FLC-BTM101 Datasheet Document Type: Bluetooth Module Datasheet Document Number: FLC-BTM101-DS Document Version: V2.0 Release Date: 2014/12/09 Copyright 2014 ~ 2016 by Flaircomm Microelectronics Inc., All Right Reserved Without written permission from Flaircomm Microelectronics Inc., reproduction, transfer, distribution or storage of part or all of the contents in this document in any form is prohibited FLC-BTM101 Datasheet Release Record Version Release Date Comments 1.0 2012/6/26 Initial Release 1.1 2012/8/1 Update Table 2. 1.2 2012/8/6 Add the weight. Add Part 5.1.1&5.2&5.3. Modify PCB footprint and reference design. 1.3 2012/8/8 Add BT/CE/FCC Warnings. 1.4 2012/8/29 Update FCC 2200 logo. Add module statement. 1.5 2012/9/6 Modify operating temperature. 1.6 2012/11/29 1.7 2013/4/9 1.8 2014/10/14 Update FLC logo. Modify tray number of Product Packaging Information. 1.9 2014/10/29 Add BTM101C Dimension, weight, Block Diagram, Pin Configuration, Reference Design and Mechanical Characteristic. 2.0 2014/12/09 Add CE statement, label instructions and antenna statement. Flaircomm Microelectronics, Inc. logo. Add Cautions & Add BTM101B Block Diagram and modify Power Consumption. Modify the height of the module. -2- FLC-BTM101 Datasheet CONTENTS 1. INTRODUCTION ..................................................................................................................... 7 1.1 BLOCK DIAGRAM ........................................................................................................................ 7 1.1.1 Block Diagram of BTM101A ........................................................................................... 7 1.1.2 Block Diagram of BTM101B ........................................................................................... 8 1.1.3 Block Diagram of BTM101C ........................................................................................... 8 1.2 FEATURES .................................................................................................................................. 8 1.3 APPLICATIONS ............................................................................................................................ 9 2. GENERAL SPECIFICATION .............................................................................................. 10 3. PIN DEFINITION ................................................................................................................... 11 3.1 PIN CONFIGURATION (BTM101A/B)....................................................................................... 11 3.2 PIN CONFIGURATION (BTM101C) .......................................................................................... 12 3.3 PIN DEFINITION ........................................................................................................................ 12 4. PHYSICAL INTERFACES................................................................................................... 15 4.1 POWER SUPPLY ....................................................................................................................... 15 4.2 RESET ...................................................................................................................................... 15 4.2.1 Digital Pin States on Reset ........................................................................................... 15 4.2.2 Power-on Reset .............................................................................................................. 15 4.3 GENERAL PURPOSE DIGITAL IO .............................................................................................. 16 4.4 GENERAL PURPOSE ANALOGUE IO ......................................................................................... 16 5. SERIAL INTERFACES ........................................................................................................ 17 5.1 UART....................................................................................................................................... 17 5.1.1 UART Configuration While in Deep Sleep .................................................................. 17 5.2 I2C INTERFACE ......................................................................................................................... 17 5.3 SPI MASTER INTERFACE ......................................................................................................... 18 5.4 PROGRAMMING AND DEBUG INTERFACE ................................................................................. 