IA
NT
Features
CO
M
PL
■
*R
oH
S
■
■
■
■
■
■
SIP (Single in-line package)
Output voltage programmable from
0.75 Vdc to 3.3 Vdc via external resistor
Up to 16 A output current
Up to 95 % efficiency
Small size, low profile, cost-efficient open
frame design
Low output ripple and noise
■
■
■
■
■
■
■
High reliability
Remote on/off
Remote sense
Output overcurrent protection
(non-latching)
Overtemperature protection
Constant switching frequency (300 kHz)
Wide operating temperature range
Optional sequencing function
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Description
How to Order
Bourns® SX(T)16A-3-5SA is a non-isolated DC-DC converter
offering designers a cost and space-efficient solution with
standard features such as remote on/off, remote sense, precisely
regulated programmable output voltage, overcurrent and overtemperature protection, and optional output voltage sequencing.
These modules deliver up to 16 A of output current with full load
efficiency of 95 % at 3.3 V output.
S X (T) 16A - 3-5 S A (-P)
Configuration
S = SIP
Internal Identifier
Identifies Sequencing Pin Function
Output Current (Amps)
Input Voltage (V)
Outputs
S = Single
Output Voltage (V)*
A = Adjustable
Optional Positive On/Off Logic
*Fixed output voltage parts and optional features available; contact factory.
Absolute Maximum Ratings
Stress in excess of absolute maximum ratings may cause permanent damage to the device. Device reliability may be affected if
exposed to absolute maximum ratings for extended time periods.
Characteristic
Min.
Max.
Units
Continuous Input Voltage
Operating Temperature Range
-0.3
5.8
Vdc
-40
+85
°C
Storage Temperature
-55
+125
°C
Sequencing Function
-0.3
Vin, max.
Vdc
Notes & Conditions
See Thermal Considerations section
Electrical Specifications
Unless otherwise specified, specifications apply over all input voltage, resistive load and temperature conditions.
Characteristic
Min.
Nom.
Max.
Units
Vdc
Adc
Operating Input Voltage
2.4
5.5
Maximum Input Current
-
16.0
Input No Load Current
Input Stand-by Current
Notes & Conditions
Vout ≤ Vin - 0.5 V
Over Vin range, Io max, Vout = 3.3 Vdc
25
30
mA
mA
Vin = 5.0 Vdc, Io = 0 A, mod. enabled,
-Vout = 0.75 Vdc
-Vout = 3.3 Vdc
1.5
mA
Vin = 5.0 Vdc, module disabled
Inrush Transient
0.1
A2s
Input Reflected Ripple Current
100
mAp-p
Input Ripple Rejection
30
dB
120 Hz
Caution: The power modules are not internally fused. An external input line fast acting fuse with a maximum rating of 20 A (glass type,
rated to 32V) is required. See the Safety Considerations section of this data sheet.
Applications
■
■
■
Intermediate Bus architecture
Distributed power applications
Workstations and servers
■
■
■
Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
1
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Electrical Specifications (Continued)
Characteristic
Min.
Output Voltage Setpoint Accuracy
Output Voltage Tolerance
Voltage Adjustment Range
Nom.
Max.
Units
-2.0
2.0
% Vo,set
Vin min, Io max, TA = 25 °C
-3.0
3.0
% Vo,set
Over all rated in out voltage, load and
temperature conditions
0.7525
3.63
Line Regulation
0.3
Vdc
% Vo,set
Load Regulation
0.4
% Vo,set
Temperature Regulation
Output Current
0.4
0.0
% Vo,set
16.0
Adc
Output Current Limit Inception (Hiccup Mode)
200
% Io max
Output Short Circuit Current
3.5
Adc
Output Ripple and Noise Voltage
RMS
Peak-to-Peak
8
25
External Capacitance
- ESR ≥ 1 mΩ
- ESR ≥ 10 mΩ
Notes & Conditions
15
50
mVrms
mVpk-pk
1000
5000
µF
µF
Vo≤ 250 mV – Hiccup Mode
1 µF ceramic/10 µF tantalum capacitors
5 Hz to 20 MHz bandwidth
Efficiency
(Vin = 5 Vdc, TA= 25 °C, Full Load)
82.0
87.0
89.0
90.0
92.5
95.0
%
%
%
%
%
%
Vo,set = 0.75 Vdc
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Switching Frequency
300
kHz
Dynamic Load Response
8 A to 16 A; 16 A to 8 A;
(∆i/∆t = 2.5 A/µs; 25 °C)
300
25
mV
µs
1 µF ceramic/10 µF tantalum capacitor
Peak Deviation
Settling Time (Vo<10 % peak deviation)
8 A to 16 A; 16 A to 8 A;
(∆i/∆t = 2.5 A/µs; 25 °C)
150
100
mV
µs
3 x 100 µF polymer capacitors
Peak Deviation
Settling Time (Vo<10 % peak deviation)
Nom.
