User: Steinebrunner, Udo Date: 8/4/06 4:02:07 PM IMDS ID / Version: 6818196 / 4.00 Page: 1 Initial Sample Test Report Substances of Assemblies and Materials 1. Company and Product Name 1.1 Supplier data Name [ID]: 1.2 Product Identification Part: DUNS Number: Diotec Semiconductor AG [2845] - Report No.: Bridge Rectifier Single Inline - Street/Postal Code: Kreuzmattenstraße 4 Part/Item No.: - Nat./ZipCode/City: 79423 Heitersheim Purchase Order No.: - Organisation unit [ID]: - Article No.: KBUxx DUNS Number: - Bill of Delivery No.: - Street/Postal Code: - Status of changes: 4.00 Nat./ZipCode/City: -- Date: - Supplier Code: - Development Sample Report: No Business contact: Phone/Fax: Brigitte Kelpe +49 7634 5266 77 +49 7634 5266 277 2. Recyclate information Since IMDS release 3.0, recyclate information is stored on the reference to certain materials. User: Steinebrunner, Udo Date: 8/4/06 4:02:07 PM IMDS ID / Version: 6818196 / 4.00 Page: 2 Initial Sample Test Report Substances of Assemblies and Materials Materials which are subject to legal prohibitions must not be included! Dangerous substances formed or released during use must also be declared Please note: GADSL list for substances that require declaration 3. Characterization of the component Part/Item No.: Article Name: KBUxx Bridge Rectifier Single Inline Article- Article/Part Name No. / MaterialNo. KBUxx Level Quantity Component of Assembled Part Bridge Rectifier Single Inline Mass [g] Level Report No.: Material / Producer Mass [g] related Product Name - Amount [%] Substances CASNo. Basic substances name Amount [%] 7 1 1 Anschlüsse/contact pins 1.906 Chip gelötet/soldered 0.0292 1 Leadframe Cu 98.2 7440-50-8 Copper 100 1 tin plating Ag 1.8 7440-22-4 Silver 100 1 Si chip 71.2 7440-21-3 Silicon 62.5 7440-57-5 Gold 11.5 7440-02-0 Nickel 1 63394-02-5 Polydimethylsiloxane rubber 25 7439-92-1 Lead 92.5 7440-31-5 Tin 5 7440-22-4 Silver 2.5 1 solder disc RoHS compliant 28.8 User: Steinebrunner, Udo Date: 8/4/06 4:02:07 PM IMDS ID / Version: 6818196 / 4.00 Page: 3 Article- Article/Part Name No. / MaterialNo. Level 1 Quantity Component of Assembled Part molding compound Mass [g] 4.75 Level 1 Material / Producer Mass [g] related Product Name molding compound Amount [%] 100 Substances CASNo. - Basic substances name Epoxy resin Amount [%] 100