PL
IA
NT
Features
CO
M
■
*R
oH
S
■
■
■
■
■
■
Industry standard surface mount device
RoHS compliant*
Output voltage programmable from
0.75 Vdc to 5.0 Vdc via external resistor
Up to 5 A output current
Up to 92 % efficiency
Small size, low profile
■
■
■
■
■
■
Cost-efficient open frame design
Low output ripple and noise
High reliability
Remote on/off
Output overcurrent protection
(non-latching)
Constant switching frequency (300 kHz)
Wide operating temperature range
MX5A-12SA SMT Non-Isolated Power Module
How to Order
Description
M X 5A - 12 S A
Bourns® MX5A-12SA is a non-isolated DC-DC converter
offering designers a cost and space-efficient solution with
standard features such as remote on/off, precisely regulated
programmable output voltage and overcurrent and overtemperature protection. These modules deliver up to 5 A of
output current with load efficiency of 92 % at 5 V output.
Configuration
• M = Surface Mount Device
Internal Identifier
Output Current (Amps)
Input Voltage (V)
Outputs
• S = Single
Output Voltage (V)
• A = Adjustable
Fixed output voltage parts and optional features available; contact factory.
Absolute Maximum Ratings
Stress in excess of absolute maximum ratings may cause permanent damage to the device. Device reliability may be affected if
exposed to absolute maximum ratings for extended time periods.
Characteristic
Min.
Max.
Units
Continuous Input Voltage
-0.3
15.0
Vdc
Operating Temperature Range
-40
+85
°C
Storage Temperature
-55
+125
°C
Notes & Conditions
See Thermal Considerations section
Electrical Specifications
Unless otherwise specified, specifications apply over all input voltage, resistive load and temperature conditions.
Characteristic
Min.
Operating Input Voltage
Maximum Input Current
Nom.
Max.
Units
10.0
14.0
-
3.5
Vdc
Adc
Over Vin range, Io max, Vout = 5 Vdc
26
70
mA
mA
Vin = 12 Vdc, Io = 0 A, mod. enabled,
-Vout = 0.75 Vdc
-Vout = 5.0 Vdc
1.6
mA
Vin = 5.0 Vdc, module disabled
Input No Load Current
Input Stand-by Current
Inrush Transient
0.4
Notes & Conditions
A2s
Input Reflected Ripple Current
40
mAp-p
Input Ripple Rejection
30
dB
120 Hz
Caution: The power modules are not internally fused. An external input line fast-blow fuse with a maximum rating of 6 A is required.
See the Safety Considerations section of this data sheet.
Applications
■
■
■
Intermediate Bus architecture
Distributed power applications
Workstations and servers
■
■
■
Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
1
MX5A-12SA SMT Non-Isolated Power Module
Electrical Specifications (Continued)
Characteristic
Min.
Output Voltage Setpoint Accuracy
Output Voltage Tolerance
Voltage Adjustment Range
Nom.
Max.
Units
-2.0
2.0
% Vo,set
Vin min, Io max, TA = 25 °C
-3.0
3.0
% Vo,set
Over all rated in out voltage, load and
temperature conditions
0.7525
5.5
Line Regulation
0.3
Vdc
% Vo,set
Load Regulation
0.3
% Vo,set
Temperature Regulation
Output Current
0.4
0.0
Output Current Limit Inception (Hiccup Mode)
Output Short Circuit Current
2
Output Ripple and Noise Voltage
RMS
Peak-to-Peak
15
30
External Capacitance
- ESR ≥ 1 mΩ
- ESR ≥ 10 mΩ
Notes & Conditions
% Vo,set
5.0
Adc
200
% Io max
Adc
30
75
mVrms
mVpk-pk
1000
3000
µF
µF
Vo≤ 250 mV – Hiccup Mode
1 µF ceramic/10 µF tantalum capacitors
5 Hz to 20 MHz bandwidth
Efficiency
(Vin = 5 Vdc, TA= 25 °C, Full Load)
81.5
84.0
85.0
87.0
89.0
92.0
%
%
%
%
%
%
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Vo,set = 5.0 Vdc
Switching Frequency
300
kHz
Dynamic Load Response
2.5 A to 5 A; 5 A to 2.5 A;
(∆i/∆t = 2.5 A/µs; 25 °C)
200
25
mV
µs
1 µF ceramic/10 µF tantalum capacitor
Peak Deviation
Settling Time (Vo<10 % peak deviation)
2.5 A to 5 A; 5 A to 2.5 A;
(∆i/∆t = 2.5 A/µs; 25 °C)
75
50
mV
µs
2 x 150 µF polymer capacitors
Peak Deviation
Settling Time (Vo<10 % peak deviation)
General Specifications
Characteristic
Calculated MTBF
Weight
2
Nom.