Units
13,675,000
hours
5.4
(0.19)
g
(oz.)
General Specifications
Characteristic
Calculated MTBF
Weight
2
Notes & Conditions
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Feature Specifications
Characteristic
Min.
Remote Enable
Open = On (Logic Low)
Low = Off (Logic High)
>2.5
Turn-On Delay and Rise Times
Case 1: On/Off Low – Vin Applied
Case 2: Vin Applied, then On/Off Set Low
Case 3: Output Voltage Rise
Sequencing Delay Time
Tracking Accuracy
Nom.
Max.
Units
0.4
5.5
Vdc
Vdc
2.5
2.5
3.0
msec
msec
msec
10
msec
100
200
Output Voltage Overshoot
Remote Sense Range
200
400
mV
mV
1
% Vo, set
0.5
Vdc
Overtemperature Protection
125
°C
Input Undervoltage Lockout
-Turn-on Threshold
-Turn-off Threshold
2.2
2.0
V
V
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Notes & Conditions
10 µA max.
1 mA max.
(10 %-90 % of Vo setting)
Delay from Vin, min. to application of
voltage on SEQ pin
Power Up: 2 V/ms
Power Down: 1 V/ms
Io max, Vin=5.5, TA=25 °C
See Thermal Consideration section
3
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves
The curves provided below are typical characteristics for the SX(T)16A-3-5SA modules at 25 °C. For any specific test configurations or
any specific test requests, please contact Bourns.
100.0
95.0
Efficiency (%)
95.0
Efficiency (%)
100.0
Vin=5.5 V
Vin=5.0 V
Vin=2.4 V
90.0
85.0
80.0
75.0
10.0
Output Current (A dc)
Vin=5.5 V
Vin=5.0 V
Vin=2.4 V
95.0
90.0
85.0
80.0
10.0
Output Current (A dc)
95.0
90.0
85.0
80.0
Vin=5.5 V
Vin=5.0 V
Vin=3.0 V
75.0
7.0
70.0
5.0
15.0
9.0
11.0
13.0
Output Current (A dc)
95.0
90.0
85.0
80.0
9.0
11.0
13.0
Output Current (A dc)
15.0
100.0
Efficiency (%)
Vin=5.5 V
Vin=5.0 V
Vin=2.4 V
7.0
Fig. 5 Efficiency vs. Output Current (Vout = 2.5 Vdc )
Fig. 2 Efficiency vs. Output Current (Vout = 1.2 Vdc )
100.0
15.0
100.0
75.0
Efficiency (%)
Vin=5.5 V
Vin=5.0 V
Vin=2.4 V
Fig. 4 Efficiency vs. Output Current (Vout = 1.8 Vdc )
Efficiency (%)
Efficiency (%)
100.0
95.0
90.0
85.0
80.0
75.0
Vin=5.5 V
Vin=5.0 V
Vin=4.5 V
75.0
7.0
9.0
11.0
13.0
Output Current (A dc)
15.0
Fig. 3 Efficiency vs. Output Current (Vout = 1.5 Vdc )
4
80.0
70.0
5.0
15.0
Fig. 1 Efficiency vs. Output Current (Vout = 0.75 Vdc )
70.0
5.0
85.0
75.0
70.0
5.0
70.0
5.0
90.0
70.0
5.0
7.0
9.0
11.0
13.0
Output Current (A dc)
15.0
Fig. 6 Efficiency vs. Output Current (Vout = 3.3 Vdc )
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SX(T)16A-3-5SA SIP Non-Isolated Power Module
18.0
Iin, Adc
Vo, Vdc
16.0
14.0
12.0
Output Voltage
Vo (200 mV/div)
Output Voltage (Vdc)
Characteristic Curves (Continued)
10.0
Output Current
Io (5.0 A/div)
Input Current (A)
8.0
6.0
4.0
2.0
0.0
-0.5
0.5
3.5 4.5
1.5 2.5
Input Voltage (Vdc )
Output Voltage: 200 mVolt 5 µs
Output Current (5.0 A/Div): 2 Volt 5 µs
5.5
Time (5 µs/div)
Fig. 10 Transient Response - 8 A - 16 A Step
(Vo = 3.3 Vdc )
?
