User: Steinebrunner, Udo Date: 8/4/06 4:01:50 PM IMDS ID / Version: 1464540 / 5.00 Page: 1 Initial Sample Test Report Substances of Assemblies and Materials 1. Company and Product Name 1.1 Supplier data Name [ID]: 1.2 Product Identification Part: DUNS Number: Diotec Semiconductor AG [2845] - Report No.: Bridge Rectifier Single Inline - Street/Postal Code: Kreuzmattenstraße 4 Part/Item No.: - Nat./ZipCode/City: 79423 Heitersheim Purchase Order No.: - Organisation unit [ID]: - Article No.: BxxC2300, GBSxx DUNS Number: - Bill of Delivery No.: - Street/Postal Code: - Status of changes: 5.00 Nat./ZipCode/City: -- Date: - Supplier Code: - Development Sample Report: No Business contact: Phone/Fax: Brigitte Kelpe +49 7634 5266 77 +49 7634 5266 277 2. Recyclate information Since IMDS release 3.0, recyclate information is stored on the reference to certain materials. User: Steinebrunner, Udo Date: 8/4/06 4:01:50 PM IMDS ID / Version: 1464540 / 5.00 Page: 2 Initial Sample Test Report Substances of Assemblies and Materials Materials which are subject to legal prohibitions must not be included! Dangerous substances formed or released during use must also be declared Please note: GADSL list for substances that require declaration 3. Characterization of the component Part/Item No.: Article Name: BxxC2300, GBSxx Bridge Rectifier Single Inline Article- Article/Part Name No. / MaterialNo. Level Quantity Component of Assembled Part BxxC2300 Bridge Rectifier , GBSxx Single Inline Mass [g] Level Report No.: Material / Producer Mass [g] related Product Name - Amount [%] Substances CASNo. Basic substances name Amount [%] 1.3 1 1 Anschlüsse/contact pins 0.456 Chip gelötet/soldered 0.00895 1 Leadframe Cu 96.5 7440-50-8 Copper 100 1 tin plating Sn96.5Ag3.2Cu0.3 3.5 7440-31-5 Tin 96.5 7440-22-4 Silver 3.2 7440-50-8 Copper 0.3 7440-21-3 Silicon 62.5 7440-57-5 Gold 11.5 7440-02-0 Nickel 1 63394-02-5 Polydimethylsiloxane rubber 25 1 Si chip 71.5 User: Steinebrunner, Udo Date: 8/4/06 4:01:50 PM IMDS ID / Version: 1464540 / 5.00 Page: 3 Article- Article/Part Name No. / MaterialNo. Level Quantity Component of Assembled Part Mass [g] Level 1 1 Gehäuse/case 0.78 1 Material / Producer Mass [g] related Product Name solder paste RoHS compliant molding compound thermoplast Amount [%] 28.5 100 Substances CASNo. Basic substances name Amount [%] 7439-92-1 Lead 92.5 7440-31-5 Tin 5 7440-22-4 Silver 2.5 - PA66 100