bonding with sensor for low-cost, high-density chip-on-board assembly † Accuracy as high as ±0.25% FSO@ -40 to 125°C, 3V, 5V, Vsupply ±10% Interfaces I²C™ or SPI interface—easy connection to a µC PDM outputs (Filtered Analog Ratiometric) for both capacitance and temperature Up to two alarms that can act as full push-pull or opendrain switches Physical Characteristics Supply voltage: 2.3V to 5.5V Typical current consumption 650μA down to 60μA depending on configuration Typical Sleep Mode current: ≤ 1μA at 85°C Operation temperature: –40°C to +125°C Die or TSSOP14 package Available Support ZSSC3123 SSC Evaluation Kit available: SSC Evaluation Board, samples, software, documentation. Support for industrial mass calibration available. Quick circuit customization option for large production volumes. Application: Digital Output, Alarms VSUPPLY VDD cLite™ Vcore ZSSC3123 (2.3V to 5.5V) 0.1µF 0.1µF Ready VSS GND SDA/MISO SCL/SCLK SS C0 Alarm_High CC Alarm_Low * I2C™ is a registered trademark of NXP. † See data sheet section 1.3 for restrictions. For more information, contact us at [email protected]. © 2013 Zentrum Mikroelektronik Dresden AG — Rev. 1.62 — December 11, 2013. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. ZSSC3123 cLite™ Capacitive Sensor Signal Conditioner ZSSC3123 ZSSC3123 cLite™ Capacitive Sensor Signal Conditioner Block Diagram VDD (2.3V to 5.5V) Temp Sensor Vcore Ref Cap Offset Cap EEPROM 0.1µF CLK/Reset Ready SCL/SCLK SDA/MISO PDM 0.1µF Sensor C/A C0 C0 CC C1 C1 Ready/PDM_C I2C / SPI D Alarm_Low/PDM_T DSP Low Alarm SS CDC High Alarm (Optional) MUX Alarm_High ROM Analog Core VSS Application: Analog Output Output Communication Digital Core Application: Differential Capacitance Input V 0.1µF 0.1µF VDD cLite™ Vcore ZSSC3123 PDM_C SUPPLY (+2.3V to 5.5V) VSUPPLY 0.1µF Cap. Analog Output 0.1µF PDM_T C0 GND Temp Analog Output ZSSC3123 VSS SDA/MISO C0 SCL/SCLK SS CC LED CC cLite™ Vcore Ready VSS GND VDD (+2.3V to 5.5V) Alarm_High C1 Alarm_High Alarm_Low Ordering Codes Sales Code Description Package ZSSC3123AA1B ZSSC3123 die — Temperature range: -40°C to +125°C Tested dice on un-sawn wafer ZSSC3123AI1B ZSSC3123 die — Temperature range: -40°C to +85°C Tested dice on un-sawn wafer ZSSC3123AA1C ZSSC3123 die — Temperature range: -40°C to +125°C Tested dice on frame ZSSC3123AI1C ZSSC3123 die — Temperature range: -40°C to +85°C Tested dice on frame ZSSC3123AA2 ZSSC3123 TSSOP14 — Temperature range: -40°C to +125°C – Lead-free package Tube: add “T” to code; reel: add “R” ZSSC3123AI2 ZSSC3123 TSSOP14 — Temperature range: -40°C to +85°C – Lead-free package Tube: add “T” to code; reel: add “R” ZSSC3123KIT Kit ZSSC3123 SSC Evaluation Kit: Communication Board, SSC Board, Sensor Replacement Board, USB Cable, 5 IC Samples (software can be downloaded from www.zmdi.com/zssc3123) Sales and Further Information Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany Central Office: Phone +49.351.8822.0 Fax +49.351.8822.600 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA USA Phone +855.275.9634 Phone +408.883.6310 Fax +408.883.6358 www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone Fax Phone Fax +81.3.6895.7410 +81.3.6895.7301 +886.2.2377.8189 +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building 11th Floor, Unit JA-1102 670 Sampyeong-dong Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. © 2013 Zentrum Mikroelektronik Dresden AG — Rev. 1.62 — December 11, 2013 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.