No Load: 20 mVolt 2.5 µs
Half Load: 20 mVolt 2.5 µs
Full Load: 20 mVolt 2.5 µs
Output Current
Io (5.0 A/div)
Output Voltage
Vo (20 mV/div)
Output Voltage
Vo (200 mV/div)
Fig. 7 Input Voltage vs. Io and Vo
(Vo = 2.5 V, Io= 16.0 A)
Output Voltage: 200 mVolt 5 µs
Output Current (5.0 A/Div): 2 Volt 5 µs
Output Voltage
Vo (100 mV/div)
Time (5 µs/div)
Fig. 11 Transient Response - 16 A - 8 A Step
(Vo = 3.3 Vdc )
?
?
No Load: 20 mVolt 2.5 µs
Half Load: 20 mVolt 2.5 µs
Full Load: 20 mVolt 2.5 µs
Time (2.5 µs/div)
Fig. 9 Typical Output Ripple and Noise
(Vin = 5.0 V, Vo = 3.3 V, I o = 16.0 A)
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Output Current
Io (5.0 A/div)
Output Voltage
Vo (20 mV/div)
Time (2.5 µs/div)
Fig. 8 Typical Output Ripple and Noise
(V in= 5.0 V, V o = 0.75 V, I o= 16.0 A)
Output Voltage: 100 mVolt 10 µs
Output Current (5.0 A/Div): 2 Volt 10 µs
Time (10 µs/div)
Fig. 12 Transient Response - 8 A - 16 A Step
(Vo = 3.3 Vdc , Cext = 3x100 µF Polymer Capacitors)
5
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Output Voltage: 100 mVolt 10 µs
Output Current (5.0 A/Div): 2 Volt 10 µs
Output Voltage
Vo (0.5 V/div)
Output Current
Io (5.0 A/div)
Output Voltage
Vo (100 mV/div)
Input Voltage
Vin (2 V/div)
Characteristic Curves (Continued)
Output Voltage:
500 mVolt 1 ms
On/Off Voltage:
2 Volt 1 ms
Time (10 µs/div)
Fig. 13 Transient Response - 16 A - 8 A Step
(Vo = 3.3 Vdc , Cext = 3x100 µF Polymer Capacitors)
On/Off Voltage
Von/off (2 V/div)
Output Current:
500 mVolt 1 ms
On/Off Voltage:
2 Volt 1 ms
Time (1 ms/div)
Fig. 17 Typical Start-up using Remote On/Off with Prebias
(Vin = 5 Vdc , Vo = 3.3 Vdc , Io = 1 A, Vbias = 1 Vdc )
Output Current
Io (4 A/div)
On/Off Voltage
Von/off (2 V/div)
Output Voltage
Vo (0.5 V/div)
Output Voltage
Vo (0.5 V/div)
On/Off Voltage
Von/off (2 V/div)
Output Voltage
Vo (0.5 V/div)
Output Voltage: 500 mVolt 1 ms
On/Off Voltage: 2 Volt 1 ms
Time (1 ms/div)
Fig. 14 Typical Start-up using Remote On/Off
(Vin = 5 Vdc, Vo = 3.3 Vdc, Io = 10 A)
Output Voltage:
500 mVolt 1 ms
On/Off Voltage:
2 Volt 1 ms
Time (1 ms/div)
Fig. 15 Typical Start-up using Remote On/Off
with Low-ESR External Capacitors (100x100 µF Polymer)
(Vin = 5.0 Vdc , Vo = 3.3 Vdc , Io = 10.0 A, Co = 1000 µF)
6
Time (1 ms/div)
Fig. 16 Typical Start-up with Application of Vin
(Vin = 5 Vdc , Vo = 3.3 Vdc , Io = 16 A)
Output Current (10 A/div): 50 mVolt 5 ms
Time (5 ms/div)
Fig. 18 Output Short Circuit Current
(Vin = 5.0 Vdc , Vo = 0.75 Vdc )
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Output Current (A)
18
16
14
12
10
8
6
4
2
0
15
18
16
14
12
10
8
6
4
2
0
15
Output Current (A)
Output Current (A)
Characteristic Curves (Continued)
0 LFM
100 LFM
200 LFM
300 LFM
400 LFM
25
35 45 55 65 75
Ambient Temperature (°C)
85
18
16
14
12
10
8
6
4
2
0
15
0 LFM
100 LFM
200 LFM
300 LFM
400 LFM
25
35 45 55 65 75
Ambient Temperature (°C)
85
Fig. 19 Derating Output Current vs.