Units
10,000,000
hours
2.2
(0.08)
g
(oz.)
Notes & Conditions
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
MX5A-12SA SMT Non-Isolated Power Module
Feature Specifications
Characteristic
Min.
Remote Enable
Open = On (Logic Low)
Low = Off (Logic High)
>2.5
Turn-On Delay and Rise Times
Case 1: On/Off Low – Vin Applied
Case 2: Vin Applied, then On/Off Set Low
Case 3: Output Voltage Rise
Nom.
Max.
Units
0.4
14
Vdc
Vdc
2.5
2.5
3.0
Output Voltage Overshoot
1
10 µA max.
1 mA max.
msec
msec
msec
(10 %-90 % of Vo setting)
% Vo, set
Io max, Vin=5.5, TA=25 °C
Overtemperature Protection
135
°C
Input Undervoltage Lockout
-Turn-on Threshold
-Turn-off Threshold
8.2
8.0
V
V
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Notes & Conditions
See Thermal Consideration section
3
MX5A-12SA SMT Non-Isolated Power Module
Characteristic Curves
The curves provided below are typical characteristics for the MX5A-12SA modules at 25 °C. For any specific test configurations or any
specific test requests, please contact Bourns.
100.0
100.0
Vin=14 V
Vin=12 V
Vin=10 V
90.0
85.0
80.0
75.0
70.0
1.0
2.0
3.0
Output Current (A dc)
5.0
4.0
Vin=14 V
Vin=12 V
Vin=10 V
95.0
Efficiency (%)
Efficiency (%)
2.0
3.0
Output Current (A dc)
100.0
90.0
85.0
80.0
90.0
85.0
80.0
75.0
75.0
2.0
3.0
Output Current (A dc)
70.0
1.0
5.0
4.0
Fig. 2 Efficiency vs. Output Current (Vout = 1.5 Vdc )
100.0
2.0
3.0
Output Current (A dc)
100.0
95.0
Efficiency (%)
90.0
85.0
80.0
75.0
90.0
85.0
80.0
Vin=14 V
Vin=12 V
Vin=10 V
75.0
2.0
3.0
Output Current (A dc)
4.0
Fig. 3 Efficiency vs. Output Current (Vout = 1.8 Vdc )
5.0
4.0
Fig. 5 Efficiency vs. Output Current (Vout = 3.3 Vdc )
Vin=14 V
Vin=12 V
Vin=10 V
95.0
Efficiency (%)
80.0
Fig. 4 Efficiency vs. Output Current (Vout = 2.5 Vdc )
Vin=14 V
Vin=12 V
Vin=10 V
95.0
4
85.0
70.0
1.0
5.0
4.0
100.0
70.0
1.0
90.0
75.0
Fig. 1 Efficiency vs. Output Current (Vout = 1.2 Vdc )
70.0
1.0
Vin=14 V
Vin=12 V
Vin=10 V
95.0
Efficiency (%)
Efficiency (%)
95.0
5.0
70.0
1.0
2.0
3.0
Output Current (A dc)
4.0
5.0
Fig. 6 Efficiency vs. Output Current (Vout = 5.0 Vdc )
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
MX5A-12SA SMT Non-Isolated Power Module
Output Voltage
Vo (100 mV/div)
Characteristic Curves (Continued)
4.00
2.00
Iin, Adc
Vo, Vdc
0.00
6.00
Output Current
Io (1.3 A/div)
Input Current (A)/
Output Voltage (Vdc)
6.00
12.00
8.00
10.00
Input Voltage (Vdc )
Fig. 7 Input Voltage vs. Io and Vo
(Vo = 2.5 Vdc , Io= 6.0 A)
Output Voltage: 100 mVolt 5 µs
Output Current (1.3 A/Div): 2 Volt 5 µs
Time (5 µs/div)
Full Load: 10 mVolt 2.5 µs
No Load: 10 mVolt 2.5 µs
Half Load: 10 mVolt 2.5 µs
Output Current
Io (1.3 A/div)
Output Voltage
Vo (10 mV/div)
Output Voltage
Vo (100 mV/div)
Fig. 10 Transient Response - 2.5 A - 5 A Step