19 5.4.1 Instruction Cycle .............................................................................................................. 20 5.4.2 Multi-slave Operation....................................................................................................... 21 Flaircomm Microelectronics, Inc. -3- FLC-BTM101 Datasheet 6. ELECTRICAL CHARACTERISTICS ................................................................................. 22 6.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................ 22 6.2 RECOMMENDED OPERATING CONDITIONS .............................................................................. 22 6.3 INPUT/OUTPUT TERMINAL CHARACTERISTICS ......................................................................... 23 6.3.1 Digital Terminals ............................................................................................................. 23 6.4 AIO........................................................................................................................................... 24 6.5 POWER CONSUMPTION ............................................................................................................ 24 7. REFERENCE DESIGN ........................................................................................................ 25 8. MECHANICAL CHARACTERISTICS ............................................................................... 27 9. RECOMMENDED REFLOW PROFILE ............................................................................ 29 10. ORDERING INFORMATION ............................................................................................... 31 10.1 PRODUCT PACKAGING INFORMATION .................................................................................. 31 10.2 ORDERING INFORMATION ..................................................................................................... 33 10.2.1 Product Revision ......................................................................................................... 33 10.2.2 Shipping Package ....................................................................................................... 33 10.2.3 Product Package ......................................................................................................... 33 10.2.4 Product Grade.............................................................................................................. 34 11. CERTIFICATIONS ................................................................................................................ 35 11.1 FCC STATEMENT ................................................................................................................. 35 11.2 RF W ARNING STATEMENT ................................................................................................... 35 11.3 CE STATEMENT .................................................................................................................... 35 11.4 FLC-BTM101 LABEL INSTRUCTIONS .................................................................................. 36 11.5 FLC-BTM101 ANTENNA STATEMENT ................................................................................. 37 11.5.1 FLC-BTM101XQZC (Without Antenna) ................................................................... 37 11.5.2 FLC-BTM101XQZA & FLC-BTM101XQZB (With Antenna) ................................. 37 Flaircomm Microelectronics, Inc. -4- FLC-BTM101 Datasheet TABLES AND FIGURES Table 1: General Specification ........................................................................................... 10 Table 2: Pin Definition ........................................................................................................ 14 Table 3: Digital Pin Status on Reset .................................................................................. 15 Table 4: Power-on Reset ................................................................................................... 16 Table 5: Possible UART Settings ....................................................................................... 17 Table 6: SPI Master Serial Flash Memory Interface........................................................... 18 Table 7: Instruction Cycle for a SPI Transaction ................................................................ 20 Table 8: Absolute Maximum Ratings ................................................................................. 22 Table 9: Recommended Operating Conditions .................................................................. 22 Table 10: Digital Terminal .................................................................................................. 