XC6223 Series
ETR0339-009
Built-in Inrush Current Protection, 300mA High Speed LDO Voltage Regulator
■GENERAL DESCRIPTION
The XC6223 series is a high speed LDO regulator that features high accurate, low noise, high ripple rejection, low dropout
and low power consumption. The series consists of a voltage reference, an error amplifier, a driver transistor, a current limiter, a
phase compensation circuit, a thermal shutdown circuit and an inrush current protection circuit.
The CE function enables the circuit to be in stand-by mode by inputting low level signal. In the stand-by mode, the series
enables the electric charge at the output capacitor CL to be discharged via the internal switch, and as a result the VOUT pin
quickly returns to the VSS level. The output stabilization capacitor CL is also compatible with low ESR ceramic capacitors.
The output voltage is selectable in 0.05V increments within the range of 1.2V to 4.0V which fixed by laser trimming
technologies. The over current protection circuit and the thermal shutdown circuit are built-in. These two protection circuits
will operate when the output current reaches current limit level or the junction temperature reaches temperature limit level.
■APPLICATIONS
■FEATURES
●Digital still cameras
●Smart phones / Mobile phones
●Portable game consoles
●Modules (wireless, cameras, etc. )
●IC recorders
●Mobile devices / terminals
●Bluetooth
●Wireless LAN
●Digital TV tuners
Maximum Output Current
Input Voltage Range
Output Voltages
■ TYPICAL PERFORMANCE
CHARACTERISTICS
XC6223x251
2.60
400
2.55
350
2.50
2.45
Output Voltage
250
2.40
200
2.35
2.30
300
150
Output Current
2.25
100
50
2.20
Output Current Iout[mA]
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
Output Voltage: VOUT [V]
■TYPICAL APPLICATION CIRCUIT
: 300mA
: 1.6～5.5V
: 2.0～4.0V （Accuracy ±1%）
1.2～1.95V （Accuracy ±20mV）
0.05V increments
Dropout Voltage
: 200mV＠IOUT=300mA (VOUT=3.0V)
Low Power Consumption
: 100μA
Stand-by Current
: 0.1μA
High Ripple Rejection
: 80dB＠f=1kHz
Protection Circuits
: Current Limit（400mA）
Short Circuit Protection
Over Heat Protection
Inrush Current Protection
Low ESR Capacitors
: CIN =1.0μF, CL=1.0μF
CE Function
: Active High
CL High Speed Discharge
Operating Ambient Temperature : -40℃～+105℃
Packages
: USPQ-4B03
USP-4
SSOT-24
SOT-25
SOT-89-5
: EU RoHS Compliant, Pb Free
Environmentally Friendly
0
Time [20μs/div]
1/37
XC6223 Series
■PIN CONFIGURATION
*The dissipation pad for the USPQ-4B03,USP-4 packages should be solder-plated in reference mount pattern and metal masking so as to
enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No. 2) pin.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
4
VIN
Power Input
5
5
VOUT
Output
2
2
VSS
Ground
1
3
3
CE
ON/OFF Control
-
4
1
NC
No Connection
USPQ-4B03
USP-4
SSOT-24
SOT-25
SOT-89-5
4
4
4
1
1
1
3
2
2
2
3
3
-
-
■LOGIC CONDITION FOR THE PIN
PIN NAME
CE
2/37
DESIGNATOR
CONDITION
L
0V≦VCE≦0.3V
H
1.0V≦VCE≦5.5V
OPEN
CE=OPEN
XC6223
Series
■PIN FUNCTION ASSIGNMENT
CE LOGIC
CONDITION
IC OPERATION
H
Operation ON
L
Operation OFF(Stand-by)
OPEN
*
* Undefined state in XC6223 A/B/E/F/J/K/P/Q. On the other hand, Operation OFF states in XC6223C/D/G/H/M/N/R/T because
that an internal pull-down resister maintains the CE pin voltage to be low.
■PRODUCT CLASSIFICATION
●Ordering Information
XC6223①②③④⑤⑥-⑦(*1)
DESIGNATOR
ITEM
SYMBOL
(*3)
①
②③
Type of
Regulator
Output Voltage
A/J
B/K(*3)
C/M(*3)
D/N(*3)
E/P(*3)
F/Q(*3)
G/R(*3)
H/T(*3)
Without Inrush Current Protection, Without CE Pull-down, Without CL discharge (Semi-Custom)
12～40
ex.) 2.80V → ②=2, ③=8, ④=please see down below.
1
④
Output Accuracy
B
⑤⑥-⑦(*1)
(*1)
Packages
(Order Unit)
DESCRIPTION
9R-G
GR-G
NR-G
MR-G
PR-G
Without Inrush Current Protection, Without CE Pull-down, With CL discharge (Semi-Custom)
Without Inrush Current Protection, With CE Pull-down(*2), Without CL discharge (Semi-Custom)
Without Inrush Current Protection, With CE Pull-down(*2), With CL discharge
With Inrush Current Protection, Without CE Pull-down, Without CL discharge (Semi-Custom)
With Inrush Current Protection, Without CE Pull-down, With CL discharge (Semi-Custom)
With Inrush Current Protection, With CE Pull-down(*2), Without CL discharge (Semi-Custom)
With Inrush Current Protection, With CE Pull-down(*2), With CL discharge
±1％ (VOUT≧2.0V)
±0.02V (VOUT＜2.0V)
In case of 2nd decimal place 0 (ex.2.80V → ④=1)
±1％ (VOUT≧2.0V)
±0.02V (VOUT＜2.0V)
In case of 2nd decimal place 5 (ex.2.85V → ④=B)
USPQ-4B03 (5,000/Reel)
USP-4 (3,000/Reel)
SSOT-24 (3,000/Reel)
SOT-25 (3,000/Reel)
SOT-89-5 (1,000/Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2)
With CE pin pull-down resistor.
(*3)
Product types A/B/C/D/E/F/G/H are for pre-existing customers who were or are already using these types of products.
For customers who intend to adopt this product newly, please select from types J/K/M/N/P/Q/R/T which have been extended the operating
temperature range (105℃compliance).
3/37
XC6223 Series
■BLOCK DIAGRAMS
XC6223A/J series
XC6223B/K series
XC6223C/M series
XC6223D/N series
XC6223E/P series
XC6223F/Q series
XC6223G/R series
XC6223H/T series
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
4/37
XC6223
Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
●XC6223A/B/C/D/E/F/G/H Series
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
Output Current
Output Voltage
CE Input Voltage
VIN
IOUT
VOUT
VCE
VSS-0.3～+7.0
500 (*1)
VSS-0.3～VIN+0.3
VSS-0.3～+7.0
100
550 (PCB mounted) (*2)
120
1000 (PCB mounted) (*2)
150
500 (PCB mounted) (*2)
250
600 (PCB mounted) (*2)
500
1300 (PCB mounted) (*2)
-40～+85
-55～+125
V
mA
V
V
USPQ-4B03
USP-4
Power Dissipation
SSOT-24
Pd
SOT-25
SOT-89-5
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
mW
℃
℃
(*1) : IOUT≦Pd / (VIN-VOUT)
(*2) : The power dissipation figure shown is PCB mounted.
