EGIGATEK Bluetooth 4.0 LE Single Mode module datasheet Doc. Version : 20141012 Product ID eGM-A21A/B/C Product Name Bluetooth 4.0 LE single mode(KB) module Firmware Version Hardware Version Rev.1.0.2 1. DESCRIPTION eGM-A21 is product from CSR's single-mode keyboard Bluetooth Low Energy solution. CSR µEnergy enables ultra low-power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. The CSR µEnergy platform provides everything required to create a Bluetooth low energy product with RF, baseband, MCU, qualified Bluetooth v4.0 stack and customer application running on a single IC. 2. FEATURES ■ Bluetooth Low Energy available with CSR1011 QFN ■ Bluetooth v4.0 specification ■ Single mode Bluetooth low energy ■ 7.5dBm Bluetooth low energy maximum TX output power ■ -92.5dBm Bluetooth low energy RX sensitivity ■ Support for Bluetooth v4.0 specification host stack including: ATT, GATT, SMP, L2CAP, GAP ■ RSSI monitoring for proximity applications ■ <600nA ultra low consumption in dormant mode ■ Integrated 32kHz and 16MHz crystal or system clock ■ Switch-mode power supply ■ Programmable general purpose PIO controller ■ 10-bit ADC ■ 30 digital PIOs ■ 3 analogue AIOs ■ UART 1 ■ 512KB EEPROM ■ Debug SPI ■ 3 PWM modules ■ Wake-up interrupt ■ 64KB RAM and 64KB ROM ■ Watchdog timer ■ Dimensions: 13.5 mm x 16.5 mm x 1.8 mm(eGM-A21A) 17.75 mm x 16.5 mm x 1.8 mm (eGM-A21B with printed antenna/eGM-A21C with integrated chip antenna) ■ Storage temperature range: -40ºC ~ +85ºC ■ Operating temperature range: -30ºC ~ +85ºC 3. APPLICATIONS Building an ecosystem using Bluetooth low energy Bluetooth low energy enables the transfer of simple data sets between compact devices opening up a completely new class of Bluetooth applications such as watches, TV remote controls, medical sensors and fitness trainers. Bluetooth low energy takes less time to make a connection than conventional Bluetooth wireless technology and can consume approximately 1/20th of the power of Bluetooth Basic Rate. Supports profiles for sensors, watches, HIDs and time synchronization. Typical Bluetooth low energy applications: ■ Sports and fitness ■ Healthcare ■ Home entertainment ■ Office and mobile accessories ■ Automotive ■ Commercial ■ Watches ■ Human interface devices 3.1 Device Details 3.1.1 Bluetooth Radio ■ On-chip balun (50Ω impedance in TX and RX modes) ■ No external trimming is required in production ■ Bluetooth v4.0 specification compliant 3.1.2 Bluetooth Transmitter ■ 7.5dBm RF transmit power with level control from integrated 6-bit DAC over a dynamic 2 range >30dB ■ No external power amplifier or TX/RX switch required 3.1.3 Bluetooth Receiver ■ -92.5dBm sensitivity ■ Integrated channel filters ■ Digital demodulator for improved sensitivity and cochannel rejection ■ Fast AGC for enhanced dynamic range 3.1.4 Synthesiser ■ Fully integrated synthesiser requires no external VCO varactor diode, resonator or loop filter 3.1.5 Baseband and Software ■ Hardware MAC for all packet types enables packet handling without the need to involve the MCU 3.1.6 Physical Interfaces ■ SPI master interface ■ SPI programming and debug interface ■ I²C ■ Digital PIOs ■ Analogue AIOs 3.1.7 Auxiliary Features ■ Battery monitor ■ Power management features include software shutdown and hardware wake-up ■ Run in low power modes from an external 32.768kHz clock signal ■ Integrated switch-mode power supply ■ Linear regulator (internal use only) ■ Power-on-reset cell