Local Ambient Temp. and Airflow
Fig. 22 Derating Output Current vs.
Local Ambient Temp. and Airflow
(Vin = 5.0 Vdc , Vo = 3.3 Vdc )
(Vin = 3.3 Vdc , V o = 0.75 Vdc )
0 LFM
100 LFM
200 LFM
300 LFM
400 LFM
25
35 45 55 65 75
Ambient Temperature (°C)
85
Fig. 20 Derating Output Current vs.
Local Ambient Temp. and Airflow
Output Current (A)
(Vin = 5.0 Vdc , Vo = 0.75 Vdc )
18
16
14
12
10
8
6
4
2
0
15
0 LFM
100 LFM
200 LFM
25
35 45
55 65
Ambient Temperature (°C)
75
85
Fig. 21 Derating Output Current vs.
Local Ambient Temp. and Airflow
(Vin = 3.3 Vdc , Vo = 2.5 Vdc )
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
7
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Operating Information
Remote On/Off
The SX(T)16A-3-5SA comes standard with Active LOW Negative On/Off logic, i.e., OPEN or LOW (< 0.4 V) will turn ON the device.
To turn the device OFF, increase the voltage level on the On/Off pin above 2.4 V, as shown in Figure 23, placing the part into low
dissipation sleep mode.
The SX(T)16A-3-5SA-P comes with Active HIGH Positive On/Off logic, i.e., OPEN or HIGH (>2.4 V) will turn on the device. To turn OFF,
decrease the voltage level on the On/Off pin below 0.4 V.
The signal levels of the On/Off pin input is defined with respect to ground.
SX(T)16A-3-5SA-P
SX(T)16A-3-5SA
Fig. 23 Circuit Configuration for using
Negative Logic On/Off
Fig. 24 Circuit Configuration for using
Positive On/Off
Input Considerations
The input must have a stable low impedance AC source for optimum performance. This can be accomplished with external ceramic
capacitors, tantalum capacitors and/or polymer capacitors. Using low impedance tantalum capacitors requires about 20 µF per amp
and an ESR of 250 mΩ per amp of output current. Tantalum capacitors with a combined value of 300 µF and less than 15mΩ ESR
would be adequate. This can be implemented with (3) 100 µF tantalum capacitors with an ESR less than of 40mΩ. Ceramic capacitors
are also recommended to reduce high frequency ripple on the input.
Output Considerations
To maintain the specified output ripple and transient response, external capacitors must be used. An external 1 µF ceramic capacitor in
parallel with a 10 µF low ESR tantalum capacitor will usually meet the specified performance. Improved performance can be achieved
by using more capacitance. Low ESR polymer capacitors may also be used. Two 100 µF, 9 mΩ or lower ESR capacitors are
recommended.
Safety Information
In order to comply with safety requirements the user must provide a fuse in the unearthed input line. This is to prevent earth being
disconnected in the event of a failure.
The converter must be installed as per guidelines outlined by the various safety approvals if safety agency approval is required for the
overall system. The positive input lead must be provided with a fact acting fuse with a maximum rating of 20 A (glass type, rated to
32 V).
Overtemperature Protection
The device will shut down if it becomes too hot (typically 125 °C). Once the converter cools, it automatically restarts. This feature does
not guarantee the converter won’t be damaged by temperatures above its rating.