(Vo = 3.3 Vdc )
Output Voltage: 100 mVolt 5 µs
Output Current (1.3 A/Div): 2 Volt 5 µs
Time (5 µs/div)
Fig. 11 Transient Response - 5 A - 2.5 A Step
(Vo = 3.3 Vdc )
Full Load: 50 mVolt 2.5 µs
No Load: 50 mVolt 2.5 µs
Half Load: 50 mVolt 2.5 µs
Time (2.5 µs/div)
Fig. 9 Typical Output Ripple and Noise
(Vin = 12.0 V, Vo = 3.3 V, Io = 5.0 A)
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Output Current
Io (0.9 A/div)
Output Voltage
Vo (50 mV/div)
Output Voltage
Vo (100 mV/div)
Time (2.5 µs/div)
Fig. 8 Typical Output Ripple and Noise
(Vin = 12.0 V, Vo = 0.75 V, Io = 5.0 A)
Output Voltage: 100 mVolt 10 µs
Output Current (0.9 A/Div): 2 Volt 10 µs
Time (10 µs/div)
Fig. 12 Transient Response - 2.5 A - 5 A Step
(Vin = 12.0 V, Vo = 12 Vdc , Cext = 2x100 µF Polymer Capacitors)
5
MX5A-12SA SMT Non-Isolated Power Module
Input Voltage
Vin (5 V/div)
Output Voltage
Vo (100 mV/div)
Characteristic Curves (Continued)
??
Output Voltage: 100 mVolt 10 µs
Output Current (0.9 A/Div): 2 Volt 10 µs
???
Output Voltage
Vo (1 V/div)
Output Current
Io (0.9 A/div)
???
On/Off Voltage
Von/off (5 V/div)
On/Off Voltage
Von/off (5 V/div)
Output Voltage
Vo (0.5 V/div)
Time (1 ms/div)
Fig. 16 Typical Start-up with Application of Vin
(Vin = 12 Vdc , Vo = 3.3 Vdc , Io = 5 A)
Output Voltage
Vo (1 V/div)
Time (5 µs/div)
Fig. 13 Transient Response - 5 A - 2.5 A Step
(Vin = 12 Vdc ,Vo = 3.3 Vdc , Cext = 2x100 µF Polymer Caps)
??
Output Voltage:
1 Volt 1 ms
Input Voltage:
5 Volt 1 ms
???
Output Voltage: 1 Volt 1 ms
On/Off Voltage: 5 Volt 1 ms
??
Time (1 ms/div)
Fig. 17 Typical Start-up using Remote On/Off with Prebias
(Vin = 12 Vdc , Vo = 1.8 Vdc , Io = 1 A, Vbias = 1 Vdc )
??
Output Current
Io (4 A/div)
Output Voltage
Vo (1 V/div)
On/Off Voltage
Von/off (5 V/div)
Time (1 ms/div)
Fig. 14 Typical Start-up using Positive Remote On/Off
(Vin = 12 Vdc, Vo = 3.3 Vdc, I o = 5 A)
Output Voltage:
500 mVolt 1 ms
On/Off Voltage:
5 Volt 1 ms
??
Output Voltage:
1 Volt 1 ms
On/Off Voltage:
5 Volts 1 ms
Time (1 ms/div)
Fig. 15 Typical Start-up using Negative Remote On/Off
with Low-ESR External Capacitors (10x100 µF Polymer)
Output Current (4 A/div): 20 mVolt 25 ms
Time (5 ms/div)
Fig. 18 Output Short Circuit Current
(Vin = 12.0 Vdc , Vo = 0.75 Vdc )
(Vin = 12 Vdc , V o = 3.3 Vdc , Io = 5.0 A, Co = 1000 µF)
6
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
MX5A-12SA SMT Non-Isolated Power Module
Characteristic Curves (Continued)
7
6
6
200 LFM
200 LFM
5
Output Current (A)
Output Current (A)
5
0 LFM
100 LFM
4
3
2
1
0
15
25
35 45 55 65 75
Ambient Temperature (°C)
2
1
45
55
65
75
85
(Vin = 12.0 Vdc , Vo = 3.3 Vdc )
7
200 LFM
6
6
200 LFM
0 LFM
5
Output Current (A)
5
Output Current (A)
35
Fig. 21 Derating Output Current vs.