Please refer to page 29～33 for details.
Ta=25℃
●XC6223J/K/M/N/P/Q/R/T Series
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
Output Current
Output Voltage
CE Input Voltage
VIN
IOUT
VOUT
VCE
VSS-0.3～+7.0
500 (*1)
VSS-0.3～VIN+0.3
VSS-0.3～+7.0
100
550 (PCB mounted) (*2)
120
1000 (PCB mounted) (*2)
150
500 (PCB mounted) (*2)
250
600 (PCB mounted) (*2)
500
1300 (PCB mounted) (*2)
-40～+105
-55～+125
V
mA
V
V
USPQ-4B03
USP-4
Power Dissipation
SSOT-24
Pd
SOT-25
SOT-89-5
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
mW
℃
℃
(*1) : IOUT≦Pd / (VIN-VOUT)
(*2) : The power dissipation figure shown is PCB mounted.
Please refer to page 29～33 for details.
5/37
XC6223 Series
■ELECTRICAL CHARACTERISTICS
●XC6223A/B/C/D/E/F/G/H/J/K/M/N/P/Q/R/T Series
PARAMETER
SYMBOL
CONDITIONS
VOUT(T)≧2.0V,
Output Voltage
VOUT(E)
(*1)
VCE=VIN, IOUT=10mA
VOUT(T)<2.0V,VCE=VIN,
(*3)
IOUT =10mA
Maximum Output Current
IOUTMAX
VCE=VIN
Load Regulation
∆VOUT
VCE=VIN, 0.1mA≦IOUT≦300mA
Dropout Voltage
Supply Current
Stand-by Current
Line Regulation
Input Voltage
Vdif
(*4)
ISS
ISTB
∆VOUT/
(∆VIN・VOUT)
VIN
Output Voltage
Temperature Characteristics
(A/B/C/D/E/F/G/H Type)
Output Voltage
Temperature Characteristics
(J/K/M/N/P/Q/R/T Type)
∆VOUT/
(∆Ta・VOUT)
∆VOUT/
(∆Ta・VOUT)
Ta=25℃
MIN.
TYP.
MAX.
VOUT(T)×0.99
VOUT(T)
VOUT(T)×1.01
(*2)
(*2)
(*2)
VOUT(T)-20mV
VOUT(T)
VOUT(T)+20mV
(*2)
(*2)
(*2)
300
-
-
mA
①
-
25
45
mV
①
mV
①
VCE=VIN, IOUT=300mA
E-1
UNITS
CIRCUITS
V
①
V
VCE=VIN
-
100
220
μA
②
VCE=VSS
-
0.01
0.4
μA
②
-
0.01
0.1
%/V
①
1.6
-
5.5
V
①
-
±100
-
ppm / ℃
①
-
±100
-
ppm / ℃
①
-
80
-
dB
③
310
400
-
mA
①
-
50
-
mA
①
VOUT(T)+0.5V≦VIN≦5.5Ｖ
VCE=VIN, IOUT=50mA
VCE=VIN, IOUT=10mA
-40℃≦Ta≦85℃
VCE=VIN, IOUT=10mA
-40℃≦Ta≦105℃
VOUT(T)＜2.5V
VIN=3.0VDC+0.5Vp-pAC
VCE=VOUT(T)+1.0V
Power Supply Rejection
Ratio
IOUT=30mA、f=1kHz
PSRR
VOUT(T)≧2.5V
VIN=｛VOUT(T)+1.0｝
VDC+0.5Vp-pAC
VCE=VOUT(T)+1.0V
IOUT=30mA、f=1kHz
Current Limit
ILIM
Short Current
ISHORT
VCE=VIN, VOUT=VSS
CE High Level Voltage
VCEH
-
1.0
-
5.5
V
④
CE Low Level Voltage
VCEL
-
-
-
0.3
V
④
ICEH
VCE=VIN＝5.5V
-0.1
-
0.1
μA
④
ICEH
VCE=VIN=5.5V
3.0
5.5
9.0
μA
④
ICEL
VCE=VSS
-0.1
-
0.1
μA
④
CE High Level Current
(A/B/E/F/J/K/P/Q Type)
CE High Level Current
(C/D/G/H/M/N/R/T Type)
CE Low Level Current
CL Discharge Resistance
(Only B/D/F/H/K/N/Q/T Type)
Inrush Current
(Only E/F/G/H/P/Q/R/T Type)
Thermal Shutdown
Detect
Temperature
Thermal Shutdown Release
Temperature
Thermal Shutdown
Hysteresis Width
VCE=VIN
RDCHG
VIN=5.5V, VOUT=2.0V, VCE=VSS
-
300
-
Ω
①
Irush
VIN=VCE=5.5V
-
150
-
mA
⑤
TTSD
Junction Temperature
-
150
-
℃
TTSR
Junction Temperature
-
120
-
℃
TTSD - TTSR
Junction Temperature
-
30
-
℃
NOTE:
*1: VOUT(E): Effective output voltage
(i.e. the output voltage when “VOUT(T)+1.0V” is provided at the VIN pin while maintaining a certain IOUT value.)
*2: VOUT(T): Nominal output voltage
*3: The standard output voltage is specified in VOUT（T）±20mV where VOUT（T）＜2.0V.
*4: Vdif＝{VIN1{*5}－VOUT1{*6}} (VIN1≧1.6V)
*5: VIN1=The input voltage when VOUT1 appears as input voltage is gradually decreased.
*6: VOUT1=A voltage equal to 98% of the output voltage whenever an amply stabilized IOUT {VOUT(T)+1.0V} is input
*7: Unless otherwise stated regarding input voltage conditions, VIN=VOUT(T)＋1.0V.
6/37
①
XC6223
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●Voltage Chart 1
SYMBOL
E-0
E-1
OUTPUT VOLTAGE
(V)
DROPOUT VOLTAGE
(mV)
PARAMETER
NOMINAL
OUTPUT
VOLTAGE (V)
VOUT(T)
VOUT(E)
Vdif
MIN
MAX
1.20
1.1800
1.2200
1.25
1.2300
1.2700
1.30
1.2800
1.3200
1.35
1.3300
1.3700
1.40
1.3800
1.4200
1.45
1.4300
1.4700
1.50
1.4800
1.5200
1.55
1.5300
1.5700
1.60
1.5800
1.6200
1.65
1.6300
1.6700
1.70
1.6800
1.7200
1.75
1.7300
1.7700
1.80
1.7800
1.8200
1.85
1.8300
1.8700
1.90
1.8800
1.9200
1.95
1.9300
1.9700
2.00
1.9800
2.0200
2.05
2.0295
2.0705
2.10
2.0790
2.1210
2.15
2.1285
2.1715
2.20
2.1780
2.2220
2.25
2.2275
2.2725
2.30
2.2770
2.3230
2.35
2.3265
2.3735
2.40
2.3760
2.4240
2.45
2.4255
2.4745
2.50
2.4750
2.5250
2.55
2.5245
2.5755
2.60
2.5740
2.6260
2.65
2.6235
2.6765
2.70
2.75
2.6730
2.7225
2.7270
2.7775
TYP
MAX
480
630
440
580
420
520
400
440
300
410
270
380
240
350
7/37
XC6223 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●Voltage Chart2
SYMBOL
E-0
E-1
OUTPUT VOLTAGE
(V)
DROPOUT VOLTAGE
(mV)
VOUT(E)
Vdif
PARAMETER
NOMINAL
OUTPUT
VOLTAGE (V)
VOUT(T)
8/37
MIN.
