Packaging Information / Reference Pattern Layout Dimensions ●SOT-89 Unit: mm ■Packaging Information 4.5±0.1 1.6 +0.15 -0.2 (0.4) +0.03 0.4 -0.02 4.0±0.25 1.0±0.2 2.5±0.1 φ1.0 0.47±0.06 0.42±0.06 +0.03 0.4 -0.02 （1.7) 1.5±0.1 （0.25) （1.85) （0.4) 1.5±0.1 (0.1) 0.42±0.06 1.5±0.1 1.45 0.85 1.2 1.4 4.4 ■Reference Pattern Layout Dimension Taping Specifications ●SOT-89 Reel Unit: mm 1,000pcs/reel ●Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed ●SOT-89 Power Dissipation Power dissipation data for the SOT-89 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition : Mount on a board Ambient : Natural convection Soldering : Lead (Pb) free Board : Dimensions 40×40mm（1600mm2 in one side） In top and back faces 40.0 28.9 Copper (Cu) traces occupy 50% of the board area Package heat-sink is tied to the copper traces Material : Glass Epoxy（FR-4） Thickness : 1.6mm 2.5 Through-hole : 5 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Board Mount ( Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 1000 85 400 Thermal Resistance (℃/W） 100.00 Pd vs Ta Power Dissipation Pd（mW） 1200 1000 800 600 400 200 0 25 45 65 85 Ambient Temperature Ta（℃） 105 125 1/2 MOSFET DATA ●SOT-89 Power Dissipation (Tj=150℃) Power dissipation data for the SOT-89 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition : Mount on a board Ambient : Natural convection Soldering : Lead (Pb) free Board : Dimensions 250mm2 Material : Ceramic Thickness : 0.8mm Evaluation Board (Unit : mm) 2. Power Dissipation vs. Ambient temperature Board Mount ( Tjmax=150℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 1000 105 540 Thermal Resistance (℃/W） 83.33 Power Dissipation Pd（mW） Pd vs Ta 1600 1400 1200 1000 800 600 400 200 0 25 50 75 100 125 Ambient TemperatureTa（℃） 150 2/2 SOT-89 構造図 SOT-89 Perspective RoHS対応品 RoHS Compliance ① ② ③ ④ ⑤ 項 目 Item 封止樹脂 Resin リードフレーム Lead frame 端子処理 Lead plating ダイアタッチ Die attach ボンディングワイヤ Bonding wire シリコンチップ Silicon chip 捺印表示 Marking 材 料 Material エポキシ樹脂 Epoxy resin 銅系 Copper alloy 鉛フリーはんだメッキ Lead(Pb) free solder plating エポキシ Epoxy Au 備考 Note 難燃グレード/Flammability rating UL94V-0 Si レーザー Laser marking Ver.09