Model : BT40 V1.0 kr BT40 USERS Manual Copyright ㉿ 2015 JLTech Authors of the copy of the whole or part of the content without prior approval, prohibited the distribution used. BT40 Datasheet Table of Contents 1. BT40 Introduction 2. BT40 Pinout 3. BT40 Module Interface 4. BT40 Reference Design 5. BT40 Layout Design 6. BT40 PCB Footprint 7. BLS (Board Level Shielding) -2- BT40 Datasheet 1. BT40 Introduction 1.1 Tatget The module is all Bluetooth Low-Energy Features : radio , stack, profiles and application for eazy applications and include processor of System on Chip(SoC) The module can be provides directly with a simple user interface or even display to connect sensors. The module can be powered directly with pair of AAA batteries or a 3V Con cell. In lowest power sleep mode it and we provide free technical support APP od iOS system or APP Androis system. 1.2 Application § § § § § § § § Sports and fitness Healthcare Home entertainment Office and mobile accessories Automotive Commercial Watches Human interface devices 1.3 Electrical Characteristics Operating Condition Min Typical Max Unit Temperature Rang -10 -- +50 °C Battery (VDD_BAT) operation 1.8 -- +3.6 V I/O Supply Voltage (VDD_PIO) 1.2 -- +3.6 V 0 - +1.3 V 2480 MHz AIO input Frequency range 2402 -3- BT40 Datasheet 1.4 Power Consumption The current consumption are measured at the VBAT Mode Description Total typical current at 3.3V (average) Dormant All functions are shutdown. To wake up toggle the WAKE pin <600nA Hibernate All functions are shutdown except for the sleep clock. The module can wake up on a timer on the sleep clock. <1.5uA Deel Sleep VDD=3.3V 1ms wake up time <5uA Idea VDD=3.3V 1us wake up time 1mA RF RX/TX active (0dBm) VDD=3.3V VDD_PIO=3.3V 2. BT40 Pinout 2.1 Pin Configuration [Picture 1 : Pinout of JL-BT40 ] -4- ~16mA @3V peak BT40 Datasheet 2.2 Pinout and Terminal Description Symbol GND AIO2 AIO1 AIO0 Pin 1 2 3 4 PAD Type Ground Bidirectional analogue Bidirectional analogue Bidirectional analogue CMOS output, tristate, with weak internal pull-up CMOS input with weak internal pull-down UART_TX 5 UART_RX 6 PIO3 7 Bi-directional with rogrammable strength internal pull-up/down PIO4 8 Bi-directional with programmable strength internal pull-up/down PIO5/SPI_CLK 9 Bi-directional with programmable strength internal pull-up/down GND 10 Ground I2C_SDA 11 Bi-directional tristate with weak internal pull-up I2C_SCL 12 Input with weak internal pull-up PIO2 13 Bi-directional with programmable strength internal pull-up/down PIO6/SPI_CSB 14 Bi-directional with programmable strength internal pull-up/down PIO7/SPI_MISO 15 Bi-directional with programmable strength internal pull-up/down VCC_PIO 16 Powered GND 17 Bi-directional with programmable strength internal pull-up/down PIO9 18 GND 19 PIO10 20 PIO11 21 SPI_PIO_S NP VBAT GND NP 22 23 24 25 26 WAKE_UP 27 GND 28 Bi-directional with programmable strength internal pull-up/down Ground Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Input with strong internal pull-down NP Power supply Ground NP Input has no internal pulldown use external pull-up or pull-down Ground -5- 설명 Ground 10bit Analogue programmable I/O line 10bit Analogue programmable I/O line 10bit Analogue programmable I/O line UART data output UART data input Programmable input/output line PWM or LED Controls Programmable input/output line PWM or LED Controls Programmable input/output line Or debug SPI_CLK select by SPI_PIO_SEL Ground I2C data input/output or SPI serial flash data output(SF_OUT) I2C clock or SPI serial flash clock output (SF_CLK) Programmable input/output line Programmable input/output line Or debug chip select, selected by SPI_PIO_S EL Programmable input/output line Or debug SPI_MOSI, selected by SPI_PIO_S EL PIO power supply Programmable input/output line Or debug SPI_MISO, selected by SPI_PIO_SEL Programmable input/output line PWM or LED Controls Ground Programmable input/output line PWM or LED Controls Programmable input/output lin Selects SPI debug on (8:5) NP Button cell battery or DC1.8V to 3.6V Ground NP Set high to wake Ground BT40 Datasheet 3. BT40 Module Interface 3.1 Power Supply § The module power supply 3v coin cell batteries or DC 3.3v § Capacitor decouples power to the chip [Picture 2 : PCB Design] 3.2 PIO § PIO : 10 PIOs are provided § 4 are multiplexed with SPI debug interface 3.3 AIO § AIO : 3 AIOs are provided § Adc : 10Bit § They can be used to read or output a voltage between 0V to 1.3V. 3.4 UART § This is a standard UART interface for communicating with other serial devices. § Protocol : RS232 Parameter Baud Rate Possible Values Min 9600 baud (≤1% Error) Max 2M baud (≤1%Error) Flow control RTS/CTS or None Parity None, Odd or Even Numer of Stop Bits 1 or 2 Bits per Byte 8 [Picture 3 : Connection To Host device ] 6- BT40 Datasheet 3.5 SPI Master § The module can act as an SPI master (mode 0) when configured by software. § Any Four PIOs : SPI_CLK, SPI_CS#, SPI_DIN and SPI_DOUT § SPI Rate : 470kHz 3.6 SPI Debug § SPI Debug interface : chosen when PIO_SPI_S is high § Program Mode & Debug Mode 선택 4. BT40 Reference Design [Picture 4 : Reference Design ] -7- BT40 Datasheet 5. BT40 Layout Design 5.1 Soldering Recommendations § It is compatible with industrial standard reflow profile for Pb-free solders. § Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150um stencil thickness is recommended. 5.2 Layout Guidelines § Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. § Connect all the GND pins directly to a solid GND plane. § Avoid placing plastic or any other dielectric material closer than 6 mm from the antenna. [Picture 5 : Clearance area of antenna ] -8- BT40 Datasheet 6. BT40 PCB Footprint [Picture 6 : Physical Dimensions and Recommended Footprint ( Unit : mm, Deviation:0.02mm) ] -9- BT40 Datasheet 7. BLS (A Low-Cost, Single-Cavity Alternative) We also recognize that target budgets do not always accommodate a custom shielding solution. The proprietary and extremely cost-effective Slot-Lok™ design and manufacturing process can accommodate virtually any multi-cavity shielding application requirement. This circuit board shield uses a flexible manufacturing technology that increases design options while reducing lead time and total product cost. [Picture 7 : Shield-Can] • Material : Ni-Silver, SPTE • Width : 0.102mm ~ 0.406mm • Round : Min 0.15mm • Flatness : 0.08mm • Height : 1.60mm -10- JL-BT40 Datasheet [ Features] Model : Bluetooth Wireless Data Commnuicaction System Wireless-Module(BT40) KC : MSIP-CRM-JLK-BT40 Mannufacture Date : Cross-Party conformity assessment Received: JLTech Co.Ltd Mannufacture/Countury : JLTech Co.Ltd / S.Korea Operation Temperature : -10 ℃ ~ 50 ℃ Power : DC 3.3V Frequecy : 2402 ㎒ ~ 2480 ㎒ Your wireless equipment, because the whole body is likely propagation of the operation can not be related to the safety of life services. -11-