23 Table 11: Power Consumption ........................................................................................... 24 Table 12: Product Revision ................................................................................................ 33 Table 13: Shipping Package .............................................................................................. 33 Table 14: Product Package ................................................................................................ 33 Table 15: Product Grade .................................................................................................... 34 Table 16: Antenna Specifications....................................................................................... 37 Table 17: Max. and avg. antenna gain value of radiation pattern ....................................... 39 Figure 1: Block Diagram of BTM101A.................................................................................. 7 Figure 2: Block Diagram of BTM101B.................................................................................. 8 Figure 3: Block Diagram of BTM101C ................................................................................. 8 Figure 4: Pin Configuration ................................................................................................ 11 Figure 5: Pin Configuration ................................................................................................ 12 Figure 6: Example of an I2C Interface EEPROM Connection ............................................ 18 Figure 7: Memory Boot-up Sequence ................................................................................ 19 Figure 8: Reference Design (BTM101A/B) ........................................................................ 25 Figure 9: Reference Design (BTM101C)............................................................................ 26 Figure 10: Mechanical Characteristic (BTM101A/B) .......................................................... 27 Flaircomm Microelectronics, Inc. -5- FLC-BTM101 Datasheet Figure 11: Mechanical Characteristic (BTM101C) ............................................................. 28 Figure 12: Recommended Reflow Profile .......................................................................... 29 Figure 13: Product Packaging Information ......................................................................... 31 Figure 14: Product Packaging Information (Tape) ............................................................. 32 Figure 15: Ordering Information ......................................................................................... 33 Figure 16: The Definition of X-Y-Z Plane and Angle for Radiation Pattern ........................ 38 Figure 17: Radiation Pattern Measurements ..................................................................... 38 Flaircomm Microelectronics, Inc. -6- FLC-BTM101 Datasheet 1. Introduction FLC-BTM101 is a Bluetooth low energy (BLE) module supporting BT4.0 (BLE only). This module enables customers to add ultra-low power wireless connectivity to their products. The module provides everything required to create a Bluetooth low energy product with RF, base band, MCU, system clock, antenna and qualified Bluetooth 4.0 (BLE only) stack and customer application settings. It also enables the transfer of short data sets between compact devices opening up a completely new area of Bluetooth applications such as watches, TV remote controls, medical sensors and fitness trainers. Bluetooth low energy takes less time to establish a connection than conventional Bluetooth wireless technology and can consume approximately 1/20th of the power of Bluetooth Basic Rate. BTM101 support profiles for sensors, watches, HIDs and time synchronization. 1.1 Block Diagram 1.1.1 Block Diagram of BTM101A Antenna PIOs SPI Filter CSR1000 BLE PM Two Clocks VDD UART FLC-BTM101A Figure 1: Block Diagram of BTM101A Flaircomm Microelectronics, Inc. -7- FLC-BTM101 Datasheet 1.1.2 Block Diagram of BTM101B Antenna PIOs SPI Filter CSR1010 BLE Two Clocks PM VDD UART FLC-BTM101B Figure 2: Block Diagram of BTM101B 1.1.3 Block Diagram of BTM101C Filter SPI Antenna CSR1010 BLE PIOs PM Two Clocks VDD UART FLC-BTM101C Figure 3: Block Diagram of BTM101C 1.2 Features Bluetooth v4.0(BLE only) Support of Bluetooth 4.0(BLE only) specification host stack including ATT, GATT, SMP, L2CAP, GAP RSSI monitoring for proximity applications 32kHz and 16MHz system clocks Flaircomm Microelectronics, Inc. -8- FLC-BTM101 