SOT-25 Packaging Information / Reference Pattern Layout Dimensions

Packaging Information / Reference Pattern Layout Dimensions
●SOT-25
Unit: mm
■Packaging Information
2.9±0.2
+0.1
0.4 -0.05
5
4
1
2
0.2MIN
2.8±0.2
1.6 +0.2
-0.1
0~0.1
3
0.15
(0.95)
1.3MAX
1.1±0.1
1.9±0.2
■Reference Pattern Layout Dimension
1.0
2.4
0.7
0.95
0.95
+0.1
-0.05
テーピング仕様 / Taping Specifications
SOT-25
Unit: mm
11.4±1.0
●リール/Reel
9.0±0.3
2±0.5
φ13±0.2
(1.5)
3,000pcs/reel
3.2±0.1
(2.75)
3.5±0.05
8.0±0.2
1.75±0.1
●テーピング仕様/Taping Specifications
direction of feed
R Type :[Device orientation : Right]
Standard feed
●SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm(1600mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used)
Material : Glass Epoxy(FR-4)
Thickness : 1.6mm
Through-hole : 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2.
Power Dissipation vs. Ambient temperature(85℃)
Board Mount ( Tjmax=125℃)
Power
Thermal
Temperature
Dissipation
Resistance
(℃)
Pd (mW)
(℃/W)
25
600
85
240
166.67
Pd vs Ta
700
Power Dissipation Pd(mW)
Ambient
600
500
400
300
200
100
0
25
3.
45
65
85
Ambient Temperature Ta(℃)
105
125
Power Dissipation vs. Ambient temperature(105℃)
Board Mount ( Tjmax=125℃)
Power
Thermal
Temperature
Dissipation
Resistance
(℃)
Pd (mW)
(℃/W)
25
600
105
120
166.67
Pd vs Ta
Power Dissipation Pd(mW)
Ambient
700
600
500
400
300
200
100
0
25
45
65
85
105
Ambient Temparature Ta(℃)
125
1/2
4.
Power Dissipation vs. Ambient temperature(Tj=150℃)
TVS DATA
Board Mount ( Tjmax=150℃)
Power
Thermal
Temperature
Dissipation
Resistance
(℃)
Pd (mW)
(℃/W)
25
750
105
270
166.67
Pd vs Ta
Power Dssipation Pd(mW)
Ambient
800
700
600
500
400
300
200
100
0
25
50
75
100
125
Ambient TemperatureTa(℃)
150
2/2
SOT-25 構造図
SOT-25 Perspective
②リードフレーム
Lead frame
RoHS対応品
RoHS Compliance
①封止樹脂
Resin
④ボンディングワイヤ
Bonding wire
⑤シリコンチップ
Silicon chip
③ダイアタッチ
Die attach
項 目
Item
材 料
Material
備考
Note
難燃グレード/Flammability rating
UL94V-0
①
封止樹脂
Resin
エポキシ樹脂
Epoxy resin
②
リードフレーム
Lead frame
銅系
Copper alloy
端子処理
Lead plating
鉛フリーはんだメッキ
Lead(Pb) free solder plating
③
ダイアタッチ
Die attach
エポキシ
Epoxy
④
ボンディングワイヤ
Bonding wire
Au
⑤
シリコンチップ
Silicon chip
Si
捺印表示
Marking
レーザー
Laser marking
Ver.11