MAX.
2.80
2.85
2.7720
2.8215
2.8280
2.8785
2.90
2.8710
2.9290
2.95
2.9205
2.9795
3.00
2.9700
3.0300
3.05
3.0195
3.0805
3.10
3.0690
3.1310
3.15
3.1185
3.1815
3.20
3.1680
3.2320
3.25
3.2175
3.2825
3.30
3.2670
3.3330
3.35
3.3165
3.3835
3.40
3.3660
3.4340
3.45
3.4155
3.4845
3.50
3.4650
3.5350
3.55
3.5145
3.5855
3.60
3.5640
3.6360
3.65
3.6135
3.6865
3.70
3.6630
3.7370
3.75
3.7125
3.7875
3.80
3.7620
3.8380
3.85
3.8115
3.8885
3.90
3.8610
3.9390
3.95
3.9105
3.9895
4.00
3.9600
4.0400
TYP.
MAX.
240
350
200
305
XC6223
Series
■ OPERATIONAL EXPLANATION
The voltage divided by resistors R1 & R2 is compared with the
internal reference voltage by the error amplifier. The P-channel
MOSFET which is connected to the Output pin (VOUT) is then driven
by the subsequent control signal. The output voltage at the Output
pin (VOUT) is controlled and stabilized by a system of negative
feedback. The current limit circuit and short circuit protection
operate in relation to the level of output current and heat dissipation.
Further, the IC’s internal circuitry can be shutdown via the CE pin
(CE) signal.
<Low ESR Capacitor>
The XC6223 series needs an output capacitor CL for phase compensation. In order to ensure the stable phase
compensation, please place an output capacitor of 1.0μF or bigger at the VOUT pin and VSS pin as close as possible. For a
stable power input, please connect an input capacitor (CIN) of 1.0μF between the input pin (VIN) and the ground pin (VSS).
<Current Limiter, Short-Circuit Protection>
The protection circuit operates as a combination of an output current limiter and fold-back short circuit protection. When
load current reaches the current limit level, the output voltage drops. As a result, the load current starts to reduce with
showing fold-back curve. The output current finally falls at the level of 50mA when the output pin is short-circuited.
<CE Pin>
The IC's internal circuitry can be shutdown via the signal from the CE pin (CE). In shutdown mode, the XC6223B/D/F/H/
K/N/Q/T series enables the electric charge at the output capacitor (CL) to be discharged via the internal auto-discharge
switch, and as a result the output pin (VOUT) quickly returns to the ground pin (VSS) level. When the CE pin (CE) is open, the
output voltage becomes undefined state in the XC6223A/B/E/F/J/K/P/Q series because of a high active and no pull-down.
On the other hand, the XC6223C/D/G/H/M/N/R/T series has a pull-down resistor at the CE pin (CE) inside, so that the CE pin
(CE) input current flows.
<Thermal Shutdown>
When the junction temperature of the built-in driver transistor reaches the temperature limit, the thermal shutdown circuit
operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal shutdown function is
released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal
shutdown release voltage.
<Inrush Current Protection>
The inrush current protection circuit is built in the XC6223 series.
When the IC starts to operate, the protection circuit limits the inrush current from input pin (VIN) to output pin (VOUT) to charge
CL capacitor. This function is built in the XC6223E/F/G/H/P/Q/R/T series.
9/37
XC6223 Series
■ NOTES ON USE
1． Where wiring impedance is high, operations may become unstable due to the noise and/or phase lag depending on output
current. Please strengthen input pin (VIN) and output pin (VOUT) wiring in particular.
2. The input capacitor CIN and the output capacitor CL should be placed to the as close as possible with a shorter wiring.
3. The IC is controlled with constant current start-up. Start-up sequence control is requested to draw a load current after
even nominal output voltage rising up the output voltage.
4. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
5. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
10/37
XC6223
Series
■TEST CIRCUITS
・測定回路1
●Circuit
①
VIN
A
VOUT
IOUT
CE
VSS
V
V
CL
(ceramic)
CIN
(ceramic)
・測定回路2
●Circuit
②
A
VIN
VOUT
CE
VSS
CIN
(ceramic)
・測定回路3
●Circuit ③
IOUT=30mA
VIN
V
CIN=0.1μF
(ceramic)
A
VOUT
CE
VSS
CL
(ceramic)
V
11/37
XC6223 Series
■TEST CIRCUITS (Continued)
・測定回路4
●Circuit ④
VIN
A
VOUT
CE
VSS
CIN
(ceramic)
CL
(ceramic)
V
●Circuit ⑤
・測定回路5
A
VIN
VOUT
CE
VSS
CIN
(ceramic)
12/37
CL=1μF
(ceramic)
V
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Output Voltage vs. Output Current
XC6223x121
XC6223x121
VIN = 2.2V
Ta = 25℃
CIN = 1.0μF (ceramic)
CIN = 1.0μF (ceramic)
1.4
1.2
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
1.4
Ta=-40℃
1.0
Ta=25℃
Ta=85℃
0.8
Ta=105℃
0.6
0.4
0.2
1.2
1.0
VIN=1.6V
VIN=2.2V
0.8
VIN=2.7V
VIN=5.5V
0.6
0.4
0.2
0.0
0.0
0
100
200
300
400
0
500
100
200
XC6223x181
Ta = 25℃
CIN = 1.0μF (ceramic)
CIN = 1.0μF (ceramic)
2.0
2.0
1.8
1.8
Ta=-40℃
Ta=25℃
1.2
Ta=85℃
1.0
Ta=105℃
0.8
0.6
0.4
1.6
1.4
VIN=1.9V
1.2
VIN=2.3V
1.0
VIN=2.8V
VIN=3.3V
0.8
VIN=5.5V
0.6
0.4
0.2
0.2
0.0
0.0
0
100
200
300
400
0
500
100
200
300
400
500
Output Current: IOUT [mA]
Output Current: IOUT [mA]
XC6223x251
XC6223x251
Ta = 25℃
CIN = 1.0μF (ceramic)
VIN = 3.5V
CIN = 1.0μF (ceramic)
3.0
3.0
2.5
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
500
VIN = 2.8V
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