Datasheet 10 bits ADC 12 digital PIOs 3 analog AIOs UART host interface 512 kbits EEPROM Debug SPI host interface 3 PWM modules Wakeup interrupt 64KB RAM and 64K ROM Watchdog timer Small form factor SMT pads for easy and reliable PCB mounting BQB/FCC/CE Certified RoHS compliant 1.3 Applications Typical applications are: Sports and fitness Healthcare Home automation Office and mobile accessories Automotive Commercial Watches Human interface devices Flaircomm Microelectronics, Inc. -9- FLC-BTM101 Datasheet 2. General Specification Bluetooth Specification Standard Bluetooth4.0(BLE only) Frequency Band 2.402GHz ~ 2.480GHz Antenna Antenna(BTM101A/B) / None(BTM101C) High System Clock 16MHz Low System Clock 32.768kHz Interface UART, PIO, SPI,AIO Sensitivity [email protected]%BER RF TX Power 6dBm Power Supply Voltage 1.8 ~ 3.6V DC Operational Current Refer to Table 11 Deep Sleep Current <5uA in deep sleep mode Operating Environment Temperature -30ºC to +85ºC Certifications BQB/FCC/CE2200 Environmental RoHS Compliant Dimension and Weight Dimension (A/B) 22.00mm x 13.40mm x 2.30mm （Tolerance: ±0.1mm） Dimension (C) 17.00mm x 13.40mm x 2.30mm （Tolerance: ±0.1mm） Weight (A/B) 1.08g Weight (C) 0.97g Table 1: General Specification Flaircomm Microelectronics, Inc. -10- FLC-BTM101 Datasheet 3. Pin Definition 3.1 Pin Configuration (BTM101A/B) Figure 4: Pin Configuration Flaircomm Microelectronics, Inc. -11- FLC-BTM101 Datasheet 3.2 Pin Configuration (BTM101C) Figure 5: Pin Configuration 3.3 Pin Definition Pin Symbol I/O Type 1 GND Ground Ground 2 AIO2 Bidirectional analogue Analogue programmable I/O line 3 AIO1 Bidirectional analogue Analogue programmable I/O line 4 AIO0 Bidirectional analogue Analogue programmable I/O line 5 PIO0 / UART_TX Bi-directional with programmable strength internal pull-up/down Programmable input/output line / UART TX selected by firmware setting Flaircomm Microelectronics, Inc. Description -12- FLC-BTM101 Datasheet PIO1 / UART_RX Bi-directional with programmable strength internal pull-up/down Programmable input/output line / UART RX selected by firmware setting 7 PIO3 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 8 PIO4 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 9 PIO5 / SPI_CLK Bi-directional with programmable strength internal pull-up/down Programmable input/output line / SPI Clock selected by SPI_PIO# 10 GND Ground Ground 11 PIO6 / SPI_CSB Bi-directional with programmable strength internal pull-up/down Programmable input/output line / SPI CSB selected by SPI_PIO# 12 PIO7 / SPI_MOSI Bi-directional with programmable strength internal pull-up/down Programmable input/output line / SPI MOSI selected by SPI_PIO# 13 PIO8 / SPI_MISO Bi-directional with programmable strength internal pull-up/down Programmable input/output line / SPI MISO selected by SPI_PIO# 14 PIO9 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 15 I2C_SDA Bidirectional, tristate, with weak internal pull-up I2C data input/output 16 I2C_SCL Input with weak internal pullup I2C clock 17 GND Ground Ground PIO2 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 6 18 Flaircomm Microelectronics, Inc. -13- FLC-BTM101 Datasheet 19 PIO10 20 VDD_PIO Bi-directional with programmable strength internal pull-up/down Programmable input/output line Power Input Positive supply for all digital I/O port PIO[11:0] Programmable input/output line 21 PIO11 Bi-directional with programmable strength internal pull-up/down 22 SPI_PIO#SEL Input with strong internal pull-down Select SPI debug port on PIO[8:5] 23 Wake-up Input has no internal pull-up or pull-down, use external pull-down Input to wake up BTM101 from hibernate 24 VDD Power input 3.3v power input 25 GND Ground Ground 26 GND Ground Ground 27 GND Ground Ground 28 ANTENNA Antenna Antenna 29 GND Ground Ground Table 2: Pin Definition Flaircomm Microelectronics, Inc. -14- FLC-BTM101 Datasheet 4. Physical Interfaces 4.1 Power Supply BTM101 contains two regulators: • • One switch-mode regulator, which generates the main supply rail directly from battery One low-voltage linear regulator with 1.2V output powers digital circuits VDD_PIO is input voltage to power all digital I/Os including PIOs, UART port, SPI port and I2C. 4.2 Reset The module may be reset from several sources: • • Power-on reset Software configured watchdog timer. 