SOT-89-5 Packaging Information / Reference Pattern Layout

Packaging Information / Reference Pattern Layout Dimensions
●SOT-89-5
Unit: mm
(0.3)
(1.8)
(0.4)
1.5±0.1
(0.4)
(0.1)
0.8 MIN
2.5±0.1
4.35 MAX
0.8 MIN
■Packaging Information
■Reference Pattern Layout Dimension
2.0
1.0
1.5
0.7
1.5
テーピング仕様 / Taping Specifications
SOT-89-5
Unit: mm
15.4±1.0
●リール/Reel
13.0±0.5
2±0.5
φ 13±0.2
1,000pcs/reel
(1.5)
●テーピング仕様/Taping Specifications
direction of feed
R Type :[Device orientation : Right]
Standard feed
●SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm(1600mm2 in one side)
In top and back faces
40.0
28.9
Copper (Cu) traces occupy 50% of the board area
Package heat-sink is tied to the copper traces
Material : Glass Epoxy(FR-4)
Thickness : 1.6mm
2.5
Through-hole : 5 x 0.8 Diameter
Evaluation Board (Unit: mm)
2.
Power Dissipation vs. Ambient temperature(85℃)
Board Mount ( Tjmax=125℃)
Power
Thermal
Temperature
Dissipation
Resistance
(℃)
Pd (mW)
(℃/W)
25
1300
85
520
76.92
Pd vs Ta
1400
Power Dissipation Pd(mW)
Ambient
1200
1000
800
600
400
200
0
25
3.
45
65
85
Ambient Temperature Ta(℃)
105
125
Power Dissipation vs. Ambient temperature(105℃)
Board Mount ( Tjmax=125℃)
Power
Thermal
Temperature
Dissipation
Resistance
(℃)
Pd (mW)
(℃/W)
25
1300
105
260
76.92
Pd vs Ta
Power Dissipation Pd(mW)
Ambient
1400
1200
1000
800
600
400
200
0
25
45
65
85
105
Ambient Temperature Ta(℃)
125
SOT-89-5構造図
SOT-89-5 Perspective
RoHS対応品
RoHS Compliance
①
②
③
④
⑤
項 目
Item
封止樹脂
Resin
リードフレーム
Lead frame
端子処理
Lead plating
ダイアタッチ
Die attach
ボンディングワイヤ
Bonding wire
シリコンチップ
Silicon chip
捺印表示
Marking
材 料
Material
エポキシ樹脂
Epoxy resin
銅系
Copper alloy
鉛フリーはんだメッキ
Lead(Pb) free solder plating
エポキシ
Epoxy
Au
備考
Note
難燃グレード/Flammability rating
UL94V-0
Si
レーザー
Laser marking
Ver.09