XC6223x181
1.4
400
Output Current: IOUT [mA]
Output Current: IOUT [mA]
1.6
300
Ta=-40℃
2.0
Ta=25℃
1.5
Ta=85℃
Ta=105℃
1.0
0.5
0.0
0
100
200
300
Output Current: IOUT [mA]
400
500
2.5
2.0
VIN=2.6V
VIN=3.0V
1.5
VIN=3.5V
VIN=4.0V
1.0
VIN=5.5V
0.5
0.0
0
100
200
300
400
500
Output Current: IOUT [mA]
13/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(1) Output Voltage vs. Output Current (Continued)
XC6223x401
VIN = 5.0V
Ta = 25℃
CIN = 1.0μF (ceramic)
CIN = 1.0μF (ceramic)
4.5
4.5
4.0
4.0
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
XC6223x401
3.5
Ta=-40℃
3.0
Ta=25℃
2.5
Ta=85℃
Ta=105℃
2.0
1.5
1.0
0.5
3.5
3.0
VIN=4.1V
2.5
VIN=4.5V
2.0
VIN=5.0V
VIN=5.5V
1.5
1.0
0.5
0.0
0
100
200
300
400
500
0.0
0
100
Output Current: IOUT [mA]
200
300
400
500
Output Current: IOUT [mA]
(2) Output Voltage vs. Input Voltage
XC6223x121
XC6223x121
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.212
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
1.4
1.2
1.0
0.8
IOUT=1mA
IOUT=10mA
0.6
IOUT=30mA
IOUT=50mA
0.4
0.5
1.0
1.5
2.0
Input Voltage: VIN [V]
1.208
1.204
1.200
IOUT=1mA
1.196
IOUT=10mA
1.192
IOUT=30mA
IOUT=50mA
1.188
2.5
2.0
2.5
XC6223x181
5.5
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.0
1.820
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
5.0
XC6223x181
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.8
1.6
1.4
IOUT=1mA
IOUT=10mA
1.2
IOUT=30mA
IOUT=50mA
1.0
0.5
14/37
3.0 3.5 4.0 4.5
Input Voltage: VIN [V]
1.0
1.5
2.0
Input Voltage: VIN [V]
2.5
1.815
1.810
1.805
1.800
1.795
IOUT=1mA
1.790
IOUT=10mA
1.785
IOUT=30mA
1.780
IOUT=50mA
2.0
2.5
3.0 3.5 4.0 4.5 5.0
Input Voltage: VIN [V]
5.5
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Input Voltage (Continued)
XC6223x251
XC6223x251
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.530
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
2.7
2.5
2.3
2.1
IOUT=1mA
IOUT=10mA
1.9
IOUT=30mA
IOUT=50mA
1.7
2.520
2.510
2.500
IOUT=1mA
2.490
IOUT=10mA
2.480
IOUT=30mA
IOUT=50mA
2.470
1.5
2.0
2.5
3.0
Input Voltage: VIN [V]
3.0
3.5
3.5
XC6223x401
5.5
XC6223x401
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
4.040
Output Voltage: VOUT [V]
4.2
Output Voltage: VOUT [V]
4.0
4.5
5.0
Input Voltage: VIN [V]
4.0
3.8
3.6
IOUT=1mA
IOUT=10mA
3.4
IOUT=30mA
IOUT=50mA
3.2
4.030
4.020
4.010
4.000
IOUT=1mA
3.990
IOUT=10mA
3.980
IOUT=30mA
3.970
IOUT=50mA
3.960
3.0
3.5
4.0
4.5
Input Voltage: VIN [V]
5.0
4.5
4.7
4.9
5.1
5.3
Input Voltage: VIN [V]
5.5
(3) Dropout Voltage vs. Output Current
XC6223ｘ121
XC6223ｘ181
CIN = 1μF (ceramic), CL = 1μF (ceramic)
0.5
CIN = 1μF (ceramic), CL = 1μF (ceramic)
0.5
Dropout Voltage: Vdif [V]
Dropout Voltage: Vdif [V]
Ta = -40℃
0.4
Below the minimum operating voltage
0.3
Ta = -40℃
0.2
Ta = 25℃
Ta = 85℃
0.1
Ta = 105℃
0.0
0.4
Ta = 25℃
Ta = 85℃
0.3
Ta = 105℃
0.2
0.1
0.0
0
50
100
150
200
Output Current: IOUT [mA]
250
300
0
50
100
150
200
250
300
Output Current: IOUT [mA]
15/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) Dropout Voltage vs. Output Current (Continued)
XC6223x251
XC6223x401
CIN = 1μF (ceramic), CL = 1μF (ceramic)
Dropout Voltage: Vdif [V]
Dropout Voltage: Vdif [V]
Ta = -40℃
0.4
Ta = 25℃
Ta = 85℃
0.3
Ta = 105℃
0.2
0.1
0.0
0
50
100
150
200
250
CIN = 1μF (ceramic), CL = 1μF (ceramic)
0.5
0.5
Ta = -40℃
0.4
Ta = 25℃
Ta = 85℃
0.3
Ta = 105℃
0.2
0.1
0.0
300
0
Output Current: IOUT [mA]
50
100
150
200
250
300
Output Current: IOUT [mA]
(4) Supply Current vs. Input Voltage
XC6223x181
160
160
140
140
120
100
80
60
Ta = -40℃
40
Ta = 25℃
Ta = 85℃
20
Supply Current: ISS [μA]
Supply Current: ISS [μA]
XC6223x121
Ta = 105℃
0
120
100
80
60
Ta = -40℃
40
Ta = 25℃
Ta = 85℃
20
Ta = 105℃
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage: VIN [V]
Input Voltage: VIN [V]
XC6223x251
XC6223x401
300
160
120
100
80
60
Ta = -40℃
40
20
0
Ta = 25℃
Ta = 85℃
250
Ta = 25℃
Ta = 85℃
200
Ta = 105℃
150
100
50
Ta = 105℃
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage: VIN [V]
16/37
Supply Current: ISS [μA]
Supply Current: ISS [μA]
Ta = -40℃
140
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage: VIN [V]
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) Output Voltage vs. Ambient Temperature
XC6223x121
XC6223x181
VIN = 2.2V
CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.22
1.84
IOUT=30mA
IOUT=50mA
1.20
1.19
1.18
-50
-25
0
25
50
75
100
IOUT=100mA
1.80
1.79
1.78
1.77
-50
-25
0
25
50
75
100
Ambient Temperature: Ta [℃]
XC6223x251
XC6223x401
Output Voltage: VOUT [V]
IOUT=10mA
IOUT=30mA
IOUT=100mA
2.50
2.48
2.46
125
VIN = 5.0V
CIN = 1μF (ceramic), CL = 1μF (ceramic)
4.08
IOUT= 1mA
Output Voltage: VOUT [V]
IOUT=30mA
1.81
Ambient Temperature: Ta [℃]
2.56
2.52
IOUT=10mA
1.82
1.76
125
VIN = 3.5V
CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.54
IOUT= 1mA
1.83
IOUT=10mA
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
IOUT= 1mA
1.21
VIN = 2.8V
CIN = 1μF (ceramic), CL = 1μF (ceramic)
IOUT= 1mA
4.06
IOUT=10mA
4.04
IOUT=30mA
IOUT=100mA
4.02
4.00
3.98
3.96
3.94
3.92
2.44
-50
-25
0
25
50
75
100
-50
125
-25
0
25
50
75
100
125
Ambient Temperature: Ta [℃]
Ambient Temperature: Ta [℃]
(6) Rising Response Time
XC6223x121
XC6223x181
tr = 5μs, Ta = 25℃,VIN = 0→2.8V