4.2.1 Digital Pin States on Reset The following table shows the digital pin states of BTM101 on reset. PU and PD default to weak values unless specified otherwise. Pin Name/Group On Reset I2C_SDA Strong PU I2C_SCL Strong PU PIO[11:0] Weak PD Table 3: Digital Pin Status on Reset 4.2.2 Power-on Reset The following table shows how the power-on reset occurs. Flaircomm Microelectronics, Inc. -15- FLC-BTM101 Datasheet Power-on Reset Type Reset release on VDD_DIG rising 1.05 Reset assert on VDD_DIG falling 1.00 Reset assert on VDD_DIG falling (Sleep mode) 0.60 Hysteresis 50 Unit V mV Table 4: Power-on Reset 4.3 General Purpose Digital IO 12 lines of programmable bidirectional I/O are provided. They are all powered from VDD_PIO. PIO lines are software configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down. NOTE: at reset all PIO lines are input with weak pull-downs. Any of the PIO line can be configured as interrupt request line or as weak-up lines from sleep modes. The BTM101 supports alternative functions on the PIO lines: • SPI interface, • UART. • LED flashing / PWM module. NOTE: Implementation of the PIO lines is firmware build specific. 4.4 General Purpose Analogue IO BTM101 has 3 general purpose analog interface pins, AIO [2:0]. Flaircomm Microelectronics, Inc. -16- FLC-BTM101 Datasheet 5. Serial Interfaces 5.1 UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. When the module is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. When selected in firmware PIO[0] is assigned to UART_TX and PIO[1] is assigned to UART_RX. The UART CTS and RTS signals can be assigned to any PIO pin by the onchip firmware. Parameter Baud Rate Possible Values Minimum Maximum Flow control Parity Number of Stop Bits Bits per Byte 1200 baud (≤2%Error) 9600 baud (≤1%Error) 4M baud (≤1%Error) CTS / RTS None, Odd or Even 1 or 2 8 Table 5: Possible UART Settings 5.1.1 UART Configuration While in Deep Sleep The maximum baud rate is 9600 baud during deep sleep. 5.2 I2C Interface The I2C interface communicates to an internal EEPROM, or external peripherals or sensors. The internal EEPROM holds the program code insideBTM101. Figure 4 shows the connection of the internal EEPROM with the I2C interface where I2C_SCL, I2C_SDA and PIO [2] are connected to the internal EEPROM. The PIO [2] pin supplies the power to the EEPROM supply pin, e.g. VDD. At boot-up, if there is no valid ROM image in the BTM101 ROM area, BTM101 tries to boot from the I2C interface, see Figure 5. This involves reading the code from the internal EEPROM and loading it into the internal BTM101 RAM. Flaircomm Microelectronics, Inc. -17- FLC-BTM101 Datasheet Figure 6: Example of an I2C Interface EEPROM Connection 5.3 SPI Master Interface BTM101 provides a SPI interface to connect an external serial flash memory. The SPI master memory interface in the BTM101 is overlaid on the I2C interface and uses a further 3 PIOs for the extra pins, see Table 6. SPI Interface Pin Flash_VDD SF_DIN SF_CS# SF_CLK SF_DOUT PIO[2] PIO[3] PIO[4] I2C_SCL I2C_SDA Table 6: SPI Master Serial Flash Memory Interface Note: If an application using BTM101 is designed to boot from SPI serial flash, it is possible for the firmware to map the I2C interface to alternative PIOs. The boot-up sequence for BTM101 is controlled by hardware and firmware. Figure5 shows the sequence of loading RAM with content from RAM, EEPROM and SPI serial flash. Flaircomm Microelectronics, Inc. -18- FLC-BTM101 Datasheet Figure 7: Memory Boot-up Sequence 5.4 Programming and Debug Interface The BTM101 debug SPI interface is available in SPI slave mode to enable an external MCU to program and control the BTM101, generally via libraries or tools supplied by Flaircomm Microelectronics, Inc. -19- FLC-BTM101 Datasheet Flaircomm. The protocol of this interface is proprietary. The 4 SPI debug lines directly support this function. The SPI programs, configures and debugs the BTM101. Take SPI_PIO#_SEL high to enable the SPI debug feature on PIO [8:5]. BTM101 uses a 16-bit data and 16-bit address programming and debug interface. Transactions occur when the internal processor is running or is stopped. Data is written or read one word at a time, or the auto-increment feature is available for block access. 5.4.1 Instruction Cycle TheBTM101is the slave and receives commands on DEBUG_MOSI and outputs data on DEBUG_MISO. Table 7 shows the instruction cycle for a SPI transaction. 