Local Ambient Temp. and Airflow
(Vin = 12.0 Vdc , Vo = 0.75 Vdc )
100 LFM
4
3
2
1
0
15
25
Ambient Temperature (°C)
Fig. 19 Derating Output Current vs.
Local Ambient Temp. and Airflow
7
100 LFM
3
0
15
85
0 LFM
4
25
35
45
55
65
75
85
0 LFM
4
100 LFM
3
2
1
0
15
85
Ambient Temperature (°C)
35 45 55 65 75
Ambient Temperature (°C)
Fig. 20 Derating Output Current vs.
Local Ambient Temp. and Airflow
Fig. 22 Derating Output Current vs.
Local Ambient Temp. and Airflow
(Vin = 12.0 Vdc , Vo = 1.8 Vdc )
(Vin = 12.0 Vdc , Vo = 5.0 Vdc )
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
25
7
MX5A-12SA SMT Non-Isolated Power Module
Operating Information
Remote On/Off
The MX5A-12SA comes standard with Active LOW with Negative On/Off logic, i.e., OPEN or LOW (< 0.4 V) will turn ON the device. To
turn the device OFF, increase the voltage level above 2.4 V, placing the part into low dissipation sleep mode. The signal level of the
On/Off pin input is defined with respect to ground.
MX5A-12SA
Fig. 23 Circuit Configuration for using Negative Logic On/Off
Input Considerations
The input must have a stable low impedance AC source for optimum performance. This can be accomplished with external ceramic
capacitors, tantalum capacitors and/or polymer capacitors. Using low impedance tantalum capacitors requires about 20 µF per Amp
and an ESR of 250 mΩ per Amp of output current. For a 5 A converter, tantalum capacitors with a combined value of 100 µF and
50 mΩ would be adequate. This can be implemented with (2) 47 µF tantalum capacitors with an ESR of 100 mΩ. Ceramic capacitors
are also recommended to reduce high frequency ripple on the input.
Output Considerations
To maintain the specified output ripple and transient response, external capacitors must be used. An external 1 µF ceramic capacitor in
parallel with a 10 µF low ESR tantalum capacitor will usually meet the specified performance. Improved performance can be achieved
by using more capacitance. Low ESR polymer capacitors may also be used. Two 100 µF, 9 mΩ or lower ESR capacitors are
recommended.
Safety Information
In order to comply with safety requirements the user must provide a fuse in the unearthed input line. This is to prevent earth being
disconnected in the event of a failure.
The converter must be installed as per guidelines outlined by the various safety approvals if safety agency approval is required for the
overall system.
Overtemperature Protection
The device will shut down if it becomes too hot (typically 135 °C – at controller IC). Once the converter cools, it automatically restarts.
This feature does not guarantee the converter won’t be damaged by temperatures above its rating.
Overcurrent Protection
The device has an internally set output current limit to protect it from overloads, placing the unit in hiccup mode. Once the overload is
removed the converter automatically resumes normal operation. No user adjustments are available. An external fuse in series with the
input voltage is also required for complete overload protection.
Input Undervoltage Lockout
The device operation is disabled if the input voltage drops below the specified input range. Once the input returns to the specified
range operation automatically resumes. No user adjustments are available.
8
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
MX5A-12SA SMT Non-Isolated Power Module
Operating Information (Continued)
Output Voltage Setting
The output voltage can be programmed to any voltage between 0.75 Vdc and 5.5 Vdc by connecting a single resistor between the trim
pin and the GND pin of the module, as shown in Fig. 24 below.
If left open circuit the output voltage will default to 0.75 Vdc. The correct Rtrim value for a specific voltage can be calculated using the
following equation:
Rtrim = [10.5/(Vo-0.7525)-1] KΩ
For example, to set the MX5A-12SA to 3.3 V the following
Rtrim resistor must be used:
VIN (+)
VO (+)
ON/OFF
TRIM
Rtrim = [10.5/(3.3-0.7525)-1] KΩ
LOAD
Rtrim
GND
Rtrim = 3.122 kΩ,
The closest standard 1 % E96 value is 3.09 kΩ.