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
Input Voltage
1.6
1.2
-3.0
-6.0
-9.0
-12.0
Output Voltage
IOUT=0.1mA
0.8
IOUT=30mA
0.4
IOUT=100mA
Time [50μs/div]
0
Input Voltage: VIN [V]
2
3.0
0.0
6.0
2.4
Output Voltage: VOUT [V]
Input Voltage: VIN [V]
6.0
3
3.0
2.5
Input Voltage
0.0
-3.0
2
1.5
Output Voltage
-6.0
IOUT=0.1mA
1
-9.0
IOUT=30mA
0.5
IOUT=100mA
-12.0
Output Voltage: VOUT [V]
tr = 5μs, Ta = 25℃,VIN = 0→2.2V
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
0
Time [50μs/div]
17/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) Rising Response Time (Continued)
XC6223x251
XC6223x401
tr = 5μs, Ta = 25℃,VIN = 0→3.5V
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
0.0
4.0
-3.0
-6.0
3.0
Output Voltage
-9.0
2.0
IOUT=0.1mA
IOUT=30mA
IOUT=100mA
-12.0
1.0
3.0
6.0
Input Voltage
0.0
-3.0
4.0
Output Voltage
-6.0
3.0
IOUT=0.1mA
-9.0
IOUT=30mA
IOUT=100mA
-12.0
0.0
5.0
2.0
1.0
Output Voltage: VOUT [V]
5.0
Input Voltage
6.0
Input Voltage: VIN [V]
Input Voltage: VIN [V]
3.0
6.0
Output Voltage: VOUT [V]
6.0
tr = 5μs, Ta = 25℃,VIN = 0→5.0V
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
0.0
Time [50μs/div]
Time [50μs/div]
(7) Input Transient Response
XC6223x181
XC6223x121
5.0
1.24
4.0
1.23
3.0
2.0
IOUT=0.1mA
1.0
IOUT=30mA
IOUT=100mA
0.0
-1.0
1.22
Input Voltage
Output Voltage
1.21
1.2
1.19
1.18
Time [100μs/div]
Input Voltage: VIN [V]
tr = tf = 5μs, Ta = 25℃, VIN = 2.8V⇔3.8V
CIN = 0.1μF (ceramic), CL = 1.0μF (ceramic)
Output Voltage: VOUT [V]
Input Voltage: VIN [V]
tr = tf = 5μs, Ta = 25℃, VIN = 2.2V⇔3.2V
CIN = 0.1μF (ceramic), CL = 1.0μF (ceramic)
5.0
1.85
4.0
1.84
3.0
1.0
0.0
1.79
tr = tf = 5μs, Ta = 25℃, VIN = 4.5V⇔5.5V
CIN = 0.1μF (ceramic), CL = 1.0μF (ceramic)
6.0
5.0
2.53
5.0
Input Voltage
2.52
IOUT=0.1mA
IOUT=30mA
IOUT=100mA
Output Voltage
2.51
2.5
2.49
2.48
Time [100μs/div]
Input Voltage: VIN [V]
Input Voltage: VIN [V]
1.8
Output Voltage
XC6223x401
0.0
18/37
1.81
Time [100μs/div]
2.54
1.0
IOUT=100mA
-1.0
6.0
2.0
1.82
IOUT=30mA
tr = tf = 5μs, Ta = 25℃, VIN = 3.5V⇔4.5V
CIN = 0.1μF (ceramic), CL = 1.0μF (ceramic)
3.0
1.83
IOUT=0.1mA
2.0
XC6223x251
4.0
Input Voltage
4.04
4.03
Input Voltage
4.0
4.02
3.0
IOUT=10mA
4.01
2.0
IOUT=30mA
IOUT=100mA
4
1.0
0.0
3.99
Output Voltage
Time [100μs/div]
3.98
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (tr=tf=0.5μs)
XC6223x121
XC6223x121
400
1.22
400
1.25
350
1.21
350
1.20
300
250
1.10
200
1.05
150
0.95
100
50
0.90
1.19
200
150
1.16
1.15
Output Current
100
50
0
Time [20μs/div]
XC6223x181
XC6223x181
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 2.8V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
tr = tf = 0.5μs, Ta = 25℃, IOUT = 50⇔100mA
VIN = 2.8V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
400
1.82
400
1.85
350
1.81
350
1.80
300
Output Voltage
1.75
250
1.70
200
1.65
150
1.60
Output Current
100
1.55
50
1.50
0
Output Voltage: VOUT [V]
1.90
Output Current Iout[mA]
Output Voltage: VOUT [V]
250
1.17
1.14
0
300
1.18
Time [20μs/div]
1.80
1.79
Output Voltage
300
250
1.78
200
1.77
150
1.76
1.75
100
Output Current
1.74
Time [20μs/div]
50
0
Time [20μs/div]
XC6223x251
XC6223x251
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
tr = tf = 0.5μs, Ta = 25℃, IOUT = 50⇔100mA
VIN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
400
2.52
400
2.55
350
2.51
350
2.50
2.45
Output Voltage
300
250
2.40
200
2.35
150
2.30
Output Current
2.25
100
50
2.20
0
Time [20μs/div]
Output Voltage: VOUT [V]
2.60
Output Current Iout[mA]
Output Voltage: VOUT [V]
Output Voltage
2.50
2.49
300
Output Voltage
250
2.48
200
2.47
150
2.46
2.45
100
Output Current
2.44
50
Output Current Iout[mA]
1.00
Output Current
1.20
Output Current Iout[mA]
1.15
Output Voltage
Output Voltage: VOUT [V]
1.30
Output Current Iout[mA]
tr = tf = 0.5μs, Ta = 25℃, IOUT = 50⇔100mA
VIN = 2.2V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
Output Current Iout[mA]
Output Voltage: VOUT [V]
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 2.2V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
0
Time [20μs/div]
19/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (tr=tf=0.5μs) (Continued)
XC6223x401
XC6223x401
400
4.02
4.05
350
4.01
4.00
3.95
Output Voltage
300
250
3.90
200
3.85
150
3.80
Output Current
100
3.75
50
3.70
0
Output Voltage: VOUT [V]
4.10
4.00
3.99
Output Voltage
3.98
3.97
3.96
3.95
Output Current
3.94
Time [20μs/div]
500
450
400
350
300
250
200
150
100
50
0
Output Current Iout[mA]
tr = tf = 0.5μs, Ta = 25℃, IOUT =50⇔100mA
VIN = 5.0V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
Output Current Iout[mA]
Output Voltage: VOUT [V]
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 5.0V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
Time [20μs/div]
(8) Load Transient Response (tr=tf=5μs) (Continued)
XC6223x121
1.22
1.21
350
1.21
Output Voltage
1.19
250
1.18
1.17
300
200
Output Current
150
1.16
100
1.15
50
1.14
0
1.20
250
200
1.17
150
1.16
1.81
300
200
150
100
1.75
50
1.74
0
Time [50μs/div]
20/37
250
Output Voltage: VOUT [V]
350
Output Current Iout[mA]
Output Voltage: VOUT [V]
1.81
1.76
50
0
XC6223x181
1.82
Output Current
100
Time [50μs/div]
400
1.77
Output Current