1 Reset the SPI interface 2 Write the command word Take DEBUG_CS# low and clock in the 8bitcommand 3 Write the address Clock in the16-bitaddress word 4 Write or read data words Clock in or out16-bitdata word(s) 5 Termination Take DEBUG_CS# high Hold DEBUG_CS# cycles highfor2 DEBUG_CLK Table 7: Instruction Cycle for a SPI Transaction With the exception of reset, DEBUG_CS# must be held low during the transaction. Data on DEBUG_MOSI is clocked into the BTM101 on the rising edge of the clock line DEBUG_CLK. When reading, BTM101 replies to the master on DEBUG_MISO with the data changing on the falling edge of the DEBUG_CLK. The master provides the clock on DEBUG_CLK. The transaction is terminated by taking DEBUG_CS# high. The auto increment operation on the BTM101 cuts down on the overhead of sending a command word and the address of a register for each read or write, especially when large amounts of data are to be transferred. The auto increment offers increased data transfer efficiency on the BTM101. To invoke auto increment, DEBUG_CS# is kept low, which auto increments the address, while providing an extra 16 clock cycles for each extra word written or read. Flaircomm Microelectronics, Inc. -20- FLC-BTM101 Datasheet 5.4.2 Multi-slave Operation Do not connect the BTM101 in a multi-slave arrangement by simple parallel connection of slave MISO lines. When BTM101 is deselected (DEBUG_CS# = 1), the DEBUG_MISO line does not float. Instead, BTM101 outputs 0 if the processor is running or 1 if it is stopped. Flaircomm Microelectronics, Inc. -21- FLC-BTM101 Datasheet 6. Electrical Characteristics 6.1 Absolute Maximum Ratings Rating Min Max Unit Storage Temperature -40 +85 °C Operating Temperature -30 +85 °C PIO Voltage -0.4 +3.6 V Battery (VDD) operation 1.8 +3.6 V VSS-0.4 VDD+0.4 V Other Voltages Table 8: Absolute Maximum Ratings 6.2 Recommended Operating Conditions Operating Condition Min Typical Max Unit Storage Temperature -40 -- +85 °C Operating Temperature Range -30 -- +85 °C PIO Voltage +1.2 -- +3.6 V VDD Voltage +1.8 -- +3.6 V Table 9: Recommended Operating Conditions Flaircomm Microelectronics, Inc. -22- FLC-BTM101 Datasheet 6.3 Input/output Terminal Characteristics 6.3.1 Digital Terminals Supply Voltage Levels Min Typical Max Unit VIL input logic level low -0.4 - +0.4 V VIH input logic level high 0.7VDD - VDD+0.4 V - - 25 ns VOL output logic level low, lOL = 4.0mA - - 0.4 V VOH output logic level high, lOH = -4.0mA 0.75VDD - - V - - 5 ns -150 -40 -10 μA With strong pull-down 10 40 150 μA With weak pull-up -5 -1.0 -0.33 μA -0.33 +1.0 5.0 μA I/O pad leakage current -1 0 +1 μA CI Input Capacitance 1.0 - 5.0 pF Input Voltage Levels Tr/Tf Output Voltage Levels Tr/Tf Input and Tri-state Current With strong pull-up With weak pull-down Table 10: Digital Terminal Flaircomm Microelectronics, Inc. -23- FLC-BTM101 Datasheet 6.4 AIO Input Voltage Levels Input Voltages Min Typical Max Unit 0 -- +1.3 V 6.5 Power Consumption Operation Mode Dormant Hibernate Deep Sleep Description All functions are shutdown. To wake up toggle the WAKE pin. ~600ms wake up time VDD_PIO = ON. REFCLK = OFF, SLEEPCLK=ON, VDD=ON. ~600ms wake up time VDD_PIO=ON, REFCLK=OFF, SLEEPCLK=ON,VDD=ON,RAM=ON,DIGITAL CIRCUITS=ON, SMPS=ON (low-power mode), 1ms wake up time Typical Unit <600 nA <1.5 uA <5 uA Idle VDD_PIO=ON, REFCLK=ON, SLEEPCLK=ON,VDD=ON,RAM=ON,DIGITAL CIRCUITS=ON, MCU=IDLE, <1us wake up time ~1 mA RX / TX active @3V peak ~16 mA Note: “~600ms Wake up time” in Dormant Mode and Hibernate Mode only refers to BTM101B and BTM101C. Table 11: Power Consumption Flaircomm Microelectronics, Inc. -24- FLC-BTM101 Datasheet 7. Reference Design Figure 8: Reference Design (BTM101A/B) Flaircomm Microelectronics, Inc. -25- FLC-BTM101 Datasheet Figure 9: Reference Design (BTM101C) Flaircomm Microelectronics, Inc. -26- FLC-BTM101 Datasheet 8. Mechanical Characteristics Figure 10: Mechanical Characteristic (BTM101A/B) Flaircomm Microelectronics, Inc. -27- FLC-BTM101 Datasheet Figure 11: Mechanical Characteristic (BTM101C) Flaircomm Microelectronics, Inc. -28- FLC-BTM101 Datasheet 9. Recommended Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. ℃ 250 217 210 A 25 0 B 1 2 C 3 D 4 E 5 6 min Figure 12: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 °C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 °C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150° to 210° for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217 ° for about 20 to 30 second. Reflow Zone (D) —The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. Flaircomm Microelectronics, Inc. -29- FLC-BTM101 Datasheet The recommended peak temperature (Tp) is 230 ~ 250 °C. The soldering time should be 30 to 90 second when the temperature is above 217 °C. Cooling Zone (E) —The cooling ate should be fast, to keep the solder grains small which will give a longer lasting joint. Typical cooling rate should be 4 °C. Flaircomm Microelectronics, Inc. -30- FLC-BTM101 Datasheet 10. Ordering Information 10.1 Product Packaging Information Figure 13: Product Packaging Information