WLP(Wafer ( Level Package) g ) New Product Leaflet XC6602,XC9235/36/37 Series Digital Camera Smartphone Notebook PC WLP stands for “Wafer Level Package”, and is a package for ultrasmall chip sizes. The XC6602 series (LDO regulators) and the XC9235/XC9536/XC9237 series (step-down DC/DC converters) are available in a WLP package. The XC6602 series are high-speed LDO regulators with an ultra-low ON resistance that can operate from an input voltage of 0.5V at a maximum output current of 1A maximum, and are ideal for applications that require efficient output of a large current at low voltages. The XC9235/XC9236/XC9237 series are synchronous step-down DC/DC converters with an internal 0.42Ω Pch MOS driver Tr. and an internal 0.52Ω Nch MOS switch Tr. These converters are able to provide a stable power supply with high efficiency at a maximum output of 600 mA. 1 WLP-5-03 (1.26x1.06x0.4mm) WLP-5-02 (1.25x0.88x0.4mm) WLP(Wafer Level Package) Torex’ s WLP (WL-CSP) is a Chip Scale Package. Using the WLP package, we are deploying a product line based on the concepts “ultra-small” , “ultra-thin” , and “conductivity” . The process consists of (1) circuit face polyimide protection, (2) rewiring, (3) rewiring polyimide protection, and (4) solder ball mounting (Fig. 1). There is no protection on the silicon face and laser marking is performed directly, for a simple structure that enables the features “small” , “thin” , and “low cost” . The distance between the circuit face and parts that connect to the board (solder balls) is short, allowing higher heat dissipation and easier heat treatment design than other devices of similar size (refer to Fig. 2, Structural Drawing). Structural Drawing (Fig.2) Redistribution Layer (Fig.1) Pl2 (Polyimide) Solder ball (Sn-3Ag-0.5Cu) Wafer stage (4)Solder ball mounting (1)Circuit face polyimide protection Formation of UBM (solder ball mount) Pl1 (Polyimide) Wefer pad opening (AI) Under Bump Metal (Cu+Ti) (2)Rewiring Sillicon Chip (Si) (3)Rewiring polyimide protection Re-Distribution Layer (Cu+Ti) XC6602 Features Maximum Output Current 1A(1.3A Limit) ON Resistance Bias Voltage Range 0.15Ω@VBIAS=3.6V,VOUT=1.2V 2.5V～6.0V Input Voltage Range Output Voltage Range 0.5V～3.0V 0.5V～1.8V(0.1V increments) Output Voltage Accuracy ±0.015V@VOUT＜1.2V ±0.020V@VOUT≧1.2V XC9235/XC9236/XC9237 Features 2.0V～6.0V Input Voltage Range Output Voltage Range Driver Transistor Built-In High Efficiency 60dB @ ｆ =1kHz(VBIAS_PSRR) Ripple Rejection 75dB @ ｆ =1kHz(VIN_PSRR) Low Power Consumption 100μA (VBIAS), 6.5μA (VIN)@VOUT=1.2V Stand-by Current 0.01μA(VBIAS), 0.01μA (VIN) Function Built-in Soft-start, CL Auto Discharge CE Pull-Down (Active High) Packages USP-6C, SOT-26W, SOT-89-5, WLP-5-02 Maximum Duty Cycle 100% 0.8V～4.0V 0.42ΩP-ch driver transistor Function Current Limiter Circuit Built-In(Constant Current & Latching) 0.52ΩN-ch switch transistor Control Methods CL Discharge, High Speed Soft Start 92%(TYP.) Output Current 600mA Oscillation Frequency 1.2MHz, 3.0MHz (±15%) PWM(XC9235) PWM/PFM Auto(XC9236) Packages PWM/PFM Manual(XC9237) SOT-25, USP-6C, USP-6EL, WLP-5-03 www.torex.co.jp/english/ February 2013 ● Values shown in this sheet can be changed without any prior notice. New Product Leaflet WLP(Wafer Level Package) XC6602, XC9235/36/37 Series 2 XC6602 Series The XC6602 series are 1A high-speed LDO regulators that support a low input voltage (from 0.5V). Bias voltage drive is used to enable operation at a low ON resistance even when the output voltage is low. In addition, voltage drops on the input-output line due to load fluctuations are reduced, and operation at a lower dropout voltage than previous products is possible. A stable output voltage can be supplied even when a large current is required. Since WLP-5-02 uses metal wiring instead of wire bonding, it can achieve a lower On resistance. As a result, the characteristic of dropout voltage and Vout-Iout are improve compared with the usual packages. (Fig. 3,4) Dropout Voltage (Fig.3) Output Voltage vs.Output Current (Fig.4) XC6602A121xR-G XC6602A121xR-G Ta=25℃,VIN=1.5V,VBIAS=VCE=3.6V,CBIAS=CIN=1.0μF,CL=2.2μF 1.60 200 180 160 140 120 100 80 60 40 20 0 0 WLP-5-02 SOT-26W 200 400 Output Voltage: VOUT[V] Dropout Voltage: Vdif [mV] Ta=25℃,VBIAS=VCE=3.6V,CBIAS=CIN=1.0μF,CL=2.2μF 600 800 1000 1.50 WLP-5-02 SOT-26W 1.40 1.30 1.20 1.10 1.00 0.90 0.80 0 200 Output Current:IOUT[mA] 3 400 600 800 1000 Output Current:IOUT[mA] 4 XC9235/XC9236/XC9237 Series Since WLP-5-03 package use metal wiring instead of wire bonding, the WLP-5-03 package enables to achieve 0.03Ω to 0.05Ω lower On resistance than other packages, which results in increasing the efficiency by 2 to 3% during heavy loads. (Fig. 5) Miniaturization is achieved Using a WLP package can be a space saving. XC6602 86％ Reduce 1.25mm 2.8mm Pch driver ON resistance (Fig.5) (depends on VIN) SOT-26W WLP-5-02 ON resistance Characteristics (IOUT=100mA) 0.88mm 0.8 ON resistance(Ω) 0.7 USP-6C WLP-5-03 0.6 2.9mm 0.5 XC9235/XC9236/XC9237 0.4 63％ 0.3 Reduce 0.2 1 2 3 4 VIN(V) 5 6 7 USP-6C 1.26mm 0.0 2.0mm 0.1 WLP-5-03 1.06mm 1.8mm www.torex.co.jp/english/ February 2013 ● Values shown in this sheet can be changed without any prior notice.