Table 1 provides the Rtrim values required for some common output
voltage set points.
Vo (V)
0.75
1.2
1.5
1.8
2.0
2.5
3.3
5.0
MX5A-12SA Rtrim Values
Rtrim (kΩ)
Open
22.46
13.05
9.024
11.78
5.009
3.122
1.472
Fig. 24 Circuit Configuration to Program Output
Voltage using an External Resistor
1 % Value
Open
22.6
13.0
9.09
11.8
4.99
3.09
1.47
Table 1
The output voltage of the device can also be set by applying a voltage between the TRIM and GND pins. The Vtrim equation can be
written as follows:
Vtrim = (0.7 – 0.0667 x{Vo – 0.7225))
To set Vo = 3.3 V, the Vtrim required would therefore be 0.530 V.
Table 2 below provides the Vtrim values required for some common output voltage set points.
Vo (V)
0.75
1.2
1.5
1.8
2.5
3.3
5.0
MX5A-12SA Vtrim Values
Vtrim (V)
Open
0.670
0.650
0.630
0.583
0.530
0.4166
Table 2
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
9
MX5A-12SA SMT Non-Isolated Power Module
Operating Information (Continued)
Voltage Margining
Output voltage margining can be implemented as follows:
1) Trim-up: Connect a resistor, Rm-up, from the Trim pin to the ground pin for adjusting the voltage upwards, and
2) Trim-down: Connect a resistor, Rm-down, from the Trim pin to the output pin for adjusting the voltage downwards.
Please consult your local Bourns Field Applications Engineer for more details and the calculation of the required resistor values.
Vo
Vo
Vin
Rmargin-down
Q2
Trim
On/Off
Rmargin-up
Rtrim
Q1
COM
Fig. 25 Circuit Configuration for Margining Output Voltage
Thermal Considerations
Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments.
Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration.
The data presented in Figures 19 to 22 is based on physical test results taken in a wind tunnel test. The test set-up is shown in
Figure 27.
The thermal reference points are (1) Tref1 = temp at dual Mosfet, as shown in Figure 26, and (2) Tref2 = temp at controller IC. For reliable
operation, neither Tref1 or Tref2 should exceed 115 °C.
Air
Flow
Tref1
Air Flow
WIND TUNNEL
Airflow and ambient
temp sensor probes
location
8.1 (0.32)
n
76.2 (3.0)
C2
C3
L1
Q1
UNIT UNDER TEST
PCB
C1
Fig. 26 Tref1 Temperature Measurement Location
10
25.4 (1.0)
Fig. 27
Thermal Test Set-up
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
MX5A-12SA SMT Non-Isolated Power Module
Product Dimensions
SIDE VIEW
BOTTOM VIEW
20.3
(0.80)
DIMENSIONS:
MM
(INCHES)
4.06
(0.160)
4.06
(0.160)
4.57
(0.180)
4.83
(0.190)
5.84
(0.230)
MAX.
5.56
(0.219)
REF.
TOLERANCES:
GND
TRIM
VOUT
11.43
(0.450)
8.89
(0.350)
8.64
(0.340)
VIN
1.47
(0.058)
0.5
(0.02)
0.25
DECIMAL .XX ±
(0.010)
DECIMAL .X ±
ON/OFF
L1 INDUCTOR
1.5
(0.06)
2.29
(0.090)
1.57
(0.062)
1.3
(0.05)
Fig. 28 Product Dimensions
Coplanarity
The MX5A-12SA device has a maximum coplanarity of 100 µm (approx. 0.004 ”), as defined by JESD22-B108.
Pin Plating Composition
Tin (Sn) plating over nickel (Ni).
Recommended Pad Layout
17.53
(0.690)
4.06
(0.160)
4.06
(0.160)
4.83
(0.190)
4.57
(0.180)
VOUT
TRIM
GND
8.64
(0.340)
8.89
(0.350)
ON/OFF
1.5
(0.06)
1.3
(0.05)
0.25
(0.010)
RECOMMENDED PAD SIZE:
DIMENSIONS:
MM
(INCHES)
VIN
3.05
2.41
X
MIN.
(0.120) (0.095)
3.43
2.79
X
MAX.