Flaircomm Microelectronics, Inc. -31- FLC-BTM101 Datasheet Figure 14: Product Packaging Information (Tape) Flaircomm Microelectronics, Inc. -32- FLC-BTM101 Datasheet 10.2 Ordering information FLC-BTM101XYZA Product Revision Shipping Package Product Package Product Grade Figure 15: Ordering Information 10.2.1 Product Revision Product Revision A B C Description CSR1000 (with Antenna) CSR1010 (with Antenna) CSR1010(without Antenna) Availability Yes Yes Yes Table 12: Product Revision 10.2.2 Shipping Package Shipping Package Description Quantity Availability 0 1 2 Foam Tray Plastic Tray Tape — 100x10x3 = 3000 1000 No Yes Yes Table 13: Shipping Package 10.2.3 Product Package Product Package Description Availability Q L B C QFN LGA BGA Connector Yes No No No Table 14: Product Package Flaircomm Microelectronics, Inc. -33- FLC-BTM101 Datasheet 10.2.4 Product Grade Product Grade Description Availability C I V A Consumer Industrial Automobile After-Market Automobile Before-Market Yes No Yes No Table 15: Product Grade Flaircomm Microelectronics, Inc. -34- FLC-BTM101 Datasheet 11. Certifications 11.1 FCC Statement 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 11.2 RF Warning Statement The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction. 11.3 CE Statement BTM101 is conformity with the following standards. SAFETY (Art. 3.1(a)): Flaircomm Microelectronics, Inc. -35- FLC-BTM101 Datasheet • EN 60950-1:2006+A11:2009:+A1:2010+A12:2011+A2:2013 HEALTH (Art. 3.1(a)): • EN 62479:2010 EMC (Art. 3.1(b)): • EN 301 489-1 V1.9.2:2011 • EN 301 489-17 V2.2.1:2012 ο Radiated electric field immunity, EN 61000-4-3:2006 RADIOS (Art. 3.2) • EN 300 328 V1.8.1:2012 SPECTRUM • EN 300 328 V1.8.1 ο Occupied channel bandwidth ο Transmitter unwanted spurious emissions in the out-of-band domain ο Transmitter unwanted spurious emissions in the spurious domain ο Receiver spurious emissions 11.4 FLC-BTM101 Label Instructions The FLC-BTM101 module is designed to comply with the FCC statements. The packaging of host system that uses BTM101 should display a label indicating the information as follows: Contains FCC ID: P4IBTM101 Model: FLC-BTM101 (Series models: FLC-BTM101CQ1A/ FLC-BTM101CQ2A/ FLC-BTM101VQ1A/ FLC-BTM101VQ2A/ FLC-BTM101CQ1B/ FLC-BTM101CQ2B/ FLC-BTM101VQ1B/ FLC-BTM101VQ2B/ FLC-BTM101CQ1C/ FLC-BTM101CQ2C/ FLC-BTM101VQ1C/ FLC-BTM101VQ2C) Any similar wording that expresses the same meaning may also be used. Flaircomm Microelectronics, Inc. -36- FLC-BTM101 Datasheet 11.5 FLC-BTM101 Antenna Statement Note: In this section, “A”, “B” and “C” in “BTM101XQZA”, “BTM101XQZB” and “BTM101XQZC” refer to Product Revision. Please see Section 10.2.1 for reference. 11.5.1 FLC-BTM101XQZC (Without Antenna) There is no built-in antenna in BTM101XQZC. BTM101XQZC is integrated with a SMT antenna pad connector to make it simple for designers to add an external antenna into the module. In order to make the product compliant with the FCC standard, the applicable antennas which designers choose should be similar to the antenna in BTM101XQZA and BTM101XQZB in specifications and radiation patterns. And the gain should be less than the peak gain of the antenna in BTM101XQZA and BTM101XQZB. If designers choose a different antenna, additional testing and equipment authorization are needed to ensure the compliance with FCC statement. 11.5.2 FLC-BTM101XQZA & FLC-BTM101XQZB (With Antenna) Antenna specifications of BTM101XQZA & BTM101XQZB are listed in the following table: Description Centre frequency (for different central frequency shifts) Bandwidth Value 2.45 GHz 02 type/03 type/Default/06 type/07 type ＞100 MHz 4.1 dBi max. (depends on the special environment) Gain VSWR Polarization Azimuth beamwidth Impedance Power dissipation Operating temperature Resistance to soldering heat 2.5 max. (depends on the special environment) Linear Omni-directional 50 Ω 1W −55 to +85 °C 260 °C for 10 s Table 16: Antenna Specifications The following figures and table show the Radiation Patterns of the antenna in BTM101XQZA & BTM101XQZB. Flaircomm Microelectronics, Inc. -37- FLC-BTM101 Datasheet Figure 16: The Definition of X-Y-Z Plane and Angle for Radiation Pattern Figure 17: Radiation Pattern Measurements Flaircomm Microelectronics, Inc. -38- FLC-BTM101 Datasheet Plane XY (dBi) XZ(dBi) YZ (dBi) -8.9 -14.6 -4.3 -9.8 1.4 -2.8 Horizontal Pol. (max.) 2.4 4.1 1.1 Horizontal Pol. (avg.) -3.7 -3.1 -5.2 Total gain (max.) 2.4 4.1 1.6 Total gain (avg.) -3.6 -2.8 -1.6 Vertical Pol. (max.) Vertical Pol. (avg.) Table 17: Max. and avg. antenna gain value of radiation pattern Flaircomm Microelectronics, Inc. -39-