detects low supply voltage 3.1.8 Bluetooth Stack ■ Support for Bluetooth v4.0 specification features: ■ Master and slave operation ■ Including encryption ■ Software stack in firmware includes: ■ GAP ■ L2CAP ■ Security manager 3 ■ Attribute protocol ■ Attribute profile ■ Bluetooth low energy profile support 4 4. ELECTRICAL CHARACTERISTICS 4.1 Absolute Maximum Ratings Rating Min Max Storage temperature -40 +85 Battery (VDD_BAT) operation(a) 1.8 3.6 V I/O supply voltage -0.4 3.6 V VSS-0.4 VDD+0.4 V Other terminal voltages Unit (a) Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. 4.2 Recommended Operating Conditions Operating Condition Min Typ Max Unit Operating temperature range -30 - 85 Battery (VDD_BAT) operation 1.8 - 3.6 V I/O supply voltage (VDD_PADS) 1.2 - 3.6 V 4.3 Input/Output Terminal Characteristics 4.3.1 Switch-mode Regulator Switch-mode Regulator Min Typ Max Unit Input voltage 1.8 - 3.6 V Output voltage 0.65 1.35 1.35 V3.6 Temperature coefficient -200 - 200 ppm/°C Output noise, frequency range 100Hz to 100kHz - - 0.4 mV rms Settling time, settling to within 10% of final value - - 30 µs Output current (Imax) - - 50 mA Quiescent current (excluding load, Iload < 1mA) - - 20 µA Output current (Imax) - - 100 µA Quiescent current - - 1 µA Normal Operation Ultra Low-power Mode 4.3.2 Low-voltage Linear Regulator Normal Operation Min Typ Max Unit Input voltage 0.65 - 1.35 V Output voltage 0.65 - 1.20 V 5 4,3,3 Digital Terminals Input Voltage Levels Min Typ Max Unit VIL input logic level low -0.4 - 0.4 V VIH input logic level high 0.7 x VDD - VDD+0.4 V - - 25 ns Min Typ Max Unit - - 0.4 V VOH output logic level high, lOH = -4.0mA 0.75 x VDD - - V Tr/Tf 1.2 - 5 ns Input and Tristate Currents Min Typ Max Unit With strong pull-up -150 -40 -10 µA I²C with strong pull-up -250 - - µA With strong pull-down 10 40 150 µA With weak pull-up -5.0 -1.0 -0.33 µA With weak pull-down 0.33 1.0 5.0 µA CI input capacitance 1.0 - 5.0 pF Tr/Tf Output Voltage Levels VOL output logic level low, lOL = 4.0mA 4.3.4 AIO Input Voltage Levels Input voltage Min Typ Max Unit 0 - 1.3 V 6 5. CURRENT CONSUMPTION Mode Dormant Description Total Typical Current at 3V All functions are shutdown. To wake up toggle the WAKE <600nA pin. Hibernate VDD_PADS = ON, REFCLK = OFF, SLEEPCLK = ON, <1.5µA VDD_BAT = ON Deep sleep VDD_PADS = ON, REFCLK = OFF, SLEEPCLK = ON, <5µA VDD_BAT = ON, RAM = ON, digital circuits = ON, SMPS = ON (low-power mode), 1ms wake-up time Idle VDD_PADS = ON, REFCLK = ON, SLEEPCLK = ON, -1mA VDD_BAT = ON, RAM = ON, digital circuits = ON, MCU = IDLE, <1µs wake-up time RX / TX active - ~16mA @ 3V peak current 7 6. SERIAL INTERFACES 6.1 Application Interface 6.1.1 UART Interface eGM-A21 provides a simple mechanism for communicating with other serial devices using the RS232 protocol. 2 signals implement the UART function, UART_TX and UART_RX. When eGM-A20 is connected to another digital device, UART_RX and UART_TX transfer data between the 2 devices. UART configuration parameters, e.g. baud rate and data format, are set using eGM-A21 firmware. When selected in firmware PIO[0] is assigned to a UART_TX output and PIO[1] is assigned to a UART_RX input. The UART CTS and RTS signals can be assigned to any PIO pin by the on-chip firmware. Note: To communicate with the UART at its maximum data rate using a standard PC, the PC requires an accelerated serial port adapter card. Parameter Baud rate Possible Values Minimum 1200 baud (≤2%Error) 9600 baud (≤1%Error) Maximum 2Mbaud (≤1%Error) Flow control CTS / RTS Parity None, Odd or Even Number of stop bits 1 or 2 Bits per byte 8 Table 6.1: Possible UART Settings 6.1.1.1 UART Configuration While in Deep Sleep The maximum baud rate is 9600 baud during deep sleep. 