1.15
1.82
1.78
300
1.18
XC6223x181
1.79
Output Voltage
1.14
tr = tf = 5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 2.8V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
Output Voltage
350
1.19
Time [50μs/div]
1.80
400
tr = tf = 5μs, Ta = 25℃, IOUT = 50⇔100mA
VIN = 2.8V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
350
1.80
1.79
400
300
Output Voltage
250
1.78
200
1.77
150
1.76
1.75
100
Output Current
1.74
50
0
Time [50μs/div]
Output Current Iout[mA]
1.20
Output Voltage: VOUT [V]
400
Output Current Iout[mA]
Output Voltage: VOUT [V]
1.22
tr = tf = 5μs, Ta = 25℃, IOUT = 50⇔100mA
VIN = 2.2V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
Output Current Iout[mA]
XC6223x121
tr = tf = 5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 2.2V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (tr=tf=5μs) (Continued)
XC6223x251
2.52
400
350
2.51
350
2.50
300
Output Voltage
2.49
250
2.48
200
2.47
150
Output Current
100
2.45
50
2.44
0
2.50
2.49
200
2.47
150
2.46
2.45
100
Output Current
50
2.44
0
Time [50μs/div]
XC6223x401
XC6223x401
tr = tf = 5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 5.0V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
tr = tf = 5μs, Ta = 25℃, IOUT = 50⇔100mA
VIN = 5.0V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
4.02
400
4.01
350
4.01
350
4.00
300
Output Voltage
3.99
250
3.98
200
3.97
150
Output Current
3.96
100
3.95
50
3.94
Output Voltage: VOUT [V]
400
Output Current Iout[mA]
Output Voltage: VOUT [V]
250
2.48
Time [50μs/div]
4.02
300
Output Voltage
4.00
3.99
300
Output Voltage
250
3.98
200
3.97
150
3.96
3.95
100
Output Current
50
3.94
0
Output Current Iout[mA]
2.46
Output Voltage: VOUT [V]
400
2.51
Output Current Iout[mA]
tr = tf = 5μs, Ta = 25℃, IOUT = 50⇔100mA
VIN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
Output Current Iout[mA]
Output Voltage: VOUT [V]
2.52
XC6223x251
tr = tf = 5μs, Ta = 25℃, IOUT = 1⇔150mA
VIN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
0
Time [50μs/div]
Time [50μs/div]
(9) CE Rising Response Time (A,B,C,D J,K,M,N Type)
XC6223x121
VIN = 2.8V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
2.0
2.5
1.0
2.0
CE Input Voltage
0.0
-1.0
1.5
Output Voltage
-2.0
IOUT=0mA
IOUT=30mA
IOUT=100mA
-3.0
Time [20μs/div]
1.0
0.5
0.0
3.0
2.0
3.0
2.5
CE Input Voltage
1.0
2.0
0.0
1.5
-1.0
Output Voltage
1.0
IOUT=0mA
-2.0
IOUT=30mA
IOUT=100mA
-3.0
0.5
Output Voltage: VOUT [V]
3.0
Input Voltage: VCE [V]
3.0
Output Voltage: VOUT [V]
Input Voltage: VCE [V]
VCE
XC6223x181
VIN = 2.2V, tr = 5μs, Ta = 25℃
= 0→VIN, CIN = CL = 1.0μF (ceramic)
0.0
Time [20μs/div]
21/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) CE Rising Response Time (A,B,C,D,J,K,M,N Type) (Continued)
XC6223x251
VIN = 5.0V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
4.0
5.0
2.0
4.0
CE Input Voltage
0.0
3.0
-2.0
IOUT=0mA
Output Voltage
-4.0
IOUT=30mA
IOUT=100mA
-6.0
2.0
1.0
6.0
4.0
6.0
CE Input Voltage
5.0
2.0
0.0
Output Voltage: VOUT [V]
6.0
Input Voltage: VCE [V]
6.0
Output Voltage: VOUT [V]
Input Voltage: VCE [V]
VCE
XC6223x401
VIN = 3.5V, tr = 5μs, Ta = 25℃
= 0→VIN, CIN = CL = 1.0μF (ceramic)
4.0
Output Voltage
3.0
-2.0
IOUT=0mA
2.0
-4.0
IOUT=30mA
1.0
IOUT=100mA
0.0
-6.0
Time [20μs/div]
0.0
Time [20μs/div]
(9) CE Rising Response Time (E,F,G,H,P,Q,R,T Type) (Continued)
XC6223x181
XC6223x121
0.0
1.5
Output Voltage
-2.0
1
IOUT=0mA
IOUT=30mA
IOUT=100mA
-3.0
0.5
2.0
1.0
0.0
-3.0
22/37
0
4.0
0.0
3.0
2.0
IOUT=0mA
IOUT=30mA
IOUT=100mA
1.0
0.0
Input Voltage: VCE [V]
CE Input Voltage
6.0
Output Voltage: VOUT [V]
Input Voltage: VCE [V]
5.0
Time [50μs/div]
0.5
VIN = 5.0V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
4.0
-6.0
IOUT=30mA
1
XC6223x401
6.0
-4.0
IOUT=0mA
-2.0
VIN = 3.5V, tr = 5μs, Ta = 25℃
= 0→VIN, CIN = CL = 1.0μF (ceramic)
Output Voltage
1.5
Output Voltage
Time [50μs/div]
6.0
-2.0
2
-1.0
XC6223x251
2.0
2.5
IOUT=100mA
0
Time [20μs/div]
VCE
3
CE Input Voltage
Output Voltage: VOUT [V]
2
Input Voltage: VCE [V]
2.5
CE Input Voltage
1.0
-1.0
3.0
3
Output Voltage: VOUT [V]
Input Voltage: VCE [V]
3.0
2.0
VIN = 2.8V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
4.0
6.0
5.0
CE Input Voltage
2.0
0.0
-2.0
-4.0
4.0
Output Voltage
3.0
IOUT=0mA
IOUT=30mA
IOUT=100mA
-6.0
2.0
1.0
0.0
Time [50μs/div]
Output Voltage: VOUT [V]
VCE
VIN = 2.2V, tr = 5μs, Ta = 25℃
= 0→VIN, CIN = CL = 1.0μF (ceramic)
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) Inrush Current Response Time (E,F,G,H,P,Q,R,T Type)
XC6223x121
300
1.0
250
Output Voltage
0.0
-1.0
150
Rush Current
100
-3.0
50
-4.0
0
1.0
Output Voltage
200
-1.0
150
-2.0
100
Rush Current
-3.0
50
0
XC6223x401
VIN = 3.5V, tr = 5μs, Ta = 25℃
= 0→VIN, CIN = CL = 1.0μF (ceramic)
VIN = 5.0V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
350
300
CE Input Voltage
3.0
250
2.0
200
Output Voltage
Rush Current
150
100
-1.0
50
-2.0
0
Time [50μs/div]
250
0.0
XC6223x251
400
0.0
300
Time [50μs/div]
5.0
1.0
350
2.0
Time [20μs/div]
6.0
4.0
400
CE Input Voltage
-4.0
6.0
Input Voltage: VCE [V]
-2.0
200
3.0
5.0
400
CE Input Voltage
350
4.0
300
Output Voltage
3.0
2.0
200
1.0
0.0
250
150
Rush Current
-1.0
100
50
-2.0
Rush Curren: IRUSH [mA]