8
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued)
Overcurrent Protection
The device has an internally set output current limit to protect it from overloads, placing the unit in hiccup mode. Once the overload is
removed the converter automatically resumes normal operation. No user adjustments are available. An external fuse in series with the
input voltage is also required for complete overload protection.
Input Undervoltage Lockout
The device operation is disabled if the input voltage drops below the specified input range. Once the input returns to the specified
range operation automatically resumes. No user adjustments are available.
Output Voltage Setting
The output voltage can be programmed to any voltage between 0.75 Vdc and 3.3 Vdc by connecting a single resistor between the trim
pin and the GND pin of the module, as shown in Fig. 25 below.
If left open circuit the output voltage will default to 0.75 Vdc. The correct Rtrim value for a specific voltage can be calculated using the
following equation:
Rtrim = [21.07/(Vo-0.7525)-5.11] KΩ
For example, to set the SX(T)16A-3-5SA to 3.3 V the following
Rtrim resistor must be used:
VIN (+)
VO (+)
ON/OFF
TRIM
LOAD
Rtrim
Rtrim = [21.07/(3.3-0.7525)-5.11] KΩ
GND
Rtrim = 3.161 kΩ,
The closest standard 1 % E96 value is 3.16 kΩ.
Table 1 provides the Rtrim values required for some common output
voltage set points. The nearest standard E96 1 % resistor value is also given.
Vo (V)
0.75
1.0
1.2
1.5
1.8
2.0
2.5
3.3
Fig. 25 Circuit Configuration to Program Output
Voltage using an External Resistor
SX(T)16A-3-5SA Rtrim Values
Rtrim (kΩ)
1 % Value
Open
Open
80.02
80.6
41.97
42.2
23.08
23.2
15.00
15.0
11.78
11.8
6.947
6.98
3.161
3.16
Table 1
The output voltage of the device can also be set by applying a voltage between the TRIM and GND pins. The Vtrim equation can be
written as follows:
Vtrim = (0.7 – 0.1698 x{Vo – 0.7225))
To set Vo = 3.3 V, the Vtrim required would therefore be 0.2670 V.
Table 2 provides the Vtrim values required for some common output voltage set points.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
9
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued)
SX(T)16A-3-5SA Vtrim Values
Vo (V)
Vtrim (V)
0.75
Open
1.0
0.6580
1.2
0.6240
1.5
0.5731
1.8
0.5221
2.0
0.4882
2.5
0.4033
3.3
0.2674
Table 2
Voltage Margining
Output voltage margining can be implemented as follows and as shown in Figure 26.
1) Trim-up: Connect a resistor, Rm-up, from the Trim pin to the ground pin for adjusting the voltage upwards, and
2) Trim-down: Connect a resistor, Rm-down, from the Trim pin to the output pin for adjusting the voltage downwards.
Please consult your local Bourns field applications engineer for more details and the calculation of the required resistor values.
Vo
Vo
Vin
Rmargin-down
Q2
On/Off
Trim
Rmargin-up
Rtrim
Q1
COM
Fig. 26 Circuit Configuration for Margining Output Voltage
Sequencing Function
Bourns XT Series modules have a sequencing feature that enables users to implement various types of output voltage sequencing in
their applications. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the
set-point voltage. The final SEQ pin voltage must be set higher than the set-point voltage of the module. The output voltage follows the
voltage on the SEQ pin on a one-to-one basis. By connecting multiple modules together, customers can get multiple modules to track
their output voltages to the voltage applied on the SEQ pin.
For proper voltage sequencing, the input voltage is applied to the module. The On/Off pin should be set so as the module is ON by
default. An analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a 1:1 basis until
output reaches the set-point voltage, as shown in Figure 27.
To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the
modules tracks the voltages below their set-point voltages on a one-to-one basis, as shown in Figure 28. A valid input voltage must be
maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules.
When not using the sequencing feature, tie the SEQ pin to Vout. For additional guidelines please contact your local Bourns field
applications engineer.