(0.135) (0.110)
Fig. 29 Recommended Pad Layout
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
11
MX5A-12SA SMT Non-Isolated Power Module
Use in Manufacturing Environment
Pick and Place Information
Bourns SMT devices, packaged on tape and reel, are designed (low mass) for automated assembly using standard SMT pick and
place equipment. The centrally located inductor provides the flat surface area to be used for component pick up. Variables such as
nozzle style, nozzle size, handling speed, and placement pressure need to be optimized for best results.
11.43
(0.450)
6.22
(0.245)
DIMENSIONS:
MM
(INCHES)
9.65
(0.380)
20.3
(0.80)
Fig. 30 Pick and Place Location
Packaging Information
Devices come in 44 mm tape and reel, as per EIA-481-2.
4.00 ± 0.10
(.157 ± .004)
0.4 ±0.10
(.016 ± .004)
5.90
(.232)
2.00 ± 0.10
(.079 ± .004)
A
DIA.
1.50 +0.10/-0.00
(.049 +.004/-0.00)
1.75 ± 0.10
(.069 ± .004)
20.20 ± 0.10
(.795 ± .004)
20.60
(.811)
B
44.00 ± 0.10
1.732 ± .004)
Reel Dimensions:
Outside Diameter: 330.2
B
40.40 ± 0.10
(1.591 ± .004)
DIA.
2.00 +0.10/-0.00
(.079 +.004/-0.00)
(13.00)
Inside Diameter: 177.8
(7.00)
Width:
SECTION B-B
A
16.00 ± 0.10
(.630 ± .004)
44.0
(1.73)
DIMENSIONS:
MM
(INCHES)
11.70
(.461)
SECTION A-A
Fig. 31 Packaging Tape Detail
PCB Layout for SMT Devices
• Use a solder mask defined pad design.
• See specific datasheet for recommended minimum and maximum pad size.
• Interconnection to internal power planes is typically required.
• “Via-in-pad” design should be avoided in the SMT pads.
• Solder mask should be used to eliminate solder wicking into the vias.
• Low resistance and low inductance PCB layout traces should be used where possible, particularly on the output side.
• A low impedance track between the input ground and output ground is very important to achieve high efficiencies.
12
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
MX5A-12SA SMT Non-Isolated Power Module
Use in Manufacturing Environment (Continued)
Soldering Requirements
Bourns recommends the following temperature profile for use on tin lead solder (Sn-Pb Eutectic) and lead free solder. For lead free
solder, the maximum temperature during the mounting process should not exceed 245 °C. Sufficient time must be allowed to fuse the
plating on the connection to ensure a reliable solder joint. However, the time above 230 °C should not exceed 60 seconds.
Solder Reflow Profile
Temperature (°C)
300
250
Peak Temp. (Pb-Free Solder)
245 °C
Peak Temp. (Pb Solder)
210-225 °C
200
150
Soaking Zone
(2 min. max.)
60-90 sec typical
0.5 - 0.6 °C/sec.
Preheat Zone
<2.5 °C/sec.
100
50
Reflow Zone
(90 sec. max.)
30-60 sec. typ.
1.3 - 1.6 °C/sec.
Cool Down Zone
Preheating Zone
(2 - 4 min. max.)
0
0
15 30
45 60
75
90 105 120 135 150 165 180 195 210 225 240 255 270 285 300
Time (Seconds)
Fig. 32 Suggested Reflow Profile
Water Washing
A non-clean solder paste system should be used for solder attach onto application boards. The parts are suitable for water washing
applications. However, the user must ensure that the drying process is sufficient to remove all water from the module after washing
and that the module is never powered up prior to the module being fully dried.
Inspection/Rework
Conventional techniques may be employed when replacing a unit in the application. Using a precision dispenser or a suitable ministencil, a suitable volume of solder paste should be applied to the cleaned pads. Reflow can be achieved by standard SMT rework
techniques such as IR or techniques developed for BGA components.
ESD Requirements
Bourns manufactures all models in an ESD controlled environment and all product is supplied in conductive packaging to prevent
ESD damage from occurring before or during shipping. All products must be unpacked and handled using approved ESD control
procedures. Failure to do so may affect the lifetime of the converter.
Storage
The X & XT Series have an MSL rating of 1 per IPC/JEDEC J-STD-033A.
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
LONGFORM REV. B 08/06
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
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