CE Input Voltage
2.0
4.0
Rush Curren: IRUSH [mA]
350
Input Voltage: VCE [V]
400
3.0
Rush Curren: IRUSH [mA]
4.0
VCE
Input Voltage: VCE [V]
VIN = 2.8V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
Rush Curren: IRUSH [mA]
Input Voltage: VCE [V]
VCE
XC6223x181
VIN = 2.2V, tr = 5μs, Ta = 25℃
= 0→VIN, CIN = CL = 1.0μF (ceramic)
0
Time [50μs/div]
23/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) Ripple Rejection Rate
XC6223x121
XC6223x181
100
80
60
40
20
IOUT=0.1mA
IOUT=1mA
IOUT=30mA
0
0.01
0.1
1
10
Ripple Frequency: f [kHz]
Ta = 25℃, VIN = 3.0VDC+0.5Vp-pAC
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
Ripple Rejection Rate: RR [dB]
Ripple Rejection Rate: RR [dB]
Ta = 25℃, VIN = 3.0VDC+0.5Vp-pAC
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
100
100
80
60
40
20
80
60
IOUT=0.1mA
IOUT=1mA
IOUT=30mA
0.1
1
10
Ripple Frequency: f [kHz]
100
Ta = 25℃, VIN = 4.3VDC+0.5Vp-pAC
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
Ripple Rejection Rate: RR [dB]
Ripple Rejection Rate: RR [dB]
24/37
100
0
0.01
0.1
1
10
Ripple Frequency: f [kHz]
XC6223x331
Ta = 25℃, VIN = 3.5VDC+0.5Vp-pAC
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
20
IOUT=1mA
IOUT=30mA
0
0.01
XC6223x251
40
IOUT=0.1mA
100
100
80
60
40
IOUT=0.1mA
20
0
0.01
IOUT=1mA
IOUT=30mA
0.1
1
10
Ripple Frequency: f [kHz]
100
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) Output Noise Density
XC6223x181
VIN=2.8, Ta=25℃
CIN=CL=1.0μF(ceramic)
VIN=2.2V, Ta=25℃
CIN=CL=1.0μF(ceramic)
100
Output Noise Density : [μV/√Hz]
Output Noise Density : [μV/√Hz]
XC6223x121
Frequency-Range ： 0.1～100kHz
Output Noise ： 32.60μVrms
10
IOUT=30mA
1
0.1
0.01
0.1
1
10
Frequency : f [kHz]
100
100
Frequency-Range ： 0.1～100kHz
Output Noise ： 49.74μVrms
10
IOUT=30mA
1
0.1
0.01
0.1
1
10
Frequency : f [kHz]
100
XC6223x331
Output Noise Density : [μV/√Hz]
VIN=5.0V, Ta=25℃
CIN=CL=1.0μF(ceramic)
100
Frequency-Range ： 0.1～100kHz
Output Noise ： 81.52μVrms
10
IOUT=30mA
1
0.1
0.01
0.1
1
10
Frequency : f [kHz]
100
25/37
XC6223 Series
■PACKAGING INFORMATION
*The package don’t have filet because
side of lead is no plating.
26/37
XC6223
Series
■PACKAGING INFORMATION (Continued)
1.3MAX
1.1±0.1
0.2MIN
●SOT-89-5
+0.2
1.6
-0.1
2.8±0.2
●SOT-25
27/37
XC6223 Series
■PACKAGING INFORMATION (Continued)
●USP-4 Reference Pattern Layout
●USP-4 Reference Metal Mask Design
0.5
1.9
0.3
0.4
0.7
0.3
0.4
2.0
28/37
1.05
0.25
0.25
0.1
0.275
0.4
0.22
0.47
1.30
0.55
0.25
0.4
0.1
●USPQ-4B03 Reference Metal Mask Design
●USPQ-4B03 Reference Pattern Layout
XC6223
Series
■PACKAGING INFORMATION (Continued)
●
USPQ-4B03 Power Dissipation
Power dissipation data for the USPQ-4B03 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1.
Measurement Condition
Condition
: Mount on a board
Ambient
: Natural convection
Soldering
: Lead (Pb) free
Board Dimensions
: 40 x 40 mm (1600mm2)
Board Structure
: 4 Copper Layers
Each layer is connected to the package
heat-sink and terminal pin No.1.
Each layer has approximately 800mm2 copper
area.
Material
: Glass Epoxy (FR-4)
Thickness
: 1.6 mm
Through-hole
: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (85℃)
Pd vs. Ta
Ambient
Temperature
(℃)
Power
Dissipation
Pd (mW)
25
85
550
220
Thermal
Resistance
(℃/W）
181.82
Power Dissipation Pd (mW)
Board Mount (Tjmax=125℃)
Ambient Temperature Ta(℃)
3. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
(℃)
Power
Dissipation
Pd (mW)
25
105
550
110
Thermal
Resistance
(℃/W）
181.82
Power Dissipation Pd (mW)
Ambient
Temperature
Pd vs. Ta
Ambient Temperature Ta(℃)
29/37
XC6223 Series
■PACKAGING INFORMATION (Continued)
●
USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (85℃)
Ambient
Temperature
(℃)
Power
Dissipation
Pd (mW)
25
85
1000
400
Thermal
Resistance
(℃/W）
100.00
Power Dissipation Pd (mW)
Board Mount (Tjmax=125℃)
Pd vs. Ta
3. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
(℃)
Power
Dissipation
Pd (mW)
25
105
1000
200
Thermal
Resistance
(℃/W）
100.00
Power Dissipation Pd (mW)
Ambient
Temperature
Pd vs. Ta
Ambient Temperature Ta(℃)
30/37
XC6223
Series
■PACKAGING INFORMATION (Continued)
●
SSOT-24 Power Dissipation
Power dissipation data for the SSOT-24 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following
condition.
1.
Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (85℃)
Ambient
Temperature
(℃)
Power
Dissipation
Pd (mW)
25
85
500
200
Thermal
Resistance
(℃/W）
200.00
Power Dissipation Pd (mW)
Board Mount (Tjmax=125℃)
Pd vs. Ta
Ambient Temperature Ta(℃)
3. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
(℃)
Power
Dissipation
Pd (mW)
25
105
500
100
Thermal
Resistance
(℃/W）
200.00
Power Dissipation Pd (mW)
Ambient
Temperature
Pd vs. Ta
Ambient Temperature Ta(℃)
31/37
XC6223 Series
■PACKAGING INFORMATION (Continued)
●
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following
condition.
1.
2.
Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
評価基板レイアウト（単位：mm）
Evaluation Board (Unit: mm)
Power Dissipation vs. Ambient temperature（85℃）
Pd vs Ta
Board Mount ( Tjmax=125℃)
(℃)
Power
Dissipation
Pd (mW)
25
85
600
240
700
Thermal
Resistance
(℃/W）
166.67
Power Dissipation Pd（mW）
Ambient
Temperature
600
500
400
300
200
100
0
25
3.