10
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Output Voltage Sequencing Voltage
V seq (0.5 V/div)
Vo (0.5 V/div)
Output Voltage Sequencing Voltage
Vo (0.5 V/div)
V seq (0.5 V/div)
Operating Information (Continued)
Vo: 1 Volt 500 µs
Vseq: 1 Volt 500 µs
Time (0.5 ms/div)
Fig. 27 Voltage Sequencing at Power Up
(V in = 5.0 Vdc, Vo = 3.3 Vdc, Io = 16.0 A)
Vo: 1 Volt 1 ms
Vseq: 1 Volt 1 ms
Time (0.5 ms/div)
Fig. 28 Voltage Sequencing at Power Down
(V in = 5.0 Vdc, Vo = 3.3 Vdc, Io = 16.0 A)
Remote Sense
The Remote Sense feature is used to minimize the effects of distribution losses by regulating the voltage at the Remote Sense pin (See
Figure 29). The voltage between the Sense pin and Vo pin must not exceed 0.5 V.
When the Remote Sense feature is not being used, connect the Remote Sense pin to the output pin of the module.
It is very important to make sure that the maximum output power (Vo x Io) of the module remains less than or equal to the maximum
rated power. Using Remote Sense, the output voltage of the module can increase, which may increase the power output by the module.
Rdistribution Rcontact
VIN(+)
Vo
Rcontact Rdistribution
Sense
RLOAD
Rdistribution Rcontact
Rcontact Rdistribution
COM
Fig. 29 Remote Sense Circuit Configuration
Thermal Considerations
Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments.
Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration.
The data presented in Figures 19 to 23 is based on physical test results taken in a wind tunnel test. The test set-up is shown in
Figure 31.
The thermal reference points are (1) Tref1 and Tref2 as shown in Figure 30, and (2) Tref3 = temperature at controller IC. For reliable
operation, none of these Tref points should exceed 115 °C.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
11
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Thermal Considerations (Continued)
Air
Flow
WIND TUNNEL
Airflow and ambient
temp sensor probes
location
Tref1
Air Flow
Tref2
Q1
C4 C3 C2
Q2
L1
C2
C1
UNIT UNDER TEST
C1
PCB
Fig. 30 Tref1 Temperature Measurement Location
Fig. 31
Thermal Test Set-up
Product Dimensions
FRONT VIEW OF BOARD (INDUCTOR SIDE)
SIDE VIEW
50.8
(2.00)
12.7
(0.50)
7.43
MAX.
(0.293)
12.32
(0.485)
1
2
3
4
5
6
7
8
B* 9
6.96
REF.
(0.274)
L1 (REF.)
11 PINS
0.64
0.38
X
(0.025) (0.015)
10
DIMENSIONS:
MM
(INCHES)
TOLERANCES:
0.5
(0.02)
0.25
DECIMAL .XX ±
(0.010)
DECIMAL .X ±
7.6
(0.30)
1.28
(0.050)
2.54
(0.100)
5.08
(0.200)
7.62
(0.300)
10.16
(0.400)
0.64
(0.025)
35.56
(1.400)
38.10
(1.500)
40.64
(1.600)
43.18
(1.700)
45.72
(1.800)
48.26
(1.900)
*Pin Stuffed with SXT16A option only, absent with SX16A standard
12
PIN
1
2
3
4
5
6
7
8
B (optional)
9
10
6.32
(0.249)
FUNCTION
VOUT
VOUT
SENSE
VOUT
GND
GND
VIN
VIN
SEQ
TRIM
ON/OFF
Fig. 32 Product Dimensions
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SX(T)16A-3-5SA SIP Non-Isolated Power Module
Recommended Hole Pattern
48.26
(1.900)
45.72
(1.800)
43.18
(1.700)
40.64
(1.600)
38.10
(1.500)
35.56
(1.400)
10.16
(0.400)
DIMENSIONS:
MM
(INCHES)
7.62
(0.300)
5.08
(0.200)
2.54
(0.100)
1.27
(0.050)
1
2
3
4
5
6
7
8
B* 9
10
1.3
(0.05)
7.9
(0.31)
OUTLINE AREA
1.09
(0.043)
THROUGH-HOLE
PLATED
1.63
(0.064)
BOTH SIDES
PAD SIZE
*Hole required with SXT16A option only, not required with SX16A standard
50.8
(2.00)
Fig. 33 Recommended Hole Pattern
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
LONGFORM REV. A 06/06
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
13