MDS

IMDS ID / Version: 123740669 / 1
User:
Steinebrunner, Udo
Page:
Date:
1/3
12/3/09 10:02:12 AM
MDS Report
Substances of Assemblies and Materials
1. Company and Product Name
1.1 Supplier Data
Name [ID]:
DUNS Number:
Street/Postal Code:
Nat./ZipCode/City:
Supplier Code:
Contact Person:
- Phone:
- Fax No. :
- E-mail address:
1.2 Product Identification
Diotec Semiconductor
AG [2845]
Kreuzmattenstraße 4
DE 79423 Heitersheim
Brigitte Kelpe
+49 7634 5266 77
+49 7634 5266 277
[email protected]
m
2. Recyclate Information
Since IMDS release 3.0, recyclate information is stored
on the reference to certain materials.
Hewlett-Packard GmbH
Part/Item No.:
DO-213AB/Glas MELF
Article Name:
Report No.:
Date of Report:
Purchase Order No.:
Bill of Delivery No.:
Development Sample
Report:
IMDS ID / Version:
Node ID:
Diode SMD
No
MDS Status (Change
Date):
Internally released
(12/03/2009)
123740669 / 1
123740669
IMDS ID / Version:
User:
123740669 / 1
Steinebrunner, Udo
Page:
Date:
2/3
12/3/09 10:02:12 AM
MDS Report
Substances of Assemblies and Materials
Materials which are subject to legal prohibitions must not be included!
Dangerous substances formed or released during use must also be declared
Please note: GADSL list for substances that require declaration
3. Characterization of the Component
Part/Item No.:
Article Name:
Tree Level
DO-213AB/Glas MELF
Diode SMD
Article Name
Article Name
Name
Substance Name
Diode SMD
1
Anschluss/plug contact
2
3
4
3
Part/Item No.
Item- /Mat.-No.
Material-No.
CAS No.
DO-213AB/Glas
MELF
K26.3192
tin plating Sn
Tin
CuFe
Hewlett-Packard GmbH
Report No.:
IMDS ID / Version:
Node ID:
123740669 / 1
123740669
Classif.
IMDS ID / Version
Quantity
Weight
Portion
[g]
[%]
123740669 / 1
0.12
(not available)
0.0864
15324272 / 1
7440-31-5
28.2
Portion
(from - to)
[%]
GADSL,
SVHC
Parts Marking
Recyclate
(Indust./Consumer)
Application
4.2
No
3.2
No
100
23254101 / 2
71.8
IMDS ID / Version:
User:
123740669 / 1
Steinebrunner, Udo
Page:
Date:
3/3
12/3/09 10:02:12 AM
Article Name
Article Name
Name
Substance Name
Part/Item No.
Item- /Mat.-No.
Material-No.
CAS No.
4
Copper
7440-50-8
98
4
Iron
7439-89-6
2
Tree Level
Chip Presskontakt/pressure
contact
2
3
4
3
4
3
4
2
3
4
3
4
3
4
planar 0,36 x 0,36
Si
Silicon
[g]
[%]
89.5
3271
SiO2
(not available)
123736071 / 1
1317-36-8
123736958 / 1
12136-45-7
8
2.5
8.1
8.1
0.033
34.8
7.2
100
D
61
7.2
100
D/P
4.2
7.2
100
This is an uncontrolled copy of a document created by IMDS. End of the report.
Hewlett-Packard GmbH
8.1
100
14808-60-7
Dikaliumoxide
D
100
23254370 / 3
PbO RoHS compliant
GADSL,
SVHC
Parts Marking
Recyclate
(Indust./Consumer)
Application
100
76656002 / 1
Gehäuse/case
Portion
(from - to)
[%]
0.0018
7440-22-4
7440-06-4
Dipotassium-oxide
Portion
76655932 / 1
Platinum
Lead-monoxide
Weight
7440-21-3
Pt
Quartz (SiO2)
(not available)
Quantity
76655789 / 1
Ag
Silver
Classif.
IMDS ID / Version
Electrical components which
contain lead in a glass or ceramic
matrix compound except glass in
bulbs and glaze of spark plugs