45
65
85
Ambient Temperature Ta（℃）
105
125
Power Dissipation vs. Ambient temperature（105℃）
Board Mount ( Tjmax=125℃)
(℃)
Power
Dissipation
Pd (mW)
25
105
600
120
Thermal
Resistance
(℃/W）
166.67
Power Dissipation Pd（mW）
Ambient
Temperature
Pd vs Ta
700
600
500
400
300
200
100
0
25
32/37
45
65
85
105
Ambient Temparature Ta（℃）
125
XC6223
Series
■PACKAGING INFORMATION (Continued)
●
SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1.
て
Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 5 x 0.8 Diameter
Evaluation Board (Unit: mm)
2.
Power Dissipation vs. Ambient temperature（85℃）
Board Mount (Tj max = 125℃)
25
1300
85
520
Thermal
Resistance
(℃/W)
76.92
Pd-Ta特性グラフ
Pd vs. Ta
Power許容損失Pd（mW）
Dissipation Pd (mW)
Power
Dissipation Pd
（mW）
1400
1200
1000
800
600
400
200
0
25
45
65
85
105
Ambient周辺温度Ta（℃）
Temperature Ta (℃)
125
Power Dissipation vs. Ambient temperature（105℃）
Board Mount (Tj max = 125℃)
Ambient
Temperature
（℃）
Power
Dissipation Pd
（mW）
25
1300
105
260
Pd-Ta特性グラフ
Pd vs. Ta
Thermal
Resistance
(℃/W)
76.92
許容損失Pd（mW）
Power
Dissipation Pd (mW)
3.
Ambient
Temperature
（℃）
1400
1200
1000
800
600
400
200
0
25
45
65
85
105
125
Ambient周囲温度Ta（℃）
Temperature Ta(℃)
33/37
XC6223 Series
■MARKING RULE
●USPQ-4B03
① represents type of regulator and output voltage range.
MARK
OUTPUT VOLTAGE
0.1V INCREMENTS
VOLTAGE =4.0V
VOLTAGE=1.2～3.9V
0
1
2
3
4
5
6
7
4
OUTPUT VOLTAGE
0.05V INCREMENTS
VOLTAGE =1.25～3.95V
8
9
A
B
C
D
E
F
H
PRODUCT SERIES
XC6223A/J*****
XC6223B/K*****
XC6223C/M*****
XC6223D/N*****
XC6223E/P*****
XC6223F/Q*****
XC6223G/R*****
XC6223H/T*****
3
①
②
③
④
1
USPQ-4B03
(TOP VIEW)
② represents output voltage.
VOLTAGE=4.0[V]
VOLTAGE=1.2～3.95[V]
MARK
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
OUTPUT VOLTAGE (V)
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
1.25
1.35
1.45
1.55
1.65
1.75
1.85
1.95
2.05
2.15
2.25
2.35
2.45
MARK
F
H
K
L
M
N
P
R
S
T
U
V
X
Y
Z
OUTPUT VOLTAGE (V)
2.50
2.60
2.70
2.80
2.90
3.00
3.10
3.20
3.30
3.40
3.50
3.60
3.70
3.80
3.90
③④ represents production lot number.
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order.
(G, I, J, O, Q, W excepted)
*No character inversion used.
34/37
2.55
2.65
2.75
2.85
2.95
3.05
3.15
3.25
3.35
3.45
3.55
3.65
3.75
3.85
3.95
2
PRODUCT SERIES
MARK
XC6223A/J*****
XC6223B/K*****
XC6223C/M*****
XC6223D/N*****
XC6223E/P*****
XC6223F/Q*****
XC6223G/R*****
XC6223H/T*****
0
1
2
3
4
5
6
7
XC6223
Series
■MARKING RULE (Continued)
●SSOT-24 (with bar)
① represents type of regulator and output voltage range.
3
4
B
C
D
E
K
L
M
N
3
5
7
A
F
H
P
Z
8
9
S
T
U
V
X
Y
XC6223A/J*****
XC6223B/K*****
XC6223C/M*****
XC6223D/N*****
XC6223E/P*****
XC6223F/Q*****
XC6223G/R*****
XC6223H/T*****
1
④
PRODUCT SERIES
③
OUTPUT VOLTAGE
0.05V INCREMENTS
VOLTAGE =1.25～3.95V
②
OUTPUT VOLTAGE
0.1V INCREMENTS
VOLTAGE =1.2～2.9V VOLTAGE =3.0～4.0V
①
MARK
2
SSOT-24(with bar)
(TOP VIEW)
② represents output voltage.
MARK
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
OUTPUT VOLTAGE (V)
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
3.00
3.10
-
1.25
1.35
1.45
1.55
1.65
1.75
1.85
1.95
2.05
2.15
2.25
2.35
2.45
MARK
F
H
K
L
M
N
P
R
S
T
U
V
X
Y
Z
OUTPUT VOLTAGE (V)
2.50
2.60
2.70
2.80
2.90
-
3.20
3.30
3.40
3.50
3.60
3.70
3.80
3.90
4.00
-
-
2.55
2.65
2.75
2.85
2.95
3.05
3.15
3.25
3.35
3.45
3.55
3.65
3.75
3.85
3.95
③④ represents production lot number.
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order.
(G, I, J, O, Q, W excepted)
*No character inversion used.
35/37
XC6223 Series
■MARKING RULE (Continued)
5
4
●SOT-25, SOT-89-5,USP-4
①
②
③
④
⑤
① represents product series
MARK
PRODUCT SERIES
9
XC6223******
1
2
3
SOT-25
(TOP VIEW)
② represents type of regulator.
C
F
L
P
T
X
0
3
D
H
M
R
U
Y
1
4
E
K
N
S
V
Z
2
5
XC6223A/J*****
XC6223B/K*****
XC6223C/M*****
XC6223D/N*****
XC6223E/P*****
XC6223F/Q*****
XC6223G/R*****
XC6223H/T*****
1
4.00
-
1.25
1.35
1.45
1.55
1.65
1.75
1.85
1.95
2.05
2.15
2.25
2.35
2.45
-
F
H
K
L
M
N
P
R
S
T
U
V
X
Y
Z
OUTPUT VOLTAGE (V)
2.50
2.60
2.70
2.80
2.90
3.00
3.10
3.20
3.30
3.40
3.50
3.60
3.70
3.80
3.90
④⑤ represents production lot number.
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order.
(G, I, J, O, Q, W excepted)
*No character inversion used.
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-
2.55
2.65
2.75
2.85
2.95
3.05
3.15
3.25
3.35
3.45
3.55
3.65
3.75
3.85
3.95
-
④ ⑤
MARK
OUTPUT VOLTAGE (V)
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
3
① ② ③
2
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
2
SOT-89-5
(TOP VIEW)
1
③ represents output voltage.
MARK
④
③
PRODUCT SERIES
②
OUTPUT VOLTAGE
0.05V INCREMENTS
VOLTAGE =1.25～3.95V
4
①
OUTPUT VOLTAGE
0.1V INCREMENTS
VOLTAGE =1.2～3.9V VOLTAGE =4.0V
2
⑤
5
MARK
USP-4
(TOP VIEW)
4
3
XC6223
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
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