Packaging Information / Reference Pattern Layout Dimensions ●SOT-25 Unit: mm ■Packaging Information 2.9±0.2 +0.1 0.4 -0.05 5 4 1 2 0.2MIN 2.8±0.2 1.6 +0.2 -0.1 0~0.1 3 0.15 (0.95) 1.3MAX 1.1±0.1 1.9±0.2 ■Reference Pattern Layout Dimension 1.0 2.4 0.7 0.95 0.95 +0.1 -0.05 テーピング仕様 / Taping Specifications SOT-25 Unit: mm 11.4±1.0 ●リール/Reel 9.0±0.3 2±0.5 φ13±0.2 (1.5) 3,000pcs/reel 3.2±0.1 (2.75) 3.5±0.05 8.0±0.2 1.75±0.1 ●テーピング仕様/Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed ●SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition : Mount on a board Ambient : Natural convection Soldering : Lead (Pb) free Board : Dimensions 40×40mm(1600mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used) Material : Glass Epoxy(FR-4) Thickness : 1.6mm Through-hole : 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature(85℃) Board Mount ( Tjmax=125℃) Power Thermal Temperature Dissipation Resistance (℃) Pd (mW) (℃/W) 25 600 85 240 166.67 Pd vs Ta 700 Power Dissipation Pd(mW) Ambient 600 500 400 300 200 100 0 25 3. 45 65 85 Ambient Temperature Ta(℃) 105 125 Power Dissipation vs. Ambient temperature(105℃) Board Mount ( Tjmax=125℃) Power Thermal Temperature Dissipation Resistance (℃) Pd (mW) (℃/W) 25 600 105 120 166.67 Pd vs Ta Power Dissipation Pd(mW) Ambient 700 600 500 400 300 200 100 0 25 45 65 85 105 Ambient Temparature Ta(℃) 125 1/2 4. Power Dissipation vs. Ambient temperature(Tj=150℃) TVS DATA Board Mount ( Tjmax=150℃) Power Thermal Temperature Dissipation Resistance (℃) Pd (mW) (℃/W) 25 750 105 270 166.67 Pd vs Ta Power Dssipation Pd(mW) Ambient 800 700 600 500 400 300 200 100 0 25 50 75 100 125 Ambient TemperatureTa(℃) 150 2/2 SOT-25 構造図 SOT-25 Perspective ②リードフレーム Lead frame RoHS対応品 RoHS Compliance ①封止樹脂 Resin ④ボンディングワイヤ Bonding wire ⑤シリコンチップ Silicon chip ③ダイアタッチ Die attach 項 目 Item 材 料 Material 備考 Note 難燃グレード/Flammability rating UL94V-0 ① 封止樹脂 Resin エポキシ樹脂 Epoxy resin ② リードフレーム Lead frame 銅系 Copper alloy 端子処理 Lead plating 鉛フリーはんだメッキ Lead(Pb) free solder plating ③ ダイアタッチ Die attach エポキシ Epoxy ④ ボンディングワイヤ Bonding wire Au ⑤ シリコンチップ Silicon chip Si 捺印表示 Marking レーザー Laser marking Ver.11