6.2 SPI Master Interface The SPI master memory interface in the module is overlaid to uses a further 3 PIOs for the extra pins. SPI Interface Pin Flash_VDD PIO[2] SF_DIN PIO[3] SF_CS# PIO[4] SF_CLK I2C_SCL SF_DOUT I2C_SDA Table 6.2: SPI Master Serial Flash Memory Interface 8 7. PIN DESCRIPTION 7.1 Pin Numbering Figure 7.1 eGM-A21C and eGM-A21B Pin Numbering Figure 7.2 eGM-A21A Pin Numbering 9 7.2 Pin Definition PIN Name No Description GND 1 Ground AIO2 2 Analogue programmable I/O line. AIO1 3 Analogue programmable I/O line. AIO0 4 Analogue programmable I/O line. PIO0/UART_TX1 5 Programmable I/O line or UART TX PIO12 6 Programmable I/O line. PIO1/UART_RX1 7 Programmable I/O line or UART RX PIO13 8 Programmable I/O line. PIO14 9 Programmable I/O line. PIO3/SF_DOUT 10 PIO4/SF_CSB 11 PIO15 12 Programmable I/O line or SPI serial flash data (SF_DIN) input. If connecting to SPI serial flash, this pin connects to SI on the serial flash. Programmable I/O line or SPI serial flash chip select (SF_CS#) Programmable I/O line. PIO16 13 Programmable I/O line. GND 14 Ground PIO5/SPI_CLK1 15 Programmable I/O line or debug SPI CLK selected by SPI_PIO#. PIO17 16 Programmable I/O line. PIO18 17 Programmable I/O line. PIO6/SPI_CSB1 18 PIO19 19 Programmable I/O line or debug SPI chip select(CS#) selected by SPI_PIO# Programmable I/O line PIO20 20 Programmable I/O line PIO7/SPI_MOSI1 21 Programmable I/O line or debug SPI MOSI selected by SPI_PIO# PIO21 22 Programmable I/O line PIO22 23 Programmable I/O line PIO23 24 Programmable I/O line or SPI serial flash data (SF_DOUT) output PIO8/SPI_MISO1 25 Programmable I/O line or debug SPI MISO selected by SPI_PIO# 10 PIO24 26 Programmable I/O line PIO25 27 Programmable I/O line PIO9 28 Programmable I/O line. GND 29 PIO26 30 Programmable I/O line PIO27 31 Programmable I/O line PIO10 32 Programmable I/O line PIO28 33 Programmable I/O line PIO11 34 Programmable I/O line PIO29 35 Programmable I/O line PIO30 36 Programmable I/O line SPI_PIO#_SEL 37 Selects SPI debug on PIO[8:5] PIO31 38 Programmable I/O line VBAT 39 GND 40 Battery input and regulator enable (active high). Ground WAKE 41 Input to wake CSR1011 QFN from hibernate or dormant GND 42 Ground GND 43 Ground(for eGM-A21A only) RF 44 GND 45 Bluetooth transmitter/receiver(for eGM-A21A only) Ground(for eGM-A21A only) 11 8. MECHANICAL CHARACTERICS 8.1 Dimensions Figure 8.1 eGM-A21C and eGM-A21B dimension Figure 8.2 eGM-A21A dimension 12 8.2 Recommended Land Pattern Figure 8.4 eGM-A21B and eGM-A21C land pattern Figure 8.5 eGM-A21A land pattern 13 8.3 Typical Solder Reflow Profile 8.4 Housing Guidelines The individual case must be checked to decide whether a specific housing is suitable for the use of the internal antenna. A plastic housing must at least fulfill the following requirements: ² Non-conductive material, non-RF-blocking plastics ² No metallic coating ² ABS is suggested 14 8.5 Application schematic 15 9. PACKAGE Tray Type a. b. c. d. Carrier not be exceed 1mm in 100mm. Packing dimensions meet : 390mm * 270mm * 15mm Material : white anti-static polystyrene Component load per tray : 100pcs EGIGATEK Bluetooth module design data 16